CN115656775A - Method and device for testing offset voltage of instrument amplifier - Google Patents
Method and device for testing offset voltage of instrument amplifier Download PDFInfo
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- CN115656775A CN115656775A CN202211316132.6A CN202211316132A CN115656775A CN 115656775 A CN115656775 A CN 115656775A CN 202211316132 A CN202211316132 A CN 202211316132A CN 115656775 A CN115656775 A CN 115656775A
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Abstract
The invention discloses a method and a device for testing offset voltage of an instrumentation amplifier, which relate to the technical field of amplifier (or integrated circuit) testing, and the method comprises the following steps: through the standard instrument amplifier and by the instrument amplifier constitution group ligand, the test sets up two total offset voltages of group ligand under the two sets of gains of standard instrument amplifier and by instrument amplifier under test, can realize accurate test instrument amplifier input offset voltage and output offset voltage, the device includes: the device comprises a first condition applying module, a first total offset voltage obtaining module, a second condition applying module, a second total offset voltage obtaining module, a first calculating module, a second calculating module, a third calculating module and an output module. The method and the device can obtain a higher test precision result with lower test resource requirements, and can carry out automatic test.
Description
Technical Field
The invention relates to the technical field of amplifier (or integrated circuit) testing, in particular to a method and a device for testing offset voltage of an instrumentation amplifier.
Background
The offset voltage of the instrument amplifier is divided into input offset voltage and output offset voltage, and is generally realized by a method of approximately replacing the input offset voltage by total offset voltage or a method of solving an equation by measuring two groups of total offset voltages under different gain conditions.
The existing approximate substitution method has low test accuracy and cannot accurately test the input offset voltage and the output offset voltage; the existing method for testing two groups of total offset voltages under different gain conditions has high precision requirement on a testing instrument and is inconvenient for realizing automatic testing.
Disclosure of Invention
The embodiment of the invention provides a method and a device for testing offset voltage of an instrumentation amplifier, wherein the method comprises the following steps:
applying a first matching condition to a group of components comprising the measured instrument amplifier and a standard instrument amplifier of the same type as the measured instrument amplifier, wherein the first matching condition is that the gain value of the measured instrument amplifier is a first numerical value and the gain value of the standard instrument amplifier is a second numerical value; the product of the first value and the second value is a fixed value;
acquiring a first total offset voltage of a standard instrument amplifier and a first total offset voltage of a group ligand under a first group coordination condition;
applying a second assembly condition to the assembly body, wherein the second assembly condition is that the gain value of the amplifier of the instrument to be tested is a second value, and the gain value of the amplifier of the standard instrument is a first value;
acquiring a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the group component under a second group component condition;
determining a first total offset voltage of the measured instrument amplifier under a first configuration condition based on a predetermined offset voltage relational expression of an internal device of the set assembly, a second numerical value, a first total offset voltage of the standard instrument amplifier and a first total offset voltage of the set assembly;
determining a second total offset voltage of the tested instrument amplifier under a second assembly condition based on the offset voltage relational expression, the first numerical value, the second total offset voltage of the standard instrument amplifier and the second total offset voltage of the assembly;
and determining the input offset voltage and the output offset voltage of the instrument amplifier to be tested based on the first total offset voltage and the second total offset voltage.
Optionally, before determining the input offset voltage and the output offset voltage of the instrumentation amplifier under test based on the first total offset voltage and the second total offset voltage, the method includes:
determining a first equation relation between the offset voltage of the amplifier of the instrument to be tested and the first total offset voltage and a second equation relation between the offset voltage of the amplifier of the instrument to be tested and the second total offset voltage by using a predetermined first conversion relation;
the conversion relation is the conversion relation between the total offset voltage of the measured instrument amplifier and the input offset voltage of the measured instrument amplifier, the output offset voltage of the measured instrument amplifier and the gain of the measured instrument amplifier.
Optionally, determining the input offset voltage and the output offset voltage of the instrumentation amplifier to be tested based on the first total offset voltage and the second total offset voltage includes:
and substituting the first total offset voltage and the second total offset voltage into the first equation relation and the second equation relation respectively to obtain the input offset voltage and the output offset voltage of the amplifier of the instrument to be tested.
Optionally, the connection mode of the group ligand is:
the input end of the standard instrument amplifier is the input end of the assembly body, the output end of the standard instrument amplifier is connected with the positive phase input end of the instrument amplifier to be tested, the negative phase input end of the instrument amplifier to be tested is connected with the grounding end, and the output end of the instrument amplifier to be tested is the output end of the assembly body;
the negative power ends of the standard instrument amplifier and the measured instrument amplifier are connected with the positive power end of the first power supply, and the positive power ends of the standard instrument amplifier and the measured instrument amplifier are connected with the negative power end of the first power supply.
Optionally, the set of ligands is disposed in a test circuit, wherein:
the inverting input end of the group member is connected with the first end of the first resistor, the non-inverting input end of the group member is connected with the first end of the second resistor, and the second end of the first resistor and the second end of the second resistor are respectively connected with the grounding end; the output end of the group member is connected with the first end of a third resistor, the second end of the third resistor is connected with the first end of a fourth resistor, and the second end of the fourth resistor is connected with a reference voltage end;
the test circuit also comprises an auxiliary operational amplifier, wherein the positive phase input end of the auxiliary operational amplifier is connected with the second end of the third resistor, the negative phase input end of the auxiliary operational amplifier is connected with the ground terminal, the output end of the auxiliary operational amplifier is connected with the first end of the fifth resistor, and the second end of the fifth resistor is connected with the negative phase input end of the assembly body; the output end of the auxiliary operational amplifier is the output end of the circuit;
the negative power supply end of the auxiliary operational amplifier is connected with the positive power supply end of the second power supply, and the positive power supply end of the auxiliary operational amplifier is connected with the negative power supply end of the second power supply.
The invention also provides a device for testing the offset voltage of the instrumentation amplifier, which comprises:
the first condition applying module is used for applying a first assembly condition to an assembly body comprising a tested instrument amplifier and a standard instrument amplifier of the same type as the tested instrument amplifier, wherein the first assembly condition is that the gain value of the tested instrument amplifier is a first numerical value, and the gain value of the standard instrument amplifier is a second numerical value; the product of the first numerical value and the second numerical value is always a fixed value;
the first total offset voltage acquisition module is used for acquiring a first total offset voltage of the standard instrument amplifier and a first total offset voltage of the group body under a first group configuration condition;
the second condition applying module is used for applying a second assembly condition to the assembly body, wherein the second assembly condition is that the gain value of the tested instrument amplifier is a second numerical value, and the gain value of the standard instrument amplifier is a first numerical value;
the second total offset voltage acquisition module is used for acquiring a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the group body under a second group matching condition;
the first calculation module is used for determining a first total offset voltage of the measured instrument amplifier under a first configuration condition based on a predetermined offset voltage relational expression of an internal device of the configuration body, a second numerical value, a first total offset voltage of the standard instrument amplifier and a first total offset voltage of the configuration body;
the second calculation module is used for determining a second total offset voltage of the measured instrument amplifier under a second assembly condition based on the offset voltage relational expression, the first numerical value, a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the assembly;
and the output module is used for determining the input offset voltage and the output offset voltage of the amplifier of the instrument to be tested based on the first total offset voltage and the second total offset voltage.
Optionally, the apparatus further comprises:
the third calculation module is used for determining a first equation relation between the offset voltage of the instrument amplifier to be tested and the first total offset voltage and a second equation relation between the offset voltage of the instrument amplifier to be tested and the second total offset voltage by utilizing a predetermined first conversion relation;
the conversion relation is the conversion relation between the total offset voltage of the measured instrument amplifier and the input offset voltage of the measured instrument amplifier, the output offset voltage of the measured instrument amplifier and the gain of the measured instrument amplifier.
Optionally, the third calculating module is further configured to:
and substituting the first total offset voltage and the second total offset voltage into the first equation relation and the second equation relation respectively to obtain the input offset voltage and the output offset voltage of the amplifier of the instrument to be tested.
The invention also provides an electronic device, which comprises a processor and a memory, wherein at least one instruction, at least one program, a code set or an instruction set is stored in the memory, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to realize the instrumentation amplifier offset voltage testing method.
The invention also provides a computer readable storage medium, in which at least one instruction, at least one program, a code set, or a set of instructions is stored, and the at least one instruction, the at least one program, the code set, or the set of instructions is loaded and executed by a processor to implement the method for testing the offset voltage of the instrumentation amplifier.
The embodiment of the invention provides a method and a device for testing offset voltage of an instrumentation amplifier, and compared with the prior art, the method and the device have the following beneficial effects:
according to the invention, the standard instrument amplifier and the instrument amplifier to be tested form a combined body, and two total offset voltages of the combined body under two groups of gains of the standard instrument amplifier and the instrument amplifier to be tested are set in the test, so that the accurate input offset voltage and output offset voltage of the instrument amplifier to be tested can be realized.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiment or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art it is also possible to derive other drawings from these drawings without inventive effort.
Fig. 1 is a flowchart of an offset voltage testing method for an instrumentation amplifier according to an embodiment of the present invention;
FIG. 2 is a circuit diagram of a component according to an embodiment of the present invention;
FIG. 3 is a block diagram of a test circuit according to an embodiment of the present invention;
fig. 4 is a block diagram of an apparatus for testing an offset voltage of an instrumentation amplifier according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The present specification provides method steps as described in the examples or flowcharts, but more or fewer steps may be included based on routine or non-invasive labor. In practice, the circuit or server product may execute sequentially or in parallel according to the method shown in the embodiment or the figures (for example, in the context of parallel processors or multi-thread processing).
Fig. 1 is a flow chart of an instrumentation amplifier offset voltage testing method, which includes:
the measured instrument amplifier is an instrument amplifier, the gain range of the instrument amplifier is adjustable, the gain is generally within the range of 1-1000, and the measured instrument amplifier are assembled into a group of components with fixed gain and maximum gain; selecting a tested instrument amplifier with the same model as the tested instrument amplifier, and accurately testing and calibrating the relevant parameters of the total input offset voltage, the output offset voltage, the gain and the like of the tested instrument amplifier; the measured instrument amplifier is an instrument amplifier with the deviation of each index within a specified range, and in a group assembly, the fixed gain of the group assembly is selected to be 1000 times for the convenience of calculation and the accuracy of measurement and calculation. The first assembling condition comprises that the gains of the standard instrument amplifier and the tested instrument amplifier are respectively as follows: g' =1000 and G =1. The maximum value and the minimum value of the gain of the standard instrument amplifier and the gain of the measured instrument amplifier are respectively selected to enable the ratio of the standard instrument amplifier to the gain of the measured instrument amplifier to be maximum or minimum, so that the influence on the calculation precision is minimum, and the offset voltage of the measured instrument amplifier is measured most accurately.
102, acquiring a first total offset voltage of a standard instrument amplifier and a first total offset voltage of a group member under a first group member condition;
the first total offset voltage of the standard instrument amplifier is obtained after calibration, and the first total offset voltage of the group member is obtained through a test circuit. The offset voltage comprises an input offset voltage and an output offset voltage, the input offset voltage refers to the difference of direct current voltages which are required to be applied to two input ends in a differential amplifier or a differential input operational amplifier in order to obtain constant zero voltage output at the output end, the parameter represents the current-stage matching degree of the differential amplifier, and when equal input voltages are applied to the two input ends of the differential amplifier, the differential output voltage is called the output offset voltage; the offset voltage is one of the most important parameters of the operational amplifier, the operational amplifier consists of a plurality of transistors, and two paths of transistors (designed to be consistent) form a first-stage differential input stage; however, the doping process of the transistors varies, which results in different transistor parameters, and under the same conditions, the electrical characteristics displayed are varied, and finally, the offset voltage is generated. The total offset voltage is the sum of all the offset voltages of the instrumentation amplifiers. The total offset voltage is measured by a general test circuit and method, for example, the total offset voltage of a group of amplifiers and a standard instrument amplifier can be measured by the basic principle of a test method of a semiconductor integrated circuit operational (voltage) amplifier.
103, applying a second matching condition to the group matching body, wherein the second matching condition is that the gain value of the tested instrument amplifier is a second numerical value, and the gain value of the standard instrument amplifier is a first numerical value;
the second assembling condition comprises that the gains of the standard instrument amplifier and the measured instrument amplifier are respectively as follows: g' =1 and G =1000, and similarly, the maximum value and the minimum value of the gain of the standard instrument amplifier and the gain of the instrument amplifier to be measured are respectively selected to enable the ratio of the maximum value and the minimum value to be maximum or minimum, so that the influence on the calculation precision is minimum, and the offset voltage of the instrument amplifier to be measured is measured most accurately.
104, acquiring a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the group component under a second group component condition;
under the condition of the same group of ligands, the gains of the standard instrument amplifier and the tested instrument amplifier are adjusted, and a second total offset voltage of a second group of ligands and the standard instrument amplifier is obtained by interchanging the gains of the standard instrument amplifier and the tested instrument amplifier on the group of ligands, wherein the total offset voltage of the standard instrument amplifier is constant and can be checked in relevant parameters after calibration.
the offset voltage relation of the predetermined group ligand internal device is Vos = (VosT-Vos '). G'; vos is the total offset voltage of the instrument amplifier to be detected, vos 'is the total offset voltage of the standard instrument amplifier, vosT is the total offset voltage of the group ligand, and G' is the gain of the standard instrument amplifier; in the offset voltage relation, a second value 1000 of the gain G' of the standard instrument amplifier, a first total offset voltage of the standard instrument amplifier and a first total offset voltage of the assembly are input, and a first total offset voltage Vos1 of the instrument amplifier to be tested under the first assembly condition is output.
and inputting a first value 1 of the gain of the standard instrument amplifier, a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the assembly body by using the same relational expression as the previous step, and outputting a second total offset voltage Vos2 of the instrument amplifier to be tested under the second assembly condition.
And step 107, determining the input offset voltage and the output offset voltage of the amplifier of the instrument to be tested based on the first total offset voltage Vos1 and the second total offset voltage Vos2.
The total offset voltage of a first instrument amplifier to be tested obtained under the condition of a first group of ligands and the total offset voltage of a second instrument amplifier to be tested obtained under the condition of a second group of ligands are substituted into Vos = (VosT-Vos '). Multidot.G' by substituting the total offset voltage of the first instrument amplifier to be tested, the total offset voltage of the second instrument amplifier to be tested and the gains of two related standard instrument amplifiers, so that the input offset voltage is equal to the second total offset voltage of the group ligands, and the output offset voltage is equal to the second total offset voltage of the group ligands minus the first total offset voltage. Therefore, the accurate input offset voltage and output offset voltage of the measuring instrument amplifier can be obtained by reasonably setting the gain parameters of the group ligand.
In summary, the invention uses the standard instrumentation amplifier and the instrumentation amplifier to be tested to form a combined body, and two total offset voltages of the combined body under two groups of gains of the standard instrumentation amplifier and the instrumentation amplifier to be tested are set in the test, so that the accurate input offset voltage and output offset voltage of the instrumentation amplifier can be realized.
In a possible implementation, before determining the input offset voltage and the output offset voltage of the instrumentation amplifier under test based on the first total offset voltage and the second total offset voltage, the method further includes:
step 201, determining a first equation relationship between the offset voltage of the instrumentation amplifier to be tested and the first total offset voltage, and a second equation relationship between the offset voltage of the instrumentation amplifier to be tested and the second total offset voltage by using a predetermined first conversion equation;
taking the offset voltage of the measured instrument amplifier as an unknown parameter, taking the gain G =1 of the measured instrument amplifier under the first configuration condition and the first total offset voltage Vos1 corresponding to the gain of the standard instrument amplifier under the first configuration condition as a first set of known quantity of a relational expression, and taking the gain G =1000 of the measured instrument amplifier under the second configuration condition and the second total offset voltage Vos2 corresponding to the gain of the standard instrument amplifier under the second configuration condition as a second set of known quantity of the relational expression.
Step 202, converting the relation between the total offset voltage of the amplifier of the meter to be tested and the input offset voltage, the output offset voltage and the gain of the amplifier of the meter to be tested.
The conversion relation includes: vos = VosI + Voso/G;
VosI represents the input offset voltage of the instrument amplifier to be tested, voso represents the output offset voltage value of the instrument amplifier to be tested, and G represents the gain of the instrument amplifier to be tested.
In one possible embodiment, determining the input offset voltage and the output offset voltage of the instrument amplifier to be tested based on the first total offset voltage and the second total offset voltage comprises:
step 301, substituting the first total offset voltage and the second total offset voltage into the first equation relation and the second equation relation respectively to obtain the input offset voltage and the output offset voltage of the measured instrument amplifier.
The values of VosI and Voso are obtained from two sets of known quantities, vos1 and Vos2, two unknowns, vosI and Voso, and the transform relationship.
Specifically, vosI =1000/999 × Vos1-Vos2/999 ≈ 1.001 × Vos1-0.001 × Vos2;
Voso＝1000/999*(Vos2-Vos1)≈1.001*(Vos2-Vos1)。
in summary, the input offset voltage and the output offset voltage of the measured instrument amplifier can be obtained by obtaining the first total offset voltage and the second total offset voltage, and the first total offset voltage and the second total offset voltage can be obtained by measuring the total offset voltage Vos 'of the standard instrument amplifier, the group total offset voltage VosT, the gain G' of the standard instrument amplifier and the relation Vos = (VosT-Vos ') = (G'), so that the accurate input offset voltage and output offset voltage of the measured instrument amplifier can be obtained by the above steps.
In one possible embodiment, the group ligands are linked by:
the input end of the standard instrument amplifier is the input end of the assembly body, the output end of the standard instrument amplifier is connected with the positive phase input end of the instrument amplifier to be tested, the negative phase input end of the instrument amplifier to be tested is connected with the grounding end, and the output end of the instrument amplifier to be tested is the output end of the assembly body;
the negative power ends of the standard instrument amplifier and the measured instrument amplifier are connected with the positive power end of the first power supply, and the positive power ends of the standard instrument amplifier and the measured instrument amplifier are connected with the negative power end of the first power supply.
Specifically, fig. 2 is a circuit structure diagram of a set of ligands according to an embodiment of the present invention.
As shown in fig. 2, in the embodiment provided by the present invention, the input end of the assembly body 300 is the input end of the standard instrumentation amplifier 100, the output end of the standard instrumentation amplifier 100 is connected with the homodromous input end of the instrumentation amplifier 200 to be tested, the output end of the instrumentation amplifier 200 to be tested is used as the output end of the assembly body 300, the reverse input end of the instrumentation amplifier 200 to be tested is grounded, the negative power end of the assembly body 300 is connected with the common positive power connection end of the standard instrumentation amplifier 100 and the instrumentation amplifier 200 to be tested, and the positive power end of the assembly body is connected with the common negative power connection end of the standard instrumentation amplifier 100 and the instrumentation amplifier 200 to be tested.
In summary, the present invention combines the tested device and the standard instrumentation amplifier of the same model into a set of parts, and simplifies the complex test program into a general test program.
In a possible implementation manner, the set of ligands is disposed in the test circuit, the inverting input terminal of the set of ligands is connected to the first end of the first resistor, the non-inverting input terminal of the set of ligands is connected to the first end of the second resistor, and the second end of the first resistor and the second end of the second resistor are respectively connected to the ground terminal; the output end of the group member is connected with the first end of a third resistor, the second end of the third resistor is connected with the first end of a fourth resistor, and the second end of the fourth resistor is connected with a reference voltage end;
the circuit also comprises an auxiliary operational amplifier, wherein the positive phase input end of the auxiliary operational amplifier is connected with the second end of the third resistor, the negative phase input end of the auxiliary operational amplifier is connected with the ground terminal, the output end of the auxiliary operational amplifier is connected with the first end of the fifth resistor, and the second end of the fifth resistor is connected with the negative phase input end of the assembly body; the output end of the auxiliary operational amplifier is the output end of the circuit;
the negative power supply end of the auxiliary operational amplifier is connected with the positive power supply end of the second power supply, and the positive power supply end of the auxiliary operational amplifier is connected with the negative power supply end of the second power supply.
Fig. 3 is a structural diagram of a test circuit according to an embodiment of the present invention.
Specifically, as shown in fig. 3, in the embodiment of the present invention, the same-direction input end and the reverse-direction input end of the group member 300 are connected in series with the first resistor R1 and the second resistor R2, respectively, and then grounded; the output end of the assembly body 300 is connected with the non-inverting input end of the auxiliary operational amplifier 400 after being connected with the third resistor R3 in series; connecting the non-inverting input end of the auxiliary operational amplifier 400 with a fourth resistor R4, wherein the other end of the fourth resistor R4 is connected with a reference point; grounding the inverting input terminal of the auxiliary operational amplifier 400; the output terminal of the auxiliary operational amplifier 400 is connected to the inverting input terminal of the group member 300 through a fourth resistor RF; wherein R is 1 ＝R 2 . The output terminal of the auxiliary operational amplifier 400 is the output terminal of the test circuit, and the voltage of the output terminal is V L The negative power supply terminal of the auxiliary operational amplifier 400 is connected to the positive power supply terminal of the power supply, and the positive power supply terminal of the auxiliary operational amplifier 400 is connected to the negative power supply terminal of the power supply, as can be known from the basic principle of the test method of the operational (voltage) amplifier of the semiconductor integrated circuit,
where vos is the total offset voltage of the panel 300.
In conclusion, the offset voltage of the instrumentation amplifier is tested by using the universal test system and the universal test method, and the method is simple and easy to realize.
Fig. 4 is a block diagram of an apparatus for testing an offset voltage of an instrumentation amplifier according to an embodiment of the present invention. As shown in fig. 4, the apparatus 500 includes:
a first condition applying module 501, configured to apply a first configuration condition to a configuration body including a measured instrument amplifier and a standard instrument amplifier of the same type as the measured instrument amplifier, where the first configuration condition is that a gain value of the measured instrument amplifier is a first value, and a gain value of the standard instrument amplifier is a second value; the product of the first numerical value and the second numerical value is always a fixed value;
a first total offset voltage obtaining module 502, configured to obtain a first total offset voltage of the standard instrumentation amplifier and a first total offset voltage of the set of components under the first set of components;
a second condition applying module 503, for applying a second assembly condition to the assembly, where the second assembly condition is that the gain value of the instrumentation amplifier under test is the second value, and the gain value of the standard instrumentation amplifier is the first value;
a second total offset voltage obtaining module 504, configured to obtain, under the second configuration condition, a second total offset voltage of the standard instrumentation amplifier and a second total offset voltage of the set of components;
a first calculating module 505, configured to determine a first total offset voltage of the instrumentation amplifier under the first configuration condition based on a predetermined offset voltage relation of internal devices of the set of components, the second numerical value, a first total offset voltage of the standard instrumentation amplifier, and a first total offset voltage of the set of components;
a second calculating module 506, configured to determine a second total offset voltage of the instrumentation amplifier under the second configuration condition based on the offset voltage relation, the first value, a second total offset voltage of the standard instrumentation amplifier, and a second total offset voltage of the set of components;
an output module 508, configured to determine an input offset voltage and an output offset voltage of the amplifier of the meter under test based on the first total offset voltage and the second total offset voltage.
In one possible embodiment, the apparatus further comprises:
a third calculating module 507, which determines a first equation relationship between the offset voltage of the instrumentation amplifier under test and the first total offset voltage, and a second equation relationship between the offset voltage of the instrumentation amplifier under test and the second total offset voltage, by using a predetermined first conversion equation;
the conversion relation is the conversion relation among the total offset voltage of the tested instrument amplifier, the input offset voltage of the tested instrument amplifier, the output offset voltage of the tested instrument amplifier and the gain of the tested instrument amplifier.
In a possible implementation, the third calculation module 507 is further configured to:
and substituting the first total offset voltage and the second total offset voltage into the first equation relation and the second equation relation respectively to obtain the input offset voltage and the output offset voltage of the amplifier of the instrument to be tested.
In a possible embodiment provided by the present invention, an apparatus is further provided, which includes a processor and a memory, where at least one instruction, at least one program, a set of codes, or a set of instructions is stored, and the at least one instruction, the at least one program, the set of codes, or the set of instructions is loaded and executed by the processor to implement the method for processing point cloud data in the embodiment of the present invention.
In a possible embodiment provided by the present invention, a computer-readable storage medium is further provided, in which at least one instruction, at least one program, a code set, or a set of instructions is stored, and the at least one instruction, the at least one program, the code set, or the set of instructions is loaded and executed by a processor to implement the method for visualizing point cloud data in the embodiment of the present invention.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, it may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the invention to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that incorporates one or more of the available media. The usable medium may be a magnetic medium (e.g., floppy Disk, hard Disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid State Disk (SSD)), among others.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the circuit embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. An instrumentation amplifier offset voltage testing method, the method comprising:
applying a first matching condition to a matching body comprising a measured instrument amplifier and a standard instrument amplifier of the same type as the measured instrument amplifier, wherein the first matching condition is that the gain value of the measured instrument amplifier is a first numerical value, and the gain value of the standard instrument amplifier is a second numerical value; the product of the first numerical value and the second numerical value is a fixed value;
acquiring a first total offset voltage of the standard instrument amplifier and a first total offset voltage of the set of ligands under the first configuration condition;
applying a second assembly condition to the assembly, the second assembly condition being that the gain value of the instrumentation amplifier under test is the second value and the gain value of the standard instrumentation amplifier is the first value;
acquiring a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the set of components under the second set of components;
determining a first total offset voltage of the instrument amplifier to be tested under the first configuration condition based on a predetermined offset voltage relation of an internal device of the set of components, the second numerical value, a first total offset voltage of the standard instrument amplifier and a first total offset voltage of the set of components;
determining a second total offset voltage of the measured instrument amplifier under the second assembly condition based on the offset voltage relation, the first numerical value, a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the assembly;
and determining the input offset voltage and the output offset voltage of the instrument amplifier to be tested based on the first total offset voltage and the second total offset voltage.
2. The method of claim 1, prior to determining the input and output offset voltages of the instrumentation amplifier under test based on the first and second total offset voltages, comprising:
determining a first equation relation between the offset voltage of the instrument amplifier to be tested and the first total offset voltage and a second equation relation between the offset voltage of the instrument amplifier to be tested and the second total offset voltage by using a predetermined first conversion relation;
the conversion relation is the conversion relation among the total offset voltage of the tested instrument amplifier, the input offset voltage of the tested instrument amplifier, the output offset voltage of the tested instrument amplifier and the gain of the tested instrument amplifier.
3. The method of claim 2, wherein determining the input offset voltage and the output offset voltage of the instrumentation amplifier under test based on the first total offset voltage and the second total offset voltage comprises:
and substituting the first total offset voltage and the second total offset voltage into the first equation relation and the second equation relation respectively to obtain the input offset voltage and the output offset voltage of the measured instrument amplifier.
4. The method of claim 1, wherein the set of ligands are attached in a manner such that:
the input end of the standard instrument amplifier is the input end of the assembly body, the output end of the standard instrument amplifier is connected with the positive phase input end of the instrument amplifier to be tested, the negative phase input end of the instrument amplifier to be tested is connected with the grounding end, and the output end of the instrument amplifier to be tested is the output end of the assembly body;
the negative power ends of the standard instrument amplifier and the measured instrument amplifier are connected with the positive power end of a first power supply, and the positive power ends of the standard instrument amplifier and the measured instrument amplifier are connected with the negative power end of the first power supply.
5. The method of any of claims 1-4, wherein the set of ligands are disposed in a test circuit in which:
the inverting input end of the group member is connected with the first end of a first resistor, the non-inverting input end of the group member is connected with the first end of a second resistor, and the second end of the first resistor and the second end of the second resistor are respectively connected with a grounding end; the output end of the group of the components is connected with the first end of a third resistor, the second end of the third resistor is connected with the first end of a fourth resistor, and the second end of the fourth resistor is connected with a reference voltage end;
the test circuit also comprises an auxiliary operational amplifier, wherein the positive phase input end of the auxiliary operational amplifier is connected with the second end of the third resistor, the negative phase input end of the auxiliary operational amplifier is connected with the ground terminal, the output end of the auxiliary operational amplifier is connected with the first end of a fifth resistor, and the second end of the fifth resistor is connected with the negative phase input end of the group member; the output end of the auxiliary operational amplifier is the output end of the circuit;
the negative power supply end of the auxiliary operational amplifier is connected with the positive power supply end of a second power supply, and the positive power supply end of the auxiliary operational amplifier is connected with the negative power supply end of the second power supply.
6. An instrumentation amplifier offset voltage test device, the device comprising:
the device comprises a first condition applying module, a second condition applying module and a third condition applying module, wherein the first condition applying module is used for applying a first assembly condition to an assembly comprising a tested instrument amplifier and a standard instrument amplifier of the same type as the tested instrument amplifier, the first assembly condition is that the gain value of the tested instrument amplifier is a first value, and the gain value of the standard instrument amplifier is a second value; the product of the first numerical value and the second numerical value is always a fixed value;
a first total offset voltage obtaining module, configured to obtain, under the first configuration condition, a first total offset voltage of the standard instrumentation amplifier and a first total offset voltage of the set of components;
a second condition applying module for applying a second assembly condition to the assembly, wherein the second assembly condition is that the gain value of the tested instrument amplifier is the second value, and the gain value of the standard instrument amplifier is the first value;
a second total offset voltage obtaining module, configured to obtain, under the second configuration condition, a second total offset voltage of the standard instrument amplifier and a second total offset voltage of the set of components;
the first calculation module is used for determining a first total offset voltage of the tested instrument amplifier under the first matching condition based on a predetermined offset voltage relational expression of an internal device of a matching body, the second numerical value, a first total offset voltage of the standard instrument amplifier and the first total offset voltage of the matching body;
a second calculation module, configured to determine a second total offset voltage of the instrumentation amplifier under the second configuration condition based on the offset voltage relation, the first value, a second total offset voltage of the standard instrumentation amplifier, and a second total offset voltage of the set of components;
and the output module is used for determining the input offset voltage and the output offset voltage of the instrument amplifier to be tested based on the first total offset voltage and the second total offset voltage.
7. The apparatus of claim 6, further comprising:
the third calculation module is used for determining a first equation relation between the offset voltage of the amplifier of the instrument to be tested and the first total offset voltage and a second equation relation between the offset voltage of the amplifier of the instrument to be tested and the second total offset voltage by utilizing a predetermined first conversion relation;
the conversion relation is the conversion relation among the total offset voltage of the amplifier of the instrument to be tested, the input offset voltage of the amplifier of the instrument to be tested, the output offset voltage of the amplifier of the instrument to be tested and the gain of the amplifier of the instrument to be tested.
8. The apparatus of claim 7, wherein the third computing module is further configured to:
and substituting the first total offset voltage and the second total offset voltage into the first equation relation and the second equation relation respectively to obtain the input offset voltage and the output offset voltage of the measured instrument amplifier.
9. An electronic device comprising a processor and a memory, the memory having stored therein at least one instruction, at least one program, a set of codes, or a set of instructions, the at least one instruction, the at least one program, the set of codes, or the set of instructions being loaded and executed by the processor to implement the instrumentation amplifier offset voltage testing method according to any one of claims 1 to 5.
10. A computer readable storage medium having stored therein at least one instruction, at least one program, a set of codes, or a set of instructions, which is loaded and executed by a processor to implement the instrumentation amplifier offset voltage test method according to any one of claims 1 to 5.
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| CN202211316132.6A CN115656775A (en) | 2022-10-26 | 2022-10-26 | Method and device for testing offset voltage of instrument amplifier |
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| CN202211316132.6A CN115656775A (en) | 2022-10-26 | 2022-10-26 | Method and device for testing offset voltage of instrument amplifier |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116577597A (en) * | 2023-07-14 | 2023-08-11 | 深圳市爱普特微电子有限公司 | Method and system for testing offset voltage of high-precision comparator |
| CN117214661A (en) * | 2023-09-11 | 2023-12-12 | 无锡市晶源微电子股份有限公司 | Input offset voltage testing device for operational amplifier |
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2022
- 2022-10-26 CN CN202211316132.6A patent/CN115656775A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116577597A (en) * | 2023-07-14 | 2023-08-11 | 深圳市爱普特微电子有限公司 | Method and system for testing offset voltage of high-precision comparator |
| CN116577597B (en) * | 2023-07-14 | 2023-11-21 | 深圳市爱普特微电子有限公司 | Method and system for testing offset voltage of high-precision comparator |
| CN117214661A (en) * | 2023-09-11 | 2023-12-12 | 无锡市晶源微电子股份有限公司 | Input offset voltage testing device for operational amplifier |
| CN117214661B (en) * | 2023-09-11 | 2024-04-19 | 无锡市晶源微电子股份有限公司 | Input offset voltage testing device for operational amplifier |
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