CN201853682U - Working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment - Google Patents
Working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment Download PDFInfo
- Publication number
- CN201853682U CN201853682U CN2010205358566U CN201020535856U CN201853682U CN 201853682 U CN201853682 U CN 201853682U CN 2010205358566 U CN2010205358566 U CN 2010205358566U CN 201020535856 U CN201020535856 U CN 201020535856U CN 201853682 U CN201853682 U CN 201853682U
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- crossbeam
- lead
- turning handle
- lead bonding
- locating piece
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Abstract
The utility model provides a working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment, which can solve the problem that lead bonding is only realized among the surfaces in the same direction in the prior art. The working clamp for realizing lead bonding among surfaces in different directions comprises a support, a cross beam and a clamp head, wherein the support comprises a bottom plate and two cross beam supporting plates fixedly arranged on the opposite sides of the bottom plate; the cross beam is connected to the two cross beam supporting plates, and one end of the cross beam is fixedly connected with a rotary handle; and the left side and the right side of the rotary handle are respectively provided with a positioning block for limiting the rotating angle of the rotary handle, and the positioning blocks are fixedly arranged on the cross beam supporting plates. When the working clamp is utilized, the cross beam can be rotated by rotating the rotary handle, and then the bonding surfaces of electronic devices to be bonded are adjusted, therefore, the working clamp realizes the lead bonding among the surfaces in different directions, is simple to operate and is convenient to manufacture.
Description
Technical field
The utility model belongs to lead-in wire bonding processing technique field, specifically, relates to a kind of non-frock clamp of lead-in wire bonding and lead-in wire bonding apparatus between face in the same way of realizing electronic device.
Background technology
The lead-in wire bonding is meant the technology that the interior pin position on pressure welding area on the large scale integrated chip and the lead frame is coupled together with the mode of wire by bonding, and it is simple, with low cost with technology, be fit to multiple Electronic Packaging form and occupy an leading position in connected mode.The lead-in wire bonding is finished by the leads bonding apparatus usually, electronic device is fixed with chuck on the anchor clamps of lead-in wire bonding apparatus, form the distinct line arc shape of various satisfied different packing forms needs by ceramic tubule (chopper) guide wire lead-in wire (gold thread) motion of lead-in wire bonding apparatus, electronic device is bonded on the lead frame fast.
In the prior art, the anchor clamps of lead-in wire bonding apparatus are made of crossbeam and chuck, chuck and crossbeam are axle, the hole connects, the junction is provided with holddown spring, the used for electronic device chuck for the treatment of bonding is pressed on the crossbeam, and crossbeam be fixed on the lead-in wire bonding apparatus pad area on, can not rotate, then when the used for electronic device chuck compresses, electronic device can not rotate, again because the ceramic tubule (chopper) of lead-in wire bonding apparatus can only carry out horizontal translation and vertical feed is pressed on the pad, therefore, the lead-in wire bonding apparatus can only carry out bonding between the plane to the equidirectional of electronic device.
Yet, along with the continuous progress of large scale integrated circuit design and manufacturing process, require the non-of electronic device can realize the bonding that goes between between the face in the same way more and more, be adjacent bonding between vertical plane as the horizontal plane of electronic device.
Summary of the invention
The utility model provides a kind of non-frock clamp of lead-in wire bonding between face in the same way of realizing, what can solve the prior art existence can only realize the problem of the lead-in wire bonding between the face in the same way.
For reaching the purpose that solves the problems of the technologies described above, frock clamp described in the utility model is achieved by the following technical solutions:
A kind of frock clamp of realizing the non-lead-in wire of face in the same way bonding, comprise support, crossbeam and chuck, described support comprises base plate and the two crossbeam supporting brackets that are installed on the described base plate relative edge, described crossbeam is connected between the two described crossbeam supporting brackets, one end of described crossbeam is fixed with turning handle, the and arranged on left and right sides of described turning handle is respectively equipped with the locating piece that is used to limit its rotational angle, and described locating piece is installed on the described crossbeam supporting bracket.
Further, the rotational angle of described turning handle is 45 °～135 °.
Be processing, easy for installation, described locating piece is an alignment pin, with described beam supporting plate riveted joint.
For realizing technical purpose of the present utility model, lead-in wire bonding apparatus described in the utility model is achieved by the following technical solutions:
A kind of lead-in wire bonding apparatus, comprise heating station and the frock clamp that is fixed on the heating station, described frock clamp comprises support, crossbeam and chuck, described support comprises base plate and the two crossbeam supporting brackets that are installed on the described base plate relative edge, described crossbeam is connected in two described crossbeam supporting brackets, one end of described crossbeam is fixed with turning handle, and the and arranged on left and right sides of described turning handle is respectively equipped with the locating piece that is used to limit its rotational angle, and described locating piece is installed on the described crossbeam supporting bracket.
Further, the rotational angle of described turning handle is 45 °～135 °.
Be processing, easy for installation, described locating piece is an alignment pin, with described beam supporting plate riveted joint.
Compared with prior art, advantage of the present utility model and good effect are:
1, utilize frock clamp of the present utility model, can pass through the rotation turning handle and rotating beam, and then adjust the need bonding face for the treatment of the linkage electron device, realize non-lead-in wire bonding between face in the same way, simple to operate, easy to make.
2, by locating piece is set, can effectively limit the anglec of rotation of rotary handle, treat that the need bonding face of linkage electron device is to correct position thereby adjust.
3, frock clamp of the present utility model is simple in structure, and is easy to process, can be applicable to multiple non-lead-in wire bonding between face in the same way.
Description of drawings
Fig. 1 proposes to realize the go between structural front view of frock clamp of bonding of non-face in the same way for the utility model;
Fig. 2 proposes to realize the go between structure left view of frock clamp of bonding of non-face in the same way for the utility model;
Among the figure: 1, frock clamp; 11, support; 111, base plate; 112, crossbeam supporting bracket; 12, crossbeam; 13, chuck; 14, turning handle; 15, locating piece; 2, electronic device.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model embodiment clearer, below in conjunction with the accompanying drawing among the utility model embodiment, technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
As depicted in figs. 1 and 2, present embodiment is realized the frock clamp 1 of the non-lead-in wire of face in the same way bonding, comprise support 11, crossbeam 12 and chuck 13, support 11 comprises base plate 111 and two crossbeam supporting brackets 112 that are installed on base plate 111 relative edges, crossbeam 12 is connected in two crossbeam supporting brackets 112, one end of crossbeam 12 is fixed with turning handle 14, and the and arranged on left and right sides of turning handle 14 is respectively equipped with the locating piece 15 that is used to limit its rotational angle, and locating piece 15 is installed on the crossbeam supporting bracket 112.
Particularly, support 11 adopts the higher material of conductive coefficient to make, as copper product etc., can be one-body molded by base plate 111 and two beam supporting plates 112, or mold base plate 111 and two beam supporting plates 112 respectively, the three is fixed as one by screw connecting mode or welding manner then, and present embodiment does not limit this.Crossbeam 12 adopts high-abrasive material to make, as stainless steel material etc., itself and the mode that being connected of two crossbeam supporting brackets 112 that are oppositely arranged adopts axis hole to cooperate, the two ends of crossbeam 12 are plugged in respectively in two supported holes on the beam supporting plate 2, and there are certain interval in the bottom surface of crossbeam 12 and base plate 111, so that the upset of crossbeam 12.Simultaneously, the centre of crossbeam 12 is the platform-like of indent, chuck 13 is positioned on this platform, the one end also is that the mode that adopts axis hole to cooperate is connected with crossbeam 12, holddown spring is set in the connecting hole, after being used to place the electronic device 2 for the treatment of bonding, promoting chuck electronic device 2 is pressed on the platform of crossbeam 12.In addition, one end of crossbeam 12 passes the supported hole on one of them beam supporting plate 112, turning handle 14 can be fixed on this end of crossbeam 12 by modes such as riveted joints, then can drive crossbeam 12 upsets by rotation turning handle 14, thereby realizes the upset of electronic device 2.Be processing, easy for installation, locating piece 15 can directly adopt alignment pin, and the outer surface that is riveted on beam supporting plate 112 gets final product, and certainly, also can adopt alternate manner, and present embodiment does not limit the concrete shape and the fixed form of locating piece 15.Simultaneously, locating piece 15 vertical axis that relatively rotates handle 14 is symmetrical arranged.
The use of present embodiment frock clamp is: under the position-limiting action of turning handle 14 rotations and its both sides locating piece 15, when rotation turning handle 14 makes it lean against on the left positioner piece 15, one of them face of electronic device 2 goes to horizontal bonding position, first bonding that goes between; When leaning against on the right positioner piece 15 after turning handle 14 turns over certain angle, the another side of electronic device 2 goes to horizontal bonding position, second bonding that goes between, thus finished two non-bondings between face in the same way of electronic device 2.
For realizing the non-lead-in wire bonding between face in the same way of various electronic device 2 different angles, the rotational angle of turning handle 14 is 45 °～135 °, when the non-face in the same way of electronic device 2 when vertically being provided with, promptly for the horizontal plane of realizing electronic device 2 is adjacent bonding between vertical plane, the rotational angle of turning handle 14 is 90 °.
Present embodiment lead-in wire bonding apparatus, frock clamp 1 is fixed on the heating station of lead-in wire bonding apparatus, frock clamp 1 comprises support 11, crossbeam 12 and chuck 13, support 11 comprises base plate 111 and the two crossbeam supporting brackets 112 that are installed on base plate 111 relative edges, crossbeam 12 is connected in two crossbeam supporting brackets 112, one end of crossbeam 12 is fixed with turning handle 14, the and arranged on left and right sides of turning handle 14 is respectively equipped with the locating piece 15 that is used to limit its rotational angle, and locating piece 15 is installed on the crossbeam supporting bracket 112.
Particularly, the concrete structure of frock clamp 1 can not repeat them here referring to the record of embodiment and accompanying drawing 1 and Fig. 2 of the utility model frock clamp in the present embodiment.Present embodiment lead-in wire bonding apparatus adopts conventional bonding apparatus, and its heating station is provided with location hole, and frock clamp 1 directly is screwed on heating station and gets final product, and therefore omits the concrete structure figure of present embodiment lead-in wire bonding apparatus.
Particularly, support 11 adopts the higher material of conductive coefficient to make, as copper product etc., can be one-body molded by base plate 111 and two beam supporting plates 112, or mold base plate 111 and two beam supporting plates 112 respectively, the three is fixed as one by screw connecting mode or welding manner then, and present embodiment does not limit this.Crossbeam 12 adopts high-abrasive material to make, as stainless steel material etc., itself and the mode that being connected of two crossbeam supporting brackets 112 that are oppositely arranged adopts axis hole to cooperate, the two ends of crossbeam 12 are plugged in respectively in two supported holes on the beam supporting plate 112, and there are certain interval in the bottom surface of crossbeam 12 and base plate 111, so that the upset of crossbeam 12.Simultaneously, the centre of crossbeam 12 is the platform-like of indent, chuck 13 is positioned on this platform, the one end also is that the mode that adopts axis hole to cooperate is connected with crossbeam 12, holddown spring is set in the connecting hole, after being used to place the electronic device 2 for the treatment of bonding, promoting chuck electronic device 2 is pressed on the platform of crossbeam 12.In addition, one end of crossbeam 12 passes the supported hole on one of them beam supporting plate 112, turning handle 14 can be fixed on this end of crossbeam 12 by modes such as riveted joints, then can drive crossbeam 12 upsets by rotation turning handle 14, thereby realizes the upset of electronic device 2.Be processing, easy for installation, locating piece 15 can directly adopt alignment pin, and the outer surface that is riveted on beam supporting plate 112 gets final product, and certainly, also can adopt alternate manner, and present embodiment does not limit the concrete shape and the fixed form of locating piece 15.Simultaneously, locating piece 15 vertical axis that relatively rotates handle 14 is symmetrical arranged.
The use of frock clamp is in the present embodiment lead-in wire bonding apparatus: under the position-limiting action of turning handle 14 rotations and its both sides locating piece 15, when rotation turning handle 14 makes it lean against on the left positioner piece 15, one of them face of electronic device 2 goes to horizontal bonding position, first bonding that goes between; When leaning against on the right positioner piece 15 after turning handle 14 turns over certain angle, the another side of electronic device 2 goes to horizontal bonding position, second bonding that goes between, thus finished two non-bondings between face in the same way of electronic device 2.
For realizing the non-lead-in wire bonding between face in the same way of various electronic device 2 different angles, the rotational angle of turning handle 14 is 45 °～135 °, when the non-face in the same way of electronic device 2 when vertically being provided with, promptly for the horizontal plane of realizing electronic device 2 is adjacent bonding between vertical plane, the rotational angle of turning handle 14 is 90 °.
The above, it only is preferred embodiment of the present utility model, be not to be the restriction of the utility model being made other form, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solutions of the utility model content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment did, still belongs to the protection range of technical solutions of the utility model according to technical spirit of the present utility model.
Claims (6)
1. realize the non-frock clamp of lead-in wire bonding between face in the same way for one kind, it is characterized in that: comprise support, crossbeam and chuck, described support comprises base plate and the two crossbeam supporting brackets that are installed on the described base plate relative edge, described crossbeam is connected in two described crossbeam supporting brackets, one end of described crossbeam is fixed with turning handle, the and arranged on left and right sides of described turning handle is respectively equipped with the locating piece that is used to limit its rotational angle, and described locating piece is installed on the described crossbeam supporting bracket.
2. frock clamp according to claim 1 is characterized in that: the rotational angle of described turning handle is 45 °～135 °.
3. frock clamp according to claim 1 and 2 is characterized in that: described locating piece is an alignment pin, with described beam supporting plate riveted joint.
One kind the lead-in wire bonding apparatus, comprise heating station and the frock clamp that is fixed on the heating station, it is characterized in that: described frock clamp comprises support, crossbeam and chuck, described support comprises base plate and the two crossbeam supporting brackets that are installed on the described base plate relative edge, described crossbeam is connected in two described crossbeam supporting brackets, one end of described crossbeam is fixed with turning handle, the and arranged on left and right sides of described turning handle is respectively equipped with the locating piece that is used to limit its rotational angle, and described locating piece is installed on the described crossbeam supporting bracket.
5. lead-in wire bonding apparatus according to claim 4 is characterized in that: the rotational angle of described turning handle is 45 °～135 °.
6. according to claim 4 or 5 described lead-in wire bonding apparatus, it is characterized in that: described locating piece is an alignment pin, with described beam supporting plate riveted joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205358566U CN201853682U (en) | 2010-09-16 | 2010-09-16 | Working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205358566U CN201853682U (en) | 2010-09-16 | 2010-09-16 | Working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201853682U true CN201853682U (en) | 2011-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205358566U Expired - Fee Related CN201853682U (en) | 2010-09-16 | 2010-09-16 | Working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201853682U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902348A (en) * | 2015-06-30 | 2015-09-09 | 成都普创通信技术股份有限公司 | Easy-operated digital distributing frame |
| CN104954895A (en) * | 2015-06-30 | 2015-09-30 | 成都普创通信技术股份有限公司 | Digital distribution frame |
| CN105372129A (en) * | 2015-11-30 | 2016-03-02 | 钱培玉 | Improved fixture for testing bearing capacity of circuit board |
| CN108081837A (en) * | 2017-12-26 | 2018-05-29 | 米姿颖 | Inkstone ink grinder |
| CN110676186A (en) * | 2019-08-30 | 2020-01-10 | 华东光电集成器件研究所 | Three-dimensional equipment bonding device in antarafacial |
-
2010
- 2010-09-16 CN CN2010205358566U patent/CN201853682U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902348A (en) * | 2015-06-30 | 2015-09-09 | 成都普创通信技术股份有限公司 | Easy-operated digital distributing frame |
| CN104954895A (en) * | 2015-06-30 | 2015-09-30 | 成都普创通信技术股份有限公司 | Digital distribution frame |
| CN105372129A (en) * | 2015-11-30 | 2016-03-02 | 钱培玉 | Improved fixture for testing bearing capacity of circuit board |
| CN108081837A (en) * | 2017-12-26 | 2018-05-29 | 米姿颖 | Inkstone ink grinder |
| CN108081837B (en) * | 2017-12-26 | 2024-05-17 | 米姿颖 | Inkstone ink grinder |
| CN110676186A (en) * | 2019-08-30 | 2020-01-10 | 华东光电集成器件研究所 | Three-dimensional equipment bonding device in antarafacial |
| CN110676186B (en) * | 2019-08-30 | 2021-04-23 | 华东光电集成器件研究所 | Three-dimensional equipment bonding device in antarafacial |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHINA AVIATION HISENSE OPTICAL-ELECTRICAL TECHNOLO Free format text: FORMER OWNER: HISENSE BROADBAND MULTIMEDIA TECHNOLOGY Effective date: 20120727 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 266100 QINGDAO, SHANDONG PROVINCE TO: 266061 QINGDAO, SHANDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120727 Address after: 266061, Laoshan District, Shandong, Qingdao Province North residential community branch north house Subdistrict Office Patentee after: China Aviation Haixin Optical-Electrical Technology Co., Ltd. Address before: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No. Patentee before: Hisense Broadband Multimedia Technology |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20190916 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |