CN201869432U - Circuit board with die cut line - Google Patents
Circuit board with die cut line Download PDFInfo
- Publication number
- CN201869432U CN201869432U CN2010205598803U CN201020559880U CN201869432U CN 201869432 U CN201869432 U CN 201869432U CN 2010205598803 U CN2010205598803 U CN 2010205598803U CN 201020559880 U CN201020559880 U CN 201020559880U CN 201869432 U CN201869432 U CN 201869432U
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- circuit
- circuit board
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Abstract
The utility model relates to a circuit board with a die cut line. The circuit board is characterized in that a die cut metal foil or a metal plate is used, the partial metal unnecessary for the line is selectively cut away, and a metal connection supporting part is retained; in the next place, a thermosetting adhesive film, or a covering film with a window, or a reproductive adhesive film or an insulation base material with adhesive is stuck to one side where the partial metal is removed by die cutting, or the covering film with the window and the insulation base material with the adhesive are stuck to two sides where the partial metal is removed by die cutting, the retained metal connection supporting part is removed by die cutting, and then the circuit board with the die cut line is formed. The circuit board has the advantages of low cost, high efficiency and no etching; compared with the traditional production method of the circuit board, the production method of the circuit board with the die cut line is a very environmental-friendly, energy-saving and material-saving new technology.
Description
Technical field
The utility model belongs to circuit-board industry, takes cross cutting metal forming or metallic plate, optionally cuts away the unwanted part metals of circuit, keeps metal and connects support level.Be bonded in the die-cut one side of getting rid of part metals or with the coverlay of windowing and be with the insulating substrate of glue to fit simultaneously to be bonded in die-cut two sides of getting rid of part metals with the thermosetting glued membrane or with the coverlay that has window or with reprinting glued membrane or fitting then with the insulating substrate of band glue, remove that metal that removes reservation with die cuts and connect support level, be made into circuit board with cross cutting circuit.
Background technology
Traditional circuit board lead all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.
The employing that the inventor applies for is before this also put a series of inventions and the utility model patent of flat conductor circuit board manufacturing, all needs to use the gap bridge conducting, and for example: printing conductive inks realize passing a bridge conducting or welding conductors realized the conducting etc. of passing a bridge.Many gap bridge conductings can also beat some discounts for reliability of products.
The utility model is directly to take to make the production circuit board with die-cut metal forming of mould or metallic plate according to the characteristics of the big circuit board of the simple consumption of some circuits, without etching, the conducting of also need not passing a bridge, and low cost of manufacture, efficient are very high, can be used for the LED field, and be widely used in various LED products.Be that the inventor invents usefulness and puts the technological innovation again afterwards of flat conductor circuit board manufacturing.
The utility model content
The utility model relates to the circuit board with cross cutting circuit.Particularly, take cross cutting metal forming or metallic plate, optionally cut away the unwanted part metals of circuit, keep metal and connect support level.Be bonded in the die-cut one side of getting rid of part metals or with the coverlay of windowing and be with the insulating substrate of glue to fit simultaneously to be bonded in die-cut two sides of getting rid of part metals with the thermosetting glued membrane or with the coverlay that has window or with reprinting glued membrane or fitting then with the insulating substrate of band glue, remove that metal that removes reservation with die cuts and connect support level, be made into circuit board with cross cutting circuit.
The circuit board that the utility model is made, cost is low, and the efficient height need not etching, compares with traditional circuit board manufacturing, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.
According to one side of the present utility model, a kind of circuit board with cross cutting circuit is provided, comprising:, on this blank circuit, keep metal and connect support level by the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed with cross cutting circuit; The thermosetting glued membrane; And insulating substrate; Wherein, the bonding described blank circuit of the one side of described thermosetting glued membrane, the bonding described insulating substrate of the reverse side of described thermosetting glued membrane; And, on described blank circuit and described thermosetting glued membrane, be formed with the excision mouth.
According on the other hand of the present utility model, a kind of circuit board with cross cutting circuit is provided, comprising:, on this blank circuit, keep metal and connect support level by the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed with cross cutting circuit; Have the coverlay of window; And insulating substrate; Wherein, the bonding described coverlay of the one side of described blank circuit, and the bonding described insulating substrate of the reverse side of described blank circuit; And, on described blank circuit and described coverlay, be formed with the excision mouth.
According on the other hand of the present utility model, a kind of circuit board with cross cutting circuit is provided, comprising:, on this blank circuit, keep metal and connect support level by the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed with cross cutting circuit; Reprint glued membrane; With insulating substrate with a surface with glue; Wherein, the bonding described reprinting glued membrane of the one side of described blank circuit, and the surface with glue of the bonding described insulating substrate of reverse side of described blank circuit; Wherein, on described blank circuit, be formed with the excision mouth; And wherein said reprinting glued membrane is torn off after described blank circuit and described insulating substrate are bonding.
According on the other hand of the present utility model, a kind of circuit board with cross cutting circuit is provided, comprising:, on this blank circuit, keep metal and connect support level by the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed with cross cutting circuit; Insulating substrate with band glue; Wherein, described blank circuit bonds together with the insulating substrate of band glue; And, wherein on the insulating substrate of described blank circuit and described band glue, be formed with the excision mouth.
According on the other hand of the present utility model, a kind of circuit board with cross cutting circuit is provided, comprising:, on this blank circuit, keep metal and connect support level by the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed with cross cutting circuit; Have the coverlay of window; Insulating substrate with band glue; Wherein, the bonding described coverlay of the one side of described blank circuit, and the bonding described insulating substrate of the reverse side of described blank circuit; And, wherein, on the insulating substrate of the coverlay of described window, described blank circuit and described band glue, be formed with the excision mouth simultaneously.
According to an embodiment of the present utility model, the foregoing circuit plate is flexible PCB or rigid circuit board.
According to another embodiment of the present utility model, the position that needs on the foregoing circuit plate plug-in unit element is installed is provided with the pin holes that mould is die-cut or get out.
According to another embodiment of the present utility model, the length of foregoing circuit plate is greater than 1 meter or smaller or equal to 1 meter.
According to another embodiment of the present utility model, can be provided with solder mask on the foregoing circuit plate, this solder mask is coverlay or welding resistance printing ink.
According to another embodiment of the present utility model, the foregoing circuit plate is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
According to another embodiment of the present utility model, above-mentioned insulating substrate is the metal base or the ceramic base material of epoxy glass base material, phenolic aldehyde base material, polyimide base material, tape insulation glue.
According to another embodiment of the present utility model, the material of above-mentioned metal forming or metallic plate is that copper, iron, steel, aluminium, copper are zinc-plated, copper nickel plating, copper is silver-plated, iron is zinc-plated, iron nickel plating, iron is silver-plated, steel is zinc-plated, steel nickel plating, steel is silver-plated, aluminium is zinc-plated, aluminium nickel plating, aluminium are silver-plated etc., and all have the metal of conductivity.
According to another embodiment of the present utility model, thermosetting glued membrane that semi-solid preparation epoxy glass glued membrane that above-mentioned thermosetting glued membrane is a low discharge glue or Flexible Printed Circuit are used or high heat conduction thermosetting glued membrane.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, and in the accompanying drawings, that all diagrams are expressed all is single product figure, actual production is the productions that connect together of a plurality of products, cuts into single product at last.
Fig. 1 is the schematic diagram of metal forming or metallic plate 1a.
Fig. 2 keeps metal and connects support level 2a for optionally to cut away the unwanted part metals 7 of circuit with mould or cutting die, forms the schematic diagram of blank circuit 1b.
Fig. 3 is for being adhesively fixed blank circuit 1b or with the be adhesively fixed schematic diagram of blank circuit 1b of insulating substrate 4a with thermosetting glued membrane 3a.Wherein, Fig. 3 (A) is the structural representation that shapes of Fig. 3, and Fig. 3 (B) is the decomposing schematic representation of structure shown in Fig. 3 A.
Fig. 4 cuts the schematic diagram that metal connects support level 2a for the blank circuit 1b that is adhesively fixed with thermosetting glued membrane 3a with mould.Wherein, Fig. 4 (A) is the structural representation that shapes of Fig. 4, and Fig. 4 (B) is the decomposing schematic representation of structure shown in Fig. 4 A.
Fig. 5 is for adhering to the die-cut metal forming of part metals or the structural representation of the circuit board that metallic plate is made removed with the thermosetting glued membrane.Wherein, Fig. 5 (A) is the structural representation that shapes of Fig. 5, and Fig. 5 (B) is the decomposing schematic representation of structure shown in Fig. 5 A.
Fig. 6 is the schematic diagram of the blank circuit 1b that is adhesively fixed with the coverlay 5a that has window 6.Wherein, Fig. 6 (A) is the structural representation that shapes of Fig. 6, and Fig. 6 (B) is the decomposing schematic representation of structure shown in Fig. 6 A.
Fig. 7 cuts the schematic diagram that metal connects support level 2a for the blank circuit 1b that is adhesively fixed with the coverlay 5a that has window 6 with mould.Wherein, Fig. 7 (A) is the structural representation that shapes of Fig. 7, and Fig. 7 (B) is the decomposing schematic representation of structure shown in Fig. 7 A.
Fig. 8 is for adhering to the die-cut metal forming of part metals or the structural representation of the circuit board that metallic plate is made removed with the coverlay that has window.Wherein, Fig. 8 (A) is the structural representation that shapes of Fig. 8, and Fig. 8 (B) is the decomposing schematic representation of structure shown in Fig. 8 A.
Fig. 9 is for being adhered fixed the schematic diagram of blank circuit 1b with reprinting glued membrane 8a.Wherein, Fig. 9 (A) is the structural representation that shapes of Fig. 9, and Fig. 9 (B) is the decomposing schematic representation of structure shown in Fig. 9 A.
Figure 10 cuts the schematic diagram that metal connects support level 2a for the blank circuit 1b that is adhesively fixed with reprinting film 8a with mould.Wherein, Figure 10 (A) is the structural representation that shapes of Figure 10, and Figure 10 (B) is the decomposing schematic representation of structure shown in Figure 10 A.
Figure 11 is for reprinting the schematic diagram that glued membrane 8b, circuit 1c and insulating substrate 4a fit together.Wherein, Figure 11 (A) is the structural representation that shapes of Figure 11, and Figure 11 (B) is the decomposing schematic representation of structure shown in Figure 11 A.
Figure 12 tears the schematic diagram of reprinting glued membrane 8b.
Figure 13 is for adhering to the die-cut metal forming of part metals or the structural representation of the circuit board that metallic plate is made removed with reprinting glued membrane.
Figure 14 is for adhering to the die-cut metal forming of part metals or the circuit board that metallic plate is made removed with band glue insulating substrate.Wherein, Figure 14 (A) is the structural representation that shapes of Figure 14, and Figure 14 (B) is the decomposing schematic representation of structure shown in Figure 14 A.
Figure 15 is bonded in the coverlay 5a that has window 6 and is with the schematic diagram of the centre of glue insulating substrate 4a for circuit 1b solidifies.Wherein, Figure 15 (A) is the structural representation that shapes of Figure 15, and Figure 15 (B) is the decomposing schematic representation of structure shown in Figure 15 A.
Figure 16 is bonded in the structural representation of the circuit board that die-cut two sides of getting rid of part metals is made into for fitting simultaneously with the coverlay of windowing and the insulating substrate of band glue.Wherein, Figure 16 (A) is the structural representation that shapes of Figure 16, and Figure 16 (B) is the decomposing schematic representation of structure shown in Figure 16 A.
Embodiment
To be described in more detail the specific embodiment with circuit board of cross cutting circuit of the present utility model below.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.
1, cross cutting is made the blank circuit
With copper coin 1a (as shown in Figure 1), when thickness is 0.1～5mm, optionally cut away the unwanted part metals 7 of circuit with pre-designed mould; When thickness is 0.05～0.2mm, optionally cut away the unwanted part metals 7 of circuit with pre-designed cutting die, keep metal and connect support level 2a, the copper coin circuit is not scattered, unshift, be made into blank circuit 1b (as shown in Figure 2).
2, cross cutting is made circuit
Tear the release liners of one side and the blank circuit 1b that is made into to good position with thermosetting glued membrane 3a, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, the blank that is adhesively fixed circuit 1b (as shown in Figure 3).Remove with die cuts then and disconnect metal connection support level 2a, become the circuit 1c that excision mouthful 2b is arranged, the glued membrane of thermosetting simultaneously 3a and metal connect that the corresponding position of support level 2a is also punched to be fallen the excision window 2b.1 of an identical size and become the thermosetting glued membrane 3b (as shown in Figure 4) that the excision mouth is arranged.
The release liners of tearing thermosetting glued membrane 3b another side is aimed at the position and is superimposed together with insulating substrate 4a, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, on the face of line layer 1c and insulating substrate 4a, all cover one deck release film, with 150 ℃ to 180 ℃ hot pressing in 90 seconds to 180 seconds, solidified 30 minutes to 60 minutes for 150 ℃ to 160 ℃ with baking box again, the curing that realizes line layer 1c, thermosetting glued membrane 3b and base material 4a is bonding, is made into the circuit board (as shown in Figure 5) with cross cutting circuit.
The coverlay that embodiment 2, usefulness have had window adheres to the die-cut metal forming of part metals or the circuit board that metallic plate is made removed
With the coverlay 5a that has window 6 and the blank circuit 1b that is made into to good position, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, preliminary fixing realization blank circuit 1b (as shown in Figure 6).
Remove the disconnection metal with die cuts and connect support level 2a, become the circuit 1c that excision mouthful 2b is arranged, the coverlay 5a that has had window 6 simultaneously and metal connect that the corresponding position of support level 2a is also punched to be fallen the excision window 2b.2 of an identical size and become the coverlay 5b (as shown in Figure 7) that has window that the excision mouth is arranged.
Insulating substrate 4a and circuit 1c with band glue face good position, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, on the face of coverlay 5b that has window 6 and insulating substrate 4a, all cover one deck release film, with 150 ℃ to 180 ℃ hot pressing in 90 seconds to 180 seconds, solidified 30 minutes to 60 minutes for 150 ℃ to 160 ℃ with baking box then, the curing that realizes having had coverlay 5b, the circuit 1c of window 6 and insulating substrate 4a is bonding, is made into the circuit board (as shown in Figure 8) with cross cutting circuit.
To good position, be adhered fixed blank circuit 1b (as shown in Figure 9) with the blank circuit 1b that reprints glued membrane 8a and be made into.Remove with die cuts then and disconnect metal connection support level 2a, become the circuit 1c that excision mouthful 2b is arranged, reprint glued membrane 8a simultaneously and be connected the also punched excision window 2b.3 of falling in the corresponding position of support level 2a with metal and become the reprinting glued membrane 8b (as shown in figure 10) that the excision mouth is arranged.
The metal covering of circuit 1c is aimed at the position with the insulating substrate 4a of band glue and is superimposed together, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds (as shown in figure 11), tear to remove and reprint glued membrane 8b (as shown in figure 12), on the face of circuit 1c and insulating substrate 4a, all be covered with one deck release film, with 150 ℃ to 180 ℃ hot pressing in 90 seconds to 180 seconds, solidified 30 minutes to 60 minutes for 150 ℃ to 160 ℃ with baking box then, the curing that realizes circuit 1c and insulating substrate 4a is bonding, is made into the circuit board (as shown in figure 13) with cross cutting circuit.
With band glue insulating substrate 4a and the blank circuit 1b that is made into to good position, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, on the face of blank circuit 1b and band glue insulating substrate 4a, all cover one deck release film then, with 150 ℃ to 180 ℃ hot pressing in 90 seconds to 180 seconds, solidified 30 minutes to 60 minutes for 150 ℃ to 160 ℃ with baking box again, the curing that realizes blank circuit 1b and band glue insulating substrate 4a is bonding, fixedly blank circuit 1b (as shown in Figure 3).Remove with die cuts then and disconnect metal connection support level 2a, become the circuit 1c that excision mouthful 2b is arranged, connect with glue insulating substrate 4a and metal simultaneously that the corresponding position of support level 2a is also punched to be fallen the excision window 2b.4 of an identical size and become the band glue insulating substrate 4b that excision mouthful is arranged, be made into circuit board (as shown in figure 14) with cross cutting circuit.
Embodiment 5, fitting simultaneously with the insulating substrate of band glue with the coverlay of windowing is bonded in the circuit board that die-cut two sides of getting rid of part metals is made into
With the coverlay 5a that has window 6, the blank circuit 1b that is made into, band glue insulating substrate 4a good position is superimposed together, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, tentatively be adhesively fixed, on the face of coverlay 5a that has window 6 and band glue insulating substrate 4a, all cover one deck release film then, with 150 ℃ to 180 ℃ hot pressing in 90 seconds to 180 seconds, solidified 30 minutes to 60 minutes for 150 ℃ to 160 ℃ with baking box again, circuit 1b curing is bonded in coverlay 5a that has window 6 and the centre (as shown in figure 15) of being with glue insulating substrate 4a.Remove with die cuts then and disconnect metal connection support level 2a, become the circuit 1c that excision mouthful 2b is arranged, simultaneously is connected the corresponding position of support level 2a, has had that the coverlay 5a of window 6 is also punched to be fallen the excision window 2b.2 of an identical size and become the coverlay 5b that has window 6 that the excision mouth is arranged with metal; Fall the excision window 2b.4 of an identical size and become the band glue insulating substrate 4b that excision mouthful is arranged with band glue insulating substrate 4a is also punched, be made into circuit board (as shown in figure 16) with cross cutting circuit.
That all diagrams are expressed all is single product figure, and actual production is the productions that connect together of a plurality of products, cuts into single product at last.
Below in conjunction with the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (10)
1. circuit board with cross cutting circuit comprises:
By the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed, on this blank circuit, remain with metal and connect support with cross cutting circuit;
The thermosetting glued membrane; With
Insulating substrate;
Wherein, the bonding described blank circuit of the one side of described thermosetting glued membrane, the bonding described insulating substrate of the reverse side of described thermosetting glued membrane; And
Wherein, on described blank circuit and described thermosetting glued membrane, form the excision mouth.
2. circuit board with cross cutting circuit comprises:
By the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed, on this blank circuit, remain with metal and connect support with cross cutting circuit;
Have the coverlay of window; With
Insulating substrate;
Wherein, the bonding described coverlay of the one side of described blank circuit, and the bonding described insulating substrate of the reverse side of described blank circuit; And
Wherein, on described blank circuit and described coverlay, be formed with the excision mouth.
3. circuit board with cross cutting circuit comprises:
By the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed, on this blank circuit, remain with metal and connect support with cross cutting circuit;
Reprint glued membrane; With
Insulating substrate with a surface with glue;
Wherein, the bonding described reprinting glued membrane of the one side of described blank circuit, and the surface with glue of the bonding described insulating substrate of reverse side of described blank circuit;
Wherein, on described blank circuit, be formed with the excision mouth; And
Wherein, described reprinting glued membrane is torn off after described blank circuit and described insulating substrate are bonding.
4. circuit board with cross cutting circuit comprises:
By the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed, on this blank circuit, remain with metal and connect support with cross cutting circuit; With
The insulating substrate of band glue;
Wherein, described blank circuit bonds together with the insulating substrate of band glue; And
Wherein, on the insulating substrate of described blank circuit and described band glue, be formed with the excision mouth.
5. circuit board with cross cutting circuit comprises:
By the die-cut metal forming of part metals or the blank circuit that metallic plate forms removed, on this blank circuit, remain with metal and connect support with cross cutting circuit;
Have the coverlay of window; With
The insulating substrate of band glue;
Wherein, the bonding described coverlay of the one side of described blank circuit, and the bonding described insulating substrate of the reverse side of described blank circuit; And
Wherein, on the insulating substrate of the coverlay of described window, described blank circuit and described band glue, be formed with the excision mouth simultaneously.
6. according to each described circuit board among the claim 1-5, it is characterized in that described circuit board is flexible PCB or rigid circuit board.
7. according to each described circuit board among the claim 1-5, it is characterized in that the position that needs on the described circuit board plug-in unit element is installed is provided with the pin holes that mould is die-cut or get out.
8. according to each described circuit board among the claim 1-5, it is characterized in that the length of described circuit board is greater than 1 meter or smaller or equal to 1 meter.
9. according to claim 1,3 or 4 described circuit boards, it is characterized in that described circuit board is provided with solder mask, described solder mask is coverlay or welding resistance printing ink.
10. circuit board according to claim 1 is characterized in that, described circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205598803U CN201869432U (en) | 2010-10-12 | 2010-10-12 | Circuit board with die cut line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205598803U CN201869432U (en) | 2010-10-12 | 2010-10-12 | Circuit board with die cut line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201869432U true CN201869432U (en) | 2011-06-15 |
Family
ID=44140572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205598803U Expired - Lifetime CN201869432U (en) | 2010-10-12 | 2010-10-12 | Circuit board with die cut line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201869432U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN102630119A (en) * | 2011-06-03 | 2012-08-08 | 田茂福 | LED circuit board and manufacturing method thereof |
| CN103256514A (en) * | 2013-05-21 | 2013-08-21 | 上海鼎晖科技有限公司 | Linear LED light source |
| WO2013155693A1 (en) * | 2012-04-19 | 2013-10-24 | Zhang Yu | Circuit board |
| CN103427146A (en) * | 2012-05-17 | 2013-12-04 | 深圳市嘉之宏电子有限公司 | Mobile phone antenna plate producing method |
| CN104602455A (en) * | 2014-12-31 | 2015-05-06 | 广州兴森快捷电路科技有限公司 | Package substrate single-surface solder resisting plate shape-milling method |
| CN105090880A (en) * | 2014-05-23 | 2015-11-25 | 重庆四联光电科技有限公司 | Emergency lighting fluorescent lamp and manufacturing method thereof |
| CN105792534A (en) * | 2014-12-23 | 2016-07-20 | 芜湖德豪润达光电科技有限公司 | Manufacturing method of unetched circuit board and unetched circuit board |
| CN109379846A (en) * | 2018-10-09 | 2019-02-22 | 信丰迅捷兴电路科技有限公司 | A kind of novel flexible circuit board double hollow out circuit manufacturing method |
| CN114375102A (en) * | 2022-02-10 | 2022-04-19 | 业成科技（成都）有限公司 | Method for manufacturing patterned circuit |
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2010
- 2010-10-12 CN CN2010205598803U patent/CN201869432U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630119A (en) * | 2011-06-03 | 2012-08-08 | 田茂福 | LED circuit board and manufacturing method thereof |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| WO2013155693A1 (en) * | 2012-04-19 | 2013-10-24 | Zhang Yu | Circuit board |
| CN103427146A (en) * | 2012-05-17 | 2013-12-04 | 深圳市嘉之宏电子有限公司 | Mobile phone antenna plate producing method |
| CN103427146B (en) * | 2012-05-17 | 2015-07-01 | 深圳市嘉之宏电子有限公司 | Mobile phone antenna plate producing method |
| CN103256514A (en) * | 2013-05-21 | 2013-08-21 | 上海鼎晖科技有限公司 | Linear LED light source |
| CN105090880A (en) * | 2014-05-23 | 2015-11-25 | 重庆四联光电科技有限公司 | Emergency lighting fluorescent lamp and manufacturing method thereof |
| CN105792534A (en) * | 2014-12-23 | 2016-07-20 | 芜湖德豪润达光电科技有限公司 | Manufacturing method of unetched circuit board and unetched circuit board |
| CN104602455A (en) * | 2014-12-31 | 2015-05-06 | 广州兴森快捷电路科技有限公司 | Package substrate single-surface solder resisting plate shape-milling method |
| CN104602455B (en) * | 2014-12-31 | 2017-11-03 | 广州兴森快捷电路科技有限公司 | Package substrate one side anti-pad milling contour processing method |
| CN109379846A (en) * | 2018-10-09 | 2019-02-22 | 信丰迅捷兴电路科技有限公司 | A kind of novel flexible circuit board double hollow out circuit manufacturing method |
| CN114375102A (en) * | 2022-02-10 | 2022-04-19 | 业成科技（成都）有限公司 | Method for manufacturing patterned circuit |
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Granted publication date: 20110615 |