CN115161567B - Preparation method of interface control tungsten filament bundle reinforced copper-based composite material and composite material - Google Patents

Preparation method of interface control tungsten filament bundle reinforced copper-based composite material and composite material Download PDF

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Publication number
CN115161567B
CN115161567B CN202210856986.7A CN202210856986A CN115161567B CN 115161567 B CN115161567 B CN 115161567B CN 202210856986 A CN202210856986 A CN 202210856986A CN 115161567 B CN115161567 B CN 115161567B
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copper
tungsten
composite material
infiltration
tungsten filament
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CN115161567A (en
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呼陟宇
孙文彬
李瑞红
王海燕
杨礼林
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Inner Mongolia University of Science and Technology
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Inner Mongolia University of Science and Technology
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/08—Making alloys containing metallic or non-metallic fibres or filaments by contacting the fibres or filaments with molten metal, e.g. by infiltrating the fibres or filaments placed in a mould
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02—Pretreatment of the fibres or filaments
    • C22C47/04—Pretreatment of the fibres or filaments by coating, e.g. with a protective or activated covering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02—Pretreatment of the fibres or filaments
    • C22C47/06—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
    • C22C47/062—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element from wires or filaments only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B12/00—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material
    • F42B12/72—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material
    • F42B12/74—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material of the core or solid body

Abstract

The invention provides a preparation method of an interface control tungsten filament bundle reinforced copper-based composite material, which is characterized by comprising the following steps of: the method comprises the following steps: (1) electroplating copper on the surface of a tungsten wire; (2) binding a certain number of copper-plated tungsten wires into a bundle; (3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; wherein, copper is in a state that a matrix is a block or powder at the beginning of infiltration and is arranged at the bottom of an infiltration device, and tungsten filament bundles are vertically arranged in the infiltration device and only the bottom of the tungsten filament bundles is contacted with copper. The interface control tungsten filament bundle reinforced copper-based composite material prepared by the invention has the following advantages: the composite material (1) has the characteristic of armor piercing self-sharpening. (2) there is no direct contact between the tungsten filaments. (3) After the interface modification, the plasticity of the composite material is obviously improved on the premise of little change of the strength.

Description

Preparation method of interface control tungsten filament bundle reinforced copper-based composite material and composite material
Technical Field
The invention belongs to the field of novel material manufacturing, and particularly relates to a preparation method of a novel fiber reinforced composite material.
Background
At present, the armor-piercing bullet is an important weapon for anti-armor and anti-firm targets of various countries, and the bullet core is the main body of the armor-piercing bullet. The performance of the bullet core material has direct influence on the armor piercing power of the armor piercing bullet.
In order to break down tank armor, not only the bullet core is required to have enough hardness, strength and toughness, but also the characteristic of penetrating the armor is required to be self-sharpening so as to ensure that the bullet core always keeps a sharp head shape in the process of penetrating the target plate, and the energy is more concentrated.
Because of the above characteristics, tungsten wire reinforced metal matrix composites are receiving attention from researchers in the field of armor piercing bullets. The conventional preparation method of the tungsten wire reinforced metal matrix composite mainly comprises the following steps: pressure infiltration and conventional infiltration, in which the temperature is raised above the melting point of the binder phase by conventional infiltration, and after the metal is melted, the molten metal is cooled after the level is higher than the sample, thus obtaining the desired material. The method has simple process, but in the infiltration process, defects such as shrinkage cavity and the like are easy to generate in the binding phase.
In the past research of the inventor, a novel capillary infiltration method is adopted to prepare the tungsten wire reinforced copper-zinc-based composite material, the intermediate space after tungsten wires are closely arranged is used as a capillary, capillary force is utilized to carry out infiltration, and the possibility of shrinkage cavity generation in the bonding phase is greatly reduced.
Disclosure of Invention
Although the prior research of the inventor discloses a method for preparing the tungsten wire reinforced copper-zinc-based composite material by adopting a novel capillary infiltration method, the infiltration method needs to utilize capillary effect, so that the tungsten wire reinforced copper-based composite material can only be prepared when tungsten wires are densely arranged, and the volume fraction of tungsten is certain and cannot be regulated; meanwhile, the melting temperature of tungsten is far lower than the copper infiltration temperature, and the tungsten wires cannot form metallurgical bonding, so that cracks are easy to generate in the use process, and the application of the tungsten in the field of armor-piercing bullets is limited.
In order to overcome the defect that the tungsten wire reinforced copper-zinc-based composite material prepared by the prior art is easy to crack at the interface between the tungsten wire and the tungsten wire in use, the inventor provides a thought for controlling the interface between the tungsten wire and the tungsten wire, separates the interface between the tungsten wire and the tungsten wire through a bonding phase, replaces the original interface between the tungsten wire and the tungsten wire by using the bonding phase and the interface between the tungsten wire, and reduces the interface between the tungsten wire and the tungsten wire from the source. Meanwhile, the inventor proposes a feasible solution for the thought that copper is plated on the surface of the tungsten wire, the interface between the tungsten wire and the tungsten wire is replaced by the interface between the tungsten wire and the tungsten wire bonding phase by utilizing a copper plating layer, and then capillary force of an intermediate gap after the copper plating tungsten wire is closely arranged is utilized for copper infiltration, and the copper plating treatment is carried out on the surface of the tungsten wire, so that on the premise that the tungsten wire and the tungsten wire are not contacted, particularly, the interval between the tungsten wires (namely, the difference of the radius of two tungsten wires is subtracted from the distance between the centers of the cross sections of two adjacent tungsten wires) is 10um to 2mm, and preferably 10um to 50um, capillary effect can be ensured, and the infiltration process can be completed. While the material keeps high density, the state that the tungsten wire is not contacted with the tungsten wire still exists after the infiltration is finished.
Therefore, the invention aims to overcome the defect that the tungsten wire reinforced copper-zinc-based composite material prepared by the prior art is easy to crack in use, and provides the preparation method of the interface control tungsten wire bundle reinforced copper-based composite material.
In order to achieve the above object, the present invention is achieved by the following technical solutions: electroplating copper on the surface of the tungsten wire, binding a certain number of electroplated tungsten wires into a bundle, and then infiltrating copper into the tungsten wire bundle, wherein the copper is used as a binding phase of the alloy.
Specifically, the invention provides a preparation method of an interface control tungsten filament bundle reinforced copper-based composite material, which is characterized by comprising the following steps: the preparation method comprises the following steps:
(1) Electroplating copper on the surface of the tungsten wire;
(2) Binding a certain number of copper-plated tungsten wires into a bundle;
(3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; wherein, copper is in a state that a matrix is a block or powder at the beginning of infiltration and is arranged at the bottom of an infiltration device, and tungsten filament bundles are vertically arranged in the infiltration device and only the bottom of the tungsten filament bundles is contacted with copper.
The invention also provides an interface control tungsten filament bundle reinforced copper-based composite material prepared by the method.
Compared with the existing alloy, the interface control tungsten filament bundle reinforced copper-based composite material prepared by the invention has the following advantages:
(1) After copper plating on the surface of the tungsten wire and binding the tungsten wire into a bundle, the tungsten wire can be uniformly distributed in a binding phase, and the tungsten wire is easy to shear and damage in the armor piercing process, so that the composite material has the armor piercing self-sharpening characteristic.
(2) There is no direct contact between the tungsten filaments.
(3) The quasi-static compression mechanical property test is carried out on the material prepared by the invention and the copper-based composite material reinforced by the tungsten filament bundle without interface control, and as a result, the plasticity of the composite material is obviously improved on the premise of little change of the strength after the interface modification.
Drawings
FIG. 1 is a schematic view of an electrolytic copper plating apparatus;
FIG. 2 is a schematic illustration of the preparation principle of the invention, showing a schematic cross section of a tungsten wire;
FIG. 3 is a schematic view of a copper infiltration process according to the present invention;
FIG. 4 is a cross-sectional scanning electron micrograph of a composite material prepared according to one example of the present invention;
FIG. 5 is a graph showing the quasi-static compressive true stress true strain mechanical properties of the interface-controlled tungsten filament bundle reinforced copper-based composite of example 1 and the non-interface-controlled tungsten filament bundle reinforced copper-based composite of comparative example 1.
Detailed Description
The invention provides a preparation method of an interface control tungsten filament bundle reinforced copper-based composite material, which is characterized by comprising the following steps of: the preparation method comprises the following steps:
(1) Electroplating copper on the surface of the tungsten wire;
(2) Binding a certain number of copper-plated tungsten wires into a bundle;
(3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; wherein, copper is in a state that a matrix is a block or powder at the beginning of infiltration and is arranged at the bottom of an infiltration device, a tungsten filament bundle is erected in the infiltration device and only the bottom of the tungsten filament bundle is contacted with copper, as shown in fig. 3.
The diameter of the tungsten wire and the thickness of the copper plating layer are not particularly limited in the present invention, and may be in a data range commonly used in the art, for example, the diameter of the tungsten wire may be 0.2 to 0.25mm, and the thickness of the plating layer may be 0.1 to 0.15mm.
In the step (1), the tungsten wires are straightened, and then copper is electroplated on each tungsten wire. The method of electroplating copper in the present invention is not particularly limited, and conventional methods may be used. For example, copper plating may be performed by using a copper plating apparatus as shown in fig. 1.
The method of infiltration in the present invention is not particularly limited, and conventional methods may be employed.
FIG. 2 is a schematic illustration of the preparation principle of the invention, and is a schematic illustration of a cross section of a tungsten wire.
In the step (3), the tungsten filaments are arranged in a cluster manner during infiltration, the interval between the tungsten filaments is 10um to 50um, and in the range, smooth capillary action can be ensured, so that copper is effectively infiltrated into the tungsten filament bundle. Wherein the matrix is copper or copper alloy doped with Zn, al, sn and other elements. The mass percentage of copper in the matrix is 50-100%, preferably 80-100%.
The invention also provides an interface control tungsten filament bundle reinforced copper-based composite material prepared by the method. In the interface control tungsten filament bundle reinforced copper-based composite material prepared by the method, tungsten filaments are arranged in a bundling mode, finally the tungsten filaments are uniformly distributed in a bonding phase, no contact is made between the tungsten filaments, and the interval between the tungsten filaments is 10um to 50um, for example, a scanning electron microscope photograph of the interface control tungsten filament bundle reinforced copper-based composite material prepared by one example of the method is shown in fig. 4.
In the tungsten filament bundle reinforced copper-based composite material, the tungsten accounts for 50-95% of the total material by mass, and the tungsten accounts for 80-95% of the total material by mass preferably; the mass percentage of copper in the binding phase is 50-100%, preferably 80-100%, namely, the binding phase can be pure copper, and elements such as Zn, al, sn and the like can also be added.
The results of the quasi-static compression mechanical property test of the material prepared by the invention and the copper-based composite material reinforced by the tungsten filament bundle without interface control are shown in figure 5, and the plasticity of the composite material is obviously improved on the premise of little change of the strength after the interface modification.
Examples
The following description is provided in connection with six specific examples, a comparative example, an illustration and to aid in a further understanding of the invention. However, the specific details of the embodiments are only for illustrating the present invention, and do not represent all technical solutions under the concept of the present invention, and therefore, the present invention is not to be construed as being limited by the technical solutions. Insubstantial changes, e.g., simple changes or substitutions of technical features with the same or similar technical effects, without departing from the spirit of the invention are intended to be covered by the claims.
Example 1
The preparation method of the interface control tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: tungsten 90% and copper 100% in the binding phase, and the preparation method comprises the following steps:
firstly, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of the plating layer is 0.1mm.
Step two, the electroplated tungsten wire is cleaned by alcohol in an ultrasonic cleaning device, and is bound into a bundle after being dried.
And thirdly, infiltration, wherein copper is a block body during infiltration, the copper block body is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1100 ℃, the infiltration time is 4 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
Example 2
The preparation method of the interface control tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: tungsten 90% and copper 100% in the binding phase, and the preparation method comprises the following steps:
firstly, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of the plating layer is 0.15mm.
Step two, the electroplated tungsten wire is cleaned by alcohol in an ultrasonic cleaning device, and is bound into a bundle after being dried.
And thirdly, infiltration, wherein copper is a block body during infiltration, the copper block body is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1400 ℃, the infiltration time is 4 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
Example 3
The preparation method of the interface control tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: tungsten 90% and copper 100% in the binding phase, and the preparation method comprises the following steps:
firstly, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.15mm, and the thickness of the plating layer is 0.1mm.
Step two, the electroplated tungsten wire is cleaned by alcohol in an ultrasonic cleaning device, and is bound into a bundle after being dried.
And thirdly, infiltration, wherein copper is a block body during infiltration, the copper block body is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1100 ℃, the infiltration time is 4 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
Example 4
The preparation method of the interface control tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: tungsten 85% and copper 100% in the binding phase, and the preparation method comprises the following steps:
firstly, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of the plating layer is 0.1mm.
Step two, the electroplated tungsten wire is cleaned by alcohol in an ultrasonic cleaning device, and is bound into a bundle after being dried.
And thirdly, infiltration, wherein copper is a block body during infiltration, the copper block body is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1200 ℃, the infiltration time is 3 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
Example 5
The preparation method of the interface control tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: 90% of tungsten, 90% of copper and 10% of zinc in a binding phase, and the preparation method comprises the following steps:
firstly, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of the plating layer is 0.1mm.
Step two, the electroplated tungsten wire is cleaned by alcohol in an ultrasonic cleaning device, and is bound into a bundle after being dried.
And thirdly, infiltration, wherein the copper-zinc alloy is a block body during infiltration, the copper-zinc alloy is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper-zinc alloy, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1100 ℃, the infiltration time is 4 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
Example 6
The preparation method of the interface control tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: tungsten 90% and copper 100% in the binding phase, and the preparation method comprises the following steps:
firstly, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of the plating layer is 0.1mm.
Step two, the electroplated tungsten wire is cleaned by alcohol in an ultrasonic cleaning device, and is bound into a bundle after being dried.
And thirdly, infiltration, wherein copper is a block body during infiltration, the copper block body is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1100 ℃, the infiltration time is 4 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
Comparative example 1
The preparation method of the tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: tungsten 90% and copper 100% in the binding phase, and the preparation method comprises the following steps:
step one, cleaning the electric tungsten wire with alcohol in an ultrasonic cleaning device, and binding the electric tungsten wire into a bundle after drying.
And secondly, infiltration, wherein copper is a block body during infiltration, the copper block body is arranged below an infiltration device, tungsten filament bundles are vertically arranged above the copper, and the interval between the tungsten filaments is 10um to 50um. Infiltration is carried out in a hydrogen atmosphere, the infiltration temperature is 1100 ℃, the infiltration time is 4 hours, the heating rate is 7 ℃/min, and the cooling mode is furnace-following cooling.
According to national standard GB/T7314-2005, as shown in FIG. 5, the strength of the tungsten filament bundle reinforced copper-based composite material prepared in comparative example 1 and that of the tungsten filament bundle reinforced copper-based composite material prepared in comparative example 1 are almost the same, but the critical fracture strain of the tungsten filament reinforced copper-based composite material after interface control in example 1 is about 0.24, which is far higher than that of the tungsten filament reinforced copper-based composite material in comparative example 1 (the critical fracture strain of the tungsten filament reinforced copper-based composite material without interface improvement), and the plasticity of the material after interface modification is obviously improved.

Claims (5)

1. A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material is characterized by comprising the following steps: the method comprises the following steps:
(1) Electroplating copper on the surface of the tungsten wire;
(2) Binding a certain number of copper-plated tungsten wires into a bundle;
(3) Infiltrating the matrix into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; wherein, the basal body is in a block or powder state at the beginning of infiltration and is arranged at the bottom of the infiltration device, the tungsten filament bundle is vertically arranged in the infiltration device and only the bottom of the tungsten filament bundle is contacted with the basal body;
in the step (3), tungsten wires are arranged in a bundling mode during infiltration, and the interval between the tungsten wires is 10um to 50um;
in the step (3), the substrate is copper or copper alloy doped with Zn, al or Sn.
2. The method according to claim 1, characterized in that: in the step (1), the tungsten wires are straightened, and then copper is electroplated on each tungsten wire respectively.
3. The method according to claim 1, characterized in that: the mass percentage of copper in the matrix is 50-100%.
4. A method according to claim 3, characterized in that: the mass percentage of copper in the matrix is 80-100%.
5. An interface-controlled tungsten filament bundle reinforced copper-based composite prepared by the method of any one of claims 1-4.
CN202210856986.7A 2022-07-20 2022-07-20 Preparation method of interface control tungsten filament bundle reinforced copper-based composite material and composite material Active CN115161567B (en)

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JPS6324026A (en) * 1986-07-17 1988-02-01 Toshiba Corp Production of tungsten wire-reinforced composite material
CN1327027C (en) * 2005-02-03 2007-07-18 西安建筑科技大学 Preparation technology of tungsten copper or tungsten silver composite material
CN102433480A (en) * 2011-12-01 2012-05-02 北京理工大学 Tungsten-copper alloy with low skeleton connectivity and preparation method thereof
CN106119817B (en) * 2016-06-28 2019-02-01 西安理工大学 A kind of method of W fiber surface chemical deposition morphology controllable nickel layer

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