CN1244165C - 有机发光显示器的制作装置及其使用方法 - Google Patents

有机发光显示器的制作装置及其使用方法 Download PDF

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Publication number
CN1244165C
CN1244165C CNB02126547XA CN02126547A CN1244165C CN 1244165 C CN1244165 C CN 1244165C CN B02126547X A CNB02126547X A CN B02126547XA CN 02126547 A CN02126547 A CN 02126547A CN 1244165 C CN1244165 C CN 1244165C
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CN
China
Prior art keywords
planar mask
workbench
stage
glass substrate
move
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Expired - Fee Related
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CNB02126547XA
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English (en)
Chinese (zh)
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CN1426118A (zh
Inventor
裵京彬
吴圭云
崔上和
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SNU Precision Co Ltd
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ANS Inc
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Publication of CN1426118A publication Critical patent/CN1426118A/zh
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Publication of CN1244165C publication Critical patent/CN1244165C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Led Devices (AREA)
CNB02126547XA 2001-12-10 2002-07-23 有机发光显示器的制作装置及其使用方法 Expired - Fee Related CN1244165C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2001-0077739A KR100422487B1 (ko) 2001-12-10 2001-12-10 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법
KRPATENT20010077739 2001-12-10
KR20010077739 2001-12-10

Publications (2)

Publication Number Publication Date
CN1426118A CN1426118A (zh) 2003-06-25
CN1244165C true CN1244165C (zh) 2006-03-01

Family

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Family Applications (1)

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CNB02126547XA Expired - Fee Related CN1244165C (zh) 2001-12-10 2002-07-23 有机发光显示器的制作装置及其使用方法

Country Status (3)

Country Link
JP (1) JP3592689B2 (ko)
KR (1) KR100422487B1 (ko)
CN (1) CN1244165C (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564409B (zh) * 2011-11-30 2017-01-01 康寧公司 光學塗佈方法、設備與產品
US10077207B2 (en) 2011-11-30 2018-09-18 Corning Incorporated Optical coating method, apparatus and product
CN110494585A (zh) * 2017-04-12 2019-11-22 堺显示器制品株式会社 蒸镀装置、蒸镀方法以及有机el显示装置的制造方法
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier

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KR100504484B1 (ko) * 2002-12-07 2005-08-01 엘지전자 주식회사 유기 ｅｌ 디스플레이 소자의 양산용 장치
JP4494832B2 (ja) * 2004-03-11 2010-06-30 株式会社アルバック アライメント装置及び成膜装置
WO2005091683A1 (en) * 2004-03-22 2005-09-29 Doosan Dnd Co., Ltd. Substrate depositing method and organic material depositing apparatus
JP2005332991A (ja) * 2004-05-20 2005-12-02 Univ Nagoya カーボンナノチューブ発光素子
JP4609755B2 (ja) * 2005-02-23 2011-01-12 三井造船株式会社 マスク保持機構および成膜装置
KR100676177B1 (ko) * 2005-03-22 2007-02-01 엘지전자 주식회사 유기전계발광표시소자의 제조장치
JP4609759B2 (ja) * 2005-03-24 2011-01-12 三井造船株式会社 成膜装置
EP1715075B1 (de) 2005-04-20 2008-04-16 Applied Materials GmbH & Co. KG Magnetische Maskenhalterung
DE502005007746D1 (de) * 2005-04-20 2009-09-03 Applied Materials Gmbh & Co Kg Verfahren und Vorrichtung zur Maskenpositionierung
JP4428285B2 (ja) * 2005-05-16 2010-03-10 セイコーエプソン株式会社 マスク保持構造、成膜方法、及び電気光学装置の製造方法
KR100711878B1 (ko) 2005-08-30 2007-04-25 삼성에스디아이 주식회사 레이저 열 전사 장치 및 레이저 열 전사 방법
JP2007062354A (ja) 2005-08-30 2007-03-15 Samsung Sdi Co Ltd レーザ熱転写ドナーフィルム、レーザ熱転写装置、レーザ熱転写法及び有機発光素子の製造方法
US7817175B2 (en) 2005-08-30 2010-10-19 Samsung Mobile Display Co., Ltd. Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same
JP2007128845A (ja) * 2005-11-04 2007-05-24 Samsung Sdi Co Ltd レーザ熱転写装置及びレーザ熱転写方法
JP2007128844A (ja) 2005-11-04 2007-05-24 Samsung Sdi Co Ltd レーザ熱転写装置及びレーザ熱転写方法そしてこれを利用した有機発光表示素子
KR100712953B1 (ko) * 2006-06-16 2007-05-02 두산디앤디 주식회사 기판 얼라인장치 및 이를 이용한 기판얼라인방법
KR101229020B1 (ko) 2006-06-22 2013-02-01 엘지디스플레이 주식회사 쉐도우 마스크의 자성제거 방법 및 그 장치
KR100814847B1 (ko) * 2006-07-31 2008-03-20 삼성에스디아이 주식회사 유기 발광 표시 장치 제조용 증착 장치
KR100770104B1 (ko) * 2006-09-28 2007-10-24 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법과 이를 위한이송 장치
KR100842020B1 (ko) * 2007-03-16 2008-06-27 세메스 주식회사 유기 박막 증착 장치 및 방법
CN102131955A (zh) * 2008-08-25 2011-07-20 应用材料公司 具有可移动屏蔽件的涂布室
KR101108012B1 (ko) * 2009-08-14 2012-01-25 주식회사 아데소 대면적 기판용 기판정렬장치
KR101156433B1 (ko) 2009-12-15 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
KR101084185B1 (ko) 2010-01-12 2011-11-17 삼성모바일디스플레이주식회사 패턴 형성 방법 및 유기 발광 소자의 제조방법
KR101307153B1 (ko) * 2011-06-20 2013-09-17 주식회사 아이.엠.텍 대면적 글라스의 얼라이너 구동장치 및 방법
JP2013093278A (ja) * 2011-10-27 2013-05-16 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置
KR101203171B1 (ko) 2012-05-22 2012-11-21 주식회사 아이.엠.텍 글래스 기판 합착을 위한 얼라인 장치
KR101310336B1 (ko) 2013-03-28 2013-09-23 주식회사 아이.엠.텍 대면적 글라스의 얼라인 구동장치
KR102117088B1 (ko) * 2013-08-09 2020-06-01 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조 장치 및 제조 방법
CN106784394B (zh) * 2013-12-30 2018-10-09 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的***及方法
KR101537967B1 (ko) * 2013-12-30 2015-07-20 주식회사 에스에프에이 기판과 마스크의 어태치 장치 및 방법
CN103981491A (zh) * 2014-04-30 2014-08-13 京东方科技集团股份有限公司 一种蒸镀装置
KR102227479B1 (ko) 2014-09-17 2021-03-15 삼성디스플레이 주식회사 마그넷 플레이트 조립체, 이를 포함하는 증착 장치 및 증착 방법
CN105695937B (zh) * 2014-11-28 2019-06-11 上海和辉光电有限公司 磁性装置、磁力调节装置及其磁力调节方法
KR102314487B1 (ko) 2015-01-21 2021-10-19 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 증착 방법
CN105506548B (zh) * 2016-03-01 2018-05-25 京东方科技集团股份有限公司 一种掩膜板修复装置、修复方法及蒸镀***
US10892415B2 (en) * 2016-03-10 2021-01-12 Hon Hai Precision Industry Co., Ltd. Deposition mask, vapor deposition apparatus, vapor deposition method, and method for manufacturing organic EL display apparatus
KR101888173B1 (ko) * 2016-11-09 2018-08-13 한국알박(주) 자석 구조체 및 이를 구비하는 스퍼터링 장치
KR101983638B1 (ko) * 2017-03-13 2019-05-30 주식회사 아바코 기판 홀딩장치 및 챔버장치
KR101965266B1 (ko) * 2017-08-02 2019-04-03 한국알박(주) 전자석 어셈블리의 제조 방법
JP6302150B1 (ja) * 2017-08-21 2018-03-28 堺ディスプレイプロダクト株式会社 蒸着装置、蒸着方法及び有機ｅｌ表示装置の製造方法
JP6548761B2 (ja) * 2018-02-27 2019-07-24 堺ディスプレイプロダクト株式会社 蒸着装置、蒸着方法及び有機ｅｌ表示装置の製造方法
JP6564088B2 (ja) * 2018-03-01 2019-08-21 堺ディスプレイプロダクト株式会社 蒸着装置、蒸着方法及び有機ｅｌ表示装置の製造方法
KR102591646B1 (ko) * 2018-06-29 2023-10-20 삼성디스플레이 주식회사 증착 장치 및 증착 장치의 마그넷 플레이트 얼라인 방법
JP6738944B2 (ja) * 2019-06-25 2020-08-12 堺ディスプレイプロダクト株式会社 蒸着装置、蒸着方法及び有機ｅｌ表示装置の製造方法
KR102146631B1 (ko) * 2019-08-05 2020-08-28 주식회사 야스 스위칭 마그넷의 자력을 이용한 기판홀딩장치
KR102165032B1 (ko) * 2019-08-09 2020-10-13 주식회사 선익시스템 기판 정렬 장치 및 이를 포함하는 박막 증착 시스템
CN115074663B (zh) * 2022-06-17 2024-02-27 昆山国显光电有限公司 蒸镀装置

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564409B (zh) * 2011-11-30 2017-01-01 康寧公司 光學塗佈方法、設備與產品
US10077207B2 (en) 2011-11-30 2018-09-18 Corning Incorporated Optical coating method, apparatus and product
US11180410B2 (en) 2011-11-30 2021-11-23 Corning Incorporated Optical coating method, apparatus and product
CN110494585A (zh) * 2017-04-12 2019-11-22 堺显示器制品株式会社 蒸镀装置、蒸镀方法以及有机el显示装置的制造方法
CN110494585B (zh) * 2017-04-12 2021-11-16 堺显示器制品株式会社 蒸镀装置、蒸镀方法以及有机el显示装置的制造方法
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11183411B2 (en) 2019-07-26 2021-11-23 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier

Also Published As

Publication number Publication date
KR20030047284A (ko) 2003-06-18
KR100422487B1 (ko) 2004-03-11
JP3592689B2 (ja) 2004-11-24
CN1426118A (zh) 2003-06-25
JP2003187973A (ja) 2003-07-04

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