CN214477381U - Plastic packaging shell - Google Patents
Plastic packaging shell Download PDFInfo
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- CN214477381U CN214477381U CN202023022467.6U CN202023022467U CN214477381U CN 214477381 U CN214477381 U CN 214477381U CN 202023022467 U CN202023022467 U CN 202023022467U CN 214477381 U CN214477381 U CN 214477381U
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Abstract
The utility model provides a plastic package shell, including plastic frame, metal lead wire and metal heat sink. The plastic frame is encircled into a ring shape by a plastic side wall, and the plastic side wall is provided with an inner wall and an outer wall which are oppositely arranged; the metal lead is arranged on the plastic side wall in a plastic package mode, penetrates through the inner wall and the outer wall of the preset area of the plastic side wall, and one end of the metal lead extends into the plastic frame and is used for bonding a chip, and the other end of the metal lead extends out of the plastic frame and is used for connecting an external circuit; the metal heat sink is fixed at the lower part of the plastic frame; and the plastic side wall and the metal heat sink enclose a cavity with a window on the top surface. The utility model discloses a plastic frame is the main part of encapsulation shell, and semiconductor device snap-on has improved semiconductor device's thermal impedance on the one hand on the surface that the metal is heat sink, and on the other hand saving rate manufacturing cost has improved production efficiency, easily large-scale production.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package, concretely relates to plastic packaging shell.
Background
Devices made of LDMOS (laterally-diffused metal-oxide semiconductor) chips and GaN chips are high-frequency high-power transistors, are applied to power amplification assemblies in wireless communication base stations, and are key components for improving radio-frequency power signals in the base stations. Thermal impedance is a very important parameter for high frequency high power transistors, but existing packaging techniques are such as: the ceramic package is packaged and encapsulated, so that the heat dissipation performance is poor, the production process is complex, the requirements of semiconductor devices such as LDMOS chips and GaN chips on heat dissipation are difficult to meet, and the development of the package with high heat conductivity, relatively simple production process and easy realization of large-scale production is urgently needed.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a plastic packaging shell, it adopts the plastics side wall to replace the ceramic side wall, forms gas tightness packaging shell, when satisfying airtight encapsulation, practices thrift the cost of manufacture, has improved production efficiency.
In order to solve the above technical problem, an embodiment of the present application provides a plastic package housing, including:
the plastic frame is encircled into a ring by a plastic side wall, and the plastic side wall is provided with an inner wall and an outer wall which are oppositely arranged;
the metal lead is arranged on the plastic side wall in a plastic package mode, penetrates through the inner wall and the outer wall of the preset area of the plastic side wall, and one end of the metal lead extends into the plastic frame and is used for bonding a chip, and the other end of the metal lead extends out of the plastic frame and is used for connecting an external circuit;
the metal heat sink is fixed at the lower part of the plastic frame;
and the plastic side wall and the metal heat sink enclose a cavity with a window on the top surface.
The utility model provides a package shell encloses the cavity of installation device by the side wall of plastic frame and metal heat sink, and the device direct mount has improved the heat dispersion of device on the metal heat sink, adopts integrated into one piece's plastic frame can reduce the production degree of difficulty, practices thrift manufacturing cost, improves production efficiency.
In a possible implementation manner, the plastic side wall comprises an integrally formed upper side wall and a lower side wall, the inner side of the plastic frame enclosed by the upper side wall and the lower side wall is arranged in a step shape, and one end of the metal lead is arranged on the step.
In a possible implementation manner, through holes for interconnecting and fusing the upper side wall and the lower side wall are formed in the plastic sealing surface of the metal lead and the plastic frame.
In a possible implementation manner, micro pits are further processed on the metal leads and the plastic cover of the plastic frame, and micro interlocking structures are formed between the metal leads and the upper side wall and the lower side wall.
In one possible implementation, the diameter of the micro-pits is 1 micron or less and the depth is 1 micron or more.
In a possible implementation manner, the plastic frame is integrally formed through an injection molding process, inward concave process grooves are formed in two side walls used for being communicated with the injection molding flow channel, and the width of each process groove is matched with the injection molding flow channel and penetrates through the upper surface and the lower surface of the corresponding plastic side wall.
In a possible implementation manner, the plastic frame is integrally formed through an injection molding process, two side faces used for being communicated with the injection molding runner are provided with process grooves which are inwards concave, and the width of each process groove is matched with the runner and penetrates through the upper surface and the lower surface of the lower side wall.
In a possible implementation manner, the plastic frame is integrally formed through an injection molding process, and a boss or a pit for ejecting out the formed plastic frame is arranged on the bottom surface of the plastic frame.
In a possible implementation manner, the bottom of the longitudinal section of the plastic side wall is smaller, the top of the longitudinal section of the plastic side wall is larger, and the side wall is an inclined surface.
In a possible implementation manner, the area where the metal lead is arranged on the step is a first area, and the rest areas are second areas, and the second areas are provided with bosses or pits which are convenient for ejecting out the molded plastic frame.
In a possible implementation manner, the cross section of the plastic side wall is a rectangular ring body, and two opposite plastic side walls of the rectangular ring body are respectively provided with 2-3 groups of metal leads.
In a possible implementation manner, a groove is formed in the upper portion of the metal heat sink, and a boss on the bottom surface of the plastic frame is located in the groove.
In a possible implementation manner, the plastic package housing further includes a cover plate, and the cover plate covers the upper portion of the cavity surrounded by the plastic side wall and the metal heat sink to form the top-windowed cavity, so as to form the airtight package housing.
In one possible implementation, the metal lead is flat or cylindrical in shape.
Compared with the traditional ceramic package, the package shell of the embodiment of the application has the following advantages: the process steps are few, the process cost is low, the raw materials are cheap, the overall cost of the shell is low, the mass production is easy, and the cost of a device manufacturer can be reduced; and the metal lead of the ceramic package shell is welded on the surface of the ceramic ring and protrudes from the surface, the subsequent cover plate is difficult to bond, and the metal lead of the package shell is positioned in the side wall of the plastic frame, so that the upper surface of the plastic frame is flat, and the subsequent cover plate is easy to install. The encapsulation shell of this application compares with traditional embedment: the cavity of the packaging shell is hollow, so that heat dissipation is easy, the manufacturing process is simple, and mass production is easy.
Drawings
Fig. 1 is a schematic perspective structural view of a plastic package housing according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line B-B of FIG. 1;
fig. 3 is a schematic bottom view of another plastic package housing according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a cross-sectional structure of a plastic package housing according to an embodiment of the present invention;
in the figure: 1-plastic frame, 2-metal lead, 3-metal heat sink, 4-cover plate, 5-through hole, 6-micro pit, 7-process groove and 8-boss.
Detailed Description
The utility model discloses the applicant finds that traditional packaging technology manufacturing cost is higher in the production process of device encapsulation, is not suitable for mass production, especially to some semiconductor device that low-cost requirement is higher, and the encapsulation can not satisfy the demand of semiconductor device low-cost, high performance now. Therefore, the utility model discloses carried out the design of pertinence to the encapsulation shell.
As an embodiment of the present invention, as shown in fig. 1 and 2, a plastic package housing includes: a plastic frame 1, metal leads 2 and a metal heat sink 3. The plastic frame 1 is surrounded by plastic side walls to form a ring shape, and the plastic side walls are provided with inner walls and outer walls which are arranged oppositely. The plastic packaging structure is characterized in that the metal lead 2 is arranged on the plastic side wall in a plastic packaging mode, the metal lead 2 penetrates through the inner wall and the outer wall of the preset area of the plastic side wall, one end of the metal lead extends into the plastic frame 1 and is used for bonding a chip, and the other end of the metal lead extends out of the plastic frame 1 and is used for connecting an external circuit. The metal heat sink 3 is fixed at the lower part of the plastic frame 1; and the plastic side wall and the metal heat sink 3 enclose a cavity with a window on the top surface.
The side wall of the plastic frame 1 is internally provided with a plastic-sealed metal lead 2, and the lower part of the plastic frame 1 is provided with a metal heat sink 3, so that a hollow cavity is formed for installing a chip. The plastic frame 1 is used as a main body frame of the packaging shell, the plastic frame 1 can be manufactured by an injection mold, the processing is convenient, the cost is low, and the large-scale production is easy. The chip is directly arranged on the upper surface of the metal heat sink 3, so that the chip is easy to dissipate heat, convenient to assemble and convenient for large-scale production.
In this embodiment, the plastic frame 1 may be made of high temperature resistant engineering plastics such as LCP (liquid crystal polymer), LCP modified material, PPS, PS, PBT, etc., and the plastic has glass fiber or mineral powder as filler.
In this embodiment, the metal heat sink 3 may be made of high thermal conductivity metal materials such as copper and copper alloy, tungsten copper, molybdenum copper, CPC, CMC, and the like. The metal lead 2 can be made of copper and copper alloy, aluminum and aluminum alloy, kovar alloy and other materials.
In this embodiment, the metal heat sink 3 and the plastic frame 1 are fixed by epoxy resin adhesive.
As an embodiment, the plastic side wall includes an upper side wall and a lower side wall which are integrally formed, the upper side wall and the lower side wall are arranged in a step manner on the inner side of a plastic frame 1 which is enclosed between the upper side wall and the lower side wall, and one end of a metal lead 2 is arranged on the step.
In the embodiment, one end of the metal lead 2 is arranged on the step, and when the package shell is manufactured, the metal lead 2 is only required to be arranged in a mold for preparing the plastic frame 1, plastic is injected into the mold after being melted, and the metal lead 2 is plastically packaged in the plastic frame 1 after the plastic is cooled. The metal surface of the metal lead 2 exposed on the step is used as a bonding surface connected with the chip. Before or after injection molding, the metal lead 2 is also plated with nickel, gold, nickel-palladium-gold, or the like. Compared with the traditional method that the metal lead of the ceramic packaging shell is welded on the surface of the ceramic ring, the metal lead of the ceramic packaging shell protrudes out of the surface of the ceramic ring, and the surface is bonded with the cover plate in the device manufacturing process, so that the surface is uneven, the cover plate is difficult to bond, and the air tightness is poor. While the surface of the plastic frame 1 in this embodiment is flat, the cover plate 4 is easy to manufacture and adhere to the cover plate 4.
In order to ensure the airtightness of the package casing and to ensure that the metal leads 2 are tightly coupled to the plastic frame 1, through-holes 5 that are interconnected and fused with the upper and lower sidewalls of the plastic frame 1 are formed in the plastic covers of the metal leads 2 and the plastic frame 1. During injection molding, the molten plastic flows into the through-holes 5, and the upper and lower sidewalls of the plastic frame 1 are connected to each other, so that the metal leads 2 and the plastic frame 1 are fused together.
The metal lead 2 may be flat or columnar, and may be fabricated according to the device package requirements. Because the metal lead 2 and the plastic frame 1 are made of different materials, the different materials are difficult to be fused tightly, and the air tightness of the packaging shell is influenced, the micro-pits 6 are also prepared on the plastic covers of the metal lead 2 and the plastic frame 1, wherein the diameter of each micro-pit 6 is less than or equal to 1 micron, and the depth of each micro-pit is more than or equal to 1 micron. During injection molding, molten plastic enters the micro-pits 6 on the surface of the metal lead 2, so that micron-sized mutual combination is formed between the plastic and the metal, and an anchor bolt structure is formed. The metal lead 2 and the plastic frame 1 can be tightly combined together without gaps, thereby achieving the airtight effect.
In addition, an organic molecular film containing a sulfur bond is provided on the surface of the metal lead 2. The sulfur bonds of organic micromolecules in the organic molecule film layer on the surface of the metal lead 2 can react with organic molecules in the plastic frame 1 to form a compound, so that the metal lead 2 and the plastic frame 1 can be combined together to realize tight combination and achieve the airtight effect.
As an embodiment, the plastic frame 1 is integrally formed through an injection molding process, the two side walls for communicating with the injection molding runner are provided with process grooves 7 which are concave inwards, and the width of each process groove 7 is matched with the injection molding runner and penetrates through the upper surface and the lower surface of the corresponding plastic side wall.
In this embodiment, the process grooves 7 on the two side walls of the plastic frame 1 are the positions of the plastic handles during injection molding, and after the plastic handles are cut off, the residual parts of the plastic handles can be in the process grooves 7 and cannot extend out of the two side walls of the plastic frame 1, so that the size of the inner space of the cavity cannot be influenced, and the installation of a chip cannot be influenced.
When the plastic frame 1 is manufactured by integrally molding through an injection molding process, the two side surfaces used for being communicated with the injection molding flow channel are also provided with inward concave process grooves 7, and the width of each process groove 7 is matched with the flow channel and penetrates through the upper surface and the lower surface of the lower side wall. When the plastic injection molding is integrally formed, the plastic material is mainly concentrated on the upper surface and the lower surface of the lower side wall, and the process groove 7 is positioned on the upper surface and the lower surface of the lower side wall.
As another embodiment, as shown in fig. 3, the plastic frame 1 is integrally formed by an injection molding process, and a boss 8 for ejecting the formed plastic frame 1 is provided on a bottom surface of the plastic frame 1.
In this embodiment, the plastic frame 1 in the mold after injection is tightly contacted with the injection mold, and is difficult to be taken out, and must be pushed out by using a push rod. The ejector pin is generally a cylinder, and the surface of the ejector pin is flush with the surface of the cavity of the injection mold. During actual processing, the ejector rod protrudes or dents relative to the surface of the cavity of the injection mold, and a pit or a bulge is formed corresponding to the trace of the ejector rod after injection molding. The bottom surface of the plastic frame 1 is provided with a boss 8, and after the ejector rod applies force on the boss 8, the plastic frame 1 can be separated from the injection mold.
In order to make the plastic frame 1 and the injection mold easily separated, the side wall of the plastic frame 1 may be an inclined surface, that is, the bottom of the longitudinal section of the side wall has a smaller size and the top has a larger size. When the ejector rod applies external force to the boss 8, the plastic frame 1 can be demoulded without using large external force.
As another embodiment, it is also possible to provide the boss 8 on a step of the upper surface of the plastic frame 1. The step is divided into a first area and a second area, the metal lead 2 is arranged in the first area of the step, the rest areas are the second areas, and the boss 8 is located in the second area. The height of the boss 8 is lower than that of the step and cannot exceed the upper surface of the plastic frame 1. The ejector rod applies external force on the boss 8 on the upper surface of the plastic frame 1, so that the plastic frame 1 is separated from the injection mold from the lower part of the injection mold.
As another embodiment, the cross section of the plastic frame 1 surrounded by the plastic side walls is a rectangular ring, and two opposite plastic side walls of the rectangular ring are respectively provided with 2-3 groups of metal leads 2. The number of the metal leads 2 can be set according to the requirements of the chip mounted in the cavity.
As another embodiment, when the protrusion 8 is disposed on the bottom surface of the plastic frame 1, in order to tightly couple the plastic frame 1 and the metal heat sink 3, the upper portion of the metal heat sink 3 is provided with the groove 9, and the protrusion 8 on the bottom surface of the plastic frame 1 is located in the groove 9, so that the plastic frame 1 and the metal heat sink 3 can be tightly coupled, and the air tightness of the package can be better. The plastic frame 1 and the metal heat sink 3 are bonded together by epoxy resin glue, and the bonding position can achieve a good sealing effect by means of the sealing performance of the epoxy resin. The metal heat sink 3 is manufactured by adopting a machining or die punching method, and after the metal heat sink 3 is manufactured, plating is carried out on the metal heat sink, wherein the plating is gold plating or nickel-palladium-gold plating and the like.
In addition, as shown in fig. 4, a cover plate 4 fastened to the plastic frame 1 is further disposed on the upper portion of the package housing, and the cover plate 4 is made of plastic and can be prepared by an injection molding process. The cover plate 4 is glued to the plastic frame 1 to form a gas-tight chamber.
To sum up, the embodiment of the utility model provides a plastic packaging shell adopts hollow plastic frame as the encapsulation main part, and the bottom is fixed with the metal heat sink and is formed the cavity of installation chip. The encapsulation shell of this application compares with traditional ceramic encapsulation: the heat dissipation performance is good, the process steps are few, the process cost is low, the raw materials are cheap, the overall cost of the shell is low, the mass production is easy, and the cost of a device manufacturer can be reduced; and the metal lead of the ceramic package shell is welded on the surface of the ceramic ring and protrudes from the surface, the subsequent cover plate is difficult to bond, and the metal lead of the package shell is positioned in the side wall of the plastic frame, so that the upper surface of the plastic frame is flat, and the subsequent cover plate is easy to install. Compared with the traditional encapsulation: the cavity of the packaging shell is hollow, so that heat dissipation is easy, the manufacturing process is simple, and mass production is easy.
The utility model discloses preparation step of preparation plastics encapsulation shell includes:
s101: processing a metal lead 2;
s102: after the metal lead 2 is arranged in an injection mold, the plastic frame 1 is integrally formed;
s103: plating the surface of the metal lead 2 by nickel plating, gold plating or nickel-palladium-gold plating, etc.;
s104: plating the surface of the metal heat sink 3 and then bonding the metal heat sink with the plastic frame 1;
s105: mounting a chip on the surface of the metal heat sink 3 from an electrode bonding gold wire of the chip to the surface of the metal lead 2;
s106: the back of the cover plate 4 is glued and adhered to the upper surface of the plastic frame 1 to form an airtight packaging shell.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (14)
1. A plastic package housing, comprising:
the plastic frame is surrounded by a plastic side wall to form an annular shape, and the plastic side wall is provided with an inner wall and an outer wall which are oppositely arranged;
the metal lead is arranged on the plastic side wall in a plastic package mode, penetrates through the inner wall and the outer wall of the preset area of the plastic side wall, and one end of the metal lead extends into the plastic frame and is used for bonding a chip, and the other end of the metal lead extends out of the plastic frame and is used for connecting an external circuit;
the metal heat sink is fixed at the lower part of the plastic frame;
and the plastic side wall and the metal heat sink enclose a cavity with a window on the top surface.
2. The plastic package housing as claimed in claim 1, wherein the plastic sidewall comprises an upper sidewall and a lower sidewall integrally formed with each other, the upper and lower sidewalls are stepped on the inner side of the plastic frame, and one end of the metal lead is disposed on the step.
3. The plastic package can as in claim 2, wherein the metal leads and the plastic molding surface of the plastic frame are provided with through holes for interconnecting and fusing the upper and lower sidewalls.
4. A plastic package according to claim 2 or 3, wherein said metal leads and said plastic frame are further formed with dimples formed in the plastic cover thereof, and microscopic interlocking structures are formed between said metal leads and said upper and lower sidewalls.
5. The plastic package housing of claim 4, wherein the dimples are less than or equal to 1 micron in diameter and greater than or equal to 1 micron in depth.
6. The plastic package casing as claimed in claim 1, wherein the plastic frame is integrally formed by injection molding, and process grooves are formed in the two side walls for communicating with the injection molding runner, and have a width corresponding to the injection molding runner and penetrating the upper and lower surfaces of the corresponding plastic side walls.
7. The plastic package housing as claimed in claim 2, wherein the plastic frame is integrally formed by an injection molding process, and process grooves are formed on both sides for communicating with the injection molding runner, and have a width corresponding to the runner and penetrating the upper and lower surfaces of the lower sidewall.
8. The plastic package housing as claimed in claim 1, wherein the plastic frame is integrally formed by an injection molding process, and a protrusion or a recess for ejecting the formed plastic frame is formed on a bottom surface of the plastic frame.
9. The plastic encapsulating housing as claimed in claim 8, wherein the plastic sidewall has a smaller bottom dimension and a larger top dimension in a longitudinal section, and the sidewall is an inclined surface.
10. The plastic package can as claimed in claim 2, wherein the area where the metal leads are disposed on the step is a first area, and the remaining area is a second area, and the second area is provided with a boss or a pit for facilitating ejection of the molded plastic frame.
11. The plastic package housing as claimed in claim 1, wherein the plastic sidewalls enclose a rectangular ring body in cross section, and two opposing plastic sidewalls of the rectangular ring body are respectively provided with 2-3 sets of metal leads.
12. The plastic package shell of claim 8, wherein the metal heat sink has a groove on the top thereof, and the protrusion on the bottom surface of the plastic frame is located in the groove.
13. The plastic package housing of claim 1, further comprising a cover plate covering the upper end surface of the plastic sidewall to form an airtight package housing.
14. The plastic package of claim 1, wherein the metal leads are flat or cylindrical in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023022467.6U CN214477381U (en) | 2020-12-15 | 2020-12-15 | Plastic packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023022467.6U CN214477381U (en) | 2020-12-15 | 2020-12-15 | Plastic packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214477381U true CN214477381U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023022467.6U Active CN214477381U (en) | 2020-12-15 | 2020-12-15 | Plastic packaging shell |
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| CN (1) | CN214477381U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114236708A (en) * | 2021-12-09 | 2022-03-25 | 广东华智芯电子科技有限公司 | TOSA/ROSA shell packaging structure and packaging method |
-
2020
- 2020-12-15 CN CN202023022467.6U patent/CN214477381U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114236708A (en) * | 2021-12-09 | 2022-03-25 | 广东华智芯电子科技有限公司 | TOSA/ROSA shell packaging structure and packaging method |
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