CN201298542Y - Wire-solder worktable of press welder - Google Patents
Wire-solder worktable of press welder Download PDFInfo
- Publication number
- CN201298542Y CN201298542Y CN 200820155827 CN200820155827U CN201298542Y CN 201298542 Y CN201298542 Y CN 201298542Y CN 200820155827 CN200820155827 CN 200820155827 CN 200820155827 U CN200820155827 U CN 200820155827U CN 201298542 Y CN201298542 Y CN 201298542Y
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- CN
- China
- Prior art keywords
- platform
- solder
- wire
- bonding wire
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Wire Bonding (AREA)
Abstract
The utility model provides a wire-solder worktable of a press welder, and the wire-solder worktable comprises a first lead rail, a second lead rail, a bearing platform, a working platform and a working orbit which are sequentially arranged from bottom to top. A rotation platform is arranged between the bearing platform and the working platform; the rotation platform is fixedly connected with the working platform; cambered grooves arranged on two sides of the rotation platform form an included angle ranging from 0 to 60 degrees; and at least a locating stud is arranged on the bearing platform corresponding to the cambered grooves. Compared with the prior art, the rotation platform with the rotation function is additionally arranged on the original working platform, thereby changing the included angle between the working orbit and the lead rails, relatively shortening the span of a wire-solder, simplifying the running orbit of the wire-solder, solving the problems that the running orbit of an orbit is complicated and the wire-solder is scuffed because the span of the wire-solder is great and the rosin joint occurs, and improving the performance and the yield rate of products.
Description
Technical field
The utility model belongs to semiconductor encapsulation device, relates in particular to a kind of press welder bonding wire workbench.
Background technology
The encapsulation of chip plays and transmits electric energy, transmit signal, provide the heat radiation approach and to critical functions such as the structural defence of chip and supports; wherein; the quality of bonding wire has very important material impact; complexity day by day along with chip; various functional modules are integrated on the chip piece; it is increasing that chip area becomes; the various signals that chip is connected with external circuits are increasing; the solder joint that is arranged in the chip periphery also increases thereupon; how to improve the quality of bonding wire, avoid defectives such as the scuffing that causes in the bonding wire process and rosin joint to seem and be even more important.
Referring to Fig. 1 is traditional ultrasonic thick aluminum thread pressure welding machine bonding wire workbench schematic diagram, first guide rail 1 is vertical mutually with second guide rail 2, on described second guide rail 2, be placed with a carrying platform 3, on described carrying platform 3, be set with workbench 4, working track 5 fixed placement are on described workbench 4, add man-hour, chip to be processed (not indicating) is placed on the described working track 5, place of orbital direction or the vertical direction operation of the bonding wire head (not indicating) of described working track 5 tops, thereby the chip that is placed on the described working track 5 is processed along described working track 5.
Existing its bonding wire head of ultrasonic wave aluminum steel press welder cannot rotate automatically, when the bigger chip of area is encapsulated, because the bonding wire span is big, orbital motion track complexity, causes chopper that bonding wire is caused scratch and produces rosin joint, has a strong impact on the performance and the yield of product.
The utility model content
The technical problems to be solved in the utility model provides a kind of press welder bonding wire workbench, makes the workbench that carries out bonding wire can change the track angle and better processes.
In order to address the above problem, the utility model provides a kind of press welder bonding wire workbench, comprise first guide rail, second guide rail, carrying platform, workbench and the working track that set gradually from bottom to up, between described carrying platform and described workbench, be provided with rotation platform, described rotation platform is fixedlyed connected with described workbench, and described rotation platform both sides are provided with deep-slotted chip breaker.
Further, the angle of described deep-slotted chip breaker formation is 0～60 degree.
Further, described rotation platform and described carrying platform are rotationally connected, and the position of the corresponding described deep-slotted chip breaker of described carrying platform is provided with at least one alignment pin.
Further, described alignment pin be arranged on described carrying platform both sides the centre position.
Compared with prior art, the utility model is by increasing the rotation platform with spinfunction on original workbench, can change the angle between working track and the guide rail, the span of bonding wire, the running orbit of simplification bonding wire have been shortened relatively, the complexity and the bonding wire span that have solved the orbital motion track cause that bonding wire is scratched, the problem of rosin joint greatly, have improved the performance and the yield of product.
Description of drawings
Below in conjunction with the drawings and specific embodiments press welder bonding wire workbench of the present utility model is described in further detail.
Fig. 1 is traditional press welder bonding wire workbench schematic diagram;
Fig. 2 is the utility model press welder bonding wire workbench schematic diagram;
Fig. 3 is the front view of the rotating disk of the utility model press welder bonding wire workbench;
Fig. 4 is the utility model press welder bonding wire workbench schematic diagram that turns clockwise;
Fig. 5 is that the utility model press welder bonding wire workbench is rotated counterclockwise schematic diagram.
Embodiment
See also press welder bonding wire workbench shown in Figure 2, comprise first guide rail 1, second guide rail 2, carrying platform 3 and workbench 4, between described carrying platform 3 and described workbench 4, be provided with a rotation platform 6, described working track 5 is fixed on the described workbench 4, described carrying platform 3 can slide along the described second guide rail direction, described second guide rail 2 can slide along described first guide rail, 1 direction, when described carrying platform 3 when described first guide rail, 1 direction or described second guide rail, 2 directions are slided, also can drive described rotation platform 6 fixed thereon and described workbench 4 that is fixed together and described working track 5, can be placed on chip on the described working track 5 (indicating) move to bonding wire head (indicating) under, the bonding wire head can carry out bonding wire to the chip that is placed on it.
See also Fig. 3, be provided with deep-slotted chip breaker 60 in described rotation platform 6 both sides, described deep-slotted chip breaker 60 is symmetricly set on described rotation platform 6 both sides.Except to the chip of bonding wire along the direction of described first guide rail 1 and described second guide rail 2 is slided, when needs rotate to an angle when processing to chip, can rotate described rotation platform 6 to the angle that needs, simultaneously described rotation platform 6 can drive described workbench 4 and described working track 5 fixed thereon, thereby can rotate the chip bonding wire angle that is placed on the described working track 5, shortened the span of bonding wire relatively, simplify the movement locus of bonding wire, overcome scuffing and rosin joint.On the position by described carrying platform 3 corresponding described deep-slotted chip breakers 60 alignment pin 7 is set and positions, can carry out bonding wire processing chip.Described alignment pin 7 prevents that rotation platform 6 rotates chip described in the bonding wire process carrying out, in the actual work, can be according to the quantity of described rotation platform 6 sizes and the definite described alignment pin 7 of size, in the present embodiment, the position of two described deep-slotted chip breakers 60 of described respectively carrying platform 3 correspondences is provided with described steady pin 7, limited the maximum anglec of rotation of described rotation platform 6, described alignment pin 7 be arranged on described carrying platform 3 both sides the centre position, can symmetry fix postrotational described rotation platform 6, the number of degrees of the anglec of rotation can decide according to the track of actual production chips bonding wire, in the present embodiment, described rotation platform 6 clockwise rotating ranges are 0～30 degree, as shown in Figure 4, described rotation platform 6 counterclockwise rotating ranges are 0～30 degree, as shown in Figure 5.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; that describes in the foregoing description and the specification just illustrates principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. press welder bonding wire workbench, comprise first guide rail, second guide rail, carrying platform, workbench and the working track that set gradually from bottom to up, it is characterized in that: between described carrying platform and described workbench, be provided with rotation platform, described rotation platform is fixedlyed connected with described workbench, and described rotation platform both sides are provided with deep-slotted chip breaker.
2. press welder bonding wire workbench as claimed in claim 1 is characterized in that: the angle that described deep-slotted chip breaker forms is 0～60 degree.
3. press welder bonding wire workbench as claimed in claim 1 is characterized in that: described rotation platform and described carrying platform are rotationally connected, and the position of the corresponding described deep-slotted chip breaker of described carrying platform is provided with at least one alignment pin.
4. press welder bonding wire workbench as claimed in claim 3 is characterized in that: described alignment pin be arranged on described carrying platform both sides the centre position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820155827 CN201298542Y (en) | 2008-11-24 | 2008-11-24 | Wire-solder worktable of press welder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820155827 CN201298542Y (en) | 2008-11-24 | 2008-11-24 | Wire-solder worktable of press welder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201298542Y true CN201298542Y (en) | 2009-08-26 |
Family
ID=41044530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820155827 Expired - Lifetime CN201298542Y (en) | 2008-11-24 | 2008-11-24 | Wire-solder worktable of press welder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201298542Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447661A (en) * | 2013-08-26 | 2013-12-18 | 芜湖炬胜机电设备厂 | Multifunctional automatic welding machine |
| CN103708213A (en) * | 2013-12-31 | 2014-04-09 | 江苏金铁人自动化科技有限公司 | Rotary feeding mechanism |
| CN106862826A (en) * | 2017-04-18 | 2017-06-20 | 河南威猛振动设备股份有限公司 | A kind of Intelligent welding system |
| CN108817795A (en) * | 2018-06-27 | 2018-11-16 | 绿星(福州)居室用品有限公司 | A kind of 360 degree rotation formula iron frame welding equipment and technique |
| CN111922572A (en) * | 2020-05-30 | 2020-11-13 | 安徽精力电动工具有限公司 | Welding auxiliary frame convenient to adjust for stainless steel door production |
| CN111933554A (en) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | Chip packaging manufacturing equipment |
-
2008
- 2008-11-24 CN CN 200820155827 patent/CN201298542Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447661A (en) * | 2013-08-26 | 2013-12-18 | 芜湖炬胜机电设备厂 | Multifunctional automatic welding machine |
| CN103447661B (en) * | 2013-08-26 | 2016-04-20 | 芜湖炬胜机电设备厂 | A kind of multifunction automatic welding machine |
| CN103708213A (en) * | 2013-12-31 | 2014-04-09 | 江苏金铁人自动化科技有限公司 | Rotary feeding mechanism |
| CN106862826A (en) * | 2017-04-18 | 2017-06-20 | 河南威猛振动设备股份有限公司 | A kind of Intelligent welding system |
| CN108817795A (en) * | 2018-06-27 | 2018-11-16 | 绿星(福州)居室用品有限公司 | A kind of 360 degree rotation formula iron frame welding equipment and technique |
| CN108817795B (en) * | 2018-06-27 | 2020-10-09 | 绿星(福州)居室用品有限公司 | 360-degree rotary iron frame welding equipment and process |
| CN111922572A (en) * | 2020-05-30 | 2020-11-13 | 安徽精力电动工具有限公司 | Welding auxiliary frame convenient to adjust for stainless steel door production |
| CN111933554A (en) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | Chip packaging manufacturing equipment |
| CN111933554B (en) * | 2020-09-15 | 2021-05-04 | 深圳市三航工业技术研究院 | Chip packaging manufacturing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CX01 | Expiry of patent term |
Granted publication date: 20090826 |
|
| CX01 | Expiry of patent term |