CN1896811A - 柔性电路板及采用该柔性电路板的显示装置 - Google Patents
柔性电路板及采用该柔性电路板的显示装置 Download PDFInfo
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Abstract
本发明旨在提供即便在过于苛刻的环境下也难以发生电极端子溶蚀(腐蚀)的柔性电路板及采用该柔性电路板的显示装置。本发明的柔性电路板(3),其中设有:自由弯曲的FPC膜(3d);在FPC膜(3d)上按预定图案形成的FPC布线(3c);覆盖FPC布线(3c)的抗焊剂(3e);以及设于FPC布线(3c)的端部并与外部连接的FPC端子(3a)。并且,本发明中,FPC端子(3a)至少含有一个其前端部相对FPC膜(3d)外形在内侧形成的端子。
Description
技术领域
本发明涉及柔性电路板及采用该柔性电路板的显示装置,特别是涉及与显示屏的电极端子连接的柔性电路板端子部的结构。
背景技术
在传统的液晶显示装置中,具备夹入液晶的2块玻璃基板、与玻璃基板上的布线连接的驱动电路及在玻璃基板的背面重叠的照明装置。特别是薄膜晶体管(TFT:Thin Film Transistor)型的液晶显示装置中,在一方玻璃基板上TFT以矩阵状排列,另一方玻璃基板上形成对置电极。另外,为将从各TFT延伸的布线与驱动电路连接,在一方玻璃基板的周边部设置电极端子。因此,一方玻璃基板仅比另一方玻璃基板大出该电极端子等形成的部分,且其外形突出。
各TFT与对应的像素连接,通过导通或截止,控制发送到像素的图像信号。图像信号由与各TFT的源电极连接的源极布线供给。该源极布线与玻璃基板的短边平行,与设于玻璃基板长边侧周边部的电极端子连接。另一方面,控制TFT的控制信号由与各TFT的栅电极连接的栅极布线供给。该栅极布线与玻璃基板的长边平行,与设于玻璃基板短边侧周边部的电极端子连接。
电极端子经由柔性电路板(FPC:Flexible Printed Circuit)连接到驱动电路。该柔性电路板由厚度30μm到70μm左右的绝缘膜即FPC膜、厚度8μm到25μm左右的铜箔构成的FPC布线及覆盖FPC布线的聚酰亚胺类的抗焊剂构成。还有,FPC膜由可自由弯曲的材料构成。另外,在FPC布线的端部形成FPC端子,在该部分上不形成抗焊剂。
FPC端子用各向异性导电膜(ACF:anisotropic conductive film)连接到玻璃基板上的电极端子。还有,通过ACF中包含的导电粒子,FPC端子与电极端子电连接,但相邻的FPC端子间或相邻的电极端子间因导电粒子周围存在的绝缘性环氧树脂而不导通。
在传统的液晶显示装置中,为不使液晶显示屏的密封材料到电极端子的布线腐蚀,利用分配器在该部分涂敷绝缘性涂料。还有,关于这种电极端子的腐蚀防止方法,分别公开于以液晶显示装置为例的专利文献1及以等离子体显示装置为例的专利文献2中。
专利文献1:日本特开2003-195336号公报
专利文献2:日本特开2004-93860号公报
发明内容
在专利文献1中公开了液晶显示装置中,用绝缘性涂料涂敷从与FPC端子连接的电极端子到液晶显示屏的密封材料的例。另外,在专利文献2中公开了等离子体显示装置中,用绝缘性涂料涂敷从与FPC端子连接的电极端子到显示屏的密封材料的例。如此,在传统的显示装置中也对电极端子进行一定程度的防腐措施。
但是,在高温高湿那样过于苛刻的环境下进行显示装置的可靠性实验时,通过绝缘性涂料,有水分侵入ACF内的情况。若水分侵入到ACF内,则有在高电位的电极端子与低电位的电极端子相邻的部位,高电位的电极端子以负离子方式洗脱并断线的(所谓溶蚀或腐蚀的现象)问题。若电极端子断线,则所期望的信号不能供给像素,因此显示装置显示不良。
于是,本发明旨在提供即便在过于苛刻的环境下也难以发生电极端子溶蚀(腐蚀)的柔性电路板及采用该柔性电路板的显示装置。
本发明的柔性电路板,其中设有:自由弯曲的绝缘膜;在绝缘膜上按预定图案形成的布线;覆盖布线的抗蚀剂层;以及设于布线的端部并与外部连接的端子,所述端子至少含有一个其前端部相对绝缘膜外形在内侧形成的端子。
本发明的柔性电路板中,端子的前端部相对绝缘膜外形在内侧形成,因此将端子与外部的电极端子连接时,可用绝缘膜覆盖该连接部分,具有能够在过于苛刻的环境下也难以发生电极端子溶蚀(腐蚀)的效果。另外,采用本发明的柔性电路板的显示装置,具有显示不良少,且可靠性提高的效果。
附图说明
图1是本发明实施例1的显示装置的平面图。
图2是本发明实施例1的电极端子的平面图。
图3是本发明实施例1的柔性电路板的平面图。
图4是本发明实施例1的FPC端子的平面图及剖视图。
图5是本发明实施例1的电极端子上连接FPC端子的平面图。
图6是本发明实施例1的电极端子上连接FPC端子的剖视图。
图7是本发明实施例2的柔性电路板的平面图。
图8是本发明实施例2的FPC端子的平面图。
图9是说明本发明的柔性电路板的平面图。
图10是说明本发明的FPC端子的平面图及剖视图。
图11是说明本发明的电极端子上连接FPC端子的平面图。
图12是说明本发明的电极端子上连接FPC端子的剖视图。
(符号说明)
1、111电极基板,2、112对置基板,3柔性电路板,3a、103FPC端子,3b、101FPC输入侧端子,3c、102FPC布线,3d、104FPC膜,3e、105抗焊剂,4、113显示屏布线,5、114电极端子,6、117绝缘性涂料,7、116密封材料,8、118绝缘膜,9、115ACF,9a导电粒子,9b 环氧树脂。
具体实施方式
实施例1
首先,在说明本实施例的柔性电路板之前,说明一般的柔性电路板。图9是一般的柔性电路板的平面图。图9所示柔性电路板中,设有FPC输入侧端子101和用FPC布线102连接的FPC端子103。另外,图9所示柔性电路板中,有一处设置FPC输入侧端子101,但FPC端子103有五处设置。
图10(a)是设有FPC端子103的附近的平面图,图10(b)是设有FPC端子103的附近的剖视图。如图10(b)所示,柔性电路板由厚度约30μm至70μm的FPC膜104、厚度约8μm至25μm的FPC布线102和FPC端子103以及覆盖FPC布线102的聚酰亚胺类抗焊剂105构成。
在图11示出将图10(a)及图10(b)所示的FPC端子103与显示屏的电极端子连接的平面图,并在图12示出图11的A-B面的剖视图。图11中,设有像素电极等(未图示)的电极基板111大于设有对置电极等(未图示)的对置基板112,仅图示电极基板111的周边部。仅在该电极基板111的周边部,形成与像素电极等连接的显示屏布线113和电极端子114。
如图12所示,FPC端子103利用ACF115连接到电极端子114。具体地说,将FPC端子103与电极端子114的位置高精度校准,利用加热加压工具,将FPC端子103与电极端子114利用ACF115热压接。还有,此时的条件设加热温度为170℃~200℃、加压力为2MPa~10MPa、加热加压时间为10秒~20秒。通过该热压接,使包含在ACF115中的导电粒子115a夹于FPC端子103与电极端子114之间地接触,使FPC端子103与电极端子114导通。由于FPC端子103与电极端子114电连接,来自驱动电路的图像信号或控制信号经由柔性电路板供给显示屏。
还有,导电粒子115a的直径小于相邻的FPC端子103间的宽度,且在导电粒子115a周围存在绝缘性环氧树脂115b,因此相邻的FPC端子103间不会短路。
最后,为了防止从密封材料116到电极端子114之间的腐蚀,如图11或图12所示,在该部分涂敷绝缘性涂料117。涂敷绝缘性涂料117时使用分配器。另外,如图12所示,在从密封材料116到形成电极端子114的部分为止的显示屏布线113上形成绝缘膜118。
在这种一般的柔性电路板的场合,若在上述那样高温高湿的过于苛刻的环境下进行可靠性实验,则水分通过绝缘性涂料117侵入ACF115内。具体说明则一般的柔性电路板中,如图12所示,由于ACF115与绝缘性涂料117直接相接,如果水分通过绝缘性涂料117,就马上侵入ACF115内。
于是,为了消除上述问题,以下说明本实施例的柔性电路板及采用该柔性电路板的显示装置。
首先,图1示出安装本实施例的柔性电路板的显示装置的平面图。图1中,设有像素电极等(未图示)的电极基板1和设有对置电极等(未图示)的对置基板2相对地重叠,并构成显示屏。另外,由于电极基板1大于对置基板2,形成仅为电极基板1的周边部。该仅为电极基板1的周边部上,安装柔性电路板3。
图2放大示出仅为电极基板1的周边部的平面图。图2中,形成与像素电极等(未图示)连接的显示屏布线4和电极端子5。显示屏布线4与电极端子5电连接,电极端子5的宽度大于显示屏布线4。这是为了使电极端子5与柔性电路板3连接。还有,本实施例中,作为显示装置主要对液晶显示装置进行了说明,但本发明的显示装置并不限于此,等离子体显示装置等,只要具有用以供给驱动所必要的信号的多个电极端子设于周边部的显示屏的显示装置,可为其它显示装置。
接着,图3示出本实施例的柔性电路板3的平面图。在图3所示柔性电路板3中,FPC端子3a和FPC输入侧端子3b用FPC布线3c连接。另外,在图3所示柔性电路板3中,FPC输入侧端子3b设有一处,但FPC端子3a设有五处。还有,如图3所示,本实施例中,FPC布线按预定图案形成,但这仅为例示,本发明中FPC布线3c的布置等并无特别限定,也可为搭载IC驱动器等其它布线结构。
另外,图4(a)及图4(b)示出图3所示FPC端子3a附近的柔性电路板的放大图。图4(a)示出FPC端子3a附近的平面图,图4(b)示出FPC端子3a附近的剖视图。图4(b)中柔性电路板3由绝缘膜构成的FPC膜3d、由铜箔构成的FPC布线3c和FPC端子3a以及覆盖FPC布线3c的聚酰亚胺类的抗焊剂3e构成。图4(a)及图4(b)所示柔性电路板3的结构基本上与图10(a)及图10(b)所示柔性电路板3的结构相同,但不同的是图4(a)及图4(b)所示柔性电路板3中,FPC端子3a的前端部比FPC膜3d的外形向内侧形成。还有,FPC膜3d由可自由弯曲的材料构成。另外,在FPC布线3c的端部形成FPC端子3a,该部分上未形成抗焊剂3e。
另一方面,本实施例的FPC输入侧端子3b,也由图3可知,前端部形成到FPC膜3d的外形。这是为了从FPC输入侧端子3b侧加电,对FPC端子3a及FPC输入侧端子3b、FPC布线3c进行电镀。还有,在电镀生成方法以外的方法或电镀生成后实施其它加工,从而能够将FPC输入侧端子3b的前端部也比FPC膜3d在内侧形成。
接着,利用图5及图6,就柔性电路板3的FPC端子3a与电极端子5的连接进行说明。图5示出FPC端子3a和电极端子5连接的部分的平面图,图6示出图5的A-B面的剖视图。
FPC端子3a如图6所示,利用ACF9连接到电极端子5。具体地说,首先,如图5所示,使FPC端子3a和电极端子5重叠地高精度校准。然后,利用加热加压工具将FPC端子3a和电极端子5用ACF9热压接。还有,此时的条件设为与上述条件相同的加热温度170℃~200℃、加压力2MPa~10Mpa、加热加压时间10秒~20秒。
本实施例中,由于FPC膜3d长于FPC端子3a,如图6所示,FPC膜3d可覆盖ACF9的端部。还有,在本实施例的柔性电路板3中,FPC端子3a的前端部比FPC膜3d的外形还内侧形成,但从FPC端子3a前端部到FPC膜3d外形为止的距离,只要能确保将柔性电路板3安装到电极基板1时能够用FPC膜3d覆盖ACF9端部的距离即可。
最后,为了防止从显示屏的密封材料7到电极端子5之间的腐蚀,如图6所示,在该部分涂敷绝缘性涂料6。作为绝缘性涂料6,主要采用硅树脂、丙烯树脂、氟树脂、尿烷树脂等。另外,涂敷绝缘性涂料6时使用分配器。还有,ACF9中包含导电粒子9a和环氧树脂9b。另外,如图6所示,在从密封材料7到形成电极端子5的部分为止的显示屏布线4上形成绝缘膜8。
如上所述,本实施例的柔性电路板3中,由于FPC端子3a的前端部比FPC膜3d的外形还内侧形成,能够防止水分进入ACF9,并可抑制过于苛刻的环境下的电极端子的溶蚀(腐蚀)发生。另外,采用本实施例的柔性电路板3的显示装置也具有同样的效果,能够提供显示不良少且可靠性高的显示装置。
并且,本实施例的显示装置对包含FPC端子3a和电极端子5连接的部分的、显示屏的周边部(从密封材料7到电极端子5之间)实施树脂涂敷,因此能够防止水分进入ACF9,并可抑制更加苛刻的环境下的电极端子的溶蚀(腐蚀)发生。
还有,也可只使未设有FPC端子3a的前端部分的FPC膜3d的膜厚大于其它部分的FPC膜3d。
实施例2
在图7示出本实施例的柔性电路板3的平面图。在图7所示柔性电路板3中,用FPC布线3c连接FPC端子3a和FPC输入侧端子3b。另外,在图7所示柔性电路板3中,FPC输入侧端3b设有一处,但FPC端子3a设有五处。
另外,在图8示出图7所示FPC端子3a附近的柔性电路板3的放大图。图8所示FPC端子3a附近也与图4(a)所示FPC端子3a附近同样,由绝缘膜构成的FPC膜3d、由铜箔构成的FPC布线3c和FPC端子3a以及覆盖FPC布线3c的聚酰亚胺类抗焊剂3e构成。
但是,图7及图8所示柔性电路板3与图3或图4(a)所示柔性电路板3不同,各FPC端子3a用FPC布线3c连接的该FPC端子3a,其前端部形成到FPC膜3d的外形。即,与同例外部(本实施例中,FPC端子3a全部与同侧的显示屏连接且FPC输入侧端子3b与不同侧的驱动电路连接)连接的各FPC端子3a用FPC布线3c连接时,该FPC端子3a的前端部形成到FPC膜3d的外形。
当各FPC端子3a用FPC布线3c连接时,该FPC端子3a不会被供给来自FPC输入侧端子3b的图像信号等。因此,如本实施例的柔性电路板3那样,可采用仅对显示装置的可靠性产生较大影响的FPC端子3a,使FPC端子3a的前端部比FPC膜3d外形还内侧形成的结构。
如上所述,本实施例的柔性电路板3在与同侧的外部连接的各FPC端子3a用FPC布线3c连接时,由于该FPC端子3a的前端部形成到FPC膜3d的外形,仅在必要的FPC端子3a上适用实施例1,能够防止水分进入ACF9。
Claims (4)
1.一种柔性电路板,其中设有:
自由弯曲的绝缘膜;
在所述绝缘膜上按预定图案形成的布线;
覆盖所述布线的抗蚀剂层;以及
设于所述布线的端部并与外部连接的端子,
所述端子至少含有一个其前端部相对所述绝缘膜外形在内侧形成的端子。
2.如权利要求1所述的柔性电路板,其特征在于:仅在与外部连接的同侧各所述端子用所述布线连接时,将该所述端子的前端部形成到所述绝缘膜的外形。
3.一种显示装置,其中设有:
在周边部设有供给驱动所需信号的多个电极端子的显示屏;以及
权利要求1或权利要求2所述的所述柔性电路板,
其前端部比所述绝缘膜外形还内侧形成的所述端子与所述电极端子连接。
4.如权利要求3所述的显示装置,其特征在于:对包含所述端子与所述电极端子连接的部分的、所述显示屏的周边部实施树脂涂敷。
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Cited By (4)
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---|---|---|---|---|
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CN105359071A (zh) * | 2013-07-09 | 2016-02-24 | 日本写真印刷株式会社 | 触摸传感器及触摸传感器的制造方法 |
CN109036171A (zh) * | 2018-07-10 | 2018-12-18 | 中航华东光电有限公司 | 液晶屏信号转接带密封方法 |
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Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100902928B1 (ko) * | 2007-12-06 | 2009-06-15 | 엘지전자 주식회사 | 연성 필름, 그를 포함하는 표시 장치, 및 표시 장치의 제조방법 |
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KR100939550B1 (ko) * | 2007-12-27 | 2010-01-29 | 엘지전자 주식회사 | 연성 필름 |
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KR100947608B1 (ko) * | 2007-12-28 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
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US9660004B2 (en) * | 2014-03-21 | 2017-05-23 | Apple Inc. | Flexible displays with strengthened pad area |
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US10725354B2 (en) * | 2017-02-28 | 2020-07-28 | Sharp Kabushiki Kaisha | Wiring substrate and display device |
EP3779583B1 (en) * | 2018-04-05 | 2023-12-06 | Toppan Printing Co., Ltd. | Light control unit |
CN109143668B (zh) | 2018-09-17 | 2021-08-17 | 京东方科技集团股份有限公司 | 一种显示装置及其制备方法 |
KR20200062702A (ko) * | 2018-11-27 | 2020-06-04 | 한국유리공업 주식회사 | 투명 디스플레이부 및 이를 포함하는 유리 조립체 |
EP3905850A4 (en) * | 2018-12-26 | 2022-09-21 | Kyocera Corporation | WIRING BOARD, ELECTROLUMINESCENT DEVICE AND DISPLAY DEVICE USING THE SAME |
KR20200107014A (ko) * | 2019-03-05 | 2020-09-16 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102654597B1 (ko) * | 2019-07-25 | 2024-04-04 | 동우 화인켐 주식회사 | 터치센서 및 이를 포함하는 윈도우 적층체, 화상 표시 장치 |
WO2023201030A2 (en) * | 2022-04-15 | 2023-10-19 | Cellink Corporation | Flexible interconnect circuits for battery packs |
WO2023233458A1 (ja) * | 2022-05-30 | 2023-12-07 | 住友電気工業株式会社 | 接続構造及び接続構造の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6010277U (ja) * | 1983-07-01 | 1985-01-24 | カシオ計算機株式会社 | フイルム状ヒ−トシ−ルコネクタ |
JPS62122078A (ja) * | 1985-11-22 | 1987-06-03 | 株式会社日立製作所 | ヒ−トシ−ルコネクタ |
EP0289026B1 (en) * | 1987-05-01 | 1994-12-28 | Canon Kabushiki Kaisha | External circuit connecting method and packaging structure |
JPH0472671U (zh) * | 1990-11-06 | 1992-06-26 | ||
JPH052181A (ja) * | 1991-10-18 | 1993-01-08 | Hitachi Ltd | 液晶表示装置 |
JPH0697511A (ja) * | 1992-07-30 | 1994-04-08 | Kyocera Corp | 画像装置 |
JPH0990394A (ja) * | 1995-09-26 | 1997-04-04 | Casio Comput Co Ltd | 液晶表示パネルの外部配線接続方法 |
JPH09237648A (ja) * | 1996-02-28 | 1997-09-09 | Shin Etsu Polymer Co Ltd | ヒートシールコネクターと、これを用いた基板間の接続構造 |
JP3624570B2 (ja) * | 1996-09-02 | 2005-03-02 | セイコーエプソン株式会社 | 液晶表示パネルの検査装置、液晶表示パネルの検査方法及び集積回路の実装方法 |
JP2000275666A (ja) | 1999-03-25 | 2000-10-06 | Hitachi Ltd | 液晶表示装置 |
TWI286629B (en) * | 2000-07-20 | 2007-09-11 | Samsung Electronics Co Ltd | Liquid crystal display device and flexible circuit board |
CN1189064C (zh) | 2000-07-31 | 2005-02-09 | 友达光电股份有限公司 | 电极接合结构及其制造方法 |
JP2003195336A (ja) | 2001-12-27 | 2003-07-09 | Casio Comput Co Ltd | 液晶表示装置及びその製造方法 |
JP2003287766A (ja) * | 2002-03-27 | 2003-10-10 | Optrex Corp | 液晶表示装置 |
JP2004093860A (ja) | 2002-08-30 | 2004-03-25 | Matsushita Electric Ind Co Ltd | プラズマディスプレイ装置 |
-
2005
- 2005-07-15 JP JP2005206450A patent/JP4579074B2/ja active Active
-
2006
- 2006-05-15 TW TW095117149A patent/TWI340269B/zh active
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- 2006-06-12 CN CN2006100913227A patent/CN1896811B/zh not_active Expired - Fee Related
- 2006-07-07 KR KR1020060063728A patent/KR100770439B1/ko active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101271205B (zh) * | 2007-03-19 | 2011-05-04 | 株式会社日立显示器 | 液晶显示装置 |
CN105359071A (zh) * | 2013-07-09 | 2016-02-24 | 日本写真印刷株式会社 | 触摸传感器及触摸传感器的制造方法 |
CN105359071B (zh) * | 2013-07-09 | 2017-06-09 | 日本写真印刷株式会社 | 触摸传感器及触摸传感器的制造方法 |
CN109036171A (zh) * | 2018-07-10 | 2018-12-18 | 中航华东光电有限公司 | 液晶屏信号转接带密封方法 |
CN112114449A (zh) * | 2019-06-21 | 2020-12-22 | 三星显示有限公司 | 显示装置 |
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US20070013856A1 (en) | 2007-01-18 |
TWI340269B (en) | 2011-04-11 |
US7593085B2 (en) | 2009-09-22 |
KR20070009402A (ko) | 2007-01-18 |
TW200702804A (en) | 2007-01-16 |
CN1896811B (zh) | 2011-08-10 |
JP4579074B2 (ja) | 2010-11-10 |
KR100770439B1 (ko) | 2007-10-26 |
JP2007026846A (ja) | 2007-02-01 |
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