CN1306621C - 光源连接件、发光装置、图案化导体以及用于制造光源连接件的方法 - Google Patents

光源连接件、发光装置、图案化导体以及用于制造光源连接件的方法 Download PDF

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Publication number
CN1306621C
CN1306621C CNB028088506A CN02808850A CN1306621C CN 1306621 C CN1306621 C CN 1306621C CN B028088506 A CNB028088506 A CN B028088506A CN 02808850 A CN02808850 A CN 02808850A CN 1306621 C CN1306621 C CN 1306621C
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CN
China
Prior art keywords
light source
patterned conductor
main line
led
source assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028088506A
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English (en)
Chinese (zh)
Other versions
CN1529914A (zh
Inventor
森山秀男
柳田宗彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Moriyama Sangyo KK
Original Assignee
Moriyama Sangyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moriyama Sangyo KK filed Critical Moriyama Sangyo KK
Publication of CN1529914A publication Critical patent/CN1529914A/zh
Application granted granted Critical
Publication of CN1306621C publication Critical patent/CN1306621C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CNB028088506A 2001-04-26 2002-04-24 光源连接件、发光装置、图案化导体以及用于制造光源连接件的方法 Expired - Fee Related CN1306621C (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP129579/2001 2001-04-26
JP2001129579 2001-04-26
JP201418/2001 2001-07-02
JP2001201418 2001-07-02
JP2001201436 2001-07-02
JP201436/2001 2001-07-02
JP2001289290 2001-09-21
JP289290/2001 2001-09-21
JP001666/2002 2002-01-08
JP2002001666 2002-01-08
PCT/JP2002/004100 WO2002089222A1 (fr) 2001-04-26 2002-04-24 Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses

Publications (2)

Publication Number Publication Date
CN1529914A CN1529914A (zh) 2004-09-15
CN1306621C true CN1306621C (zh) 2007-03-21

Family

ID=27531879

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028088506A Expired - Fee Related CN1306621C (zh) 2001-04-26 2002-04-24 光源连接件、发光装置、图案化导体以及用于制造光源连接件的方法

Country Status (4)

Country Link
JP (1) JP3880522B2 (fr)
KR (1) KR100537897B1 (fr)
CN (1) CN1306621C (fr)
WO (1) WO2002089222A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
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US9997684B2 (en) 2012-03-30 2018-06-12 Lumileds Llc Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture
CN110010749A (zh) * 2017-12-22 2019-07-12 朗德万斯公司 具有引线框架的灯管

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JP2008300884A (ja) * 2003-10-30 2008-12-11 Furukawa Electric Co Ltd:The Ｌｅｄ並びにｌｅｄとフラットケーブルの接続構造及びｌｅｄ接続回路構造体
JP4507062B2 (ja) * 2003-11-20 2010-07-21 オムロン株式会社 面光源装置及び当該装置を用いた機器
JP3851911B2 (ja) * 2004-05-26 2006-11-29 株式会社アドバネクス 発光ダイオードの固定装置及び固定構造
JP4556166B2 (ja) * 2004-07-29 2010-10-06 ライツ・アドバンスト・テクノロジー株式会社 光源装置
JP4654639B2 (ja) * 2004-09-09 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
JP3802910B2 (ja) 2004-09-13 2006-08-02 ローム株式会社 半導体発光装置
WO2006033297A1 (fr) * 2004-09-21 2006-03-30 Intellectual Property Bank Corp. Procede de fabrication d'une unite sur laquelle une del est montee, douille de del et substrat de circuit electronique pour montage de del
GB0421772D0 (en) * 2004-09-30 2004-11-03 Crescent Lighting Ltd Electrical circuit and connection method
JP4913459B2 (ja) * 2006-03-28 2012-04-11 電気化学工業株式会社 金属ベース回路基板およびその製法、ならびにｌｅｄモジュール
JP5239138B2 (ja) * 2005-08-31 2013-07-17 東芝ライテック株式会社 Ｌｅｄ点灯装置
US7918702B2 (en) * 2006-04-25 2011-04-05 Koninklijke Philips Electronics N.V. Large area LED array and method for its manufacture
KR101412473B1 (ko) * 2006-04-25 2014-06-30 코닌클리케 필립스 엔.브이. Ｌｅｄ 어레이 그리드, ｌｅｄ 어레이 그리드의 제조를 위한 방법 및 장치 및 ｌｅｄ 어레이 그리드에서 사용하기 위한 ｌｅｄ 구성부품
US7988332B2 (en) * 2006-09-12 2011-08-02 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire
JP4840067B2 (ja) * 2006-10-11 2011-12-21 豊田合成株式会社 Ｌｅｄランプ装置
TW200824142A (en) * 2006-11-22 2008-06-01 Lighthouse Technology Co Ltd High power diode holder and thereof package is described
JP5297592B2 (ja) * 2007-02-15 2013-09-25 矢崎総業株式会社 Ｌｅｄ発光装置
JP5198460B2 (ja) * 2007-09-21 2013-05-15 昭和電工株式会社 表示装置、光源連結体、照明装置、光源連結体の製造方法
US20100254119A1 (en) * 2007-11-20 2010-10-07 Showa Denko K.K. Light source connection member, light emitting device and display device
JP2010034369A (ja) * 2008-07-30 2010-02-12 Kyocera Corp 太陽電池ユニットおよび太陽電池ユニット用パッケージ
DE102008038778A1 (de) 2008-08-12 2010-02-25 Bega Gantenbrink-Leuchten Kg Farb-LED-Strahler
CN101806439B (zh) * 2009-02-18 2013-04-17 黄嘉宾 一种led的散热结构
KR101020992B1 (ko) * 2009-03-02 2011-03-09 엘지이노텍 주식회사 발광 모듈 및 이를 구비한 라이트 유닛
JP5323668B2 (ja) 2009-12-24 2013-10-23 日本メクトロン株式会社 照明装置及びその製造方法
JP2011253967A (ja) * 2010-06-02 2011-12-15 Chichibu Fuji Co Ltd 半導体レーザ素子用エージングボード
TW201235609A (en) * 2010-07-13 2012-09-01 Koninkl Philips Electronics Nv Low cost mounting of LEDs in TL-retrofit tubes
JP2012028412A (ja) * 2010-07-20 2012-02-09 Furukawa Electric Co Ltd:The ２次元面発光レーザアレイ素子、面発光レーザ装置および光源
JP2012049367A (ja) * 2010-08-27 2012-03-08 Kyocera Elco Corp 半導体発光素子取付用モジュール、半導体発光素子モジュール、半導体発光素子照明器具、及び、半導体発光素子取付用モジュールの製造方法
KR101300907B1 (ko) * 2010-10-01 2013-08-27 소닉스자펜 주식회사 반사갓연결장치, 이를 포함하는 반사갓결합모듈 및 등기구
JP5303579B2 (ja) * 2011-01-11 2013-10-02 京セラコネクタプロダクツ株式会社 半導体発光素子取付用モジュール、及び、半導体発光素子モジュール
JP5750297B2 (ja) 2011-04-19 2015-07-15 日本メクトロン株式会社 基板組立体および照明装置
CN102200230A (zh) * 2011-05-18 2011-09-28 陈建伟 Led灯泡
CN102974907A (zh) * 2011-09-06 2013-03-20 苏州世鼎电子有限公司 Led组件的焊接工艺方法
CN103017108B (zh) * 2011-09-27 2017-04-19 欧司朗股份有限公司 基座、圆管形壳体以及包括基座和圆管形壳体的灯
CN102509760B (zh) * 2011-11-21 2014-04-02 上海大溥实业有限公司 一种线条型led及其生产方法和应用
US10680383B2 (en) 2013-03-14 2020-06-09 Apex Technologies, Inc. Linear electrode systems for module attachment with non-uniform axial spacing
KR101647953B1 (ko) * 2014-08-26 2016-08-12 한국단자공업 주식회사 엘이디 모듈, 엘이디 모듈 어셈블리
CN105276534A (zh) * 2015-09-25 2016-01-27 吴少健 一种led线路板
CN105161602B (zh) * 2015-09-25 2018-03-16 临安市新三联照明电器有限公司 一种带加强筋的led线路板
CN106382609B (zh) * 2016-10-18 2023-05-30 南昌大学 一种led灯丝条
JP6934180B2 (ja) * 2017-05-17 2021-09-15 アイリスオーヤマ株式会社 Ｌｅｄランプ
CN110808242B (zh) * 2019-11-20 2020-12-08 博兴战新产业发展有限公司 一种led灯串及其制造方法
TWI772098B (zh) * 2021-07-09 2022-07-21 聯嘉光電股份有限公司 長條狀發光二極體及其應用裝置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9997684B2 (en) 2012-03-30 2018-06-12 Lumileds Llc Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture
CN104204652B (zh) * 2012-03-30 2018-12-14 亮锐控股有限公司 用于伸展的引线框架构的预旋转的重叠模制双向发散透镜
US10249807B2 (en) 2012-03-30 2019-04-02 Lumileds Llc Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture
CN110010749A (zh) * 2017-12-22 2019-07-12 朗德万斯公司 具有引线框架的灯管
CN110010749B (zh) * 2017-12-22 2022-04-08 朗德万斯公司 具有引线框架的灯管

Also Published As

Publication number Publication date
CN1529914A (zh) 2004-09-15
JP3880522B2 (ja) 2007-02-14
WO2002089222A1 (fr) 2002-11-07
JPWO2002089222A1 (ja) 2004-08-19
KR20030095400A (ko) 2003-12-18
KR100537897B1 (ko) 2005-12-20

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