CN202297105U - 微机电***mems器件的方形扁平无引脚封装qfn结构 - Google Patents
微机电***mems器件的方形扁平无引脚封装qfn结构 Download PDFInfo
- Publication number
- CN202297105U CN202297105U CN2011204234679U CN201120423467U CN202297105U CN 202297105 U CN202297105 U CN 202297105U CN 2011204234679 U CN2011204234679 U CN 2011204234679U CN 201120423467 U CN201120423467 U CN 201120423467U CN 202297105 U CN202297105 U CN 202297105U
- Authority
- CN
- China
- Prior art keywords
- mems
- chip
- mini
- substrate
- asic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Micromachines (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204234679U CN202297105U (zh) | 2011-10-31 | 2011-10-31 | 微机电***mems器件的方形扁平无引脚封装qfn结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204234679U CN202297105U (zh) | 2011-10-31 | 2011-10-31 | 微机电***mems器件的方形扁平无引脚封装qfn结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202297105U true CN202297105U (zh) | 2012-07-04 |
Family
ID=46366043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011204234679U Expired - Fee Related CN202297105U (zh) | 2011-10-31 | 2011-10-31 | 微机电***mems器件的方形扁平无引脚封装qfn结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202297105U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102344110A (zh) * | 2011-10-31 | 2012-02-08 | 嘉盛半导体(苏州)有限公司 | 微机电***器件的方形扁平无引脚封装结构及方法 |
CN105036067A (zh) * | 2015-05-29 | 2015-11-11 | 中国科学院电子学研究所 | Mems传感器倒装叠层封装结构及其制备方法 |
WO2022026000A1 (en) * | 2020-07-30 | 2022-02-03 | Invensense, Inc. | Reducing delamination in a packaged integrated circuit |
-
2011
- 2011-10-31 CN CN2011204234679U patent/CN202297105U/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102344110A (zh) * | 2011-10-31 | 2012-02-08 | 嘉盛半导体(苏州)有限公司 | 微机电***器件的方形扁平无引脚封装结构及方法 |
CN102344110B (zh) * | 2011-10-31 | 2015-07-15 | 嘉盛半导体(苏州)有限公司 | 微机电***器件的方形扁平无引脚封装结构及方法 |
CN105036067A (zh) * | 2015-05-29 | 2015-11-11 | 中国科学院电子学研究所 | Mems传感器倒装叠层封装结构及其制备方法 |
WO2022026000A1 (en) * | 2020-07-30 | 2022-02-03 | Invensense, Inc. | Reducing delamination in a packaged integrated circuit |
US11584638B2 (en) | 2020-07-30 | 2023-02-21 | Invensense, Inc. | Reducing delamination in sensor package |
TWI795761B (zh) * | 2020-07-30 | 2023-03-11 | 美商伊凡聖斯股份有限公司 | 減少感測器封裝中的脫層及其方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102344110B (zh) | 微机电***器件的方形扁平无引脚封装结构及方法 | |
CN102157512B (zh) | 芯片封装体及其形成方法 | |
KR20090033141A (ko) | 리드프레임 어레이를 구비하는 집적회로 패키지 시스템 | |
CN101477955B (zh) | 小片重新配置的封装结构及封装方法 | |
CN106744646A (zh) | Mems芯片封装结构以及封装方法 | |
CN103985720B (zh) | 太阳能供电的ic芯片 | |
CN101477956B (zh) | 小片重新配置的封装结构及封装方法 | |
CN202297105U (zh) | 微机电***mems器件的方形扁平无引脚封装qfn结构 | |
CN108389850A (zh) | 三维***级封装结构及其封装方法 | |
CN102270589A (zh) | 半导体元件的制造方法和相应的半导体元件 | |
CN105632943A (zh) | 芯片的超薄嵌入式封装方法及封装体 | |
CN206134648U (zh) | 一种扇出型封装结构 | |
CN104064612B (zh) | 太阳能供电的ic芯片 | |
CN106744647A (zh) | Mems芯片封装结构以及封装方法 | |
CN102398886B (zh) | 具微机电元件的封装结构及其制法 | |
CN103208467B (zh) | 内嵌封装体的封装模块及其制造方法 | |
CN102651323B (zh) | 半导体封装结构的制法 | |
CN105590904A (zh) | 一种指纹识别多芯片封装结构及其制备方法 | |
CN205211727U (zh) | 一种指纹识别多芯片封装结构 | |
CN206417858U (zh) | Mems芯片封装结构 | |
CN108630626A (zh) | 无基板封装结构 | |
CN107611097A (zh) | 晶圆级芯片封装结构及其制备方法 | |
CN210296344U (zh) | 一种无引线框架的半导体封装结构 | |
CN206417859U (zh) | Mems芯片封装结构 | |
CN100361317C (zh) | 具有支撑体的感光半导体封装件及其制法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CU01 | Correction of utility model patent |
Correction item: Claims|Description|Abstract Correct: QFN False: OFN Number: 27 Page: Description Volume: 28 |
|
CU03 | Correction of utility model patent gazette |
Correction item: Claims|Description|Abstract Correct: QFN False: OFN Number: 27 Volume: 28 |
|
ERR | Gazette correction |
Free format text: CORRECT: CLAIMS; SPECIFICATION; ABSTRACT; FROM: OFN TO: QFN |
|
RECT | Rectification | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20151031 |
|
EXPY | Termination of patent right or utility model |