CN1281331A - 带锚定焊盘的多层陶瓷衬底 - Google Patents
带锚定焊盘的多层陶瓷衬底 Download PDFInfo
- Publication number
- CN1281331A CN1281331A CN00120400A CN00120400A CN1281331A CN 1281331 A CN1281331 A CN 1281331A CN 00120400 A CN00120400 A CN 00120400A CN 00120400 A CN00120400 A CN 00120400A CN 1281331 A CN1281331 A CN 1281331A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- hole
- layer
- metal
- ceramics substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (35)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/356,944 | 1999-07-19 | ||
US09/356,944 US6187418B1 (en) | 1999-07-19 | 1999-07-19 | Multilayer ceramic substrate with anchored pad |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1281331A true CN1281331A (zh) | 2001-01-24 |
CN1181716C CN1181716C (zh) | 2004-12-22 |
Family
ID=23403624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001204009A Expired - Fee Related CN1181716C (zh) | 1999-07-19 | 2000-07-18 | 带锚定焊盘的多层陶瓷衬底及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US6187418B1 (zh) |
JP (1) | JP3401767B2 (zh) |
CN (1) | CN1181716C (zh) |
SG (1) | SG93244A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100435602C (zh) * | 2003-03-20 | 2008-11-19 | Tdk株式会社 | 电子部件的制造方法及电子部件 |
US8242593B2 (en) | 2008-01-27 | 2012-08-14 | International Business Machines Corporation | Clustered stacked vias for reliable electronic substrates |
CN114747301A (zh) * | 2019-11-14 | 2022-07-12 | 株式会社村田制作所 | 电路基板以及电路基板的制造方法 |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7088002B2 (en) * | 2000-12-18 | 2006-08-08 | Intel Corporation | Interconnect |
US6492254B2 (en) * | 2001-01-31 | 2002-12-10 | Bae Systems Information And Electronic Systems Integration, Inc. | Ball grid array (BGA) to column grid array (CGA) conversion process |
US6564986B1 (en) * | 2001-03-08 | 2003-05-20 | Xilinx, Inc. | Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board |
US7189595B2 (en) * | 2001-05-31 | 2007-03-13 | International Business Machines Corporation | Method of manufacture of silicon based package and devices manufactured thereby |
US6878608B2 (en) * | 2001-05-31 | 2005-04-12 | International Business Machines Corporation | Method of manufacture of silicon based package |
JP3998984B2 (ja) * | 2002-01-18 | 2007-10-31 | 富士通株式会社 | 回路基板及びその製造方法 |
JP4291615B2 (ja) * | 2002-05-28 | 2009-07-08 | 株式会社巴川製紙所 | 光学素子ウエハ及びその製造方法、光学素子の製造方法 |
KR100481216B1 (ko) * | 2002-06-07 | 2005-04-08 | 엘지전자 주식회사 | 볼 그리드 어레이 패키지 및 그의 제조 방법 |
US6900395B2 (en) * | 2002-11-26 | 2005-05-31 | International Business Machines Corporation | Enhanced high-frequency via interconnection for improved reliability |
JP4059085B2 (ja) * | 2003-01-14 | 2008-03-12 | 松下電器産業株式会社 | 高周波積層部品およびその製造方法 |
US20050047106A1 (en) * | 2003-08-29 | 2005-03-03 | Martino Peter Miguel | Substrate reinforcing in an LGA package |
KR20030074582A (ko) * | 2003-09-03 | 2003-09-19 | 학교법인 한국정보통신학원 | 초고주파 다층회로 구조 및 제작 방법 |
US20050104374A1 (en) * | 2003-11-17 | 2005-05-19 | Steur Gunnar V.D. | Pull-out resistant compression fitting for fluid lines |
US6987316B2 (en) | 2004-01-14 | 2006-01-17 | International Business Machines Corporation | Multilayer ceramic substrate with single via anchored pad and method of forming |
JP2006013272A (ja) * | 2004-06-29 | 2006-01-12 | Hitachi Ltd | 多層セラミック基板の製造方法 |
DE102004031878B3 (de) * | 2004-07-01 | 2005-10-06 | Epcos Ag | Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt |
JP2006073593A (ja) * | 2004-08-31 | 2006-03-16 | Toshiba Corp | 配線基板とそれを用いた半導体装置 |
US20080136041A1 (en) * | 2006-01-24 | 2008-06-12 | Tessera Interconnect Materials, Inc. | Structure and method of making interconnect element having metal traces embedded in surface of dielectric |
JP4600065B2 (ja) * | 2005-02-03 | 2010-12-15 | 富士電機システムズ株式会社 | 半導体装置及びその製造方法 |
US7387758B2 (en) * | 2005-02-16 | 2008-06-17 | Siemens Power Generation, Inc. | Tabbed ceramic article for improved interlaminar strength |
JP4683269B2 (ja) * | 2005-03-23 | 2011-05-18 | Tdk株式会社 | 多層セラミック基板の製造方法 |
TWI311451B (en) * | 2005-11-30 | 2009-06-21 | Murata Manufacturing Co | Ceramic substrate, electronic device, and manufacturing method of ceramic substrate |
US7648847B2 (en) * | 2006-06-26 | 2010-01-19 | Hamilton Sundstrand Corporation | In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit |
US7573115B2 (en) * | 2006-11-13 | 2009-08-11 | International Business Machines Corporation | Structure and method for enhancing resistance to fracture of bonding pads |
JP2009032992A (ja) * | 2007-07-27 | 2009-02-12 | Kuroda Techno Co Ltd | 多層回路基板 |
TWI434640B (zh) * | 2008-01-30 | 2014-04-11 | Murata Manufacturing Co | Electronic parts and their construction methods |
US8186051B2 (en) * | 2008-03-28 | 2012-05-29 | Intel Corporation | Method for fabricating package substrate and die spacer layers having a ceramic backbone |
JP2010045134A (ja) * | 2008-08-11 | 2010-02-25 | Shinko Electric Ind Co Ltd | 多層配線基板、半導体パッケージ及び製造方法 |
JP5278371B2 (ja) * | 2010-05-17 | 2013-09-04 | 富士電機株式会社 | 半導体装置の製造方法 |
US8759691B2 (en) * | 2010-07-09 | 2014-06-24 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
KR101153492B1 (ko) * | 2010-08-24 | 2012-06-11 | 삼성전기주식회사 | 프로브 카드용 세라믹 기판 제조 방법 및 프로브 카드용 세라믹 기판 |
JP5693940B2 (ja) * | 2010-12-13 | 2015-04-01 | 株式会社トクヤマ | セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法 |
KR20130077477A (ko) * | 2011-12-29 | 2013-07-09 | 삼성전자주식회사 | 파워 반도체 소자 및 그 제조 방법 |
WO2014020975A1 (ja) | 2012-07-31 | 2014-02-06 | 株式会社村田製作所 | 積層基板 |
US20140097002A1 (en) | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
US9758858B2 (en) | 2012-10-05 | 2017-09-12 | Tyco Electronics Corporation | Methods of manufacturing a coated structure on a substrate |
JP6142831B2 (ja) * | 2014-03-27 | 2017-06-07 | ソニー株式会社 | 実装用基板及びその製造方法、並びに、部品実装方法 |
US10291231B2 (en) | 2016-07-20 | 2019-05-14 | Microsoft Technology Licensing, Llc | Superconducting device with dummy elements |
JP2018045212A (ja) | 2016-09-16 | 2018-03-22 | 株式会社フジクラ | 撮像モジュール及びその製造方法 |
EP3322267A1 (en) * | 2016-11-10 | 2018-05-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with adhesion promoting shape of wiring structure |
JP7449076B2 (ja) * | 2019-11-26 | 2024-03-13 | Ngkエレクトロデバイス株式会社 | セラミック配線基板の製造方法 |
EP4099807A1 (en) * | 2021-06-01 | 2022-12-07 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier interconnection and manufacturing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4070518A (en) * | 1976-10-15 | 1978-01-24 | E. I. Du Pont De Nemours And Company | Copper metallizations |
JPH05116985A (ja) * | 1991-05-22 | 1993-05-14 | Ngk Spark Plug Co Ltd | セラミツク基板 |
US5293504A (en) * | 1992-09-23 | 1994-03-08 | International Business Machines Corporation | Multilayer ceramic substrate with capped vias |
JP2783751B2 (ja) | 1993-12-21 | 1998-08-06 | 富士通株式会社 | 多層セラミック基板の製造方法 |
US5552232A (en) * | 1994-12-21 | 1996-09-03 | International Business Machines Corporation | Aluminum nitride body having graded metallurgy |
US6136419A (en) * | 1999-05-26 | 2000-10-24 | International Business Machines Corporation | Ceramic substrate having a sealed layer |
-
1999
- 1999-07-19 US US09/356,944 patent/US6187418B1/en not_active Expired - Lifetime
-
2000
- 2000-07-05 SG SG200003755A patent/SG93244A1/en unknown
- 2000-07-12 JP JP2000210777A patent/JP3401767B2/ja not_active Expired - Fee Related
- 2000-07-18 CN CNB001204009A patent/CN1181716C/zh not_active Expired - Fee Related
- 2000-08-25 US US09/648,862 patent/US6312791B1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100435602C (zh) * | 2003-03-20 | 2008-11-19 | Tdk株式会社 | 电子部件的制造方法及电子部件 |
US8242593B2 (en) | 2008-01-27 | 2012-08-14 | International Business Machines Corporation | Clustered stacked vias for reliable electronic substrates |
US8522430B2 (en) | 2008-01-27 | 2013-09-03 | International Business Macines Corporation | Clustered stacked vias for reliable electronic substrates |
CN114747301A (zh) * | 2019-11-14 | 2022-07-12 | 株式会社村田制作所 | 电路基板以及电路基板的制造方法 |
CN114747301B (zh) * | 2019-11-14 | 2024-06-04 | 株式会社村田制作所 | 电路基板以及电路基板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
SG93244A1 (en) | 2002-12-17 |
US6187418B1 (en) | 2001-02-13 |
JP3401767B2 (ja) | 2003-04-28 |
JP2001068857A (ja) | 2001-03-16 |
US6312791B1 (en) | 2001-11-06 |
CN1181716C (zh) | 2004-12-22 |
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Effective date of registration: 20171120 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171120 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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