CN201298542Y - 压焊机焊线工作台 - Google Patents
压焊机焊线工作台 Download PDFInfo
- Publication number
- CN201298542Y CN201298542Y CN 200820155827 CN200820155827U CN201298542Y CN 201298542 Y CN201298542 Y CN 201298542Y CN 200820155827 CN200820155827 CN 200820155827 CN 200820155827 U CN200820155827 U CN 200820155827U CN 201298542 Y CN201298542 Y CN 201298542Y
- Authority
- CN
- China
- Prior art keywords
- platform
- solder
- wire
- bonding wire
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Wire Bonding (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820155827 CN201298542Y (zh) | 2008-11-24 | 2008-11-24 | 压焊机焊线工作台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820155827 CN201298542Y (zh) | 2008-11-24 | 2008-11-24 | 压焊机焊线工作台 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201298542Y true CN201298542Y (zh) | 2009-08-26 |
Family
ID=41044530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820155827 Expired - Lifetime CN201298542Y (zh) | 2008-11-24 | 2008-11-24 | 压焊机焊线工作台 |
Country Status (1)
Country | Link |
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CN (1) | CN201298542Y (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103447661A (zh) * | 2013-08-26 | 2013-12-18 | 芜湖炬胜机电设备厂 | 一种多功能自动化焊机 |
CN103708213A (zh) * | 2013-12-31 | 2014-04-09 | 江苏金铁人自动化科技有限公司 | 一种旋转送料机构 |
CN106862826A (zh) * | 2017-04-18 | 2017-06-20 | 河南威猛振动设备股份有限公司 | 一种智能焊接*** |
CN108817795A (zh) * | 2018-06-27 | 2018-11-16 | 绿星(福州)居室用品有限公司 | 一种360度旋转式铁框焊接设备及工艺 |
CN111933554A (zh) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | 一种芯片封装制造设备 |
CN111922572A (zh) * | 2020-05-30 | 2020-11-13 | 安徽精力电动工具有限公司 | 一种便于调节的不锈钢门生产用焊接辅助架 |
-
2008
- 2008-11-24 CN CN 200820155827 patent/CN201298542Y/zh not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103447661A (zh) * | 2013-08-26 | 2013-12-18 | 芜湖炬胜机电设备厂 | 一种多功能自动化焊机 |
CN103447661B (zh) * | 2013-08-26 | 2016-04-20 | 芜湖炬胜机电设备厂 | 一种多功能自动化焊机 |
CN103708213A (zh) * | 2013-12-31 | 2014-04-09 | 江苏金铁人自动化科技有限公司 | 一种旋转送料机构 |
CN106862826A (zh) * | 2017-04-18 | 2017-06-20 | 河南威猛振动设备股份有限公司 | 一种智能焊接*** |
CN108817795A (zh) * | 2018-06-27 | 2018-11-16 | 绿星(福州)居室用品有限公司 | 一种360度旋转式铁框焊接设备及工艺 |
CN108817795B (zh) * | 2018-06-27 | 2020-10-09 | 绿星(福州)居室用品有限公司 | 一种360度旋转式铁框焊接设备及工艺 |
CN111922572A (zh) * | 2020-05-30 | 2020-11-13 | 安徽精力电动工具有限公司 | 一种便于调节的不锈钢门生产用焊接辅助架 |
CN111933554A (zh) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | 一种芯片封装制造设备 |
CN111933554B (zh) * | 2020-09-15 | 2021-05-04 | 深圳市三航工业技术研究院 | 一种芯片封装制造设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term |
Granted publication date: 20090826 |
|
CX01 | Expiry of patent term |