TWI366015B - Driver chip and display apparatus having the same - Google Patents
Driver chip and display apparatus having the sameInfo
- Publication number
- TWI366015B TWI366015B TW093138916A TW93138916A TWI366015B TW I366015 B TWI366015 B TW I366015B TW 093138916 A TW093138916 A TW 093138916A TW 93138916 A TW93138916 A TW 93138916A TW I366015 B TWI366015 B TW I366015B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- display apparatus
- driver chip
- driver
- chip
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030091951A KR101051013B1 (ko) | 2003-12-16 | 2003-12-16 | 구동 칩 및 이를 갖는 표시장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200530676A TW200530676A (en) | 2005-09-16 |
TWI366015B true TWI366015B (en) | 2012-06-11 |
Family
ID=34793179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093138916A TWI366015B (en) | 2003-12-16 | 2004-12-15 | Driver chip and display apparatus having the same |
Country Status (5)
Country | Link |
---|---|
US (2) | US7327411B2 (zh) |
JP (1) | JP4782410B2 (zh) |
KR (1) | KR101051013B1 (zh) |
CN (1) | CN100437234C (zh) |
TW (1) | TWI366015B (zh) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101051013B1 (ko) * | 2003-12-16 | 2011-07-21 | 삼성전자주식회사 | 구동 칩 및 이를 갖는 표시장치 |
TW200634375A (en) * | 2005-03-28 | 2006-10-01 | Elan Microelectronics Corp | Power line structure for liquid crystal display panel |
EP1770610A3 (en) * | 2005-09-29 | 2010-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4943691B2 (ja) * | 2005-10-31 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5292665B2 (ja) * | 2005-10-31 | 2013-09-18 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2008164787A (ja) | 2006-12-27 | 2008-07-17 | Epson Imaging Devices Corp | 液晶表示装置 |
KR101387922B1 (ko) * | 2007-07-24 | 2014-04-22 | 삼성디스플레이 주식회사 | 구동 칩, 이를 갖는 구동 칩 패키지 및 표시 장치 |
JP2009192796A (ja) * | 2008-02-14 | 2009-08-27 | Seiko Instruments Inc | 液晶表示装置 |
JP5246782B2 (ja) | 2008-03-06 | 2013-07-24 | 株式会社ジャパンディスプレイウェスト | 液晶装置および電子機器 |
WO2010024015A1 (ja) * | 2008-09-01 | 2010-03-04 | シャープ株式会社 | 半導体素子およびそれを備えた表示装置 |
RU2487435C1 (ru) * | 2009-06-16 | 2013-07-10 | Шарп Кабусики Кайся | Полупроводниковый кристалл и его монтажная структура |
KR20110014033A (ko) * | 2009-08-04 | 2011-02-10 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP5250525B2 (ja) * | 2009-10-16 | 2013-07-31 | 株式会社ジャパンディスプレイセントラル | 表示装置 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
JP2012227480A (ja) * | 2011-04-22 | 2012-11-15 | Japan Display East Co Ltd | 表示装置及び半導体集積回路装置 |
JP2014026042A (ja) * | 2012-07-25 | 2014-02-06 | Japan Display Inc | 表示装置 |
KR20140025253A (ko) * | 2012-08-22 | 2014-03-04 | 삼성디스플레이 주식회사 | 구동칩 및 그 제조방법 |
US9318454B2 (en) * | 2012-10-11 | 2016-04-19 | Sharp Kabushiki Kaisha | Drive chip and display apparatus |
KR101983374B1 (ko) * | 2012-11-06 | 2019-08-29 | 삼성디스플레이 주식회사 | 표시 패널, 칩 온 필름, 및 이들을 포함하는 표시 장치 |
US11457531B2 (en) | 2013-04-29 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
KR102379591B1 (ko) * | 2014-04-10 | 2022-03-30 | 삼성디스플레이 주식회사 | 전자부품, 이를 포함하는 전자기기 및 전자기기의 본딩 방법 |
CN103488338A (zh) * | 2013-08-30 | 2014-01-01 | 江西合力泰科技股份有限公司 | 一种改善触摸屏邦定效果的方法 |
KR101849339B1 (ko) | 2013-09-30 | 2018-04-17 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 |
KR102081129B1 (ko) * | 2013-12-20 | 2020-02-25 | 엘지디스플레이 주식회사 | 액정표시장치 |
JP6434210B2 (ja) * | 2013-12-20 | 2018-12-05 | デクセリアルズ株式会社 | 電子部品、接続体、接続体の製造方法及び電子部品の接続方法 |
KR102514158B1 (ko) * | 2013-12-20 | 2023-03-27 | 데쿠세리아루즈 가부시키가이샤 | 전자 부품, 접속체, 접속체의 제조 방법 및 전자 부품의 접속 방법 |
JP6457214B2 (ja) * | 2014-08-08 | 2019-01-23 | デクセリアルズ株式会社 | 電子部品、接続体、接続体の製造方法及び電子部品の接続方法 |
JP6645730B2 (ja) | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
JP6324746B2 (ja) | 2014-02-03 | 2018-05-16 | デクセリアルズ株式会社 | 接続体、接続体の製造方法、電子機器 |
JP2015179831A (ja) | 2014-02-27 | 2015-10-08 | デクセリアルズ株式会社 | 接続体、接続体の製造方法及び検査方法 |
JP6435627B2 (ja) | 2014-03-20 | 2018-12-12 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2016029698A (ja) | 2014-07-22 | 2016-03-03 | デクセリアルズ株式会社 | 接続体、及び接続体の製造方法 |
KR102325643B1 (ko) * | 2015-01-07 | 2021-11-12 | 삼성디스플레이 주식회사 | 표시 장치 |
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-
2003
- 2003-12-16 KR KR1020030091951A patent/KR101051013B1/ko not_active IP Right Cessation
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2004
- 2004-12-13 JP JP2004359397A patent/JP4782410B2/ja not_active Expired - Fee Related
- 2004-12-15 TW TW093138916A patent/TWI366015B/zh not_active IP Right Cessation
- 2004-12-16 US US11/012,228 patent/US7327411B2/en not_active Expired - Fee Related
- 2004-12-16 CN CNB2004101012252A patent/CN100437234C/zh not_active Expired - Fee Related
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US7903067B2 (en) | 2011-03-08 |
JP2005203758A (ja) | 2005-07-28 |
US20050162577A1 (en) | 2005-07-28 |
CN1629926A (zh) | 2005-06-22 |
KR20050060349A (ko) | 2005-06-22 |
CN100437234C (zh) | 2008-11-26 |
JP4782410B2 (ja) | 2011-09-28 |
US7327411B2 (en) | 2008-02-05 |
KR101051013B1 (ko) | 2011-07-21 |
US20080174535A1 (en) | 2008-07-24 |
TW200530676A (en) | 2005-09-16 |
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