CN1629926A - 驱动芯片及具有该驱动芯片的显示装置 - Google Patents
驱动芯片及具有该驱动芯片的显示装置 Download PDFInfo
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- CN1629926A CN1629926A CNA2004101012252A CN200410101225A CN1629926A CN 1629926 A CN1629926 A CN 1629926A CN A2004101012252 A CNA2004101012252 A CN A2004101012252A CN 200410101225 A CN200410101225 A CN 200410101225A CN 1629926 A CN1629926 A CN 1629926A
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR200391951 | 2003-12-16 | ||
KR1020030091951A KR101051013B1 (ko) | 2003-12-16 | 2003-12-16 | 구동 칩 및 이를 갖는 표시장치 |
Publications (2)
Publication Number | Publication Date |
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CN1629926A true CN1629926A (zh) | 2005-06-22 |
CN100437234C CN100437234C (zh) | 2008-11-26 |
Family
ID=34793179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004101012252A Expired - Fee Related CN100437234C (zh) | 2003-12-16 | 2004-12-16 | 驱动芯片及具有该驱动芯片的显示装置 |
Country Status (5)
Country | Link |
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US (2) | US7327411B2 (zh) |
JP (1) | JP4782410B2 (zh) |
KR (1) | KR101051013B1 (zh) |
CN (1) | CN100437234C (zh) |
TW (1) | TWI366015B (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7894033B2 (en) | 2005-10-31 | 2011-02-22 | Renesas Electronics Corporation | Semiconductor device including a particular dummy terminal |
CN103576350A (zh) * | 2012-07-25 | 2014-02-12 | 株式会社日本显示器 | 显示装置 |
CN103811529A (zh) * | 2012-11-06 | 2014-05-21 | 三星显示有限公司 | 显示面板、薄膜覆晶及包括该面板和薄膜覆晶的显示装置 |
CN104704621A (zh) * | 2012-10-11 | 2015-06-10 | 夏普株式会社 | 驱动芯片和显示装置 |
CN105762153A (zh) * | 2015-01-07 | 2016-07-13 | 三星显示有限公司 | 显示设备 |
CN105814675A (zh) * | 2013-12-20 | 2016-07-27 | 迪睿合株式会社 | 电子部件、连接体、连接体的制造方法及电子部件的连接方法 |
CN106918962A (zh) * | 2015-12-25 | 2017-07-04 | 株式会社日本显示器 | 显示装置、显示装置的制造方法、以及驱动ic |
CN108279517A (zh) * | 2018-03-28 | 2018-07-13 | 京东方科技集团股份有限公司 | 一种集成电路芯片绑定结构及其制备方法、显示装置 |
CN110596925A (zh) * | 2018-06-12 | 2019-12-20 | 夏普株式会社 | 电路基板 |
CN111708238A (zh) * | 2020-06-30 | 2020-09-25 | 上海中航光电子有限公司 | 一种阵列基板及显示面板 |
WO2021022869A1 (zh) * | 2019-08-02 | 2021-02-11 | 云谷(固安)科技有限公司 | 柔性显示屏及显示装置 |
CN114255658A (zh) * | 2021-12-16 | 2022-03-29 | 武汉华星光电技术有限公司 | 显示面板及显示装置 |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101051013B1 (ko) * | 2003-12-16 | 2011-07-21 | 삼성전자주식회사 | 구동 칩 및 이를 갖는 표시장치 |
TW200634375A (en) * | 2005-03-28 | 2006-10-01 | Elan Microelectronics Corp | Power line structure for liquid crystal display panel |
EP1770610A3 (en) * | 2005-09-29 | 2010-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5292665B2 (ja) * | 2005-10-31 | 2013-09-18 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2008164787A (ja) | 2006-12-27 | 2008-07-17 | Epson Imaging Devices Corp | 液晶表示装置 |
KR101387922B1 (ko) * | 2007-07-24 | 2014-04-22 | 삼성디스플레이 주식회사 | 구동 칩, 이를 갖는 구동 칩 패키지 및 표시 장치 |
JP2009192796A (ja) * | 2008-02-14 | 2009-08-27 | Seiko Instruments Inc | 液晶表示装置 |
JP5246782B2 (ja) | 2008-03-06 | 2013-07-24 | 株式会社ジャパンディスプレイウェスト | 液晶装置および電子機器 |
WO2010024015A1 (ja) * | 2008-09-01 | 2010-03-04 | シャープ株式会社 | 半導体素子およびそれを備えた表示装置 |
RU2487435C1 (ru) * | 2009-06-16 | 2013-07-10 | Шарп Кабусики Кайся | Полупроводниковый кристалл и его монтажная структура |
KR20110014033A (ko) * | 2009-08-04 | 2011-02-10 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP5250525B2 (ja) * | 2009-10-16 | 2013-07-31 | 株式会社ジャパンディスプレイセントラル | 表示装置 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
JP2012227480A (ja) * | 2011-04-22 | 2012-11-15 | Japan Display East Co Ltd | 表示装置及び半導体集積回路装置 |
KR20140025253A (ko) * | 2012-08-22 | 2014-03-04 | 삼성디스플레이 주식회사 | 구동칩 및 그 제조방법 |
US11457531B2 (en) | 2013-04-29 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
KR102379591B1 (ko) * | 2014-04-10 | 2022-03-30 | 삼성디스플레이 주식회사 | 전자부품, 이를 포함하는 전자기기 및 전자기기의 본딩 방법 |
CN103488338A (zh) * | 2013-08-30 | 2014-01-01 | 江西合力泰科技股份有限公司 | 一种改善触摸屏邦定效果的方法 |
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CN114255658A (zh) * | 2021-12-16 | 2022-03-29 | 武汉华星光电技术有限公司 | 显示面板及显示装置 |
US12021049B2 (en) | 2021-12-16 | 2024-06-25 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display panel and display device |
Also Published As
Publication number | Publication date |
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US7903067B2 (en) | 2011-03-08 |
JP2005203758A (ja) | 2005-07-28 |
US20050162577A1 (en) | 2005-07-28 |
TWI366015B (en) | 2012-06-11 |
KR20050060349A (ko) | 2005-06-22 |
CN100437234C (zh) | 2008-11-26 |
JP4782410B2 (ja) | 2011-09-28 |
US7327411B2 (en) | 2008-02-05 |
KR101051013B1 (ko) | 2011-07-21 |
US20080174535A1 (en) | 2008-07-24 |
TW200530676A (en) | 2005-09-16 |
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