WO2013155693A1 - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
WO2013155693A1
WO2013155693A1 PCT/CN2012/074405 CN2012074405W WO2013155693A1 WO 2013155693 A1 WO2013155693 A1 WO 2013155693A1 CN 2012074405 W CN2012074405 W CN 2012074405W WO 2013155693 A1 WO2013155693 A1 WO 2013155693A1
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WO
WIPO (PCT)
Prior art keywords
substrate
metal foil
circuit board
flexible substrate
flexible
Prior art date
Application number
PCT/CN2012/074405
Other languages
French (fr)
Chinese (zh)
Inventor
张昱
Original Assignee
Zhang Yu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhang Yu filed Critical Zhang Yu
Priority to PCT/CN2012/074405 priority Critical patent/WO2013155693A1/en
Publication of WO2013155693A1 publication Critical patent/WO2013155693A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Definitions

  • the utility model belongs to the technical field of circuit boards, in particular to a circuit board obtained by die cutting processing.
  • the utility model aims to provide a circuit board, which solves the technical problem of high cost of the conventional circuit board by using the circuit board.
  • the technical solution of the present invention is to provide a circuit board comprising a substrate which is superposed and bonded in order from bottom to top, and a flexible substrate having a metal foil on the surface, the surface having a metal foil
  • the flexible substrate is die-cut to form a flexible substrate having the desired circuitry.
  • the circuit board is formed by two-layer structure, and the circuit board obtained by the etching process on one layer of medium has the advantage of low cost compared with the prior art.
  • one side of the flexible substrate without the metal foil is bonded to the substrate by a hot melt glue or a hot melt adhesive film.
  • the surface of the metal foil on which the wiring board forms the desired wiring is covered with an insulating film.
  • the flexible substrate has a side of the metal foil bonded to the substrate by a hot melt glue or a hot melt adhesive film.
  • metal foil and the flexible substrate are joined by a cover glue.
  • the substrate is a flexible insulating substrate or a rigid insulating substrate
  • the metal foil is a gold foil or a silver foil or a copper foil or an aluminum foil.
  • the flexible insulating substrate is made of polyethylene terephthalate or a polyimide film.
  • the flexible substrate is made of polyethylene terephthalate or polyimide film.
  • the circuit board provided by the utility model is laminated by using a substrate and a flexible substrate using a die. Since the surface of the flexible material is covered with a metal foil, the conductive material can be electrically conductive, and the flexible material is die-cut.
  • the flexible material forms the required circuit board, and the above-mentioned circuit board eliminates the chemical method of etching the substrate with the metal foil by the corrosive substance in the conventional process, thereby avoiding the generation of toxic substances due to the chemical reaction, The good environmental protection effect also reduces the danger of the operator.
  • the circuit board obtained by the die-cutting method greatly reduces the production equipment cost and material cost, and fully improves the market competitiveness.
  • FIG. 1 is an exploded sectional view of a circuit board according to an embodiment of the present invention.
  • FIG. 2 is an exploded sectional view showing a portion of a circuit board according to Embodiment 1 of the present invention
  • Figure 3 is a partial cross-sectional view of the circuit board according to the second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a circuit board before die cutting according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a step of die cutting of a circuit board according to an embodiment of the present invention
  • Figure 6 is a cross-sectional view showing the completion of the die cutting step of the circuit board according to the embodiment of the present invention.
  • Figure 7 is a cross-sectional view of the circuit board stripped waste provided by the embodiment of the present invention.
  • FIG. 8 is a cross-sectional view showing a step of hot pressing of a circuit board according to an embodiment of the present invention.
  • FIG. 9 is an exploded sectional view of a portion of a circuit board according to a third embodiment of the present invention.
  • Figure 10 is a cross-sectional view showing the combination of the circuit board before die cutting according to the third embodiment of the present invention.
  • Figure 11 is a cross-sectional view showing the die cutting step of the circuit board according to the third embodiment of the present invention.
  • Figure 12 is a cross-sectional view showing the completion of the die cutting step of the circuit board according to the third embodiment of the present invention.
  • Figure 13 is a cross-sectional view of the circuit board stripping waste provided in the third embodiment of the present invention.
  • Figure 14 is a cross-sectional view showing the hot pressing step of the circuit board according to the third embodiment of the present invention.
  • the technical proposal of the present invention is to provide a circuit board comprising a substrate which is superposed and bonded in order from bottom to top, and a flexible substrate having a metal foil on the surface, wherein the flexible substrate having a metal foil on the surface is A die-cut process forms a flexible substrate having the desired circuitry.
  • the circuit board is formed by two-layer structure, and the circuit board obtained by the etching process on one layer of medium has the advantage of low cost compared with the prior art.
  • a first embodiment of the present invention provides a circuit board having a substrate 3 , a glue 2 , a flexible substrate 13 , and a cover rubber 12 in order from bottom to top.
  • the structure of the metal foil 11 and the insulating film 9 and the circuit board obtained by the all physical treatment have better environmental protection characteristics and lower the cost.
  • a method of manufacturing the above circuit board includes the following process steps:
  • a flexible insulating substrate 3 made of polyethylene terephthalate or polyimide film; applying glue 2 using hot melt glue or hot melt adhesive film to the surface of the substrate 3,
  • a flexible substrate 13 having a metal foil 11 on its surface is placed on the surface of the substrate 3 and joined thereto by the above-mentioned glue 2;
  • the flexible substrate 13 is made of polyethylene terephthalate or polyamide.
  • An amine film is formed, and the metal foil 11 having the surface of the flexible substrate 13 is attached to the surface of the flexible substrate 13 by the cover rubber 12.
  • the surface of the metal foil 11 forming the desired line 6 is covered with an insulating film 9 and then heated and pressed by the heat generating plate 8 to form a desired wiring board.
  • 11 is a gold foil or a silver foil or a copper foil or an aluminum foil, and the above-mentioned manufacturing method is used to abandon the chemical method of etching a substrate having a metal foil by using a corrosive substance in a conventional process, thereby avoiding generation of poison due to a chemical reaction.
  • the material has good environmental protection effect and reduces the danger of the operator.
  • the circuit board obtained by the die-cutting method greatly reduces the production equipment cost and material cost, and fully improves the market competitiveness.
  • a second embodiment of the present invention provides a circuit board having a substrate 3 , a glue 2 , a flexible substrate 13 , and a cover rubber 12 in order from bottom to top.
  • the structure of the metal foil 11 and the insulating film 9 and the circuit board obtained by the all physical treatment have better environmental protection characteristics and lower the cost.
  • a method of manufacturing the above circuit board includes the following process steps:
  • a flexible insulating substrate 3 made of polyethylene terephthalate or polyimide film; preparing a flexible substrate 13 having a metal foil 11 on the surface, which will be hot melt adhesive or hot melt adhesive film Glue 2 is applied to one side of the flexible substrate 13 without the metal foil 11, and the flexible substrate 13 is attached to the flexible insulating substrate 3 and joined to the flexible insulating substrate 3 by the glue 2;
  • the flexible substrate 13 is made of polyethylene terephthalate or a polyimide film, and the metal foil 11 on the surface of the flexible substrate 13 is attached to the flexible substrate by the cover adhesive 12 . 13 surface.
  • the surface of the metal foil 11 forming the desired line 6 is covered with an insulating film 9 and then heated and pressed by the heat generating plate 8 to form a desired wiring board.
  • 11 is a gold foil or a silver foil or a copper foil or an aluminum foil, and the above-mentioned manufacturing method is used to abandon the chemical method of etching a substrate having a metal foil by using a corrosive substance in a conventional process, thereby avoiding generation of poison due to a chemical reaction.
  • the material has good environmental protection effect and reduces the danger of the operator.
  • the circuit board obtained by the die-cutting method has greatly reduced the production equipment cost and the material cost, and fully improves the market competitiveness.
  • the main difference compared with the first embodiment is that the glue 2 is applied to one side of the flexible substrate 13 without the metal foil 11, and in the case where the area of the flexible insulating substrate 3 is relatively large, the plurality of flexible substrates 13 can be separated by the glue 2
  • the flexible insulating substrate 3 is joined without causing a portion where the uncoated flexible substrate 13 is left with glue, and is suitable for the case where the flexible substrate 13 is smaller in area than the flexible insulating substrate 3.
  • a third embodiment of the present invention provides a circuit board having a substrate 3 , a glue 2 , a metal foil 11 , a laminating rubber 12 , and a flexible structure from bottom to top.
  • the structure of the substrate 13 saves the insulating film 9 relative to the first embodiment and the second embodiment, and the circuit board obtained by the physical treatment has better environmental protection characteristics and lowers the cost.
  • a method of manufacturing the above circuit board includes the following process steps:
  • a flexible insulating substrate 3 made of polyethylene terephthalate or polyimide film; preparing a flexible substrate 13 having a metal foil 11 on the surface, which will be hot melt adhesive or hot melt adhesive film Glue 2 is applied to one side of the flexible substrate 13 having the metal foil 11, and the flexible substrate 13 is attached to the flexible insulating substrate 3 and joined to the flexible insulating substrate 3 by the glue 2;
  • the flexible substrate 13 is made of polyethylene terephthalate or a polyimide film, and the metal foil 11 of the flexible substrate surface is attached to the surface of the flexible substrate 13 by the cover rubber 12.
  • the metal foil 11 is a gold foil or a silver foil or a copper foil or an aluminum foil.
  • the method eliminates the chemical method of etching the substrate with metal foil by using corrosive substances in the traditional process, avoids the generation of toxic substances due to chemical reaction, has good environmental protection effect, and reduces the operator's
  • the circuit board obtained by the die-cutting method greatly reduces the production equipment cost and the material cost, and fully improves the market competitiveness.
  • the flexible substrate 13 has a surface of the metal foil 11 bonded to the flexible insulating substrate 3, and the metal foil 11 is sealed between the flexible substrate 13 and the flexible insulating substrate 3, since the flexible substrate 13 is a poly pair Made of ethylene phthalate or polyimide film, it has insulation properties, which reduces the working procedure of covering the insulating film 9, further simplifying the process and reducing the cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A circuit board is characterized by comprising base materials (3) which are superposed in sequence from bottom to top and integrated in one piece, and a flexible base material (13) which has a metal foil (11) on the surface thereof. The flexible base material (13) which has a metal foil (11) on the surface thereof is a flexible base material (13) which is formed after die-cutting processing and has a required circuit. The circuit board solves the technical problems of easy generation of environmental pollution, dangerous operation and higher costs which exist in the production process of a conventional circuit board at present.

Description

一种线路板  Circuit board 技术领域Technical field
本实用新型属于电路板技术领域，具体地是涉及一种模切加工获得的线路板。The utility model belongs to the technical field of circuit boards, in particular to a circuit board obtained by die cutting processing.
背景技术Background technique
目前，电子产品小型化、高速化的发展趋势正在推动电子线路板行业进入一个新的发展时期，而在线路板的制作过程中，通常是由压合于基材上的铜箔经过压合、曝光、显影、蚀刻等多个步骤形成导电线路，进而形成线路板，柔性线路板的出现，对该行业起到了革命化的推进作用，但柔性线路板也多是采用柔性的绝缘基材通过上述的制作步骤而完成的导电线路，虽然此类线路板具有很多硬性线路板所无法做到的优势之处，如可弯曲、卷绕、折叠等，可依照空间布局要求任意安排，自由度非常强，非常适用于电子产品向高密度、小型化、高可靠性的方向发展，并且，柔性线路板在航天、军事、移动电子设备等领域得到广泛应用。但是，应用上述制作方法在生产过程中需要通过化学腐蚀溶剂进行处理，容易产生环境污染以及操作危险，并且由于生产环节繁琐、设备复杂昂贵、原材料成本较高，直接导致产品成本升高，降低市场竞争优势。因此，有必要提供一种线路板的制作方法，用以减少现有技术中带来的污染及危险并且降低线路板的制作成本，提高产业竞争优势。At present, the development trend of miniaturization and high speed of electronic products is pushing the electronic circuit board industry into a new development period. In the production process of circuit boards, the copper foil pressed onto the substrate is usually pressed. Exposure, development, etching and other steps to form conductive lines, and thus the formation of circuit boards, the emergence of flexible circuit boards, has revolutionized the industry, but flexible circuit boards are mostly made of flexible insulating substrates. The conductive circuit completed by the manufacturing steps, although such a circuit board has many advantages that cannot be achieved by a rigid circuit board, such as bending, winding, folding, etc., can be arranged arbitrarily according to the spatial layout requirement, and the degree of freedom is very strong. It is very suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Moreover, flexible circuit boards are widely used in aerospace, military, mobile electronic equipment and other fields. However, the application of the above-mentioned manufacturing method needs to be treated by a chemical etching solvent in the production process, which is liable to cause environmental pollution and operational danger, and because the production process is cumbersome, the equipment is complicated and expensive, and the raw material cost is high, the product cost is directly increased, and the market is lowered. Competitive advantages. Therefore, it is necessary to provide a method for manufacturing a circuit board, which can reduce the pollution and danger brought by the prior art, reduce the manufacturing cost of the circuit board, and improve the industrial competitive advantage.
技术问题technical problem
本实用新型目的在于提供一种线路板，通过采用该线路板解决目前常规线路板成本较高的技术问题。The utility model aims to provide a circuit board, which solves the technical problem of high cost of the conventional circuit board by using the circuit board.
技术解决方案Technical solution
为解决上述技术问题，本实用新型的技术方案是：提供一种线路板，包含自下而上依次叠加并接合于一体的基材、表面具有金属箔的柔性基材，所述表面具有金属箔的柔性基材为经过模切加工后形成具有所需电路的柔性基材。In order to solve the above technical problem, the technical solution of the present invention is to provide a circuit board comprising a substrate which is superposed and bonded in order from bottom to top, and a flexible substrate having a metal foil on the surface, the surface having a metal foil The flexible substrate is die-cut to form a flexible substrate having the desired circuitry.
通过上述技术方案，所述线路板通过两层结构拼合而成，相比现有技术中，通过在一层介质上进行蚀刻的工艺得来的线路板具有成本低廉的优势。Through the above technical solution, the circuit board is formed by two-layer structure, and the circuit board obtained by the etching process on one layer of medium has the advantage of low cost compared with the prior art.
进一步地，所述柔性基材无金属箔的一面与基材之间通过热熔胶水或热熔胶膜相接合。Further, one side of the flexible substrate without the metal foil is bonded to the substrate by a hot melt glue or a hot melt adhesive film.
更进一步地，所述线路板形成所需线路的金属箔表面覆有绝缘膜。Further, the surface of the metal foil on which the wiring board forms the desired wiring is covered with an insulating film.
或者进一步地，所述柔性基材具有金属箔的一面与基材之间通过热熔胶水或热熔胶膜相接合。Or further, the flexible substrate has a side of the metal foil bonded to the substrate by a hot melt glue or a hot melt adhesive film.
更进一步地，所述金属箔与柔性基材之间通过覆合胶相接合。Further, the metal foil and the flexible substrate are joined by a cover glue.
具体地，所述基材为柔性绝缘基材或者硬性绝缘基材，所述金属箔为金箔或银箔或铜箔或铝箔。Specifically, the substrate is a flexible insulating substrate or a rigid insulating substrate, and the metal foil is a gold foil or a silver foil or a copper foil or an aluminum foil.
更具体地，其特征在于：所述柔性绝缘基材采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜。More specifically, it is characterized in that the flexible insulating substrate is made of polyethylene terephthalate or a polyimide film.
具体地，所述柔性基材采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜。Specifically, the flexible substrate is made of polyethylene terephthalate or polyimide film.
有益效果Beneficial effect
本实用新型提供的线路板，通过采用基材与运用刀模的柔性基材层叠，由于柔性材料表面覆有一层金属箔，可具有导电性，被模切的柔性材料，通过剥离所需电路以外的柔性材料，形成所需线路板，上述线路板拼弃了传统工艺中利用腐蚀性物质对具有金属箔的基材进行蚀刻的化学方法，避免了产生由于化学反应而产生的有毒害物质，具有良好的环保效果，也减小了操作人员的危险性，同时，利用模切的方式得到的线路板，生产设备成本、材料成本都大幅降低，充分提高了市场竞争力。The circuit board provided by the utility model is laminated by using a substrate and a flexible substrate using a die. Since the surface of the flexible material is covered with a metal foil, the conductive material can be electrically conductive, and the flexible material is die-cut. The flexible material forms the required circuit board, and the above-mentioned circuit board eliminates the chemical method of etching the substrate with the metal foil by the corrosive substance in the conventional process, thereby avoiding the generation of toxic substances due to the chemical reaction, The good environmental protection effect also reduces the danger of the operator. At the same time, the circuit board obtained by the die-cutting method greatly reduces the production equipment cost and material cost, and fully improves the market competitiveness.
附图说明DRAWINGS
图1是本实用新型实施例提供的线路板分解剖视图；1 is an exploded sectional view of a circuit board according to an embodiment of the present invention;
图2是本实用新型实施例一提供的线路板部分分解剖视图；2 is an exploded sectional view showing a portion of a circuit board according to Embodiment 1 of the present invention;
图3是本实用新型实施例二提供的线路板部分剖视图；Figure 3 is a partial cross-sectional view of the circuit board according to the second embodiment of the present invention;
图4是本实用新型实施例提供的线路板模切前组合剖视图；4 is a cross-sectional view of a circuit board before die cutting according to an embodiment of the present invention;
图5是本实用新型实施例提供的线路板模切步骤剖视图；5 is a cross-sectional view showing a step of die cutting of a circuit board according to an embodiment of the present invention;
图6是本实用新型实施例提供的线路板模切步骤完成后剖视图；Figure 6 is a cross-sectional view showing the completion of the die cutting step of the circuit board according to the embodiment of the present invention;
图7是本实用新型实施例提供的线路板剥离废料后剖视图；Figure 7 is a cross-sectional view of the circuit board stripped waste provided by the embodiment of the present invention;
图8是本实用新型实施例提供的线路板热压步骤剖视图；8 is a cross-sectional view showing a step of hot pressing of a circuit board according to an embodiment of the present invention;
图9是本实用新型实施例三提供的线路板部分分解剖视图；9 is an exploded sectional view of a portion of a circuit board according to a third embodiment of the present invention;
图10是本实用新型实施例三提供的线路板模切前组合剖视图；Figure 10 is a cross-sectional view showing the combination of the circuit board before die cutting according to the third embodiment of the present invention;
图11是本实用新型实施例三提供的线路板模切步骤剖视图；Figure 11 is a cross-sectional view showing the die cutting step of the circuit board according to the third embodiment of the present invention;
图12是本实用新型实施例三提供的线路板模切步骤完成后剖视图；Figure 12 is a cross-sectional view showing the completion of the die cutting step of the circuit board according to the third embodiment of the present invention;
图13是本实用新型实施例三提供的线路板剥离废料后剖视图；Figure 13 is a cross-sectional view of the circuit board stripping waste provided in the third embodiment of the present invention;
图14是本实用新型实施例三提供的线路板热压步骤剖视图；Figure 14 is a cross-sectional view showing the hot pressing step of the circuit board according to the third embodiment of the present invention;
本发明的实施方式Embodiments of the invention
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。In order to make the objects, technical solutions and advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
本实用新型的技术方案是：提供一种线路板，包含自下而上依次叠加并接合于一体的基材、表面具有金属箔的柔性基材，所述表面具有金属箔的柔性基材为经过模切加工后形成具有所需电路的柔性基材。The technical proposal of the present invention is to provide a circuit board comprising a substrate which is superposed and bonded in order from bottom to top, and a flexible substrate having a metal foil on the surface, wherein the flexible substrate having a metal foil on the surface is A die-cut process forms a flexible substrate having the desired circuitry.
通过上述技术方案，所述线路板通过两层结构拼合而成，相比现有技术中，通过在一层介质上进行蚀刻的工艺得来的线路板具有成本低廉的优势。Through the above technical solution, the circuit board is formed by two-layer structure, and the circuit board obtained by the etching process on one layer of medium has the advantage of low cost compared with the prior art.
以上述技术方案为基础罗列以下实施例：The following examples are listed on the basis of the above technical solutions:
实施例一 Embodiment 1
参照图1、图2、图4至图8，本实用新型实施例一提供了一种线路板，具有自下而上依次为基材3，胶水2，柔性基材13，覆合胶12，金属箔11及绝缘膜9的结构，全物理方式处理所得的线路板具有更好的环保特性，降低了成本。制造上述线路板的方法，包括以下工艺步骤：Referring to FIG. 1 , FIG. 2 , FIG. 4 to FIG. 8 , a first embodiment of the present invention provides a circuit board having a substrate 3 , a glue 2 , a flexible substrate 13 , and a cover rubber 12 in order from bottom to top. The structure of the metal foil 11 and the insulating film 9 and the circuit board obtained by the all physical treatment have better environmental protection characteristics and lower the cost. A method of manufacturing the above circuit board includes the following process steps:
制备一采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成的柔性绝缘基材3；将采用热熔胶水或热熔胶膜的胶水2涂于所述基材3表面，将一表面具有金属箔11的柔性基材13置于所述基材3表面之上并通过上述胶水2与之相接合；上述柔性基材13采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成，并且所述柔性基材13表面所具有的金属箔11通过覆合胶12附着于所述柔性基材13表面。Preparing a flexible insulating substrate 3 made of polyethylene terephthalate or polyimide film; applying glue 2 using hot melt glue or hot melt adhesive film to the surface of the substrate 3, A flexible substrate 13 having a metal foil 11 on its surface is placed on the surface of the substrate 3 and joined thereto by the above-mentioned glue 2; the flexible substrate 13 is made of polyethylene terephthalate or polyamide. An amine film is formed, and the metal foil 11 having the surface of the flexible substrate 13 is attached to the surface of the flexible substrate 13 by the cover rubber 12.
制备刀模4，运用刀模4通过所述具有金属箔11的柔性基材13表面向下模切，切线5贯通具有金属箔11的柔性基材13并形成所需线路6；Preparing a die 4, using the die 4 to die down through the surface of the flexible substrate 13 having the metal foil 11, the tangential line 5 penetrating through the flexible substrate 13 having the metal foil 11 and forming the desired line 6;
剥离所需线路6以外的剩余金属箔及柔性基材废料7；Stripping the remaining metal foil and flexible substrate waste 7 other than the required line 6;
压合具有金属箔11的柔性基材13与基材3后，在形成所需线路6的金属箔11表面覆绝缘膜9后通过发热板8进行加热压合形成所需线路板，上述金属箔11为金箔或银箔或铜箔或铝箔，采用上述制作方法拼弃了传统工艺中利用腐蚀性物质对具有金属箔的基材进行蚀刻的化学方法，避免了产生由于化学反应而产生的有毒害物质，具有良好的环保效果，也减小了操作人员的危险性，同时，利用模切的方式得到的线路板，生产设备成本、材料成本都大幅降低，充分提高了市场竞争力。After the flexible substrate 13 having the metal foil 11 and the substrate 3 are pressed together, the surface of the metal foil 11 forming the desired line 6 is covered with an insulating film 9 and then heated and pressed by the heat generating plate 8 to form a desired wiring board. 11 is a gold foil or a silver foil or a copper foil or an aluminum foil, and the above-mentioned manufacturing method is used to abandon the chemical method of etching a substrate having a metal foil by using a corrosive substance in a conventional process, thereby avoiding generation of poison due to a chemical reaction. The material has good environmental protection effect and reduces the danger of the operator. At the same time, the circuit board obtained by the die-cutting method greatly reduces the production equipment cost and material cost, and fully improves the market competitiveness.
实施例二， Embodiment 2,
参照图1、图3、图4至图8，本实用新型实施例二提供了一种线路板，具有自下而上依次为基材3，胶水2，柔性基材13，覆合胶12，金属箔11及绝缘膜9的结构，全物理方式处理所得的线路板具有更好的环保特性，降低了成本。制造上述线路板的方法，包括以下工艺步骤：Referring to FIG. 1 , FIG. 3 , FIG. 4 to FIG. 8 , a second embodiment of the present invention provides a circuit board having a substrate 3 , a glue 2 , a flexible substrate 13 , and a cover rubber 12 in order from bottom to top. The structure of the metal foil 11 and the insulating film 9 and the circuit board obtained by the all physical treatment have better environmental protection characteristics and lower the cost. A method of manufacturing the above circuit board includes the following process steps:
制备一采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成的柔性绝缘基材3；制备一表面具有金属箔11的柔性基材13，将采用热熔胶水或热熔胶膜的胶水2涂于所述柔性基材13无金属箔11的一面，将所述柔性基材13附于柔性绝缘基材3上并通过上述胶水2与所述柔性绝缘基材3相接合；；上述柔性基材13采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成，并且所述柔性基材13表面所具有的金属箔11通过覆合胶12附着于所述柔性基材13表面。Preparing a flexible insulating substrate 3 made of polyethylene terephthalate or polyimide film; preparing a flexible substrate 13 having a metal foil 11 on the surface, which will be hot melt adhesive or hot melt adhesive film Glue 2 is applied to one side of the flexible substrate 13 without the metal foil 11, and the flexible substrate 13 is attached to the flexible insulating substrate 3 and joined to the flexible insulating substrate 3 by the glue 2; The flexible substrate 13 is made of polyethylene terephthalate or a polyimide film, and the metal foil 11 on the surface of the flexible substrate 13 is attached to the flexible substrate by the cover adhesive 12 . 13 surface.
制备刀模4，运用刀模4通过所述具有金属箔11的柔性基材13表面向下模切，切线5贯通具有金属箔11的柔性基材13并形成所需线路6；Preparing a die 4, using the die 4 to die down through the surface of the flexible substrate 13 having the metal foil 11, the tangential line 5 penetrating through the flexible substrate 13 having the metal foil 11 and forming the desired line 6;
剥离所需线路6以外的剩余金属箔及柔性基材废料7；Stripping the remaining metal foil and flexible substrate waste 7 other than the required line 6;
压合具有金属箔11的柔性基材13与基材3后，在形成所需线路6的金属箔11表面覆绝缘膜9后通过发热板8进行加热压合形成所需线路板，上述金属箔11为金箔或银箔或铜箔或铝箔，采用上述制作方法拼弃了传统工艺中利用腐蚀性物质对具有金属箔的基材进行蚀刻的化学方法，避免了产生由于化学反应而产生的有毒害物质，具有良好的环保效果，也减小了操作人员的危险性，同时，利用模切的方式得到的线路板，生产设备成本、材料成本都大幅降低，充分提高了市场竞争力，本实施例相比实施例一的主要区别在于胶水2涂于所述柔性基材13无金属箔11的一面，在柔性绝缘基材3面积比较大的情况下可通过胶水2将多片柔性基材13与柔性绝缘基材3相接合，不会造成产生未覆柔性基材13的部分留有胶水的情形，适合柔性基材13面积小于柔性绝缘基材3的情形。After the flexible substrate 13 having the metal foil 11 and the substrate 3 are pressed together, the surface of the metal foil 11 forming the desired line 6 is covered with an insulating film 9 and then heated and pressed by the heat generating plate 8 to form a desired wiring board. 11 is a gold foil or a silver foil or a copper foil or an aluminum foil, and the above-mentioned manufacturing method is used to abandon the chemical method of etching a substrate having a metal foil by using a corrosive substance in a conventional process, thereby avoiding generation of poison due to a chemical reaction. The material has good environmental protection effect and reduces the danger of the operator. At the same time, the circuit board obtained by the die-cutting method has greatly reduced the production equipment cost and the material cost, and fully improves the market competitiveness. The main difference compared with the first embodiment is that the glue 2 is applied to one side of the flexible substrate 13 without the metal foil 11, and in the case where the area of the flexible insulating substrate 3 is relatively large, the plurality of flexible substrates 13 can be separated by the glue 2 The flexible insulating substrate 3 is joined without causing a portion where the uncoated flexible substrate 13 is left with glue, and is suitable for the case where the flexible substrate 13 is smaller in area than the flexible insulating substrate 3.
实施例三， Embodiment 3,
参照图9、图10、图5至图8，本实用新型实施例三提供了一种线路板，具有自下而上依次为基材3，胶水2，金属箔11、覆合胶12、柔性基材13的结构，相对于实施例一和实施例二节省了绝缘膜9且全物理方式处理所得的线路板具有更好的环保特性，降低了成本。制造上述线路板的方法，包括以下工艺步骤：Referring to FIG. 9 , FIG. 10 and FIG. 5 to FIG. 8 , a third embodiment of the present invention provides a circuit board having a substrate 3 , a glue 2 , a metal foil 11 , a laminating rubber 12 , and a flexible structure from bottom to top. The structure of the substrate 13 saves the insulating film 9 relative to the first embodiment and the second embodiment, and the circuit board obtained by the physical treatment has better environmental protection characteristics and lowers the cost. A method of manufacturing the above circuit board includes the following process steps:
制备一采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成的柔性绝缘基材3；制备一表面具有金属箔11的柔性基材13，将采用热熔胶水或热熔胶膜的胶水2涂于所述柔性基材13具有金属箔11的一面，将所述柔性基材13附于柔性绝缘基材3上并通过上述胶水2与所述柔性绝缘基材3相接合；上述柔性基材13采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成，并且所述柔性基材表面所具有的金属箔11通过覆合胶12附着于所述柔性基材13表面。Preparing a flexible insulating substrate 3 made of polyethylene terephthalate or polyimide film; preparing a flexible substrate 13 having a metal foil 11 on the surface, which will be hot melt adhesive or hot melt adhesive film Glue 2 is applied to one side of the flexible substrate 13 having the metal foil 11, and the flexible substrate 13 is attached to the flexible insulating substrate 3 and joined to the flexible insulating substrate 3 by the glue 2; The flexible substrate 13 is made of polyethylene terephthalate or a polyimide film, and the metal foil 11 of the flexible substrate surface is attached to the surface of the flexible substrate 13 by the cover rubber 12. .
制备刀模4，运用刀模4通过所述具有金属箔11的柔性基材13表面向下模切，切线5贯通具有金属箔11的柔性基材13并形成所需线路6；Preparing a die 4, using the die 4 to die down through the surface of the flexible substrate 13 having the metal foil 11, the tangential line 5 penetrating through the flexible substrate 13 having the metal foil 11 and forming the desired line 6;
剥离所需线路6以外的剩余金属箔及柔性基材废料7；Stripping the remaining metal foil and flexible substrate waste 7 other than the required line 6;
通过发热板8进行加热压合具有金属箔11的柔性基材13与柔性绝缘基材3后，形成所需的线路6，上述金属箔11为金箔或银箔或铜箔或铝箔，采用上述制作方法拼弃了传统工艺中利用腐蚀性物质对具有金属箔的基材进行蚀刻的化学方法，避免了产生由于化学反应而产生的有毒害物质，具有良好的环保效果，也减小了操作人员的危险性，同时，利用模切的方式得到的线路板，生产设备成本、材料成本都大幅降低，充分提高了市场竞争力，本实施例相比实施例一及实施例二的主要区别在于，所述柔性基材13具有金属箔11的表面与所述柔性绝缘基材3相接合，将金属箔11密封在柔性基材13与柔性绝缘基材3之间，由于上述柔性基材13采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜制成，本身具有绝缘性，减少了覆绝缘膜9的工作步骤，进一步简化了工序降低成本。After the flexible substrate 13 and the flexible insulating substrate 3 having the metal foil 11 are heated and pressed by the heat generating plate 8, a desired wiring 6 is formed, and the metal foil 11 is a gold foil or a silver foil or a copper foil or an aluminum foil. The method eliminates the chemical method of etching the substrate with metal foil by using corrosive substances in the traditional process, avoids the generation of toxic substances due to chemical reaction, has good environmental protection effect, and reduces the operator's At the same time, the circuit board obtained by the die-cutting method greatly reduces the production equipment cost and the material cost, and fully improves the market competitiveness. The main difference between the embodiment and the first embodiment and the second embodiment is that The flexible substrate 13 has a surface of the metal foil 11 bonded to the flexible insulating substrate 3, and the metal foil 11 is sealed between the flexible substrate 13 and the flexible insulating substrate 3, since the flexible substrate 13 is a poly pair Made of ethylene phthalate or polyimide film, it has insulation properties, which reduces the working procedure of covering the insulating film 9, further simplifying the process and reducing the cost.
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the present invention. The scope of protection of utility models.
工业实用性Industrial applicability
序列表自由内容Sequence table free content

Claims (8)

  1. 一种线路板，其特征在于：包含自下而上依次叠加并接合于一体的基材、表面具有金属箔的柔性基材，所述表面具有金属箔的柔性基材为经过模切加工后形成具有所需电路的柔性基材。 A circuit board comprising: a substrate laminated and bonded in order from bottom to top; a flexible substrate having a metal foil on the surface, wherein the flexible substrate having a metal foil is formed by die cutting A flexible substrate with the required circuitry.
  2. 如权利要求1所述的线路板，其特征在于：所述柔性基材无金属箔的一面与基材之间通过热熔胶水或热熔胶膜相接合。The circuit board according to claim 1, wherein one side of the flexible substrate without the metal foil is bonded to the substrate by a hot melt adhesive or a hot melt adhesive film.
  3. 如权利要求2所述的线路板，其特征在于：所述线路板形成所需线路的金属箔表面覆有绝缘膜。A wiring board according to claim 2, wherein said metal foil surface on which said wiring board forms a desired wiring is covered with an insulating film.
  4. 如权利要求1所述的线路板，其特征在于：所述柔性基材具有金属箔的一面与基材之间通过热熔胶水或热熔胶膜相接合。The wiring board according to claim 1, wherein one side of the flexible substrate having the metal foil is bonded to the substrate by a hot melt adhesive or a hot melt adhesive film.
  5. 如权利要求1至4任一项所述的线路板，其特征在于：所述金属箔与柔性基材之间通过覆合胶相接合。The wiring board according to any one of claims 1 to 4, wherein the metal foil and the flexible substrate are joined by a cover glue.
  6. 如权利要求1至4任一项所述的线路板，其特征在于：所述基材为柔性绝缘基材或者硬性绝缘基材，所述金属箔为金箔或银箔或铜箔或铝箔。The wiring board according to any one of claims 1 to 4, wherein the substrate is a flexible insulating substrate or a rigid insulating substrate, and the metal foil is a gold foil or a silver foil or a copper foil or an aluminum foil.
  7. 如权利要求6所述的线路板，其特征在于：所述柔性绝缘基材采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜。The wiring board according to claim 6, wherein said flexible insulating substrate is made of polyethylene terephthalate or polyimide film.
  8. 如权利要求1至4任一项所述的线路板，其特征在于：所述柔性基材采用聚对苯二甲酸乙二醇酯或聚酰亚胺薄膜。The wiring board according to any one of claims 1 to 4, wherein the flexible substrate is made of polyethylene terephthalate or a polyimide film.
PCT/CN2012/074405 2012-04-19 2012-04-19 Circuit board WO2013155693A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201854501U (en) * 2010-11-23 2011-06-01 罗海宁 Circuit board
CN201869432U (en) * 2010-10-12 2011-06-15 王定锋 Circuit board with die cut line
CN102480843A (en) * 2010-11-23 2012-05-30 罗海宁 Circuit board and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201869432U (en) * 2010-10-12 2011-06-15 王定锋 Circuit board with die cut line
CN201854501U (en) * 2010-11-23 2011-06-01 罗海宁 Circuit board
CN102480843A (en) * 2010-11-23 2012-05-30 罗海宁 Circuit board and manufacturing method thereof

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