CN1519858A - 半导体存储装置 - Google Patents
半导体存储装置 Download PDFInfo
- Publication number
- CN1519858A CN1519858A CNA2003101015646A CN200310101564A CN1519858A CN 1519858 A CN1519858 A CN 1519858A CN A2003101015646 A CNA2003101015646 A CN A2003101015646A CN 200310101564 A CN200310101564 A CN 200310101564A CN 1519858 A CN1519858 A CN 1519858A
- Authority
- CN
- China
- Prior art keywords
- storage unit
- tft
- bit line
- gate electrode
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 239000010408 film Substances 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 25
- 239000011229 interlayer Substances 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 description 31
- 230000000694 effects Effects 0.000 description 16
- 230000009471 action Effects 0.000 description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 239000012535 impurity Substances 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000001351 cycling effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 101100268330 Solanum lycopersicum TFT7 gene Proteins 0.000 description 2
- 101100268333 Solanum lycopersicum TFT8 gene Proteins 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000004941 influx Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000018199 S phase Effects 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
- H10B10/125—Static random access memory [SRAM] devices comprising a MOSFET load element the MOSFET being a thin film transistor [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/15—Static random access memory [SRAM] devices comprising a resistor load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/84—Electrodes with an enlarged surface, e.g. formed by texturisation being a rough surface, e.g. using hemispherical grains
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
- Static Random-Access Memory (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26968/03 | 2003-02-04 | ||
JP2003026968A JP2004241473A (ja) | 2003-02-04 | 2003-02-04 | 半導体記憶装置 |
JP26968/2003 | 2003-02-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1519858A true CN1519858A (zh) | 2004-08-11 |
CN100394509C CN100394509C (zh) | 2008-06-11 |
Family
ID=32732888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101015646A Expired - Fee Related CN100394509C (zh) | 2003-02-04 | 2003-10-07 | 半导体存储装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6936878B2 (zh) |
JP (1) | JP2004241473A (zh) |
KR (1) | KR100805434B1 (zh) |
CN (1) | CN100394509C (zh) |
DE (1) | DE10338049A1 (zh) |
TW (1) | TWI226063B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101030446B (zh) * | 2006-02-27 | 2010-06-02 | 富士通微电子株式会社 | 半导体存储器件 |
CN101840728A (zh) * | 2010-05-28 | 2010-09-22 | 上海宏力半导体制造有限公司 | 一种双端sram单元 |
CN110047534A (zh) * | 2014-03-21 | 2019-07-23 | 意法半导体(鲁塞)公司 | 与sram存储平面和非易失性存储平面相关联的、针对意外翻转而硬化的存储器装置 |
CN110400797A (zh) * | 2019-07-17 | 2019-11-01 | 上海华力集成电路制造有限公司 | Sram的存储单元结构版图、sram的存储单元结构及其版图 |
WO2024007543A1 (zh) * | 2022-07-07 | 2024-01-11 | 北京超弦存储器研究院 | 存储单元、存储器及其控制方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7078306B1 (en) * | 2003-03-24 | 2006-07-18 | Integrated Device Technology, Inc. | Method for forming a thin film resistor structure |
US6979849B2 (en) * | 2003-12-31 | 2005-12-27 | Micron Technology, Inc. | Memory cell having improved interconnect |
JP5025140B2 (ja) * | 2005-03-23 | 2012-09-12 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置の製造方法 |
JP5038612B2 (ja) * | 2005-09-29 | 2012-10-03 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP5076462B2 (ja) * | 2005-12-28 | 2012-11-21 | ソニー株式会社 | 半導体メモリデバイス |
JP4868934B2 (ja) * | 2006-05-11 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
JP2008227344A (ja) * | 2007-03-15 | 2008-09-25 | Nec Electronics Corp | 半導体装置及びその製造方法 |
JP2008269751A (ja) * | 2007-04-25 | 2008-11-06 | Semiconductor Energy Lab Co Ltd | 半導体記憶装置及び当該半導体記憶装置を具備する電子機器 |
DE102007021402A1 (de) * | 2007-05-04 | 2008-11-06 | Atmel Germany Gmbh | Integrierter Verstärkerschaltkreis |
US8299722B2 (en) * | 2008-12-12 | 2012-10-30 | Cirrus Logic, Inc. | Time division light output sensing and brightness adjustment for different spectra of light emitting diodes |
JP2010245293A (ja) * | 2009-04-06 | 2010-10-28 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
US10411013B2 (en) * | 2016-01-22 | 2019-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and memory device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62257698A (ja) | 1986-04-30 | 1987-11-10 | Oki Electric Ind Co Ltd | 半導体スタテイツクメモリセル |
US5508540A (en) * | 1993-02-19 | 1996-04-16 | Hitachi, Ltd. | Semiconductor integrated circuit device and process of manufacturing the same |
JPH06291281A (ja) | 1993-03-31 | 1994-10-18 | Sony Corp | Sramメモリーセル構造及びその形成方法 |
JPH07130878A (ja) * | 1993-10-29 | 1995-05-19 | Sony Corp | 半導体記憶装置 |
JPH07161840A (ja) | 1993-12-07 | 1995-06-23 | Sony Corp | スタティックramのメモリセル |
JP2689923B2 (ja) * | 1994-11-11 | 1997-12-10 | 日本電気株式会社 | 半導体装置およびその製造方法 |
JPH09270494A (ja) * | 1996-01-31 | 1997-10-14 | Hitachi Ltd | 半導体集積回路装置 |
JP3554666B2 (ja) * | 1997-10-07 | 2004-08-18 | 株式会社日立製作所 | 半導体メモリ装置 |
JP3523762B2 (ja) * | 1996-12-19 | 2004-04-26 | 株式会社東芝 | 半導体記憶装置 |
JP3036588B2 (ja) * | 1997-02-03 | 2000-04-24 | 日本電気株式会社 | 半導体記憶装置 |
JPH10229135A (ja) * | 1997-02-14 | 1998-08-25 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
KR100253321B1 (ko) * | 1997-09-23 | 2000-04-15 | 김영환 | 반도체 메모리 소자의 구조 및 제조방법 |
JP3807836B2 (ja) * | 1997-11-28 | 2006-08-09 | 株式会社ルネサステクノロジ | 半導体装置および半導体装置の製造方法 |
JP3410976B2 (ja) * | 1998-12-08 | 2003-05-26 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 薄膜及びバルク・シリコン・トランジスタを組み合わせる併合化論理及びメモリ集積回路チップとその形成方法 |
JP4674386B2 (ja) * | 1999-02-17 | 2011-04-20 | ソニー株式会社 | 半導体記憶装置 |
JP4565700B2 (ja) * | 1999-05-12 | 2010-10-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4530464B2 (ja) * | 2000-03-09 | 2010-08-25 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
JP4936582B2 (ja) * | 2000-07-28 | 2012-05-23 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
JP2002176112A (ja) * | 2000-12-08 | 2002-06-21 | Mitsubishi Electric Corp | 半導体記憶装置およびその製造方法 |
JP2002368135A (ja) * | 2001-06-12 | 2002-12-20 | Hitachi Ltd | 半導体記憶装置 |
-
2003
- 2003-02-04 JP JP2003026968A patent/JP2004241473A/ja active Pending
- 2003-07-25 US US10/626,594 patent/US6936878B2/en not_active Expired - Fee Related
- 2003-08-19 DE DE10338049A patent/DE10338049A1/de not_active Withdrawn
- 2003-08-20 TW TW092122835A patent/TWI226063B/zh not_active IP Right Cessation
- 2003-10-04 KR KR1020030068981A patent/KR100805434B1/ko not_active IP Right Cessation
- 2003-10-07 CN CNB2003101015646A patent/CN100394509C/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101030446B (zh) * | 2006-02-27 | 2010-06-02 | 富士通微电子株式会社 | 半导体存储器件 |
CN101840728A (zh) * | 2010-05-28 | 2010-09-22 | 上海宏力半导体制造有限公司 | 一种双端sram单元 |
CN101840728B (zh) * | 2010-05-28 | 2015-06-10 | 上海华虹宏力半导体制造有限公司 | 一种双端sram单元 |
CN110047534A (zh) * | 2014-03-21 | 2019-07-23 | 意法半导体(鲁塞)公司 | 与sram存储平面和非易失性存储平面相关联的、针对意外翻转而硬化的存储器装置 |
CN110047534B (zh) * | 2014-03-21 | 2023-09-22 | 意法半导体(鲁塞)公司 | 与sram存储平面和非易失性存储平面相关联的、针对意外翻转而硬化的存储器装置 |
CN110400797A (zh) * | 2019-07-17 | 2019-11-01 | 上海华力集成电路制造有限公司 | Sram的存储单元结构版图、sram的存储单元结构及其版图 |
CN110400797B (zh) * | 2019-07-17 | 2022-02-01 | 上海华力集成电路制造有限公司 | Sram的存储单元结构版图、sram的存储单元结构及其版图 |
WO2024007543A1 (zh) * | 2022-07-07 | 2024-01-11 | 北京超弦存储器研究院 | 存储单元、存储器及其控制方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI226063B (en) | 2005-01-01 |
TW200415651A (en) | 2004-08-16 |
KR100805434B1 (ko) | 2008-02-20 |
JP2004241473A (ja) | 2004-08-26 |
CN100394509C (zh) | 2008-06-11 |
US20040150019A1 (en) | 2004-08-05 |
DE10338049A1 (de) | 2004-08-19 |
US6936878B2 (en) | 2005-08-30 |
KR20040071577A (ko) | 2004-08-12 |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
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ASS | Succession or assignment of patent right |
Owner name: RENESAS ELECTRONICS CORPORATION Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP. Effective date: 20101019 |
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Free format text: CORRECT: ADDRESS; FROM: TOKYO TO, JAPAN TO: KAWASAKI CITY, KANAGAWA PREFECTURE, JAPAN |
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TR01 | Transfer of patent right |
Effective date of registration: 20101019 Address after: Kawasaki, Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Tokyo, Japan, Japan Patentee before: Renesas Technology Corp. |
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Granted publication date: 20080611 Termination date: 20101007 |