CN1443369A - 外壳器件及其中所用的接触单元 - Google Patents
外壳器件及其中所用的接触单元 Download PDFInfo
- Publication number
- CN1443369A CN1443369A CN01812931.5A CN01812931A CN1443369A CN 1443369 A CN1443369 A CN 1443369A CN 01812931 A CN01812931 A CN 01812931A CN 1443369 A CN1443369 A CN 1443369A
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- CN
- China
- Prior art keywords
- zone
- osculating element
- housing device
- shell
- shell zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000694 effects Effects 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 11
- 238000003466 welding Methods 0.000 description 9
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 101150064138 MAP1 gene Proteins 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10024377.0 | 2000-05-17 | ||
DE10024377A DE10024377B4 (de) | 2000-05-17 | 2000-05-17 | Gehäuseeinrichtung und darin zu verwendendes Kontaktelement |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1443369A true CN1443369A (zh) | 2003-09-17 |
CN100452395C CN100452395C (zh) | 2009-01-14 |
Family
ID=7642531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018129315A Expired - Fee Related CN100452395C (zh) | 2000-05-17 | 2001-05-16 | 外壳器件及其中所用的接触单元 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6802745B2 (zh) |
CN (1) | CN100452395C (zh) |
DE (1) | DE10024377B4 (zh) |
WO (1) | WO2001088982A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101088160B (zh) * | 2004-12-22 | 2012-01-11 | 西门子公司 | 半导体模块和电力母线***布置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10316356B4 (de) * | 2003-04-10 | 2012-07-26 | Semikron Elektronik Gmbh & Co. Kg | Modular aufgebautes Leistungshalbleitermodul |
US7354282B2 (en) * | 2005-06-15 | 2008-04-08 | Molex Incorporated | Electrical connector having blade terminals |
DE112005003653B4 (de) * | 2005-08-26 | 2013-05-16 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit auf Schaltungsträger aufgebrachten Lastanschlusselementen und Anschlussklemmelementen |
JP5041798B2 (ja) * | 2006-12-15 | 2012-10-03 | 三菱電機株式会社 | 半導体装置 |
DE102019125108A1 (de) | 2019-09-18 | 2021-03-18 | Audi Ag | Leistungselektronikanordnung umfassend eine Leiterplatte und ein Leistungsmodul, Verfahren zur Herstellung einer Leistungselektronikanordnung, Kraftfahrzeug umfassend eine Leistungselektronikanordnung |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3307077A (en) * | 1965-10-23 | 1967-02-28 | Bernstein Bernard | Flat package bridge rectifier |
DE3143339C2 (de) * | 1981-10-31 | 1987-05-14 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
US4630174A (en) * | 1983-10-31 | 1986-12-16 | Kaufman Lance R | Circuit package with external circuit board and connection |
DE3345285A1 (de) * | 1983-12-14 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | Leistungs-halbleiteranordnung |
DE3611658A1 (de) * | 1985-04-05 | 1986-10-16 | Omron Tateisi Electronics Co., Kyoto | Elektronikbauteilaufbau |
DE3643288A1 (de) * | 1986-12-18 | 1988-06-30 | Semikron Elektronik Gmbh | Halbleiterbaueinheit |
DE8701935U1 (de) * | 1987-02-09 | 1987-04-09 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit mindestens einem Halbleiterkörper |
JP2898694B2 (ja) | 1989-04-17 | 1999-06-02 | 株式会社東芝 | 半導体装置の製造方法 |
JPH0783080B2 (ja) * | 1990-01-18 | 1995-09-06 | 株式会社東芝 | 半導体装置用部品 |
EP0513410B1 (de) * | 1991-05-15 | 1993-12-15 | IXYS Semiconductor GmbH | Leistungshalbleitermodul und Verfahren zur Herstellung eines solchen Moduls |
JP2956363B2 (ja) * | 1992-07-24 | 1999-10-04 | 富士電機株式会社 | パワー半導体装置 |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US5391919A (en) * | 1993-10-22 | 1995-02-21 | International Rectifier Corporation | Semiconductor power module with identical mounting frames |
JPH07335801A (ja) | 1994-06-10 | 1995-12-22 | Fuji Electric Co Ltd | 半導体装置の組立構造 |
JPH098191A (ja) | 1995-06-20 | 1997-01-10 | Origin Electric Co Ltd | 電力用半導体装置 |
DE19627858A1 (de) * | 1996-07-11 | 1998-01-22 | Eurotec Ges Fuer Energiesparte | Komplexes Leistungsbauelement |
EP0884781A3 (en) * | 1997-06-12 | 1999-06-30 | Hitachi, Ltd. | Power semiconductor module |
US6486548B1 (en) * | 1997-10-20 | 2002-11-26 | Hitachi, Ltd. | Semiconductor module and power converting apparatus using the module |
US6054765A (en) * | 1998-04-27 | 2000-04-25 | Delco Electronics Corporation | Parallel dual switch module |
DE29900370U1 (de) * | 1999-01-12 | 1999-04-08 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG, 59581 Warstein | Leistungshalbleitermodul mit Deckel |
JP4004715B2 (ja) * | 2000-05-31 | 2007-11-07 | 三菱電機株式会社 | パワーモジュール |
DE10125696A1 (de) * | 2001-05-25 | 2002-12-05 | Eupec Gmbh & Co Kg | Leistungshalbleitermodul |
-
2000
- 2000-05-17 DE DE10024377A patent/DE10024377B4/de not_active Expired - Fee Related
-
2001
- 2001-05-16 CN CNB018129315A patent/CN100452395C/zh not_active Expired - Fee Related
- 2001-05-16 WO PCT/DE2001/001847 patent/WO2001088982A2/de active Application Filing
-
2002
- 2002-11-18 US US10/298,395 patent/US6802745B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101088160B (zh) * | 2004-12-22 | 2012-01-11 | 西门子公司 | 半导体模块和电力母线***布置 |
Also Published As
Publication number | Publication date |
---|---|
WO2001088982A3 (de) | 2002-04-04 |
US20030077940A1 (en) | 2003-04-24 |
DE10024377A1 (de) | 2001-11-29 |
CN100452395C (zh) | 2009-01-14 |
WO2001088982A2 (de) | 2001-11-22 |
US6802745B2 (en) | 2004-10-12 |
DE10024377B4 (de) | 2006-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: INFINEON TECHNOLOGIES AG Free format text: FORMER OWNER: EUPEC GMBH + CO. KG Effective date: 20130325 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: EUPEC GMBH + CO. KG Free format text: FORMER NAME: EUPEC EUROPASCHE GES FON LEIST LP |
|
CP01 | Change in the name or title of a patent holder |
Address after: Wahl Belek - Germany shten Patentee after: OPEC European Power Semiconductor Co.,Ltd. Address before: Wahl Belek - Germany shten Patentee before: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO KG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130325 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Wahl Belek - Germany shten Patentee before: OPEC European Power Semiconductor Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20190516 |
|
CF01 | Termination of patent right due to non-payment of annual fee |