CN1854701A - 压力检测设备 - Google Patents
压力检测设备 Download PDFInfo
- Publication number
- CN1854701A CN1854701A CNA2006100515408A CN200610051540A CN1854701A CN 1854701 A CN1854701 A CN 1854701A CN A2006100515408 A CNA2006100515408 A CN A2006100515408A CN 200610051540 A CN200610051540 A CN 200610051540A CN 1854701 A CN1854701 A CN 1854701A
- Authority
- CN
- China
- Prior art keywords
- pressure
- detecting device
- substrate
- checking device
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 11
- 238000010125 resin casting Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 51
- 239000000463 material Substances 0.000 abstract description 47
- 230000004044 response Effects 0.000 abstract description 23
- 230000035882 stress Effects 0.000 abstract description 13
- 230000008646 thermal stress Effects 0.000 abstract description 7
- 230000002411 adverse Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 68
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000005259 measurement Methods 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 10
- 239000004734 Polyphenylene sulfide Substances 0.000 description 9
- 229920000069 polyphenylene sulfide Polymers 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/145—Housings with stress relieving means
- G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15156—Side view
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Child & Adolescent Psychology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005130533 | 2005-04-27 | ||
JP2005130533A JP5044896B2 (ja) | 2005-04-27 | 2005-04-27 | 圧力検出装置 |
JP2005-130533 | 2005-04-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1854701A true CN1854701A (zh) | 2006-11-01 |
CN1854701B CN1854701B (zh) | 2010-12-15 |
Family
ID=37111646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100515408A Expired - Fee Related CN1854701B (zh) | 2005-04-27 | 2006-02-28 | 压力检测设备 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7234358B2 (zh) |
JP (1) | JP5044896B2 (zh) |
KR (1) | KR101234363B1 (zh) |
CN (1) | CN1854701B (zh) |
DE (1) | DE102006017535B4 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104418287A (zh) * | 2013-08-19 | 2015-03-18 | 盛思锐股份公司 | 具有微米或纳米级结构的设备 |
CN105424260A (zh) * | 2014-09-17 | 2016-03-23 | 富士电机株式会社 | 压力传感器装置以及压力传感器装置的制造方法 |
CN105509713A (zh) * | 2015-11-27 | 2016-04-20 | 高佳 | 一种三足旋摆式离心脱水机水平感应器 |
CN105668507A (zh) * | 2016-01-22 | 2016-06-15 | 中国科学院地质与地球物理研究所 | Mems芯片的封装结构及封装方法 |
CN114530392A (zh) * | 2022-04-24 | 2022-05-24 | 山东中策新能源有限公司 | 一种光伏背板用硬度检测装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008261796A (ja) * | 2007-04-13 | 2008-10-30 | Denso Corp | 温度センサ一体型圧力センサ装置 |
ITTO20080485A1 (it) * | 2008-06-19 | 2009-12-20 | Eltek Spa | Dispositivo sensore di pressione |
JP5825045B2 (ja) * | 2011-10-27 | 2015-12-02 | 株式会社デンソー | 半導体装置、及び、その製造方法 |
FR3012604B1 (fr) * | 2013-10-25 | 2017-03-03 | Auxitrol Sa | Capteur de pression comprenant une structure de controle d'une couche d'adhesif resistante aux variations de temperatures |
EP2871455B1 (en) | 2013-11-06 | 2020-03-04 | Invensense, Inc. | Pressure sensor |
EP3367082A1 (en) | 2013-11-06 | 2018-08-29 | Invensense, Inc. | Pressure sensor |
JP1516096S (zh) * | 2014-03-05 | 2015-01-26 | ||
JP1516097S (zh) * | 2014-03-05 | 2015-01-26 | ||
DE102014119396A1 (de) * | 2014-12-22 | 2016-06-23 | Endress + Hauser Gmbh + Co. Kg | Druckmesseinrichtung |
EP3076146B1 (en) | 2015-04-02 | 2020-05-06 | Invensense, Inc. | Pressure sensor |
JP2018048961A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社鷺宮製作所 | 圧力センサ |
JP6862964B2 (ja) * | 2017-03-17 | 2021-04-21 | 富士電機株式会社 | 半導体圧力センサ装置および半導体圧力センサ装置の製造方法 |
US11225409B2 (en) | 2018-09-17 | 2022-01-18 | Invensense, Inc. | Sensor with integrated heater |
US11326972B2 (en) | 2019-05-17 | 2022-05-10 | Invensense, Inc. | Pressure sensor with improve hermeticity |
JP2021071305A (ja) * | 2019-10-29 | 2021-05-06 | ミネベアミツミ株式会社 | 力覚センサ装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3025362C2 (de) * | 1980-07-04 | 1982-11-04 | Ewald Max Christian Dipl.-Phys. 6000 Frankfurt Hennig | Kraftaufnehmer |
JPH02165188A (ja) * | 1988-12-19 | 1990-06-26 | Mitsubishi Electric Corp | 表示素子 |
DE69305052T2 (de) * | 1992-06-25 | 1997-04-03 | Hitachi Construction Machinery | Vorrichtung für ultraschallmessungen |
JPH06203771A (ja) * | 1992-12-28 | 1994-07-22 | Mitsubishi Electric Corp | 表示素子 |
JP3481326B2 (ja) | 1994-11-30 | 2003-12-22 | 松下電工株式会社 | 半導体圧力センサー及びその製造方法 |
FR2738340B1 (fr) * | 1995-08-28 | 1997-11-21 | Europ Propulsion | Architecture d'integration d'un element sensible dans un capteur de pression |
US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
JP3498695B2 (ja) * | 2000-10-03 | 2004-02-16 | 松下電工株式会社 | 半導体圧力センサー |
JP2003247903A (ja) * | 2002-02-21 | 2003-09-05 | Denso Corp | 圧力センサ |
JP2003322573A (ja) * | 2002-04-30 | 2003-11-14 | Fujikura Ltd | 電子デバイスの取付構造 |
JP2004045184A (ja) | 2002-07-11 | 2004-02-12 | Denso Corp | 半導体力学量センサ |
JP2004251742A (ja) * | 2003-02-20 | 2004-09-09 | Denso Corp | センサ装置 |
JP2004361308A (ja) * | 2003-06-06 | 2004-12-24 | Fuji Electric Device Technology Co Ltd | 物理量検出装置および物理量検出手段格納ケース |
JP2005292114A (ja) | 2004-03-11 | 2005-10-20 | Denso Corp | センサ装置 |
-
2005
- 2005-04-27 JP JP2005130533A patent/JP5044896B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-16 US US11/354,959 patent/US7234358B2/en active Active
- 2006-02-24 KR KR1020060018083A patent/KR101234363B1/ko active IP Right Grant
- 2006-02-28 CN CN2006100515408A patent/CN1854701B/zh not_active Expired - Fee Related
- 2006-04-13 DE DE102006017535.2A patent/DE102006017535B4/de not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104418287A (zh) * | 2013-08-19 | 2015-03-18 | 盛思锐股份公司 | 具有微米或纳米级结构的设备 |
CN105424260A (zh) * | 2014-09-17 | 2016-03-23 | 富士电机株式会社 | 压力传感器装置以及压力传感器装置的制造方法 |
CN105424260B (zh) * | 2014-09-17 | 2020-02-28 | 富士电机株式会社 | 压力传感器装置以及压力传感器装置的制造方法 |
CN105509713A (zh) * | 2015-11-27 | 2016-04-20 | 高佳 | 一种三足旋摆式离心脱水机水平感应器 |
CN105668507A (zh) * | 2016-01-22 | 2016-06-15 | 中国科学院地质与地球物理研究所 | Mems芯片的封装结构及封装方法 |
CN114530392A (zh) * | 2022-04-24 | 2022-05-24 | 山东中策新能源有限公司 | 一种光伏背板用硬度检测装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1854701B (zh) | 2010-12-15 |
JP2006308399A (ja) | 2006-11-09 |
JP5044896B2 (ja) | 2012-10-10 |
DE102006017535A1 (de) | 2006-11-09 |
KR101234363B1 (ko) | 2013-02-18 |
US20060243054A1 (en) | 2006-11-02 |
KR20060113379A (ko) | 2006-11-02 |
DE102006017535B4 (de) | 2020-07-09 |
US7234358B2 (en) | 2007-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1854701A (zh) | 压力检测设备 | |
CN1252455C (zh) | 具有温度传感器的压力传感器装置 | |
CN101285726B (zh) | 包括容纳在共用壳体中的温度传感器的压力传感器装置 | |
US20090288492A1 (en) | Media isolated differential pressure sensor with cap | |
US10473546B2 (en) | Hermetic pressure sensor having a bending part | |
CN1235024C (zh) | 压力传感器组件 | |
CN1302270C (zh) | 具有安装在公共管座上的传感器芯片和信号处理电路的压力传感器 | |
TWI495054B (zh) | 感測器模組與製造感測器模組的方法 | |
CN1892198A (zh) | 压力传感器 | |
CN107110729A (zh) | 压力测量装置 | |
KR20120065940A (ko) | 반도체 압력 센서 및 그 제조 방법 | |
JP2014102252A (ja) | 物理的な量を測定する測定装置 | |
US4807479A (en) | Transducer for detecting pressure changes in pipes | |
CN104204755B (zh) | 微机械的压力传感器 | |
US11199463B2 (en) | Pressure sensor system having a land grid array/mold premold structure and method for its manufacture | |
JP2007040772A (ja) | 半導体圧力センサ | |
CN207423427U (zh) | 一种硅应变计压阻式传感模块及应用该模块的传感器 | |
CN110174209A (zh) | 介质隔离式压力传感器 | |
US7540658B2 (en) | Temperature detecting device | |
JP2013152228A (ja) | 応力分離付き微細構造デバイス | |
CN111198131A (zh) | 一种拉伸载荷下材料体积膨胀特性的测量装置和测量方法 | |
JP2013108876A (ja) | 半導体圧力センサおよびその製造方法 | |
CN106525328A (zh) | 密闭压力传感器 | |
CN219694302U (zh) | 一种超高精度光纤光栅液位传感器 | |
CN213180426U (zh) | 一种压力传感器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: FUJI MOTOR SYSTEM CO., LTD. Free format text: FORMER OWNER: FUJI MOTOR ELECTRONICS TECHNOLOGY CO., LTD. Effective date: 20100527 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20100527 Address after: Tokyo, Japan Applicant after: Fuji Electric Systems Co.,Ltd. Address before: Tokyo, Japan Applicant before: Fuji Electric Device Technology Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUJI ELECTRIC CO., LTD. Free format text: FORMER OWNER: FUJI ELECTRIC SYSTEMS CO., LTD. Effective date: 20110921 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20110921 Address after: Kanagawa Patentee after: FUJI ELECTRIC Co.,Ltd. Address before: Tokyo, Japan Patentee before: Fuji Electric Systems Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 |
|
CF01 | Termination of patent right due to non-payment of annual fee |