CN1252820C - 具有体偏置电路的半导体集成电路器件 - Google Patents
具有体偏置电路的半导体集成电路器件 Download PDFInfo
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- CN1252820C CN1252820C CN03149583.4A CN03149583A CN1252820C CN 1252820 C CN1252820 C CN 1252820C CN 03149583 A CN03149583 A CN 03149583A CN 1252820 C CN1252820 C CN 1252820C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0218—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0727—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/04—Modifications for accelerating switching
- H03K17/041—Modifications for accelerating switching without feedback from the output circuit to the control circuit
- H03K17/04106—Modifications for accelerating switching without feedback from the output circuit to the control circuit in field-effect transistor switches
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/003—Modifications for increasing the reliability for protection
- H03K19/00369—Modifications for compensating variations of temperature, supply voltage or other physical parameters
- H03K19/00384—Modifications for compensating variations of temperature, supply voltage or other physical parameters in field effect transistor circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/01—Modifications for accelerating switching
- H03K19/017—Modifications for accelerating switching in field-effect transistor circuits
- H03K19/01707—Modifications for accelerating switching in field-effect transistor circuits in asynchronous circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/901—MOSFET substrate bias
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP211536/2002 | 2002-07-19 | ||
JP2002211536 | 2002-07-19 | ||
JP19271/2003 | 2003-01-28 | ||
JP2003019271 | 2003-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1476092A CN1476092A (zh) | 2004-02-18 |
CN1252820C true CN1252820C (zh) | 2006-04-19 |
Family
ID=30447654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03149583.4A Expired - Lifetime CN1252820C (zh) | 2002-07-19 | 2003-07-17 | 具有体偏置电路的半导体集成电路器件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6864539B2 (zh) |
CN (1) | CN1252820C (zh) |
FR (1) | FR2842652B1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7205758B1 (en) * | 2004-02-02 | 2007-04-17 | Transmeta Corporation | Systems and methods for adjusting threshold voltage |
EP1617477A4 (en) * | 2003-03-31 | 2008-12-10 | Juridical Foundation Osaka Ind | LATERAL BIPOLAR CMOS INTEGRATED CIRCUIT |
US7816742B1 (en) * | 2004-09-30 | 2010-10-19 | Koniaris Kleanthes G | Systems and methods for integrated circuits comprising multiple body biasing domains |
US7859062B1 (en) | 2004-02-02 | 2010-12-28 | Koniaris Kleanthes G | Systems and methods for integrated circuits comprising multiple body biasing domains |
US20060099567A1 (en) * | 2004-04-08 | 2006-05-11 | Biomatrica, Inc. | Integration of sample storage and sample management for life science |
US7326972B2 (en) * | 2004-06-30 | 2008-02-05 | Intel Corporation | Interconnect structure in integrated circuits |
US7509504B1 (en) | 2004-09-30 | 2009-03-24 | Transmeta Corporation | Systems and methods for control of integrated circuits comprising body biasing systems |
JP2006237388A (ja) * | 2005-02-25 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 半導体集積回路及び半導体集積回路の制御方法及び信号伝送回路 |
US7501880B2 (en) * | 2005-02-28 | 2009-03-10 | International Business Machines Corporation | Body-biased enhanced precision current mirror |
KR101281440B1 (ko) * | 2005-05-13 | 2013-07-02 | 모사이드 테크놀로지스 인코퍼레이티드 | 로직 셀들의 셀 접합부에 의해 형성된 신호 버스를 구비한집적 회로 |
JP5041760B2 (ja) * | 2006-08-08 | 2012-10-03 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
US8558349B2 (en) * | 2006-08-11 | 2013-10-15 | System General Corp. | Integrated circuit for a high-side transistor driver |
JP4968327B2 (ja) * | 2007-03-19 | 2012-07-04 | 富士通株式会社 | インバータ回路 |
JP2008252047A (ja) * | 2007-03-30 | 2008-10-16 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置、半導体集積回路の設計方法及び半導体集積回路設計装置 |
US7605601B2 (en) * | 2007-04-19 | 2009-10-20 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device |
EP2184859A1 (en) * | 2007-08-28 | 2010-05-12 | Panasonic Corporation | D/a converter, differential switch, semiconductor integrated circuit, video device, and communication device |
JP5529450B2 (ja) * | 2009-07-15 | 2014-06-25 | スパンション エルエルシー | ボディバイアス制御回路及びボディバイアス制御方法 |
JP2012195326A (ja) * | 2011-03-14 | 2012-10-11 | Ricoh Co Ltd | 半導体装置 |
WO2012131435A1 (en) * | 2011-03-30 | 2012-10-04 | Freescale Semiconductor, Inc. | Apparatus for forward well bias in a semiconductor integrated circuit |
US9000524B2 (en) | 2011-04-06 | 2015-04-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for modeling multi-terminal MOS device for LVS and PDK |
JP2013069790A (ja) * | 2011-09-21 | 2013-04-18 | Toshiba Corp | 半導体装置 |
US9287253B2 (en) * | 2011-11-04 | 2016-03-15 | Synopsys, Inc. | Method and apparatus for floating or applying voltage to a well of an integrated circuit |
US9772232B2 (en) * | 2014-03-28 | 2017-09-26 | Darryl G. Walker | Semiconductor device having temperature sensor circuit that detects a temperature range upper limit value and a temperature range lower limit value |
US20160071849A1 (en) * | 2014-09-08 | 2016-03-10 | Texas Instruments Incorporated | Mode-Variant Adaptive Body Bias Scheme For Low-Power Semiconductors |
US9559665B2 (en) * | 2015-06-30 | 2017-01-31 | Stmicroelectronics International N.V. | Ultra-low voltage temperature threshold detector |
FR3042891B1 (fr) * | 2015-10-22 | 2018-03-23 | Stmicroelectronics (Rousset) Sas | Puce electronique securisee |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3191653B2 (ja) * | 1996-01-17 | 2001-07-23 | 三菱電機株式会社 | パワーデバイス用半導体スイッチング装置 |
US5689144A (en) * | 1996-05-15 | 1997-11-18 | Siliconix Incorporated | Four-terminal power MOSFET switch having reduced threshold voltage and on-resistance |
WO1998059419A1 (en) * | 1997-06-20 | 1998-12-30 | Intel Corporation | Forward body bias transistor circuits |
JP4109340B2 (ja) * | 1997-12-26 | 2008-07-02 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US6366156B1 (en) * | 1999-11-30 | 2002-04-02 | Intel Corporation | Forward body bias voltage generation systems |
US6515534B2 (en) * | 1999-12-30 | 2003-02-04 | Intel Corporation | Enhanced conductivity body biased PMOS driver |
JP2001345424A (ja) | 2000-05-30 | 2001-12-14 | Hitachi Ltd | 半導体集積回路装置 |
JP3762856B2 (ja) * | 2000-05-30 | 2006-04-05 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US6469572B1 (en) * | 2001-03-28 | 2002-10-22 | Intel Corporation | Forward body bias generation circuits based on diode clamps |
-
2003
- 2003-07-15 US US10/618,710 patent/US6864539B2/en not_active Expired - Lifetime
- 2003-07-17 CN CN03149583.4A patent/CN1252820C/zh not_active Expired - Lifetime
- 2003-07-18 FR FR0308784A patent/FR2842652B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2842652A1 (fr) | 2004-01-23 |
US20040014268A1 (en) | 2004-01-22 |
US6864539B2 (en) | 2005-03-08 |
CN1476092A (zh) | 2004-02-18 |
FR2842652B1 (fr) | 2008-02-08 |
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ASS | Succession or assignment of patent right |
Owner name: RENESAS TECH CORP. Free format text: FORMER OWNER: SEMICONDUCTOR MECHANICS RESEARCH CENTER CO., LTD. Effective date: 20060818 |
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Effective date of registration: 20060818 Address after: Tokyo, Japan Patentee after: Renesas Technology Corp. Address before: Kanagawa Patentee before: SEMICONDUCTOR TECHNOLOGY ACADEMIC RESEARCH CENTER |
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Owner name: NEC CORP. Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP. Effective date: 20140929 |
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CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Renesas Electronics Corp. Address before: Kanagawa Patentee before: NEC electronics Kabushiki Kaisha |
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Effective date of registration: 20140929 Address after: Kanagawa Patentee after: NEC electronics Kabushiki Kaisha Address before: Tokyo, Japan Patentee before: Renesas Technology Corp. |
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Address after: Japan, Tokyo, east of the Yangtze River, three, 2, 24 Patentee after: Renesas Electronics Corp. Address before: Kanagawa Patentee before: Renesas Electronics Corp. |
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