CN110197792B - Method for packaging bilaterally-symmetrical convex polygonal tube shell with even number of sides - Google Patents
Method for packaging bilaterally-symmetrical convex polygonal tube shell with even number of sides Download PDFInfo
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- CN110197792B CN110197792B CN201910480600.5A CN201910480600A CN110197792B CN 110197792 B CN110197792 B CN 110197792B CN 201910480600 A CN201910480600 A CN 201910480600A CN 110197792 B CN110197792 B CN 110197792B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Abstract
The invention discloses a packaging method of a bilaterally symmetrical convex polygonal tube shell with even number of sides, which is characterized in that the position and the number of positioning holes are determined according to the sides of a convex polygon by using a parallel seam welding technology, the positioning slotting size of the tube shell is the external size of the tube shell, and leg leading slots are reserved. The packaging procedure sets the length of the X-axis packaging to be the length of a connecting line of the center point of the edge to be packaged, the length of the Y-axis packaging is equal to the length of the packaging edge, the tube shell to be packaged is fixed in a mold during packaging, and the packaging procedure of the parallel seam welding machine is started to package the convex polygonal tube shell. The packaging of the pipe shell with the complex shape can be realized, the consistency and the air tightness are good, the equipment investment is reduced, and the production cost is reduced.
Description
Technical Field
The invention belongs to the field of parallel seam welding mold design, and particularly relates to a packaging mold and a program design for a left-right symmetrical convex polygonal tube shell with an irregular rectangle and an even number of sides.
Background
The parallel seam welding technology is mainly applied to packaging integrated circuit chips, and the principle of the parallel seam welding technology is resistance welding. As shown in figure 1, two conical electrode wheels are utilized to press a cover plate to be packaged and a metal packaging edge on a tube shell, two high-frequency large currents start from the electrode wheel at one end and return to the other end through the cover plate and the tube shell, the high resistance of the whole loop is at the joint of the cover plate and the tube shell, the heat provided by the high-frequency large currents melts the joint, and a welding spot is formed after solidification. And setting the program to enable the welding spots to be continuously overlapped to form the welding seam.
The parallel seam welding technology has higher reliability than energy storage welding and laser welding, and has stronger sealing performance, low cost and high efficiency. The packaging is the last procedure of the assembly of the thick film hybrid integrated circuit, and the reliability of the tube shell is directly influenced by the quality of the packaging. The integrated circuit package provides a reliable and stable working environment for the circuit tube core in the tube shell, and plays a mechanical or environmental protection role for the internal components, thereby enabling the integrated circuit to normally play the function.
The device to be packaged can be heated and vacuumized in the packaging process, so that the content of water vapor and oxygen in the tube shell can be reduced, the chip is not easy to oxidize, and the chip is protected. High-purity nitrogen can be filled into the glove box, and the content of water vapor and oxygen in the pipe shell is further reduced. The operation process is set by a program, and all mechanical automation is realized except for cover plate alignment and tube shell placement, so that the burden of operators is reduced, and the packaging stability and consistency are improved.
The encapsulation procedure of the parallel seam welder can easily realize the encapsulation of the tube shells of a right-angled rectangle, a rounded rectangle and a round shape. When the rectangular tube shell is packaged, two sides of the rectangular tube shell are packaged, then the shell is rotated by 90 degrees, and the other two sides in the vertical direction are packaged; the circular shell needs to rotate the worktable 180 degrees along the Z axis to complete the packaging of the whole tube shell.
Most tube encapsulation needs special mould, and the factor that the mould design need be considered has tube height, shape and leg guiding position, and the mould of design can be with tube central point location at encapsulation mesa zero point position, effectual restriction X, Y direction degree of freedom, and Z axle direction height need rationally be in order to cooperate the electrode wheel height of pushing down.
Disclosure of Invention
The invention aims to provide a packaging method of a bilaterally symmetrical convex polygonal tube shell with even number of sides. The packaging of the pipe shell with the complex shape can be realized, the consistency and the air tightness are good, the equipment investment is reduced, and the production cost is reduced.
The parallel seam welder packaging program setting can only realize point, rectangular and circular packaging, and the rectangular and circular programs can not be carried out simultaneously.
Based on the limitation of the condition, the technical scheme of the invention is as follows: a packaging method for a bilaterally symmetrical convex polygonal tube shell with even number of sides comprises the following three conditions:
when even-number-side convex polygons with equal side lengths are packaged, the die only needs a pair of positioning holes, and the positioning holes are located on the connecting line of the central lines of the tube shells. The size of the positioning slot of the pipe shell is the external size of the pipe shell, and a leg leading slot is reserved. And the packaging procedure sets the length of the X-axis seal to be the length of the connecting line of the center points of the edges to be packaged, and the length of the Y-axis seal is equal to the length of the packaging edge. When packaging, the pipe shell to be packaged is fixed in a mould, the packaging program is started and executed, when the program is over half, the program is stopped, the position of the table top is reset to zero, the pipe shell is taken out and rotated by a certain angle and placed in the mould again, the packaging program is started and executed for the second time, and when the program is over half, the packaging program is stopped, and the operations are repeatedly executed to realize parallel seam welding of convex deformation of equilateral-long even sides.
When the even-number convex polygons with different side lengths are packaged, the die needs a plurality of pairs of positioning holes, the number of pairs of the positioning holes is equal to the type of the sides, and the pairs of the positioning holes are respectively connected with the central points of the edges to be packaged. The size of the positioning slot of the pipe shell is the external size of the pipe shell, and a leg leading slot is reserved. Fixing the die in one pair of positioning holes, placing the tube shell to be packaged, and setting the length of the X-axis seal to be the length of a connecting line of the center points of the edges to be packaged by a packaging procedure, wherein the length of the Y-axis seal is equal to the length of the packaging edge. And starting an executing packaging program, stopping the program when the program is over half, returning the position of the table top to zero, rotationally fixing the die to the second pair of positioning holes at the moment, setting a second section of packaging program according to the method, and repeatedly executing the operations to realize parallel seam welding with unequal side lengths and even-number convex deformation.
When even-number-side convex polygons with circular arcs are packaged, the die needs a plurality of pairs of positioning holes, the straight-side positioning holes are arranged on a connecting line of central points of the packages, the procedure is stopped when the procedure is over half, the position of the table top is reset to zero, and the die is rotationally fixed into a second pair of positioning holes; the connecting line of the circular arc edge packaging positioning hole and the connecting line of the two sections of circular arc packaging starting points are reverse 1 degree, the circular packaging program is opened, and the packaging diameter is the diameter of the circle where the circular arc is located. When the arc edge is packaged, the die is fixed in the arc positioning holes, the tube shell to be packaged is placed, the program is executed until the arc packaging is finished, the program is stopped, the table top position is reset to zero, the die is rotationally fixed in the first next pair of positioning holes, and other edges are packaged.
The method provided by the invention can realize the packaging of the tube shell with the complex shape, only one die needs to be processed, and the effect of laser welding is realized by parallel seam welding. And the consistency and the air tightness are good, the equipment investment is reduced, and the production cost is reduced.
Drawings
FIG. 1 is a schematic diagram of a parallel seam welding electrode.
Fig. 2 is an example of an even-numbered convex polygonal mold with equal package side lengths.
Fig. 3 is an example of an even-numbered convex polygonal mold with unequal package sides.
Fig. 4 is an example of an even-sided convex polygonal mold encapsulating a tape arc.
Detailed Description
The following describes the present invention with reference to the accompanying drawings.
Fig. 2 is a regular hexagon, a convex polygon die with even number sides and equal package side length. The die positioning holes are arranged on the midpoint connecting line of any opposite sides, the length of the midpoint connecting line is set to be the length of an X axis in the packaging procedure, and the length of the packaging side is set to be the length of a Y axis in the packaging procedure. During packaging, the mould does not need to be moved, the program does not need to be changed, the angle of the pipe shell only needs to be rotated, and the packaging can be completed by executing the program for multiple times. (tube shell encapsulation in the figure performs 3 times procedure altogether)
FIG. 3 shows a mold for encapsulating even-numbered convex polygons with unequal side lengths, and unequal-length octagons. The die positioning holes are arranged on the midpoint connecting line of any two pairs of edges. And the packaging program sets the length of the connecting line of the middle points of the edges to be packaged as the length of an X axis, and the length of the packaging edge as the length of a Y axis. During packaging, the pipe shell does not need to be moved, the angle of the die needs to be rotated, the program corresponding to the positioning hole is replaced and executed, and packaging is completed after multiple operations. (tube shell encapsulation in the figure performs 4 times of procedure altogether)
FIG. 4 shows a mold for encapsulating even-numbered convex polygons with circular arcs, having two pairs of positioning holes. The connecting line of the positioning holes of the circular arc edge packaging is 1 reverse to the connecting line of the starting points of the two sections of circular arc packaging, the tube shell does not need to be moved during packaging, the angle of the die needs to be rotated, the program corresponding to the positioning holes is replaced and executed, and the packaging is completed after multiple operations. (tube shell encapsulation in the figure performs 2-pass procedure altogether)
The above embodiments are only for illustrating the technical solutions of the present invention, and the present invention is not limited to the above embodiments, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A method for packaging a bilaterally symmetrical convex polygonal tube shell with even number of sides is characterized by comprising the following three conditions:
when even-number-side convex polygons with equal side length are packaged, the die only needs a pair of positioning holes, the positioning holes are located on the connecting line of the central lines of the tube shells, the positioning slotting size of the tube shells is the external size of the tube shells, leg leading grooves are reserved, the packaging program sets the X-axis packaging length as the connecting line length of the central points of the edges to be packaged, the Y-axis packaging length is equal to the packaging side length, the tube shells to be packaged are fixed in the die during packaging, the packaging program is started and executed, the program is stopped when the program is over half, the position of the table top is reset to zero, the tube shells are taken out and rotated by a certain angle and placed in the die again, the packaging program is started for the second time to execute the same program and is stopped when the program;
when an even-number convex polygon with unequal side lengths is packaged, a plurality of pairs of positioning holes are needed for the die, the number of pairs of the positioning holes is equal to the types of the sides, the pairs of the positioning holes are respectively connected with the central point of the side to be packaged, the positioning slotting size of the tube shell is equal to the external size of the tube shell, leg leading grooves are reserved, the die is fixed in one pair of the positioning holes and placed into the tube shell to be packaged, the packaging program sets the length of an X-axis seal to be the length of the central point of the side to be packaged, the length of a Y-axis seal is equal to the side length of the package, the packaging program is started and executed, the program is stopped when the program is over half, the position of the table top is zeroed, the die is fixed into a second pair of the positioning holes in;
when an even-number-side convex polygon with an arc and the center of the arc coinciding with the center point of the tube shell is packaged, the die needs a plurality of pairs of positioning holes, the straight-side positioning holes are arranged on the connecting line of the center points of the package, the procedure is stopped when the procedure is over half, the position of the table top is reset to zero, and the die is rotationally fixed into a second pair of positioning holes; the connecting line of the circular arc edge packaging positioning holes is opposite to the connecting line of the two circular arc packaging starting points by 1 degree, the circular packaging program setting is opened, the packaging diameter is the circular diameter of the circular arc, when the circular arc edge is packaged, the die is fixed in the circular arc positioning holes and placed into the tube shell to be packaged, the program is executed until the circular arc packaging is finished, the program is stopped, the position of the table top is reset to zero, the die is rotationally fixed in the first pair of positioning holes, other edges are packaged, and the parallel seam welding of the convex deformation tube shell with even number edges and unequal side lengths can be realized by repeatedly executing the operations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910480600.5A CN110197792B (en) | 2019-06-04 | 2019-06-04 | Method for packaging bilaterally-symmetrical convex polygonal tube shell with even number of sides |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910480600.5A CN110197792B (en) | 2019-06-04 | 2019-06-04 | Method for packaging bilaterally-symmetrical convex polygonal tube shell with even number of sides |
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| Publication Number | Publication Date |
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| CN110197792A CN110197792A (en) | 2019-09-03 |
| CN110197792B true CN110197792B (en) | 2020-11-10 |
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| CN115781115B (en) * | 2022-11-17 | 2024-06-14 | 青岛航天半导体研究所有限公司 | Parallel seam welding method for fan-shaped shell |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011119338A (en) * | 2009-12-01 | 2011-06-16 | Misuzu Kogyo:Kk | Method of joining metal member, and joined metal member unit |
| CN102837136B (en) * | 2012-09-11 | 2014-08-27 | 陕西华经微电子股份有限公司 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
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