CN102595783A - Novel LED circuit board and method - Google Patents
Novel LED circuit board and method Download PDFInfo
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- CN102595783A CN102595783A CN2011102115383A CN201110211538A CN102595783A CN 102595783 A CN102595783 A CN 102595783A CN 2011102115383 A CN2011102115383 A CN 2011102115383A CN 201110211538 A CN201110211538 A CN 201110211538A CN 102595783 A CN102595783 A CN 102595783A
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Abstract
The invention relates to a novel LED circuit board and a method, and provides an LED circuit board comprises a circuit layer directly manufactured by a nickeliferous metal single layer, and cover films respectively covered on the front side and the rear side of the circuit layer. The invention also provides a method for manufacturing the LED circuit board. The method comprises the following steps: a nickeliferous metal single layer is provided; the nickeliferous metal single layer is punched or cut for the first time to form the circuit layer; a reverse cover film is attached to the back side of the circuit layer and then stitched; the circuit layer is punched or cut for the second time to form a rudiment circuit board; and a front cover film is attached to the front side of the rudiment circuit board and then stitched. According to the invention, the structure that a PI layer is clamped between two layers of copper foils of a conventional LED circuit board is directly replaced by a nickeliferous metal single-layer circuit layer, so that the manufacture process and the product structure are simplified, the material cost and the process cost are lowered, the environmental pollution and the energy consumption are reduced, the product welding reliability is improved, the product service life is prolonged and the working current of the LED circuit board is increased.
Description
Technical field
The present invention relates to LED lighting field printed substrate field, be specifically related to a kind of new LED wiring board and preparation method thereof.
Background technology
In the LED wiring board of prior art; For example as shown in Figure 1, the structure of its LED wiring board is that the centre is a layer insulating 6 (for example being processed by typical PI material); Two sides at insulating barrier is respectively equipped with (for example through bonding mode) line layer 3; 7 (for example being typical Copper Foil) are respectively equipped with the covering rete 5,5 (being typically CVL) that (mode of for example bonding, coating, coating or printing) plays protective action in the outside of this two-layer line layer.
The defective of the LED wiring board of this prior art is many-sided.
For example, copper foil layer 3,7 need be adhered on the insulating barrier 6 through for example adhesion technique, and sometimes need lay additional adhesive layer, and the complicacy of processing step will cause the cost of LED wiring board finished product to increase with additional jointing material;
The line construction of copper foil layer 3,7 will realize through etching mode, and the interlayer conduction of copper foil layer 3,7 needs the plating mode plated-through-hole to realize, therefore unavoidably can bring pollution to environment, and its energy consumption be also high;
Copper foil layer 3; 7 with insulating barrier 6, cover rete 5; 5 bonding contraposition unavoidably can have influence on wiring board and/or insulating barrier and/or cover the processing step of rete windowing; Further increase the complexity of its manufacture craft, and possibly have influence on the final reliability of product, and then have influence on the rate of finished products and the real work life-span of product because of its contraposition operation.
Be prone to oxidation when moreover, being exposed to air owing to copper foil layer 3,7; Cause solder joint (or claim pad) oxidation and break down when causing welding electronic component such as LED or even lost efficacy, therefore on the copper foil layer 3,7 of prior art, to enclose coverlay usually; And need be to wiring board copper foil layer 3; 7 the solder joint that exposes carries out Passivation Treatment, and this not only makes manufacturing process complicated, but also can increase cost.Therefore, this area needs a kind of novel wiring board that can simplify technology, and it can cancel passivation process, and improves welding reliability.
In addition, copper foil layer 3,7 is owing to be to adopt copper material to make, and cost is higher, so also needs in this area to adopt other more cheap metal material to make line layer, comprises pad, to reduce the material cost of LED wiring board.
Therefore, press for the LED wiring board that a kind of novel technology is simpler, cost is more cheap in this area, with alleviate or even avoid above-mentioned defective; Simplify manufacture craft and product structure; Reduce cost, reduce environmental pollution and energy consumption, improve reliability of products and real work life-span.
Summary of the invention
In view of the above, the present invention has been proposed.The present invention is intended to solve above technical problem with other.
According to the present invention; The structure of folder PI layer between the two-layer copper in the LED wiring board product of prior art is directly dispensed, and the nickeliferous metal single layer that is replaced with simple non-copper foil layer serves as line layer, has therefore simplified manufacture craft and product structure; Greatly reduce material cost and technology cost; Reduce environmental pollution and energy consumption, improved the soldering reliability and the real work life-span of product, and can increase the operating current of LED wiring board.
According to a further aspect in the invention, disclosed a kind of LED wiring board, having comprised: the line layer of directly processing by nickeliferous metal single layer; Cover the coverlay on the obverse and reverse of said line layer respectively.
According to a preferred embodiment of the invention, said nickeliferous metallic circuit layer directly replaces the two-layer or sandwich construction of existing LED board substrate.
According to another preferred embodiment of the invention, said nickeliferous metal is the aluminium of nickel plating or the aluminium alloy of nickel plating.
According to another preferred embodiment of the invention, said nickeliferous metal is the iron of nickel plating or the ferroalloy of nickel plating.
According to another preferred embodiment of the invention, said line layer is the line layer that is shaped through die-cut, cutting or the said nickeliferous metal single layer of etching.
According to another preferred embodiment of the invention, said line layer comprises the pad of not passivation.
According to another preferred embodiment of the invention, the thickness of said line layer is more than 3 ounces, is preferably 6 ounces or greater than 6 ounces.
According to another preferred embodiment of the invention, said line layer is a line layer directly die-cut by said nickeliferous metal single layer or that cutting forms.
According to another preferred embodiment of the invention, said nickeliferous metal is the aluminium alloy that has the aluminium of nickel laminate layers or have the nickel laminate layers.
According to another preferred embodiment of the invention; The model that can be installed in the LED on the LED wiring board of the present invention comprises one or more in 335,3528,5050 and 5060, and the model that can be installed in the resistance on the LED wiring board of the present invention comprises one or more in 0603,0805 and 0812.
According to a further aspect in the invention, disclosed a kind of method of the LED of making wiring board, having comprised: nickeliferous metal single layer is provided; Through said nickeliferous metal single layer being carried out the die-cut or cutting first time, and form line layer; Paste the reverse side coverlay and carry out pressing at the back side of said line layer; Said line layer is carried out the die-cut or cutting second time, form the blank wiring board; With stick the front coverlay in the front of said blank wiring board and carry out pressing.
According to a preferred embodiment of the invention, said nickeliferous metal is the aluminium of nickel plating or the aluminium alloy of nickel plating, or the ferroalloy of the iron of nickel plating or nickel plating, and said line layer comprises the pad of not passivation.
According to a further aspect in the invention, disclosed a kind of method of the LED of making wiring board, having comprised: nickeliferous metal is provided; Stick the reverse side coverlay at the back side of said nickeliferous metal and carry out pressing; Said nickeliferous metal is carried out etching, form line layer; Paste the front coverlay and carry out pressing in the front of said line layer; With paste the front coverlay in the front of said blank wiring board and carry out pressing.
According to a preferred embodiment of the invention, said nickeliferous metal is the aluminium of nickel plating or the aluminium alloy of nickel plating, or the ferroalloy of the iron of nickel plating or nickel plating, and said line layer comprises the pad of not passivation.
According to another preferred embodiment of the invention, said method also comprises, LED and resistance are installed on said LED wiring board.
In following description, with the details of setting forth one or more embodiment of the present invention to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Through combining following this specification of advantages, it is more obvious that characteristic of the present invention, purpose and advantage will become, and accompanying drawing is described as follows.
Fig. 1 is the partial section of the LED wiring board of prior art, has shown the structure of the LED wiring board of prior art; And
Fig. 2 has shown the New LED wiring board of one embodiment of the invention, has shown the structure of this LED wiring board.
Embodiment
Below will be to be applicable to that the single-sided flexible printed substrate that LED and other element are installed is that specific embodiment comes the present invention is described in more detail.But, should be appreciated that the present invention is not only applicable to single face and double-sided flexible printed circuit board, also be applicable to two-sided rigidity printed substrate (being also referred to as " hardboard " in the industry), and more than the multilayer LED wiring board of two-layer line layer.
In addition, term " double-sided flexible printed circuit board " refers on the two sides of this flexible print circuit board and all is provided with line layer.
Before describing the present invention in detail, it will be appreciated by those skilled in the art that " element " should do the understanding on the most wide in range connotation in this application; Promptly comprise all types of elements that are used for electronic component, electric component or other type of circuit; For example various resistance, the element of various surface mount (SMT) type, the element of support rack type, various high power devices or the like; Comprise great power LED, or the like.
In addition, term " wiring board " and " circuit board " can use in the application with exchanging.
Below in conjunction with accompanying drawing and embodiment the manufacturing process of LED wiring board of the present invention is done further to specify with structure.
The relevant material of tradition LED wiring board
The raw material volume of traditional double-sided flexible printed circuit board is also referred to as the coiled material of copper-clad plate.As shown in Figure 1, Fig. 1 is the partial section of the LED wiring board of prior art, has shown the structure of the LED wiring board of prior art.In the structure of this LED wiring board, typical structure is five layers, promptly; Two-layer line layer 3; 7 (modal is to adopt Copper Foil, can be described as again in the present embodiment and covers copper layer or Copper Foil, and these terms use sometimes interchangeably); And be bonded in the insulating barrier 6 between this two-layer line layer 3,7.Insulating barrier 6 has formed the basal layer of flexible circuit.The outside at this two-layer line layer 3,7 is respectively equipped with the covering rete 5,5 that (mode of for example bonding, coating, coating or printing) plays protective action, and this covering rete for example can be processed by CVL.
Certainly,, in fact, can be respectively equipped with adhesive layer usually with insulating barrier 6, be used for line layer and insulating barrier are glued together at two-layer line layer 3,7 although not shown in Fig. 1.Therefore, under a lot of situations, this LED wiring board structure of prior art is actually seven layers complicated structure.
The material of insulating barrier 6 has many kinds, and wherein the most commonly used is polytetrafluoroethylene, polyimides, polyester and PI (PI) material.Polyimide material has non-flammable, and physical dimension is stable, has advantages of higher tensile strength; And the ability with the welding temperature of bearing, polyester is also referred to as PETG (being called for short PET); Its physical property is similar to polyimides; Have lower dielectric constant, the humidity of absorption is very little, but non-refractory.Polyester demonstrates rigidity in cryogenic applications.These materials all can be used for forming insulating barrier.
In a preferred embodiment of the present invention, adopt PI (PI) material to make insulating barrier.Certainly, those skilled in the art obviously are appreciated that and can adopt any other material well known in the art to make insulating barrier.
Copper Foil generally is suitable among flexible circuit, being used as line layer 5, and it can adopt the mode of electro-deposition (ED), forging.Copper Foil is the material with compliance, can be made into many kinds of thickness and width.The Copper Foil of forging also has the level and smooth characteristics of hard except having pliability, it is suitable for being applied among the occasion that requires dynamic deflection.
In the prior art, traditionally, adoptable aborning material is fine copper or copper alloy, zinc yellow copper for example, and the thickness of Copper Foil is more than the 10Z.If the employing fine copper, then the general requirement of fine copper is a T2 copper.The requirement of copper alloy is generally Tp2 or copper content more than 20%, and remaining composition can be zinc (Zn) or other trace additives.
The basic design of the wiring material layer of LED wiring board of the present invention
According to of the present invention one basic inventive concept, with adopting nickeliferous metal material to replace the copper material of the copper foil circuit layer 3,7 of traditional LED wiring board employing.Through doing like this, both can omit the passivation technology of butt welding point, can reduce production costs greatly again.
In the present invention, term " nickeliferous metal " broadly is defined as and is comprised: nickel; Nickel alloy; Nickel-base alloy; The metal that has nickel laminate layers or nickel alloy lamination layer; The metal that has nickel coating or nickel-alloy coating; Or the like; Wherein, this nickel coating or nickel-alloy coating can be electrodeposited coatings, immersion plating layer, chemical deposit, vapor deposition layer, magnetron sputtering coating of nickel or nickel alloy or the like, and this metal can be any suitable metal or alloy; For example aluminium, aluminium alloy, iron, ferroalloy, ordinary steel, steel alloy, tin, Sn-containing alloy, or the like; This nickel laminate layers or nickel alloy lamination layer are at the heat lamination layer of arranging on the substrate metal, cold rolling laminate layers or are bonded in nickel or the nickel alloy layer on the substrate metal.These all belong in " nickeliferous metal " of the present invention defined scope.
The main design of LED wiring board product of the present invention and technology
As stated; The product of prior art is formed the structure that structure is five layers or seven layers: the centre is a layer insulating; The two sides is respectively line layer (also having the adhesive layer with the insulating barrier pressing in the seven-layer structure respectively), and the outside of this two-layer line layer is respectively equipped with coverlay (for example CVL).
According to the present invention, with the insulating barrier of prior art, the structure that accompanies one deck insulating barrier (for example PI) in the middle of the two-layer line layer directly is replaced with the nickeliferous metallic circuit layer of one deck.
The wiring of wiring board product and windowing
According to different application scenarios, come the wiring of deisgn product and pad to window, to satisfy the requirement of Different products and purposes.These all are the technological know-hows that those skilled in the art use always, give unnecessary details no longer one by one.
The technological process of the LED wiring board product of prior art
The manufacturing process of the LED lamp bar wiring board of prior art as shown in Figure 1 generally comprises main technological process and auxiliary process flow process.
Main flow: open material and (open base material; Base material is two-sided 1 ounce of base material, the base material here refer to by the PI of 25 microns of two-layer 1 ounce copper foil, two-layer 25 microns glue and one decks totally 5 layers form)-boring (brill base material)-heavy copper-copper facing-exposure-development-etching-paste epiphragma (the obverse and reverse coverlay is attached on the wiring board after the etching simultaneously)-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packing-shipment.
Auxilliary flow process: open material (obverse and reverse coverlay)-boring (brill obverse and reverse coverlay)-change over to and paste the epiphragma operation.
Traditional LED lamp bar wiring board of prior art need be used aborning is that highly basic strong acid materials such as sulfuric acid, hydrochloric acid, nitric acid, NaOH, sodium carbonate are used for heavy copper and circuit etching, and this kind manufacturing process not only manufacturing cost is high but also can bring severe contamination to environment.
Because Copper Foil is easy to oxidation, therefore need carry out further Passivation Treatment to the pad that exposes (solder joint) of wiring board, this has not only increased operation, has improved cost, and Passivation Treatment can adopt chemical passivation liquid, brings pollution to environment.
The typical process flow of LED wiring board product of the present invention
According to a preferred embodiment of the invention, the manufacture craft of LED wiring board for example as shown in Figure 2 of the present invention is following:
Main flow (a): (karat gold belongs to base material to open material; This base material adopts thickness more than 1 ounce; Be preferably the nickeliferous metal 8 of thickness more than 3 ounces; According to a special preferred embodiment; This metal base 8 will adopt the nickeliferous metal more than 6 ounces or 6 ounces; This nickeliferous metal adopts nickel plating aluminium)-the die-cut or laser cutting (this time die-cut or cutting back circuit displays fully, forms blank wiring board 8) of die-cut 1 (nickeliferous metal base 8 is carried out the die-cut or laser cutting of machinery for the first time)-paste epiphragma (pasting nickeliferous metal 8 back sides of reverse side coverlay after die-cut)-for the second time machinery-paste epiphragma 5 (pasting on the wiring board 8 of front coverlay 5 after die-cut)-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packing-shipment.
Perhaps according to another preferred embodiment; Also can select main flow (b) for use: (karat gold belongs to base material to open material; This base material adopts thickness more than 1 ounce; Be preferably the nickeliferous metal 8 of thickness more than 3 ounces; According to a special preferred embodiment, this metal base 8 will adopt the nickeliferous metal more than 6 ounces or 6 ounces, and this nickeliferous metal adopts nickel plating aluminium)-paste epiphragma 5 (pasting on the nickeliferous metal 8 of reverse side coverlay after opening material)-pressing-etching-subsides end face CVL-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packing-shipment.
Auxilliary flow process: open material (opening the obverse and reverse coverlay)-hole-change over to and paste the epiphragma operation.
Because the non-oxidizability of nickeliferous metal is superior, therefore need carry out further Passivation Treatment, thereby omit this operation the pad that exposes (solder joint) of nickeliferous metallic circuit layer 8.
Through with the technology of above prior art relatively, just can know that manufacture craft according to the present invention has been omitted many processing steps, much simple, therefore not only save time, save processing step and cost accordingly, and its reliability is also very high.In addition importantly, manufacture craft of the present invention no longer relates to operations such as heavy copper, copper facing, plating, exposure, development, even also can not adopt etch process, therefore very environmental protection.
Like this, just can obtain LED wiring board as shown in Figure 2 of the present invention.Fig. 2 has shown the New LED wiring board of one embodiment of the invention, has shown the structure of this LED wiring board, wherein; Compare with the wiring board shown in Figure 1 of prior art; Just can find out significantly that the present invention directly uses the nickeliferous metal 8 of one deck (line layer) to replace the structure that accompanies insulating barrier 6 between the two-layer line layer 3,7 of prior art; It not only shows the many above-mentioned superiority that is superior to prior art on manufacture craft; And the structure of itself is simpler, omitted an one deck line layer and a layer insulating (also comprising two-layer adhesive layer in certain embodiments) and window, the technological requirement of bonding contraposition, saved material cost and technology cost; Therefore the cost of product is lower, and reliability is higher.
Width according to LED wiring board product of the present invention for example can reach more than 3 millimeters, for example the 3-20 millimeter.
According to a preferred embodiment of the invention, for example can reach more than 3 millimeters according to the width of LED wiring board of the present invention, for example the 3-20 millimeter.
According to a preferred embodiment of the invention,, can increase greatly, for example can reach more than 3 ounces, particularly preferably be the thickness that reaches more than 6 ounces or 6 ounces according to the thickness of the line layer of LED wiring board of the present invention because what adopt is nickeliferous metal 8.
Compared with prior art, the line layer that thickness increases means that the cross-sectional flow area of electric current increases, and allows through the higher magnitude of current, therefore also allows the operating current of LED wiring board to increase, thereby allows more LED of load and longer wiring board length.
According to a preferred embodiment of the invention, the connected length of LED wiring board product of the present invention for example can reach 5-100 rice.And the maximum length of the attachable LED wiring board of the manufacture craft of prior art is merely 5 meters.
The material cost of this LED wiring board of the present invention compared with prior art can reduce a lot, for example, if adopt the nickel plating aluminium as nickeliferous metal, can reduce more than 2/3rds than the copper foil material of prior art.
Moreover, this structure of the present invention and manufacture craft make the useful life can prolong the LED lamp that reliability is high, and thermal diffusivity is good, and this is that so conductivity and thermal diffusivity are better because nickeliferous metal layer thickness can be chosen to thicklyer.
In addition, connect and to window, also can not window according to the LED wiring board product of the present invention back side.This also is that the LED wiring board of prior art is not accomplished.
According to a preferred embodiment of the invention, according to the operating voltage of LED wiring board of the present invention product design applicable to 12V, 24V or other different direct current safety.
According to a preferred embodiment of the invention, the element that on LED wiring board product of the present invention, mounts or carry can comprise all kinds of LED and resistance, and preferred element can be described below.
The model of LED is following: 335,3528,5050,5060, or the like.
The model of resistance is following: 0603,0805,0812, or the like.
Obviously, this area designer is appreciated that fully that according to different application scenarios and customer requirement LED wiring board product of the present invention can comprise other various types of LED, resistance and other components and parts or the like.
Preceding text by the agency of specific embodiment of the present invention.Yet should be appreciated that under the premise without departing from the spirit and scope of the present invention, can carry out various modifications.Therefore, other embodiment also belongs to the protection range of claim of the present invention.
Claims (10)
1. a LED wiring board is characterized in that, comprising:
The line layer of directly processing (8) by nickeliferous metal single layer; With
Cover the coverlay (5,5) on the obverse and reverse of said line layer (8) respectively.
2. LED wiring board according to claim 1 is characterized in that, said nickeliferous metallic circuit layer (8) directly replaces the two-layer or sandwich construction of existing LED board substrate.
3. LED wiring board according to claim 1 is characterized in that, said nickeliferous metal is the aluminium of nickel plating or the aluminium alloy of nickel plating.
4. LED wiring board according to claim 3 is characterized in that, said nickeliferous metal is the iron of nickel plating or the ferroalloy of nickel plating.
5. LED wiring board according to claim 1 is characterized in that, said line layer (8) is the line layer that is shaped through die-cut, cutting or the said nickeliferous metal single layer of etching.
6. LED wiring board according to claim 1 is characterized in that, said line layer (8) comprises the pad of not passivation.
7. a method of making the LED wiring board is characterized in that, comprising:
Nickeliferous metal single layer is provided;
Through said nickeliferous metal single layer being carried out the die-cut or cutting first time, and form line layer (8);
Paste reverse side coverlay (5) and carry out pressing at the back side of said line layer (8);
Said line layer (8) is carried out the die-cut or cutting second time, form blank wiring board (8); With
Stick front coverlay (5) in the front of said blank wiring board (8) and carry out pressing.
8. method according to claim 7 is characterized in that, said nickeliferous metal is the aluminium of nickel plating or the aluminium alloy of nickel plating, or the ferroalloy of the iron of nickel plating or nickel plating, and said line layer (8) comprises the pad of not passivation.
9. a method of making the LED wiring board is characterized in that, comprising:
Nickeliferous metal is provided;
Stick reverse side coverlay (5) at the back side of said nickeliferous metal and carry out pressing;
Said nickeliferous metal is carried out etching, form line layer (8);
Paste front coverlay (5) and carry out pressing in the front of said line layer (8); With
Paste front coverlay (5) and carry out pressing in the front of said blank wiring board (8).
10. method according to claim 9 is characterized in that, said nickeliferous metal is the aluminium of nickel plating or the aluminium alloy of nickel plating, or the ferroalloy of the iron of nickel plating or nickel plating, and said line layer (8) comprises the pad of not passivation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011102115383A CN102595783A (en) | 2011-07-27 | 2011-07-27 | Novel LED circuit board and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102115383A CN102595783A (en) | 2011-07-27 | 2011-07-27 | Novel LED circuit board and method |
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| CN104952376A (en) * | 2015-06-12 | 2015-09-30 | 信丰福昌发电子有限公司 | Process for improving extraneous plating short circuit of LED lamp panel caused by small dot pitch |
| CN105934078A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Double-side component heat dissipation flexible printed circuit board |
| CN105934079A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Flexible circuit board preventing elements from being overheated |
| CN105934080A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Double-side heat dissipation flexible printed circuit board |
| CN106132075A (en) * | 2016-07-20 | 2016-11-16 | 苏州福莱盈电子有限公司 | A kind of flexible heat sink wiring board |
| CN106163088A (en) * | 2016-07-20 | 2016-11-23 | 苏州福莱盈电子有限公司 | A kind of double-faced flexible wiring board of middle part heat conduction |
| CN106211550A (en) * | 2016-07-20 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of flexible circuit board of top heat radiation |
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| CN104952376A (en) * | 2015-06-12 | 2015-09-30 | 信丰福昌发电子有限公司 | Process for improving extraneous plating short circuit of LED lamp panel caused by small dot pitch |
| CN104952376B (en) * | 2015-06-12 | 2017-07-28 | 信丰福昌发电子有限公司 | It is a kind of to improve the technique that dot oozes golden short circuit away from LED lamp panel |
| CN105934078A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Double-side component heat dissipation flexible printed circuit board |
| CN105934079A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Flexible circuit board preventing elements from being overheated |
| CN105934080A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Double-side heat dissipation flexible printed circuit board |
| CN106132075A (en) * | 2016-07-20 | 2016-11-16 | 苏州福莱盈电子有限公司 | A kind of flexible heat sink wiring board |
| CN106163088A (en) * | 2016-07-20 | 2016-11-23 | 苏州福莱盈电子有限公司 | A kind of double-faced flexible wiring board of middle part heat conduction |
| CN106211550A (en) * | 2016-07-20 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of flexible circuit board of top heat radiation |
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Application publication date: 20120718 |