CN115527956A - Cavity packaging structure and packaging method - Google Patents
Cavity packaging structure and packaging method Download PDFInfo
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- CN115527956A CN115527956A CN202211479667.5A CN202211479667A CN115527956A CN 115527956 A CN115527956 A CN 115527956A CN 202211479667 A CN202211479667 A CN 202211479667A CN 115527956 A CN115527956 A CN 115527956A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011800 void material Substances 0.000 claims description 2
- 230000001965 increasing effect Effects 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 230000009545 invasion Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a cavity packaging structure and a packaging method, wherein the cavity packaging structure comprises: the packaging frame comprises a base island and a pin area positioned on the periphery of the base island, wherein the pin area is provided with a first connecting part; the side, facing the packaging frame, of the upper cover comprises a second connecting part, and a gap is formed between the second connecting part and the first connecting part; the fixing glue is filled in the gap, so that a closed cavity is formed between the packaging frame and the upper cover; wherein one of the first and second connection portions includes a first protrusion and at least one second protrusion extending from the first protrusion. The fixing glue is filled between the first connecting portion and the second connecting portion and used for increasing the bonding strength between the upper cover and the packaging frame, prolonging the water vapor invasion path and improving the air tightness of the sealed cavity.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a cavity packaging structure and a packaging method.
Background
The cavity type packaging structure product has better radio frequency performance and lower dielectric constant, and has good application in RF chips (radio frequency chips), microwave chips and millimeter wave chips. In consideration of meeting the requirement of high rf performance of the high power rf chip, a Flat Package frame, such as QFN (Quad Flat No-lead Package), is usually formed by pre-molding, and then a top cover is attached to the Flat Package frame to form a sealed cavity.
As shown in fig. 1, the flat pre-encapsulation frame 1 and the cavity-type upper cover 2 are fixedly connected by an adhesive 3, and a closed cavity 4 is formed between the flat pre-encapsulation frame 1 and the cavity-type upper cover 2. The pre-encapsulation frame 1 is a flat package frame formed by pre-encapsulating the base island and the peripheral pins with a pre-encapsulation material before packaging. Before connecting the cavity type upper cover 2, the method further comprises the steps of mounting a chip 5 on the base island of the flat pre-encapsulation frame 1 and connecting the chip 5 and the peripheral pins of the flat pre-encapsulation frame 1 through metal wires 6 in a wire bonding mode.
Because the upper cover 2 and the packaging frame 1 are fixedly connected only through the adhesive 3, the airtightness of the sealed cavity 4 is very easy to be insufficient due to the curing effect of the adhesive 3, the assembling precision of the upper cover 2 and the packaging frame 1 and other factors, and the performance and the service life of the product are reduced due to the fact that external water vapor invades the sealed cavity 4.
In view of the above, a need exists for redesigning a cavity package structure, which overcomes the problem of insufficient air tightness of the sealed cavity between the top cover and the package frame in the conventional cavity package structure.
Disclosure of Invention
The invention solves the problem of how to improve the problem of insufficient air tightness of a closed cavity between an upper cover and a packaging frame in the existing cavity type packaging structure.
In order to solve the above problems, a technical solution of the present invention provides a cavity package structure, including: the packaging frame comprises a base island and a pin area positioned on the periphery of the base island, wherein the pin area is provided with a first connecting part; the upper cover comprises a second connecting part on one side facing the packaging frame, and a gap is formed between the second connecting part and the first connecting part; the fixing glue is filled in the gap, so that a closed cavity is formed between the packaging frame and the upper cover; wherein one of the first connection portion and the second connection portion includes a first protrusion and at least one second protrusion extending from the first protrusion.
As an optional technical solution, the other of the first connecting portion and the second connecting portion is a slot, and the first protrusion and the at least one second protrusion are both received in the slot; wherein the void is located between a wall of the slot and a surface of the first projection and a surface of the second projection.
As an optional technical solution, the first protrusion and the at least one second protrusion are metal protrusions disposed above the lead area; the upper cover comprises a side wall extending towards the packaging frame, and the slot is formed in the end face of the side wall.
As an optional technical solution, the first protrusion is an annular protrusion surrounding the base island; the slot is an annular groove surrounding the base island.
As an optional technical solution, each second protrusion and the first protrusion are arranged at an included angle, and the included angle is between 0 and 180 degrees.
As an optional technical solution, the number of the at least one second protrusion is two or more, and the second protrusions are disposed on both the surface of the first protrusion close to the side of the sealed cavity and the surface far away from the side of the sealed cavity.
Alternatively, two or more of the second protrusions and the first protrusions may be formed in a fishbone shape.
As an optional technical scheme, a chip or a component is arranged on the base island, and pins of the pin area are electrically connected with the chip or the component; wherein the chip or the component is located in the closed cavity.
The invention also provides a packaging method, which comprises the following steps:
providing a packaging frame, wherein the packaging frame comprises a base island and a pin area positioned at the periphery of the base island, and a first connecting part is manufactured in the pin area;
providing an upper cover, and manufacturing a second connecting part on one side of the upper cover facing the packaging frame;
coating fixing glue on the second connecting part;
fixing the upper cover to one side of the packaging frame, and thermally curing the fixing glue, wherein the fixing glue is filled in a gap between the first connecting part and the second connecting part, so that a closed cavity is formed between the packaging frame and the upper cover;
wherein one of the first and second connection portions includes a first protrusion and at least one second protrusion extending from the first protrusion; the other of the first connecting part and the second connecting part is a slot.
In a preferred embodiment, the step of forming the first connection portion in the lead area includes:
stamping the pin area to form a protrusion;
the first protrusion and the second protrusion are obtained by punching or cutting or etching the protrusion.
Compared with the prior art, the invention provides a cavity packaging structure and a packaging method thereof, the cavity packaging structure forms a first connecting part and a second connecting part which are mutually matched between a packaging frame and an upper cover, fixing glue is filled in a gap between the first connecting part and the second connecting part, one of the first connecting part and the second connecting part is designed to comprise two integral protrusions, namely, the second protrusion extending from the first protrusion can effectively increase the contact area with the fixing glue, the fixing glue is restrained in the gap, the bonding strength between the upper cover and the packaging frame is enhanced, the water vapor invasion path is prolonged, and the air tightness of the cavity packaging structure is obviously improved.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a side view of a conventional cavity package structure.
Fig. 2 is a side view of a cavity package structure according to an embodiment of the invention.
Fig. 3 is a side view of a process of fabricating the first connection portion of fig. 2.
Fig. 4 is a side view of another process of fabricating the first connection portion in fig. 2.
Fig. 5 is a schematic side view of another process for manufacturing the first connection portion in fig. 2.
Fig. 6 is a schematic side view illustrating a process of manufacturing the hollow package structure of fig. 2.
Fig. 7 is a flowchart of a packaging method according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The invention aims to provide a cavity packaging structure and a packaging method thereof, which are used for solving the problem that the air tightness of a sealed cavity between an upper cover and a packaging frame is insufficient because the upper cover and the packaging frame are fixed only by adhesive in the conventional cavity packaging structure. In order to overcome the problems, the invention adds the first connecting part and the second connecting part which are mutually matched at the joint of the upper cover and the packaging frame of the existing cavity type packaging structure, and fills the viscose into the gap between the first connecting part and the second connecting part, on one hand, the bonding strength of the viscose at the joint of the upper cover and the packaging frame is increased, and the path of water vapor invasion is prolonged; on the other hand, the first connecting portion and the second connecting portion of looks adaptation also make the counterpoint assembly between upper cover and the encapsulation frame more accurate, are difficult for appearing the dislocation, avoid because of the gas tightness that the assembly precision leads to unusually not enough.
As shown in fig. 2 and fig. 6, in an embodiment of the present invention, a cavity package structure 100 is provided, which includes a package frame 10, an upper cover 20, and a fixing glue 30, where the package frame 10 includes a base island 11 and a lead area 12 on the periphery of the base island 11, and the lead area 12 is provided with a first connection portion; the upper cover 20 includes a second connection portion on a side facing the package frame 10, and a gap 70 is formed between the second connection portion and the first connection portion; the fixing glue 30 is filled in the gap 70, so that a closed cavity 40 is formed between the package frame 10 and the upper cover 20; wherein the first connection portion includes a first protrusion 121 and two second protrusions 122 protruding from the first protrusion 121.
The second connecting portion is a slot 21 provided on the upper cover 20 corresponding to the first connecting portion, wherein after the upper cover 20 and the package frame 10 are assembled, the first protrusion 121 and the second protrusion 122 are jointly received in the slot 21, the slot wall 211 of the slot 21 is not in contact with the first protrusion 121, and the gap 70 is located between the slot wall 211 and the surface of the first protrusion 121. The fixing glue 30 is filled in the gap 70, and the fixing glue 30 completely covers the groove wall 211 and covers the surface of the first protrusion 121 and the surface of the second protrusion 122.
Further, the groove wall 211 is not in contact with an area opposite to the top of the first protrusion 121 to ensure that the potting adhesive 30 is completely filled between the first protrusion 121 and the insertion groove 21, ensuring airtightness of the hermetic cavity 40.
It should be noted that, in other embodiments of the present invention, the first connection portion may also be a slot formed in the pin area; the second connecting portion may be a protrusion structure formed on the upper cover and including a first protrusion and a second protrusion. That is, the first connection portion and the second connection portion are adapted to each other, preferably, in a male-female type fitting, wherein one of the first connection portion and the second connection portion includes a first protrusion and a second protrusion extending from the first protrusion, and the other of the first connection portion and the second connection portion includes an insertion groove; the slot provides a space for receiving the first protruding part and the second protruding part, and is not in contact with the first protruding part, a gap for filling fixing glue is formed, the adhesion area of the fixing glue between the slot and the first protruding part and between the fixing glue and the second protruding part is increased, the bonding strength of the upper cover and the packaging frame is increased, and the air tightness of the sealed cavity is improved.
With continued reference to fig. 2 and 6, the first and second tabs 121, 122 are, for example, metal tabs disposed above the pin field 12, and the metal tabs are formed for pins of the stamped pin field 12; the insertion groove 21 is, for example, a groove provided on an end surface of a side wall 22 of the upper cover 20 protruding toward the package frame 10.
With reference to fig. 2 and 3, in an embodiment of the present invention, the first protrusion 121 and the second protrusion 122 are formed, for example, by stamping the protrusion 12 'on the lead area 12 of the package frame 10, and stamping or cutting the edge of the protrusion 12' downwards by using a tool 101 including a first tip to form a first branch 122', wherein the first branch 122' extends obliquely upwards and forms an acute angle with the first protrusion 121; further pressing down the first branch 122' with another tool 201 including a flat end to form a second branch 122 ", the second branch 122" extending horizontally and having an angle with the first protrusion 121, such as a right angle; the second branch 122 "is further pressed downwards by the tool 301 comprising the second tip, and the second branch 122" is further bent downwards to form a second protrusion 122, wherein the second protrusion 122 extends obliquely downwards and forms an obtuse angle with the first protrusion 121, for example.
In the embodiment, the first protrusion 121 and the second protrusion 122 are formed by stamping the protrusion 12' with different tools, so that the problem of breaking the first branch 122' and the second branch 122 ″ of the protrusion 12' during stamping can be effectively avoided, and the yield of the manufacturing process can be improved.
On the basis of this embodiment, a third protrusion may be formed by pressing the first protrusion 121 again with a different tool in a separate step, the third protrusion being located above the second protrusion and extending obliquely downward, and the angle between the third protrusion and the first protrusion 121 being, for example, an obtuse angle.
As shown in fig. 4, in another embodiment of the present invention, a manufacturing method for forming the first protrusion 121 and the second protrusion 122 by punching from the side of the protrusion 12' of the lead area 12 of the package frame 10 through a punching mold 400 is further provided.
Specifically, the press mold 400 includes a molding cavity 410, and the shape of the molding cavity 410 is adapted to the shape of the first protrusion 121 and the second protrusion 122; placing the stamping die 400 on the side of the protrusion 12'; the control die 400 punches the protrusion 12' to make the first protrusion 121 and the second protrusion 122.
In yet another embodiment of the present invention, as shown in fig. 5, a process for forming the first protrusion 121 and the second protrusion 122 by etching with an etchant 510 is also provided.
Specifically, an etchant 510 is applied to the outer circumferential surface of the protrusion 12', and a reticle 500 is provided, the reticle 500 including a light shielding region and a light transmitting region, wherein a first pattern of the light shielding region or a second pattern of the light transmitting region is selected depending on the type of the etchant 510, a positive type etchant or a negative type etchant, and the design of the first pattern or the second pattern is made the same as the shape formed by the first protrusion 121 and the second protrusion 122 in common, thereby etching the first protrusion 121 and the second protrusion 122 to obtain a desired shape.
In other embodiments of the present invention, the first protrusion and the second protrusion may be formed by injection molding through a mold, and optionally, the first protrusion and the second protrusion may also be made of a non-metal material. When the first protruding part and the second protruding part are made of non-metal materials, the first protruding part and the second protruding part are preferably formed with the upper cover in one step, and the pin area is punched to form the mutually matched slots.
As can be seen with reference to fig. 2 to 6, in the cavity-encapsulating structure 100, the second protrusion 122 extends obliquely downward from the first protrusion 121, and is arranged at an obtuse angle; which is coated by the fixing glue 30 after being combined with the fixing glue 30, and which interacts with the fixing glue 30 to keep the fixing glue in the gap 70 at the joint between the upper cover 20 and the package frame 10, there is a beneficial effect of increasing the bonding strength of the upper cover 20 and the package frame 10.
In addition, during the actual use process, the design of the included angle between the first protrusion 121 and the second protrusion 122 can also adopt other designs according to the requirement, and preferably, the included angle is between 0 and 180 degrees.
In a preferred embodiment, the first protrusion 121 is, for example, an annular projection surrounding the base island 11; the slot 21 is, for example, an annular groove surrounding the base island 11. Wherein the annular projection and the annular groove are further closed for significantly improving the air tightness of the closed cavity 40.
In a preferred embodiment, the number of the second protrusions 122 may be multiple, and the multiple second protrusions are distributed on two opposite surfaces of the first protrusion 121 close to or far from the closed cavity 40. Wherein the plurality of second protrusions 122 and the first protrusions 121 may be a fishbone arrangement.
In other embodiments of the present invention, the at least one second protrusion may also be a structure formed on a top of the first protrusion opposite to the groove bottom of the insertion groove, such that a tooth shape is formed on the top of the first protrusion.
In the above embodiments, the first protrusion is, for example, a solid structure, but not limited thereto. In other embodiments of the invention, the first protrusion forms, for example, a hollow structure, and the second protrusion is, for example, provided on an inner wall of the hollow structure and protrudes toward the center of the hollow structure; the slot is used for accomodating above-mentioned first lug, and hollow structure and slot communicate each other, contactless between the tank bottom of hollow structure's top end opening and slot for fixed glue can fully be filled between hollow structure and slot. Preferably, the number of the second protrusions is, for example, a plurality of second protrusions extending from the inner wall of the hollow structure, and the plurality of second protrusions are arranged on the inner wall to form a brush structure.
With continued reference to fig. 2, the base island 11 and the lead area 12 are pre-packaged by the package material 13 to form a package frame 10; then, a first connection portion is formed on the lead area 12; then, the chip or the component 50 is pasted on the surface of the base island 11, and the chip or the component 50 is connected with the pins on the pin area 12 through the metal wires 60 in a routing way; wherein, after the upper cover 20 and the package frame 10 are fixed, the chip or component 50 is located in the sealed cavity 40.
As shown in fig. 7, the present invention also provides a packaging method, which includes:
providing a packaging frame, wherein the packaging frame comprises a base island and a pin area positioned at the periphery of the base island, and a first connecting part is manufactured in the pin area;
providing an upper cover, and manufacturing a second connecting part on one side of the upper cover facing the packaging frame;
coating fixing glue on the second connecting part;
fixing the upper cover to one side of the packaging frame, and thermally curing the fixing glue, wherein the fixing glue is filled in a gap between the first connecting part and the second connecting part, so that a closed cavity is formed between the packaging frame and the upper cover;
wherein one of the first connection portion and the second connection portion includes a first protrusion and at least one second protrusion extending from the first protrusion; the other of the first connecting part and the second connecting part is a slot.
In a preferred embodiment, the step of forming the first connection portion in the lead area includes:
stamping the pin area to form a protrusion;
punching or cutting or etching the protrusion to obtain the first protrusion and the second protrusion.
In summary, the present invention provides a cavity package structure and a package method thereof, in which a first connection portion and a second connection portion are formed between a package frame and an upper cover and are matched with each other, a fixing glue is filled in a gap between the first connection portion and the second connection portion, and one of the first connection portion and the second connection portion is designed to include two protrusions that are integrated with each other, that is, the second protrusion extending from the first protrusion can effectively increase a contact area with the fixing glue, and the fixing glue is confined in the gap, thereby enhancing a bonding strength between the upper cover and the package frame, extending a water vapor intrusion path, and significantly improving an air tightness of the cavity package structure.
The technical features of the different embodiments of the present invention may be combined with each other as long as they do not conflict with each other. It is to be noted that the present invention may be embodied in other specific forms, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A cavity package structure, comprising:
the packaging frame comprises a base island and a pin area positioned on the periphery of the base island, wherein the pin area is provided with a first connecting part;
the side, facing the packaging frame, of the upper cover comprises a second connecting part, and a gap is formed between the second connecting part and the first connecting part;
the fixing glue is filled in the gap, so that a closed cavity is formed between the packaging frame and the upper cover;
wherein one of the first and second connection portions includes a first protrusion and at least one second protrusion extending from the first protrusion.
2. The cavity package structure of claim 1, wherein the other of the first connection portion and the second connection portion is a socket, and the first protrusion and the at least one second protrusion are received in the socket; wherein the void is located between a wall of the slot and a surface of the first projection and a surface of the second projection.
3. The cavity package structure of claim 2, wherein the first protrusion and the at least one second protrusion are metal protrusions disposed over the lead area; the upper cover comprises a side wall extending towards the packaging frame, and the slot is formed in the end face of the side wall.
4. The cavity package structure of claim 2, wherein the first protrusion is an annular protrusion surrounding the base island; the slot is an annular groove surrounding the base island.
5. The cavity package structure of claim 1, wherein each second protrusion is disposed at an angle with respect to the first protrusion, and the angle is between 0 ° and 180 °.
6. The cavity package structure of claim 5, wherein the number of the at least one second protrusion is two or more, and the second protrusions are disposed on both the surface of the first protrusion close to the side of the sealed cavity and the surface of the first protrusion far from the side of the sealed cavity.
7. The cavity package structure of claim 6, wherein two or more of the second protrusions and the first protrusions form a fishbone shape.
8. The cavity packaging structure according to claim 1, wherein the base island is provided with a chip or a component, and the pins of the pin area are electrically connected with the chip or the component; wherein the chip or the component is located in the closed cavity.
9. A method of packaging, the method comprising:
providing a packaging frame, wherein the packaging frame comprises a base island and a pin area positioned at the periphery of the base island, and a first connecting part is manufactured in the pin area;
providing an upper cover, and manufacturing a second connecting part on one side of the upper cover facing the packaging frame;
coating fixing glue on the second connecting part;
fixing the upper cover to one side of the packaging frame, and thermally curing the fixing glue, wherein the fixing glue is filled in a gap between the first connecting part and the second connecting part, so that a closed cavity is formed between the packaging frame and the upper cover;
wherein one of the first and second connection portions includes a first protrusion and at least one second protrusion extending from the first protrusion; the other of the first connecting part and the second connecting part is a slot.
10. The packaging method of claim 9, wherein the step of forming the first connection portion in the lead region comprises:
stamping the pin area to form a protrusion;
punching or cutting or etching the protrusion to obtain the first protrusion and the second protrusion.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238862A (en) * | 2023-11-13 | 2023-12-15 | 深圳市海芯电子科技有限公司 | Integrated circuit packaging structure |
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