CN1940776A - 多层级搪瓷珐琅表盘 - Google Patents

多层级搪瓷珐琅表盘 Download PDF

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CN1940776A
CN1940776A CNA200510105087XA CN200510105087A CN1940776A CN 1940776 A CN1940776 A CN 1940776A CN A200510105087X A CNA200510105087X A CN A200510105087XA CN 200510105087 A CN200510105087 A CN 200510105087A CN 1940776 A CN1940776 A CN 1940776A
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substrate
enamel layer
plug
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dial plate
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S·博尔万
R·丁格
N·布朗卡特
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Swatch Group Research and Development SA
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Abstract

本发明涉及一种多层级搪瓷珐琅表盘。这种具有珐琅层(2)的表盘包括由陶瓷材料制成的基板(1)，该基板(1)具有通过部分或贯穿地成形或机加工获得的由插件(10)形成的凹凸部分(4，8)，插件(10)也具有珐琅层(12)，插件(10)的厚度限定了凹部(4)或凸部(8)。

Description

多层级搪瓷珐琅表盘
技术领域
本发明涉及一种多层级搪瓷珐琅表盘，即其基板具有一个或多个凹部或相反地凸部的表盘，所述基板表面涂有珐琅层/搪瓷层。这种表盘特别用于其中该凹部限定例如二级表盘的钟表中，该二级表盘例如为小秒表或计时器的表盘。这种多层级设计还具有纯粹的美观目的。
背景技术
制造多层级搪瓷珐琅表盘的常用方法是，取厚度非常小且通常由铜、铜合金或银制成的金属板，通过依次的沉积和烧结操作在基板表面形成一层珐琅，所述(珐琅)层具有通常为600至800μm的厚度，以及一层在板的背面上的厚度较小的背面珐琅(counter enamelling)。背面珐琅具有一个主要的技术功能，即抵抗在连续的烧结操作阶段在金属板中产生的应力。然后，切割出用于二级表盘的具有所需尺寸的孔，随后对以相同方式制造出的珐琅圆盘的表面进行机加工并将其切割成该孔的尺寸，这可能减小珐琅的厚度，最后将该盘焊接到孔中，这在表盘的背部产生了非常显眼的标志并可能损害二级表盘。以上简单描述的方法非常难于实施，而且具有非常高的废品率，最终导致成品的成本非常高。
为了使金属上的珐琅表盘更具立体感而不产生上述现有技术中的缺点，已经提出取一较厚的基板，在该板上加工出凹孔，然后在该凹孔上涂覆一层足够厚的珐琅以掩盖底部的金属表面。由此形成的珐琅表盘非常厚，这造成了表壳尺寸的增加，这也不再适应目前手表的要求。
也曾经提出例如通过冲压使金属基板变形，然后上釉。已经变形的部分具有改变的热性能，从而烧结操作经常造成珐琅层的裂纹，这导致制造的部件被废弃。
发明内容
由此，本发明的目的是通过提供一种多层级表盘来克服上述现有技术中的缺点，这种表盘不需要在表盘的背面涂覆背面珐琅，或者例如为了在凹孔中形成二级表盘而对一个部分进行焊接。
本发明因此涉及一种多层级搪瓷珐琅表盘，它包括一个基板，该基板的表面包括形成凹部或相反地形成凸部的凹凸部分，为了装饰或技术目的，例如为了在钟表中限定二级表盘，表盘的整个表面和该凹凸部分都覆盖有珐琅层。这种表盘的特征在于，基板由陶瓷材料制成，该凹凸部分是通过在上釉前使所述基板预成形或者通过对所述珐琅层机加工以穿过珐琅层或甚至穿过基板而制成的。事实上，这种多层级搪瓷珐琅表盘可以多种不同方式获得。
在第一实施例中，在制造陶瓷基板的过程中，例如通过采用适当模具的CIM方法(陶瓷射出成型方法)在表盘的表面形成所需要的凹凸部分，然后，通过依次的沉积和烧结操作，对整个表面和该凹凸部分上釉，以直接获得成品表盘。同样，可以通过对陶瓷基板的平坦表面机加工而形成凹凸部分。
根据第二实施例，首先对基板的整个表面上釉，然后采用锪孔或蚀刻穿透珐琅层的整个厚度并部分穿过基板而实施机加工操作，随后对由此形成的凹部的底部上釉。根据一种变型，形成的珐琅层足够厚，以至于加工凹部时不会到达底板(基板)。
根据第三实施例，首先将基板的整个表面涂覆珐琅，然后穿过珐琅层和基板加工出一通孔。单独制备一陶瓷插件，该插件与通孔具有相同的尺寸而且其可见表面包括可与整个表面的涂层相同或不同的珐琅层。然后将插件***通孔并通过接合/粘接(bonding)将其保持在所需的适当位置。根据插件及其珐琅的总体厚度，可以形成具有凹部或相反地具有凸部的珐琅表盘。
可以看到，鉴于陶瓷和珐琅的热膨胀系数非常接近，使用陶瓷基板制成的多层级搪瓷珐琅表盘不需要焊接，也不需要有背面珐琅，从而不会因此导致必须补偿的变形。
然而，可以通过在基板和插件之间的接合处粘结一个与表盘具有相同轮廓的附加板来掩盖基板和插件之间的接缝，该附加板由此也起到使插件保持在适当位置的作用。
鉴于附加板的技术功能非常有限，根据包括所述表盘的成品所要求的美学外观，这个附加板可如同基板一样由陶瓷材料制成，或者由金属制成。
根据上述实施例的一种变型，当附加板由陶瓷材料制成时，它可以与插件形成为一体。根据另一种变型，可以给附加板设置一用于固定表盘的支脚，所述附加板的周向可以设置成使其能够嵌入基板的底部。
附图说明
在以下参照附图对本发明的作为非限定性示例给出的几个实施例的说明中，展示了本发明的其它特征和优点，其中：
图1A、1B和1C以横截面图示出本发明第一实施例的步骤；
图2A、2B和2C示出第二实施例；
图3A和3B示出第二实施例的变型；
图4A、4B和4C示出第三实施例；以及
图5、6和7对应第三实施例的变型。
具体实施方式
为了更好地理解附图，首先应当注意厚度并不是都以相同比例示出，而且仅示出包含凹凸部分的表盘的一部分。
图1A至1C示出第一实施例，其中表盘由具有两个平行且平坦的表面3、5(图1A)的陶瓷基板1制成，并通过锪孔或蚀刻加工出凹部4(图1B)。然后，通过依次的沉积和烧结操作制成珐琅层(图1C)。基板1可由厚度在0.4mm至0.9mm之间的大陶瓷板切割而成，这样的(厚度)值使表盘能获得满意的机械性能。还可以例如通过陶瓷射出成型方法(CIM)或压制以直接预成形为所需尺寸来制造基板1。在这种情况下，可以同时形成凹部4。很清楚，以相同的方式通过机加工、压制或CIM，可以在上釉步骤之前形成对应于凸部的凹凸部分，而且例如为了改进凹凸部分的成形系数(aspect ratio)还可以实施精加工。
已知陶瓷材料—例如氧化铝基陶瓷材料—具有淡淡的颜色并且其中还可以包含着色剂，所以形成所需最终颜色所必须的珐琅层数可以较少，由此珐琅层具有0.1mm至0.4mm之间的厚度。由于陶瓷和珐琅的热膨胀系数非常接近，所以在烧结操作过程中不会产生易于使基板1变形的张力，从而不需要背面珐琅。
图2A至2C示出第二实施例。利用表面已经形成第一珐琅层2的基板1开始进行。然后，加工出完全穿过第一珐琅层2并部分穿过陶瓷基板1的凹部4。随后，例如通过加工(damping)在凹部4的底部形成第二珐琅层12。由此，可以使凹部具有与表盘表面的颜色不同的颜色。显然，也可以像第一实施例中所述的那样进行，即使用与第一涂层相同或不同颜色的珐琅在整个表盘表面和凹凸部分上涂覆这种第二珐琅层。根据一种示于图3A和3B中的变型，珐琅层2足够厚，例如0.4mm，从而可以对所述珐琅层进行机加工而不会到达陶瓷基板1。为了获得高水平的表面状态，希望进行附加的烧结，以获得精美的成品。
图4A至4C涉及一种实施例，该实施例与上述那些实施例的不同之处在于，基板1及其珐琅层2被加工而形成通孔9。单独形成一个具有陶瓷基板11的插件10，其与通孔9的轮廓13相匹配并且包括与第一珐琅层2相同或不同的第二珐琅层12。将插件10设置于通孔9中，并通过粘接保持于其中。在图4C所示的成品中，插件10的基板11的厚度小于基板1的厚度，从而由此形成的凹凸部分为凹部。如上述相同的原因，该基板的底部在技术上不需要任何背面珐琅。
然而，为了美观的目的，例如为了掩盖基板1和插件10之间接缝的轮廓13，可以在表盘的底部涂覆粘合剂15以粘合一附加掩盖板14。根据钟表所追求的美观效果，形成这种附加板的材料可以是与基板一样的陶瓷，或者是金属，如铜、银、黄金或铂或这些材料的合金。
图6示出上文所述的多层级表盘的可选实施例。首先看到的是，表盘的可视表面具有曲面形状，通过使用用于基板以及在这个例子中用于插件的陶瓷材料可以很容易地形成这种形状，而在上釉过程中不会产生任何特别的张力，即，仍然不需要任何背面珐琅。还可以看到，插件10的厚度大于通孔9的高度，从而形成的凹凸部分为凸部8。最后可以看到，插件可与附加的掩盖板14形成为一体，其显然由陶瓷材料制成。
图7示出，在形成插件10和附加板14的同时，可以形成将使表盘定位的支脚18，示于这个例子中的附加板设置于基板的底部5内。支脚18明显地可占据一个非中心位置，以便在凹部12为二级表盘时允许心轴通过。
很显然，可以改变上述实施例以及对应于图1C、2C、3B、4C、5、6和7中所示的成品的实施例。作为非限定性举例，在不脱离本发明的范围内，可以结合图1C、6和7的教导，以获得一个包括位于凹孔中的具有浮凸表面的二级表盘的珐琅陶瓷表盘，该表盘的基板包括一个支脚。

Claims (10)

1.一种多层级搪瓷珐琅表盘，它包括基板(1)，该基板的表面包括形成凹部(4，6)或凸部(8)的凹凸部分，所述表面和所述凹凸部分(4)涂有珐琅层(2，12)，其特征在于，该基板(1)由陶瓷材料制成，该凹凸部分(4，6，8)是通过在上釉前使所述基板(1)预成形而制成，或者通过对所述珐琅层(2)进行机加工以穿过珐琅层或穿过基板(1)而制成。
2.根据权利要求1所述的多层级搪瓷珐琅表盘，其特征在于，基板(1)的表面包括至少一个通过对所述基板(1)预成形或机加工而形成的凹部(4)。
3.根据权利要求1所述的多层级搪瓷珐琅表盘，其特征在于，基板(1)的整个表面包括第一珐琅层(2)，凹部(4)完全穿过第一珐琅层(2)，在凹部(4)的底部涂有与第一珐琅层(2)相同或不同的第二珐琅层(12)。
4.根据权利要求1所述的多层级搪瓷珐琅表盘，其特征在于，基板(1)的整个表面包括一厚珐琅层(2)，在该珐琅层(2)中加工出一凹部(4)。
5.根据权利要求1所述的多层级搪瓷珐琅表盘，其特征在于，基板(1)的整个表面包括第一珐琅层(2)，所述珐琅层(2)和所述基板(1)包括由一陶瓷插件(10)封闭的通孔(9)，该陶瓷插件(10)包括与第一珐琅层(2)相同或不同的第二珐琅层(12)。
6.根据权利要求5所述的多层级搪瓷珐琅表盘，其特征在于，插件(10)连同其珐琅层(12)的厚度小于基板(1)的厚度，从而在表盘中形成一凹部(6)。
7.根据权利要求5所述的多层级搪瓷珐琅表盘，其特征在于，插件(10)连同其珐琅层(12)的厚度大于基板(1)的厚度，从而在表盘上形成一凸部(8)。
8.根据权利要求5所述的多层级搪瓷珐琅表盘，其特征在于，在表盘的背面固定有一附加板(14)，该附加板(14)具有与基板(1)相同的轮廓。
9.根据权利要求8所述的多层级搪瓷珐琅表盘，其特征在于，形成附加板(14)的材料选自陶瓷和金属。
10.根据权利要求5所述的多层级搪瓷珐琅表盘，其特征在于，插件(10)在其底部包括与所述插件(10)形成一体的附加板(14)，附加板(14)具有位于表盘的轮廓和插件的通孔(9)的轮廓之间的轮廓，并且该附加板连接到基板(1)的底部或位于在基板中形成的空腔(16)内。
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