CN204272493U - A kind of flexible LED substrate - Google Patents
A kind of flexible LED substrate Download PDFInfo
- Publication number
- CN204272493U CN204272493U CN201420861218.1U CN201420861218U CN204272493U CN 204272493 U CN204272493 U CN 204272493U CN 201420861218 U CN201420861218 U CN 201420861218U CN 204272493 U CN204272493 U CN 204272493U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- pet film
- line
- insulated substrate
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of flexible LED substrate, insulated substrate is provided with the Copper Foil of die-cut good circuit, described Copper Foil is provided with PET film, described PET film and Copper Foil, is equipped with thermosetting glue-line between insulated substrate and Copper Foil, and described insulated substrate and PET film are bonded by thermosetting glue-line and Copper Foil.The utility model reduces close to symmetrical structure the possibility that upper and lower PET film is bending to certain one end in later stage thermal histories by upper and lower, in addition, the utility model, without the need to this one deck of ink, has saved cost, and the utility model is by one-step punching, therefore contraposition is neat.
Description
Technical field
The utility model relates to LED field, particularly relates to a kind of flexible LED substrate.
Background technology
LED refers to and LED lamp bead is welded on flexible circuitry substrate by the mode by welding, be assembled into banded FPCB (Flexible Printed Circuit Board flexible print circuit board), because its shape of product resembles a strap, can any shape be bent to arbitrarily and gain the name.Its part mainly contains FPCB, SMD lamp pearl, resistance.
Flexible PCB (Flexible Printed Circuit Board) is called for short " soft board ", FPC is commonly called as in industry, be the printed circuit board (PCB) made with flexible insulating substrate (mainly polyimides or polyester film), there is the advantage that many rigid printed circuit boards do not possess.Such as it can free bend, winding, folding.Utilize FPC greatly can reduce the volume of electronic product, be suitable for the needs of electronic product to high density, miniaturization, highly reliable future development.Therefore, FPC is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
Flexible PCB divides according to the number of plies of copper-foil conducting electricity, is divided into lamina, doubling plate, multi-layer sheet, double sided board etc.Existing doubling plate is be respectively equipped with PI film at the tow sides of metal forming, is combined between PI film and metal forming by Wear Characteristics of Epoxy Adhesive, then Tu one deck ink on PI film, and namely have 7 Rotating fields, cost compare is high.And due to the character of PI film and epoxy glue, the conventional flex LED-baseplate be prepared from can only store under cryogenic, and the life-span is short.In addition, flexible PCB mostly is employing etching technique, and more or less circuit has irregular edge.
Application number be 201010232537.2 Chinese patent " adopting the method for juxtaposed wire producing single-sided circuit board " disclose and a kind ofly adopt juxtaposed flat conductor to make the method for single-sided circuit board, directly with after the coverlay having pad openings and juxtaposed flat conductor heat pressure adhesive, excision flat conductor needs the position disconnected, then be pressed together on has on the board substrate of adhesivity together, passes a bridge to connect to adopt printing conductive inks or welding conductors to connect.Can find out, this patent covers epiphragma many parallel after heat side by side of flat conductor, can only be connected by connecting bridge between adjacent two parallel circuits, so complicated circuit design can not be used for, particularly turn and connect more circuit design, and connecting bridge is more, all realized by welding, be difficult to the permanent stability guaranteeing pad, easily affect use because of rosin joint, in addition, this patent complex process, need after flat conductor hot pressing to excise the position disconnected, and then press on board substrate, and then be welded to connect bridge, technique is once complexity, production capacity is just low, and under the method can only be applicable to the simple situation of circuit, be not suitable for complicated circuit design, cannot wide popularization and application.
Application number be 201020559880.3 Chinese patent " there is the circuit board of die cut line " disclose a kind of circuit board with die cut line, a kind of circuit board carries out the unwanted part metals of excision circuit by die-cut, but remain with metal and connect support level, then thermosetting glued membrane is used, or with having the coverlay of window, or with reprinting glued membrane, or be bonded in the die-cut one side getting rid of part metals with the insulating substrate laminating being band glue, or to fit with the insulating substrate of band glue with the coverlay of windowing simultaneously and be bonded in die-cut two sides of getting rid of part metals, that metal removing reservation with mould excision connects support level, be made into the circuit board with die cut line.This patent adopts die cutting method to carry out the repeatedly die-cut of circuit board, structure is provided with connection support level, is finally to cut away connection support level, and overall structure is that thermosetting glued membrane and insulation insulating substrate all have die-cut mouth, and whole preparation process is repeatedly die-cut, there is the defect that contraposition is uneven.
In sum, because the preparation method adopted is different, the structure of prepared flexible circuit board is all different, flexible PCB circuit as etching can simply can be complicated, but line edges has not neat place unavoidably, as the flat conductor hot pressing coverlay that the application number Chinese patent " adopting the method for juxtaposed wire producing single-sided circuit board " that is 201010232537.2 adopts, from structure, circuit board positive and negative all has otch, intermediate layer is a rule flat conductor, article two, the connecting bridge having some to weld between flat conductor, except circuit is simple also unsightly, as the die cutting technique that the application number Chinese patent " having the circuit board of die cut line " that is 201020559880.3 adopts, same, circuit board line is simple, positive and negative all has otch, its copper foil layer is parallel splicing one by one, and bending circuit can only be put up a bridge by welding by two parallel straight path, unsightly, in addition, cause contraposition not accurate due to repeatedly die-cut.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides the LED-baseplate that a kind of structure is simple, line edges is neat, contraposition is neat, the life-span is long.
Above-mentioned purpose of the present utility model is achieved by following technical solution:
A kind of flexible LED substrate, insulated substrate is provided with the Copper Foil of die-cut good circuit, described Copper Foil is provided with PET film, described PET film and Copper Foil, between insulated substrate and Copper Foil, be equipped with thermosetting glue-line, described insulated substrate and PET film are bonded by thermosetting glue-line and Copper Foil, and described insulated substrate is smooth plane layer.PET film easily shrinks tilting at high temperature, so do not adopted by the coverlay as flexible LED substrate, and polyester adhesive viscosity is large, and PET film volume contraction under the high temperature conditions can be reduced, the utility model overcomes the defect of PET film by arranging polyester glue-line, and the utility model is 5 Rotating fields, because the physical property of PET film and insulated substrate is close, structurally approximate take Copper Foil as the symmetrical structure up and down of benchmark, thermosetting glue-line viscosity is large on the one hand, high temperature resistant PET film is clung under middle hot conditions, reduce the trend of high temperature resistant PET film heat shrinkable, thus reduce the possibility that high temperature resistant PET film shrinks tilting, on the other hand, the utility model structure is near symmetrical up and down, the thermal deformation trend of up-down structure is very approximate and cancel out each other, thus reduce the possibility that PET film is bending to certain one end in later stage thermal histories.In addition, the high temperature resistant PET film of employing is horizontal in preprocessing process in early stage/vertical draw ratio is 2.8, and less draw ratio decreases the ratio of high temperature resistant PET film at later stage heat shrinkable.And the utility model is without the need to this one deck of ink, save cost, and the circuit on Copper Foil of the present utility model cuts Copper Foil for adopting cutter, detailed process is that the edge of a knife of cutter is arranged to the shape corresponding with circuit, then carry out die-cut, only need one-step punching, therefore contraposition is neat, line edges is neat.
Further, described PET film is provided with the die-cut mouth corresponding with the circuit on Copper Foil.
Described insulated substrate is polyimide layer or polyester film.Described thermosetting glue-line is polyester glue-line.What tradition adopted is PI film and epoxy glue, and due to the character of PI film and epoxy glue, the conventional flex circuits plate be prepared from can only store under cryogenic, and the life-span is short.And replace just overcoming this problem with PET film and polyester glue-line.
Described hot-setting adhesive layer thickness is 20 ~ 30 μm.Described insulated substrate thickness is 40 ~ 60 μm.
The preparation process of described flexible LED substrate comprises the steps:
S1. cutter are designed: the edge of a knife of cutter is arranged to the shape corresponding with circuit;
S2. paste in advance: under the condition of 90 DEG C, Copper Foil is attached in advance on the insulating substrate coating hot-setting adhesive film in advance;
S3. continuous cutting: control the punching depth of cutter and the consistency of thickness of Copper Foil, the line arrangement of die-cut rear stripping waste material and plastic Copper Foil, die-cut of described insulating substrate is cut off Copper Foil and does not cut and insulating substrate; Corresponding, it is die-cut that coverlay is stained with the laggard row of thermosetting glued membrane, and coverlay is worn in the punching that is punched to of coverlay, described coverlay is the die-cut mouth corresponding with the circuit on Copper Foil;
S4. contraposition: the release liners on coverlay torn, then by coverlay and die-cut good Copper Foil contraposition;
S5. hot-press solidifying: after contraposition, hot-press solidifying makes flexible LED substrate, the temperature of described hot pressing is 140 DEG C, and the condition of solidification is solidify 30 minutes under 130 DEG C of conditions after hot pressing.
From this preparation process, the insulated substrate of obtained flexible LED substrate is smooth plane layer, without any otch, and the circuit board that the Chinese patent " having the circuit board of die cut line " that application number is 201020559880.3 discloses is due to repeatedly die-cut, bottom is multiple die-cut mouths, affects attractive in appearance on the one hand, on the other hand, repeatedly die-cutly just need repeatedly contraposition, cause precision inadequate, efficiency is low.
Compared with prior art, the beneficial effects of the utility model are as follows:
(1) reduce close to symmetrical structure the possibility that upper and lower PET film is bending to certain one end in later stage thermal histories by upper and lower, in addition, the utility model, without the need to this one deck of ink, has saved cost, and the utility model is by one-step punching, therefore contraposition is neat;
(2) adopt PET film and polyester glue-line to replace PI film and epoxy adhesive layer, can store at normal temperatures, the life-span is long;
(3) insulated substrate is smooth plane layer, without any otch, attractive in appearance.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model; Wherein, 1, Copper Foil; 2, thermosetting glue-line; 3, PET film; 4, insulated substrate.
Embodiment
Below in conjunction with Figure of description and specific embodiment the utility model made and elaborating further, but embodiment does not limit in any form the utility model.
Embodiment 1
A kind of flexible LED substrate, insulated substrate 4 is provided with the Copper Foil 1 of die-cut good circuit, described Copper Foil 1 is provided with PET film 3, described PET film 3 and Copper Foil 1, insulated substrate 4 and and Copper Foil 1 between be equipped with thermosetting glue-line 2, described insulated substrate 4 and PET film 3 are bonded by thermosetting glue-line 2 and Copper Foil 1.Described PET film 3 is provided with the die-cut mouth corresponding with the circuit on Copper Foil 1.
Described thermosetting glue-line 2 is polyester glue-line.Described insulated substrate 4 is polyimide layer or polyester film.
Described hot-setting adhesive 2 layer thickness is 25 μm.Described insulated substrate 4 thickness is 50 μm.
Claims (6)
1. a flexible LED substrate, it is characterized in that, insulated substrate is provided with the Copper Foil of die-cut good circuit, described Copper Foil is provided with PET film, described PET film and Copper Foil, between Copper Foil and insulated substrate, be equipped with thermosetting glue-line, described insulated substrate and PET film are bonded by thermosetting glue-line and Copper Foil, and described insulated substrate is smooth plane layer.
2. flexible LED substrate according to claim 1, is characterized in that, described PET film is provided with the die-cut mouth corresponding with the circuit on Copper Foil.
3. flexible LED substrate according to claim 1, is characterized in that, described thermosetting glue-line is polyester glue-line.
4. flexible LED substrate according to claim 1, is characterized in that, described insulated substrate is polyimide layer or polyester film.
5. flexible LED substrate according to claim 1, is characterized in that, described hot-setting adhesive layer thickness is 20 ~ 30 μm.
6. flexible LED substrate according to claim 1, is characterized in that, described insulated substrate thickness is 40 ~ 60 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420861218.1U CN204272493U (en) | 2014-12-31 | 2014-12-31 | A kind of flexible LED substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420861218.1U CN204272493U (en) | 2014-12-31 | 2014-12-31 | A kind of flexible LED substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272493U true CN204272493U (en) | 2015-04-15 |
Family
ID=52807337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420861218.1U Active CN204272493U (en) | 2014-12-31 | 2014-12-31 | A kind of flexible LED substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204272493U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107422400A (en) * | 2017-08-14 | 2017-12-01 | 信利半导体有限公司 | A kind of method for die cutting of diaphragm integration |
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN109435369A (en) * | 2018-11-20 | 2019-03-08 | 鹤山市众晟科技有限公司 | The manufacturing method and LED light bar of LED light bar |
| CN110925636A (en) * | 2019-12-03 | 2020-03-27 | 深圳市腾鑫精密胶粘制品有限公司 | Energy-saving lamp strip capable of being cut at will and preparation method thereof |
| CN114710888A (en) * | 2022-04-13 | 2022-07-05 | 深圳市安元达电子有限公司 | FPC structure and preparation method thereof |
-
2014
- 2014-12-31 CN CN201420861218.1U patent/CN204272493U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107422400A (en) * | 2017-08-14 | 2017-12-01 | 信利半导体有限公司 | A kind of method for die cutting of diaphragm integration |
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN107911939B (en) * | 2017-11-24 | 2024-05-10 | 惠州市鹏程电子科技有限公司 | Flexible printed circuit board |
| CN109435369A (en) * | 2018-11-20 | 2019-03-08 | 鹤山市众晟科技有限公司 | The manufacturing method and LED light bar of LED light bar |
| CN110925636A (en) * | 2019-12-03 | 2020-03-27 | 深圳市腾鑫精密胶粘制品有限公司 | Energy-saving lamp strip capable of being cut at will and preparation method thereof |
| CN114710888A (en) * | 2022-04-13 | 2022-07-05 | 深圳市安元达电子有限公司 | FPC structure and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204272493U (en) | A kind of flexible LED substrate | |
| CN105813392B (en) | A kind of preparation method of flexible LED substrate | |
| CN206100596U (en) | Contain LED lamp band wire way matrix group that multi -functional aluminium foil was made | |
| CN201860505U (en) | Combined two-sided PCB | |
| CN102340928B (en) | Single-sided circuit board made by arranging flat wires side by side and making method thereof | |
| CN102340931B (en) | Method for making single-sided circuit board with flat wires arranged side by side | |
| CN103068185A (en) | Manufacturing method of printed circuit board soft-hard combination substrate flexible area | |
| CN201928518U (en) | Double-sided circuit board manufactured by indirectly adhering or attracting juxtaposed flat leads | |
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| CN102340930B (en) | Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film | |
| CN104202922A (en) | Method for manufacturing rigid-flex printed circuit board with rigid areas different in thickness | |
| CN201928521U (en) | Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires | |
| CN201928519U (en) | Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film | |
| CN106804092A (en) | A kind of FPC and preparation method thereof | |
| CN204272492U (en) | A kind of single-sided flexible circuit board | |
| CN102340932B (en) | Method of using reproduced glue film and parallel arranged flat wire to make single-sided circuit board | |
| CN105898995A (en) | Preparation method for double-layer LED high-voltage circuit board | |
| CN102883524A (en) | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method | |
| CN102307433B (en) | Method for manufacturing flexible printed circuit board | |
| CN201928520U (en) | Double-face circuit board made by bonding insulation layer and solder mask and juxtaposing flat guide lines | |
| CN204272494U (en) | A kind of flexible circuit board | |
| CN104735923A (en) | Method for manufacturing rigidity and flexibility combined plate | |
| CN201797655U (en) | Double-side circuit board made of parallel flat leads | |
| CN107046766A (en) | Flexible print thin film circuit and system | |
| CN201781677U (en) | Circuit board with flat power wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FOSHAN SHUNDE DISTRICT LEARY ELECTRICAL EQUIPMENT Free format text: FORMER OWNER: GUANGZHOU BAOLIBANG POLYMER MATERIALS CO., LTD. Effective date: 20150821 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150821 Address after: 528325, Foshan Town, Shunde District, Guangdong Province Patentee after: Leary Electrical Equipment Co., Ltd. Address before: 0402, room 13, building 38, Haizhu creative industry garden, No. 510000, Da Wai Road, Guangzhou, Guangdong, Haizhuqu District Patentee before: GUANGZHOU BAOLI BANGDE HIGH POLYMER MATERIAL CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 528325, Foshan Town, Shunde District, Guangdong Province Patentee after: Guangdong Lyle new materials Polytron Technologies Inc Address before: 528325, Foshan Town, Shunde District, Guangdong Province Patentee before: Leary Electrical Equipment Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180502 Address after: 528325 Guangdong 1 Foshan town Shunde District, Longtan Village, Qi Long Road, Da she 9, No. 1 Patentee after: Guangdong Shunde Siry Technology Co., Ltd. Address before: 528325 North Water Industrial Zone, Xing Tan Town, Shunde District, Foshan, Guangdong Patentee before: Guangdong Lyle new materials Polytron Technologies Inc |