CN1347581A - 带有应变补偿层的半导体结构及其制备方法 - Google Patents
带有应变补偿层的半导体结构及其制备方法 Download PDFInfo
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- CN1347581A CN1347581A CN00805556A CN00805556A CN1347581A CN 1347581 A CN1347581 A CN 1347581A CN 00805556 A CN00805556 A CN 00805556A CN 00805556 A CN00805556 A CN 00805556A CN 1347581 A CN1347581 A CN 1347581A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 132
- 238000005253 cladding Methods 0.000 claims description 185
- 230000004888 barrier function Effects 0.000 claims description 26
- 230000006835 compression Effects 0.000 claims description 18
- 238000007906 compression Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 17
- 230000007547 defect Effects 0.000 abstract description 10
- 230000005669 field effect Effects 0.000 abstract description 2
- 239000000470 constituent Substances 0.000 abstract 3
- 238000010276 construction Methods 0.000 abstract 1
- 229910002601 GaN Inorganic materials 0.000 description 125
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 125
- 229910002704 AlGaN Inorganic materials 0.000 description 50
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 230000002950 deficient Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 5
- 239000002800 charge carrier Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 1
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
- H01L31/03048—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP comprising a nitride compounds, e.g. InGaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/11—Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers, e.g. bipolar phototransistors
- H01L31/1105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers, e.g. bipolar phototransistors the device being a bipolar phototransistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Semiconductor Lasers (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27731999A | 1999-03-26 | 1999-03-26 | |
US09/277,319 | 1999-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1347581A true CN1347581A (zh) | 2002-05-01 |
Family
ID=23060339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00805556A Pending CN1347581A (zh) | 1999-03-26 | 2000-03-01 | 带有应变补偿层的半导体结构及其制备方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1183761A2 (ja) |
JP (1) | JP2002540618A (ja) |
CN (1) | CN1347581A (ja) |
WO (1) | WO2000058999A2 (ja) |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1326298C (zh) * | 2005-06-29 | 2007-07-11 | 武汉电信器件有限公司 | 一种提高半导体激光器成品率的方法 |
US7339255B2 (en) | 2004-08-24 | 2008-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having bidirectionally inclined toward <1-100> and <11-20> relative to {0001} crystal planes |
CN100454698C (zh) * | 2003-10-11 | 2009-01-21 | 英坦斯有限公司 | 半导体波导器件中输出光束发散的控制 |
CN100468790C (zh) * | 2002-05-30 | 2009-03-11 | 克里公司 | 具有不掺杂包层和多量子阱的ⅲ族氮化物led |
CN101425556B (zh) * | 2004-08-26 | 2011-12-14 | Lg伊诺特有限公司 | 氮化物半导体发光器件及其制造方法 |
CN102368519A (zh) * | 2011-10-27 | 2012-03-07 | 华灿光电股份有限公司 | 一种提高半导体二极管多量子阱发光效率的方法 |
CN102473796A (zh) * | 2009-06-30 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | 控制iii氮化物器件中的凹坑形成 |
CN102610719A (zh) * | 2011-01-20 | 2012-07-25 | 夏普株式会社 | 变质基板体系、其制备方法以及iii-氮化物半导体器件 |
CN102623575A (zh) * | 2012-04-17 | 2012-08-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种InP衬底生长InGaAs电池层的结构及其方法 |
CN103022211A (zh) * | 2012-12-28 | 2013-04-03 | 南京大学 | 极化增强的p-i-n结InGaN太阳电池 |
CN103137799A (zh) * | 2013-01-27 | 2013-06-05 | 厦门大学 | 一种陡峭界面GaN/AlGaN超晶格的制备方法 |
CN103151435A (zh) * | 2013-01-30 | 2013-06-12 | 东南大学 | 一种具有复合势垒的氮化镓基发光二极管 |
CN103620736A (zh) * | 2011-06-15 | 2014-03-05 | 奥斯兰姆奥普托半导体有限责任公司 | 光电子半导体本体和用于制造光电子半导体本体的方法 |
CN105118904A (zh) * | 2015-08-14 | 2015-12-02 | 湘能华磊光电股份有限公司 | Led外延层结构生长方法及所得外延层结构和led芯片 |
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US6558973B2 (en) | 2001-01-22 | 2003-05-06 | Honeywell International Inc. | Metamorphic long wavelength high-speed photodiode |
JP2004531894A (ja) | 2001-06-15 | 2004-10-14 | クリー インコーポレイテッド | 紫外線発光ダイオード |
US7741654B2 (en) | 2004-09-16 | 2010-06-22 | Nec Corporation | Group III nitride semiconductor optical device |
KR100662191B1 (ko) | 2004-12-23 | 2006-12-27 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
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JP2007250991A (ja) * | 2006-03-17 | 2007-09-27 | Nippon Telegr & Teleph Corp <Ntt> | 超格子構造を含む半導体構造および該半導体構造を備える半導体デバイス |
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US20160359086A1 (en) | 2015-06-05 | 2016-12-08 | Ostendo Technologies, Inc. | Light Emitting Structures with Multiple Uniformly Populated Active Layers |
US10396240B2 (en) | 2015-10-08 | 2019-08-27 | Ostendo Technologies, Inc. | III-nitride semiconductor light emitting device having amber-to-red light emission (>600 nm) and a method for making same |
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CN116247506B (zh) * | 2023-05-12 | 2023-08-29 | 武汉鑫威源电子科技有限公司 | 一种高性能氮化镓基激光器及其N型GaN层和生长方法 |
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JPH0629621A (ja) * | 1992-07-09 | 1994-02-04 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH0878786A (ja) * | 1994-09-02 | 1996-03-22 | Mitsubishi Electric Corp | 歪量子井戸の構造 |
JPH08307003A (ja) * | 1995-04-28 | 1996-11-22 | Mitsubishi Electric Corp | 半導体レーザ装置 |
CN1964093B (zh) * | 1997-01-09 | 2012-06-27 | 日亚化学工业株式会社 | 氮化物半导体元器件 |
US5831277A (en) * | 1997-03-19 | 1998-11-03 | Northwestern University | III-nitride superlattice structures |
JPH11154774A (ja) * | 1997-08-05 | 1999-06-08 | Canon Inc | 面発光半導体デバイスの製造方法、この方法によって製造された面発光半導体デバイス及びこのデバイスを用いた表示装置 |
-
2000
- 2000-03-01 CN CN00805556A patent/CN1347581A/zh active Pending
- 2000-03-01 WO PCT/IB2000/000892 patent/WO2000058999A2/en active Search and Examination
- 2000-03-01 EP EP00940681A patent/EP1183761A2/en not_active Withdrawn
- 2000-03-01 JP JP2000608410A patent/JP2002540618A/ja active Pending
Cited By (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100468790C (zh) * | 2002-05-30 | 2009-03-11 | 克里公司 | 具有不掺杂包层和多量子阱的ⅲ族氮化物led |
CN100454698C (zh) * | 2003-10-11 | 2009-01-21 | 英坦斯有限公司 | 半导体波导器件中输出光束发散的控制 |
US7339255B2 (en) | 2004-08-24 | 2008-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having bidirectionally inclined toward <1-100> and <11-20> relative to {0001} crystal planes |
CN100449800C (zh) * | 2004-08-24 | 2009-01-07 | 株式会社东芝 | 半导体衬底及在半导体衬底上通过外延生长制造的半导体器件 |
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