CN1228816C - 高电压自定位mos元件的集成 - Google Patents
高电压自定位mos元件的集成 Download PDFInfo
- Publication number
- CN1228816C CN1228816C CN01818221.6A CN01818221A CN1228816C CN 1228816 C CN1228816 C CN 1228816C CN 01818221 A CN01818221 A CN 01818221A CN 1228816 C CN1228816 C CN 1228816C
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- CN
- China
- Prior art keywords
- high voltage
- nmos transistor
- voltage nmos
- type doped
- gate regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000010354 integration Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 238000000034 method Methods 0.000 claims abstract description 76
- 238000002347 injection Methods 0.000 claims description 25
- 239000007924 injection Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 24
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 23
- 229920005591 polysilicon Polymers 0.000 claims description 19
- 239000002019 doping agent Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 9
- 229910052796 boron Inorganic materials 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 8
- 238000005468 ion implantation Methods 0.000 abstract description 6
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- 238000004519 manufacturing process Methods 0.000 description 39
- 108091006146 Channels Proteins 0.000 description 32
- 150000002500 ions Chemical class 0.000 description 31
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- 238000005530 etching Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 238000000151 deposition Methods 0.000 description 9
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- 238000009792 diffusion process Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 7
- 229910052681 coesite Inorganic materials 0.000 description 6
- 229910052906 cristobalite Inorganic materials 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 229910052682 stishovite Inorganic materials 0.000 description 6
- 229910052905 tridymite Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
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- 239000010703 silicon Substances 0.000 description 4
- 235000003140 Panax quinquefolius Nutrition 0.000 description 3
- 240000005373 Panax quinquefolius Species 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 108010085603 SFLLRNPND Proteins 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
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- 229910015890 BF2 Inorganic materials 0.000 description 1
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- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- OKZIUSOJQLYFSE-UHFFFAOYSA-N difluoroboron Chemical compound F[B]F OKZIUSOJQLYFSE-UHFFFAOYSA-N 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66681—Lateral DMOS transistors, i.e. LDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823857—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (32)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE00040279 | 2000-11-03 | ||
SE0004027A SE519382C2 (sv) | 2000-11-03 | 2000-11-03 | Integrering av självinriktade MOS-högspänningskomponenter samt halvledarstruktur innefattande sådana |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1471724A CN1471724A (zh) | 2004-01-28 |
CN1228816C true CN1228816C (zh) | 2005-11-23 |
Family
ID=20281691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01818221.6A Expired - Fee Related CN1228816C (zh) | 2000-11-03 | 2001-11-01 | 高电压自定位mos元件的集成 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6686233B2 (zh) |
EP (1) | EP1330837A1 (zh) |
CN (1) | CN1228816C (zh) |
AU (1) | AU2002211190A1 (zh) |
SE (1) | SE519382C2 (zh) |
TW (1) | TW486751B (zh) |
WO (1) | WO2002037547A1 (zh) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4139105B2 (ja) * | 2001-12-20 | 2008-08-27 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US6861341B2 (en) * | 2002-02-22 | 2005-03-01 | Xerox Corporation | Systems and methods for integration of heterogeneous circuit devices |
US6855985B2 (en) * | 2002-09-29 | 2005-02-15 | Advanced Analogic Technologies, Inc. | Modular bipolar-CMOS-DMOS analog integrated circuit & power transistor technology |
SE527082C2 (sv) * | 2003-08-27 | 2005-12-20 | Infineon Technologies Ag | Monolitiskt integrerad effektförstärkaranordning |
SE0302594D0 (sv) * | 2003-09-30 | 2003-09-30 | Infineon Technologies Ag | Vertical DMOS transistor device, integrated circuit, and fabrication method thereof |
SE0303106D0 (sv) * | 2003-11-21 | 2003-11-21 | Infineon Technologies Ag | Ldmos transistor device, integrated circuit, and fabrication method thereof |
SE0303099D0 (sv) * | 2003-11-21 | 2003-11-21 | Infineon Technologies Ag | Method in the fabrication of a monolithically integrated high frequency circuit |
KR100670401B1 (ko) * | 2003-12-27 | 2007-01-16 | 동부일렉트로닉스 주식회사 | 반도체 소자의 게이트 산화막 형성 방법 |
DE102004009521B4 (de) * | 2004-02-27 | 2020-06-10 | Austriamicrosystems Ag | Hochvolt-PMOS-Transistor, Maske zur Herstellung einer Wanne und Verfahren zur Herstellung eines Hochvolt-PMOS-Transistors |
KR100624912B1 (ko) * | 2005-03-22 | 2006-09-19 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자의 제조방법 |
US7329618B2 (en) * | 2005-06-28 | 2008-02-12 | Micron Technology, Inc. | Ion implanting methods |
EP1804285B1 (en) * | 2005-12-27 | 2018-10-24 | Semiconductor Components Industries, LLC | Method for manufacturing a transistor with self-aligned channel |
KR100741882B1 (ko) * | 2005-12-29 | 2007-07-23 | 동부일렉트로닉스 주식회사 | 고전압 소자 및 그 제조방법 |
US7465623B2 (en) * | 2006-08-28 | 2008-12-16 | Advanced Micro Devices, Inc. | Methods for fabricating a semiconductor device on an SOI substrate |
KR100865548B1 (ko) * | 2006-12-28 | 2008-10-28 | 주식회사 하이닉스반도체 | 반도체 메모리장치의 제조방법 |
US7781843B1 (en) * | 2007-01-11 | 2010-08-24 | Hewlett-Packard Development Company, L.P. | Integrating high-voltage CMOS devices with low-voltage CMOS |
KR100836766B1 (ko) * | 2007-01-22 | 2008-06-10 | 삼성전자주식회사 | 고전압 반도체 소자의 제조방법 및 이를 이용한 고전압반도체 소자 |
KR100917813B1 (ko) | 2007-10-05 | 2009-09-18 | 주식회사 동부하이텍 | 반도체 소자 및 이의 제조 방법 |
KR100903483B1 (ko) | 2007-11-26 | 2009-06-18 | 주식회사 동부하이텍 | 반도체 소자의 제조방법 |
JP5283916B2 (ja) * | 2008-02-01 | 2013-09-04 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置の製造方法 |
US20100117153A1 (en) * | 2008-11-07 | 2010-05-13 | Honeywell International Inc. | High voltage soi cmos device and method of manufacture |
CN101752254B (zh) * | 2008-12-22 | 2012-12-19 | 中芯国际集成电路制造(上海)有限公司 | 形成离子注入区的方法、mos晶体管及其制造方法 |
SG183751A1 (en) * | 2009-07-10 | 2012-09-27 | Globalfoundries Sg Pte Ltd | High voltage device |
CN101789432B (zh) * | 2010-01-27 | 2011-11-16 | 崇贸科技股份有限公司 | 高压侧半导体结构 |
US9209098B2 (en) * | 2011-05-19 | 2015-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | HVMOS reliability evaluation using bulk resistances as indices |
CN102683186A (zh) * | 2012-05-09 | 2012-09-19 | 上海宏力半导体制造有限公司 | 抑制热载流子注入的方法及BiCMOS器件制造方法 |
US20140167142A1 (en) | 2012-12-14 | 2014-06-19 | Spansion Llc | Use Disposable Gate Cap to Form Transistors, and Split Gate Charge Trapping Memory Cells |
DE102014017146A1 (de) | 2014-04-14 | 2015-10-15 | Elmos Semiconductor Aktiengesellschaft | Rail-to-Rail-Verpolschutz für den kombinierten Ein-/Ausgang eine integrierten CMOS Schaltkreises auf einem P-Substrat |
DE102015004235B4 (de) | 2014-04-14 | 2019-01-03 | Elmos Semiconductor Ag | Verfahren zum Schutz eines CMOS Schaltkreises auf einem N-Substrat vor Verpolung |
US9412736B2 (en) | 2014-06-05 | 2016-08-09 | Globalfoundries Inc. | Embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias |
US10038063B2 (en) | 2014-06-10 | 2018-07-31 | International Business Machines Corporation | Tunable breakdown voltage RF FET devices |
CN105789267B (zh) * | 2014-12-22 | 2019-04-26 | 旺宏电子股份有限公司 | 半导体元件 |
CN105810583B (zh) * | 2014-12-30 | 2019-03-15 | 无锡华润上华科技有限公司 | 横向绝缘栅双极型晶体管的制造方法 |
US9780250B2 (en) * | 2016-01-14 | 2017-10-03 | Varian Semiconductor Equipment Associates, Inc. | Self-aligned mask for ion implantation |
KR101822016B1 (ko) | 2016-09-13 | 2018-01-26 | 매그나칩반도체 유한회사 | Dmos 트랜지스터 및 cmos 트랜지스터 제조 방법 |
CN107785324A (zh) * | 2017-09-19 | 2018-03-09 | 上海华虹宏力半导体制造有限公司 | 高压工艺集成电路方法 |
CN109786328A (zh) * | 2017-11-10 | 2019-05-21 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
CN109950151B (zh) * | 2017-12-20 | 2022-02-15 | 中芯国际集成电路制造(上海)有限公司 | Pmos晶体管及其形成方法 |
US11228174B1 (en) | 2019-05-30 | 2022-01-18 | Silicet, LLC | Source and drain enabled conduction triggers and immunity tolerance for integrated circuits |
US10892362B1 (en) | 2019-11-06 | 2021-01-12 | Silicet, LLC | Devices for LDMOS and other MOS transistors with hybrid contact |
CN116508135B (zh) | 2020-12-04 | 2024-06-04 | 安普莱西娅有限责任公司 | 具有自对准体和混合源的ldmos |
TWI768654B (zh) * | 2021-01-14 | 2022-06-21 | 世界先進積體電路股份有限公司 | 半導體結構及其形成方法 |
US11742389B2 (en) | 2021-05-18 | 2023-08-29 | Vanguard International Semiconductor Corporation | Semiconductor structure and method for forming the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5061975A (en) * | 1988-02-19 | 1991-10-29 | Mitsubishi Denki Kabushiki Kaisha | MOS type field effect transistor having LDD structure |
US5047358A (en) * | 1989-03-17 | 1991-09-10 | Delco Electronics Corporation | Process for forming high and low voltage CMOS transistors on a single integrated circuit chip |
US5532176A (en) * | 1992-04-17 | 1996-07-02 | Nippondenso Co., Ltd. | Process for fabricating a complementary MIS transistor |
SE506433C2 (sv) | 1994-03-24 | 1997-12-15 | Anders Soederbaerg | Metod för tillverkning av integrerade komponenter |
US5498554A (en) * | 1994-04-08 | 1996-03-12 | Texas Instruments Incorporated | Method of making extended drain resurf lateral DMOS devices |
FR2735904B1 (fr) * | 1995-06-21 | 1997-07-18 | Commissariat Energie Atomique | Procede de realisation d'un semi-conducteur avec une zone fortement dopee situee entre des zones faiblement dopees, pour la fabrication de transistors |
US5817551A (en) * | 1995-08-25 | 1998-10-06 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of manufacturing the same |
JPH10189762A (ja) * | 1996-12-20 | 1998-07-21 | Nec Corp | 半導体装置およびその製造方法 |
US5891782A (en) * | 1997-08-21 | 1999-04-06 | Sharp Microelectronics Technology, Inc. | Method for fabricating an asymmetric channel doped MOS structure |
JP2000077532A (ja) * | 1998-09-03 | 2000-03-14 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
-
2000
- 2000-11-03 SE SE0004027A patent/SE519382C2/sv not_active IP Right Cessation
- 2000-11-18 TW TW089124467A patent/TW486751B/zh not_active IP Right Cessation
-
2001
- 2001-11-01 CN CN01818221.6A patent/CN1228816C/zh not_active Expired - Fee Related
- 2001-11-01 EP EP01979204A patent/EP1330837A1/en not_active Withdrawn
- 2001-11-01 WO PCT/SE2001/002405 patent/WO2002037547A1/en not_active Application Discontinuation
- 2001-11-01 AU AU2002211190A patent/AU2002211190A1/en not_active Abandoned
- 2001-11-02 US US09/985,447 patent/US6686233B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
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WO2002037547A1 (en) | 2002-05-10 |
SE0004027D0 (sv) | 2000-11-03 |
SE0004027L (sv) | 2002-05-04 |
US20020055220A1 (en) | 2002-05-09 |
SE519382C2 (sv) | 2003-02-25 |
TW486751B (en) | 2002-05-11 |
CN1471724A (zh) | 2004-01-28 |
AU2002211190A1 (en) | 2002-05-15 |
US6686233B2 (en) | 2004-02-03 |
EP1330837A1 (en) | 2003-07-30 |
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