CN117941052A - 蒸镀装置 - Google Patents

蒸镀装置 Download PDF

Info

Publication number
CN117941052A
CN117941052A CN202180102311.7A CN202180102311A CN117941052A CN 117941052 A CN117941052 A CN 117941052A CN 202180102311 A CN202180102311 A CN 202180102311A CN 117941052 A CN117941052 A CN 117941052A
Authority
CN
China
Prior art keywords
substrate
mask
touch panel
vapor deposition
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180102311.7A
Other languages
English (en)
Chinese (zh)
Inventor
牛尾修士
藤原圣士
今田裕士
园田通
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Display Technology Corp
Original Assignee
Sharp Display Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Display Technology Corp filed Critical Sharp Display Technology Corp
Publication of CN117941052A publication Critical patent/CN117941052A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
CN202180102311.7A 2021-11-10 2021-11-10 蒸镀装置 Pending CN117941052A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/041307 WO2023084634A1 (ja) 2021-11-10 2021-11-10 蒸着装置

Publications (1)

Publication Number Publication Date
CN117941052A true CN117941052A (zh) 2024-04-26

Family

ID=86335247

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180102311.7A Pending CN117941052A (zh) 2021-11-10 2021-11-10 蒸镀装置

Country Status (3)

Country Link
JP (1) JPWO2023084634A1 (ja)
CN (1) CN117941052A (ja)
WO (1) WO2023084634A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4553124B2 (ja) * 2004-12-16 2010-09-29 株式会社日立ハイテクノロジーズ 真空蒸着方法及びelディスプレイ用パネル
US10892415B2 (en) * 2016-03-10 2021-01-12 Hon Hai Precision Industry Co., Ltd. Deposition mask, vapor deposition apparatus, vapor deposition method, and method for manufacturing organic EL display apparatus
CN113614273B (zh) * 2019-03-25 2023-08-01 夏普株式会社 蒸镀装置以及显示装置的制造方法
KR20210081700A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 성막장치 및 이를 사용하여 전자 디바이스를 제조하는 방법
JP7113861B2 (ja) * 2020-03-13 2022-08-05 キヤノントッキ株式会社 マスク取付装置、成膜装置、マスク取付方法、成膜方法、電子デバイスの製造方法

Also Published As

Publication number Publication date
JPWO2023084634A1 (ja) 2023-05-19
WO2023084634A1 (ja) 2023-05-19

Similar Documents

Publication Publication Date Title
JP4773834B2 (ja) マスク成膜方法およびマスク成膜装置
KR102520693B1 (ko) 유기발광소자의 증착장치
KR102270080B1 (ko) 박막 증착 장치
WO2016199759A1 (ja) 基板保持装置、成膜装置及び基板保持方法
CN207159336U (zh) 一种掩膜板
JPH0312948A (ja) 基板ホルダ
JP2008156686A (ja) マスクおよびマスク蒸着装置
JP2012092395A (ja) 成膜方法及び成膜装置
US9599909B2 (en) Electrostatic chuck cleaner, cleaning method, and exposure apparatus
JP4949172B2 (ja) 光照射装置
JP2006244746A (ja) マスク構造体およびそれを用いた蒸着方法、並びに有機発光素子の製造方法
CN117941052A (zh) 蒸镀装置
JP2011106017A (ja) 押圧装置およびそれを備えた成膜装置、および成膜方法
JP2011047984A (ja) Fpdモジュール実装装置およびその実装方法
CN111020478B (zh) 掩膜板组件及一种蒸镀设备
JPH0831514B2 (ja) 基板の吸着装置
JPH1050810A (ja) 基板の吸着装置及び露光装置
KR102371101B1 (ko) 증착 장치
KR20150098791A (ko) 가압모듈 및 기판 스트레칭 장치
JP2008108596A (ja) マスク蒸着法、およびマスク蒸着装置
JP2018003144A (ja) マスク支持体、成膜装置及び成膜方法
CN108977763B (zh) 有源矩阵有机发光二极管精细荫罩组件及其制造方法
KR101329980B1 (ko) 반데르발스 힘에 기초한 흡착력을 갖는 부재를 구비하는 복합형 척
KR101797992B1 (ko) 기판의 워피지 제거 장치
JP2013058509A (ja) 電子部品実装装置および下受けピンの配置方法ならびに下受けピンの返戻方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination