CN1577872A - 固体摄像装置及其制造方法 - Google Patents
固体摄像装置及其制造方法 Download PDFInfo
- Publication number
- CN1577872A CN1577872A CNA2004100617845A CN200410061784A CN1577872A CN 1577872 A CN1577872 A CN 1577872A CN A2004100617845 A CNA2004100617845 A CN A2004100617845A CN 200410061784 A CN200410061784 A CN 200410061784A CN 1577872 A CN1577872 A CN 1577872A
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H01L23/02—Containers; Seals
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L31/02—Details
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- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01—ELECTRIC ELEMENTS
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- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003189776A JP3782406B2 (ja) | 2003-07-01 | 2003-07-01 | 固体撮像装置およびその製造方法 |
JP189776/2003 | 2003-07-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1577872A true CN1577872A (zh) | 2005-02-09 |
CN100428482C CN100428482C (zh) | 2008-10-22 |
Family
ID=33432313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100617845A Expired - Fee Related CN100428482C (zh) | 2003-07-01 | 2004-06-30 | 固体摄像装置及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7294907B2 (zh) |
EP (1) | EP1494292A3 (zh) |
JP (1) | JP3782406B2 (zh) |
KR (1) | KR100591375B1 (zh) |
CN (1) | CN100428482C (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100429766C (zh) * | 2005-06-30 | 2008-10-29 | 三洋电机株式会社 | 电路装置及其制造方法 |
CN101902586A (zh) * | 2009-05-27 | 2010-12-01 | 富士能株式会社 | 固体摄像单元、摄影装置以及固体摄像元件固定方法 |
WO2014042242A1 (ja) * | 2012-09-17 | 2014-03-20 | 株式会社村田製作所 | 回路基板モジュール |
CN104973560A (zh) * | 2014-04-04 | 2015-10-14 | 阿尔卑斯电气株式会社 | 电子部件 |
WO2018006673A1 (zh) * | 2016-07-03 | 2018-01-11 | 宁波舜宇光电信息有限公司 | 感光组件和摄像模组及其制造方法 |
CN113169129A (zh) * | 2018-11-28 | 2021-07-23 | 京瓷株式会社 | 电子元件安装用基板以及电子装置 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
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US6943294B2 (en) * | 2003-12-22 | 2005-09-13 | Intel Corporation | Integrating passive components on spacer in stacked dies |
JP4381274B2 (ja) * | 2004-10-04 | 2009-12-09 | シャープ株式会社 | 半導体装置およびその製造方法 |
US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
JP4554492B2 (ja) * | 2005-11-01 | 2010-09-29 | シャープ株式会社 | 半導体パッケージの製造方法 |
JP2007208045A (ja) * | 2006-02-02 | 2007-08-16 | Sony Corp | 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法 |
KR100813600B1 (ko) * | 2006-09-29 | 2008-03-17 | 삼성전기주식회사 | 카메라 모듈 및 그 제조 방법 |
JP5082542B2 (ja) | 2007-03-29 | 2012-11-28 | ソニー株式会社 | 固体撮像装置 |
JP5047679B2 (ja) * | 2007-04-26 | 2012-10-10 | オリンパスメディカルシステムズ株式会社 | 撮像ユニットおよび、この撮像ユニットの製造方法 |
US20090045476A1 (en) * | 2007-08-16 | 2009-02-19 | Kingpak Technology Inc. | Image sensor package and method for forming the same |
US20100116970A1 (en) * | 2008-11-12 | 2010-05-13 | Wen-Long Chou | Photo detection device |
TWI421982B (zh) * | 2008-11-21 | 2014-01-01 | Advanpack Solutions Pte Ltd | 半導體導線元件及其製造方法 |
JP5431232B2 (ja) * | 2010-03-31 | 2014-03-05 | 三洋電機株式会社 | 半導体装置 |
US9263315B2 (en) | 2010-03-30 | 2016-02-16 | Dai Nippon Printing Co., Ltd. | LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate |
JP2010220245A (ja) * | 2010-05-19 | 2010-09-30 | Sony Corp | 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法 |
CN103548148B (zh) * | 2011-05-19 | 2016-09-28 | 欧司朗光电半导体有限公司 | 光电子装置和用于制造光电子装置的方法 |
JP2011238963A (ja) * | 2011-07-29 | 2011-11-24 | Panasonic Corp | パッケージ部品の製造方法 |
KR101400271B1 (ko) * | 2012-08-03 | 2014-05-28 | (주)포인트엔지니어링 | 광디바이스 제조 방법 및 이에 의해 제조된 광디바이스 |
US9478473B2 (en) * | 2013-05-21 | 2016-10-25 | Globalfoundries Inc. | Fabricating a microelectronics lid using sol-gel processing |
JP6215577B2 (ja) * | 2013-05-31 | 2017-10-18 | 株式会社ヨコオ | 半導体パッケージ容器、半導体装置、電子機器 |
CN105308138B (zh) * | 2013-06-13 | 2018-01-12 | 日立汽车***株式会社 | 粘合片、使用该粘合片的半导体装置的制造方法、使用该粘合片的热式空气流量传感器的制造方法、以及热式空气流量传感器 |
JP2019519087A (ja) * | 2016-03-12 | 2019-07-04 | ニンボー サニー オプテック カンパニー,リミテッド | アレイ撮像モジュール及び成形感光性アセンブリ、並びに電子機器向けのその製造方法 |
WO2018136114A1 (en) * | 2017-01-23 | 2018-07-26 | Bailey Claiborne | Gripping aid |
JP6884595B2 (ja) | 2017-02-28 | 2021-06-09 | キヤノン株式会社 | 電子部品、電子機器及び電子部品の製造方法 |
EP3668078B1 (en) * | 2017-08-07 | 2022-07-06 | Ningbo Sunny Opotech Co., Ltd. | Camera module and manufacturing method therefor, and corresponding intelligent terminal |
CN107958915B (zh) * | 2017-12-22 | 2024-01-19 | 南京先锋材料科技有限公司 | 一种cmos传感器封装结构及其封装方法 |
US10810932B2 (en) * | 2018-10-02 | 2020-10-20 | Sct Ltd. | Molded LED display module and method of making thererof |
US11073572B2 (en) * | 2019-01-17 | 2021-07-27 | Infineon Technologies Ag | Current sensor device with a routable molded lead frame |
JP2020129629A (ja) * | 2019-02-12 | 2020-08-27 | エイブリック株式会社 | 光センサ装置およびその製造方法 |
CN115838249B (zh) * | 2022-12-12 | 2024-06-11 | 中江立江电子有限公司 | 一种双排连接器封接用烧结模具及其装配方法 |
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JPS5610975A (en) * | 1979-07-09 | 1981-02-03 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS63241937A (ja) * | 1987-03-30 | 1988-10-07 | Olympus Optical Co Ltd | 固体撮像装置 |
JPH03133146A (ja) * | 1989-10-19 | 1991-06-06 | Matsushita Electric Ind Co Ltd | 集積回路装置の製造方法 |
JP3147053B2 (ja) * | 1997-10-27 | 2001-03-19 | 日本電気株式会社 | 樹脂封止型ボールグリッドアレイicパッケージ及びその製造方法 |
US6049124A (en) * | 1997-12-10 | 2000-04-11 | Intel Corporation | Semiconductor package |
US6195258B1 (en) * | 1999-08-26 | 2001-02-27 | Advanced Semiconductor Engineering, Inc. | Thermal board used for bonding wires in semiconductor manufacturing process |
JP2001077277A (ja) * | 1999-09-03 | 2001-03-23 | Sony Corp | 半導体パッケージおよび半導体パッケージ製造方法 |
JP3461332B2 (ja) * | 1999-09-10 | 2003-10-27 | 松下電器産業株式会社 | リードフレーム及びそれを用いた樹脂パッケージと光電子装置 |
US6847103B1 (en) * | 1999-11-09 | 2005-01-25 | Amkor Technology, Inc. | Semiconductor package with exposed die pad and body-locking leadframe |
US6384472B1 (en) * | 2000-03-24 | 2002-05-07 | Siliconware Precision Industries Co., Ltd | Leadless image sensor package structure and method for making the same |
TW454323B (en) * | 2000-08-10 | 2001-09-11 | Uincent Lin | Image sensor package structure and substrate thereof |
TW458377U (en) * | 2000-11-23 | 2001-10-01 | Siliconware Precision Industries Co Ltd | Sensor structure of quad flat package without external leads |
JP4619553B2 (ja) * | 2001-01-30 | 2011-01-26 | 浜松ホトニクス株式会社 | 半導体装置 |
JP3801025B2 (ja) * | 2001-11-16 | 2006-07-26 | ソニー株式会社 | 半導体装置 |
-
2003
- 2003-07-01 JP JP2003189776A patent/JP3782406B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-25 US US10/876,839 patent/US7294907B2/en not_active Expired - Fee Related
- 2004-06-28 KR KR1020040048970A patent/KR100591375B1/ko not_active IP Right Cessation
- 2004-06-28 EP EP04015135A patent/EP1494292A3/en not_active Withdrawn
- 2004-06-30 CN CNB2004100617845A patent/CN100428482C/zh not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100429766C (zh) * | 2005-06-30 | 2008-10-29 | 三洋电机株式会社 | 电路装置及其制造方法 |
US7531785B2 (en) | 2005-06-30 | 2009-05-12 | Sanyo Electric Co., Ltd. | Circuit device and method of manufacturing the same |
CN101902586A (zh) * | 2009-05-27 | 2010-12-01 | 富士能株式会社 | 固体摄像单元、摄影装置以及固体摄像元件固定方法 |
CN101902586B (zh) * | 2009-05-27 | 2012-10-17 | 富士能株式会社 | 固体摄像单元、摄影装置以及固体摄像元件固定方法 |
WO2014042242A1 (ja) * | 2012-09-17 | 2014-03-20 | 株式会社村田製作所 | 回路基板モジュール |
CN104973560A (zh) * | 2014-04-04 | 2015-10-14 | 阿尔卑斯电气株式会社 | 电子部件 |
WO2018006673A1 (zh) * | 2016-07-03 | 2018-01-11 | 宁波舜宇光电信息有限公司 | 感光组件和摄像模组及其制造方法 |
CN113169129A (zh) * | 2018-11-28 | 2021-07-23 | 京瓷株式会社 | 电子元件安装用基板以及电子装置 |
CN113169129B (zh) * | 2018-11-28 | 2024-06-04 | 京瓷株式会社 | 电子元件安装用基板以及电子装置 |
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CN100428482C (zh) | 2008-10-22 |
EP1494292A2 (en) | 2005-01-05 |
US7294907B2 (en) | 2007-11-13 |
JP2005026426A (ja) | 2005-01-27 |
US20050001219A1 (en) | 2005-01-06 |
KR100591375B1 (ko) | 2006-06-19 |
JP3782406B2 (ja) | 2006-06-07 |
EP1494292A3 (en) | 2009-10-21 |
KR20050004022A (ko) | 2005-01-12 |
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