CN115161567A - Preparation method of interface control tungsten filament bundle reinforced copper-based composite material and composite material - Google Patents
Preparation method of interface control tungsten filament bundle reinforced copper-based composite material and composite material Download PDFInfo
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- CN115161567A CN115161567A CN202210856986.7A CN202210856986A CN115161567A CN 115161567 A CN115161567 A CN 115161567A CN 202210856986 A CN202210856986 A CN 202210856986A CN 115161567 A CN115161567 A CN 115161567A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/08—Making alloys containing metallic or non-metallic fibres or filaments by contacting the fibres or filaments with molten metal, e.g. by infiltrating the fibres or filaments placed in a mould
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/02—Pretreatment of the fibres or filaments
- C22C47/04—Pretreatment of the fibres or filaments by coating, e.g. with a protective or activated covering
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/02—Pretreatment of the fibres or filaments
- C22C47/06—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
- C22C47/062—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element from wires or filaments only
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B12/00—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material
- F42B12/72—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material
- F42B12/74—Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the material of the core or solid body
Abstract
The invention provides a preparation method of an interface control tungsten tow reinforced copper-based composite material, which is characterized by comprising the following steps of: the method comprises the following steps: electroplating copper on the surface of the tungsten wire; (2) binding a certain amount of copper-plated tungsten wires into a bundle; (3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; when infiltration begins, copper is placed at the bottom of an infiltration device in a state that a matrix is a block or powder, and a tungsten filament bundle is erected in the infiltration device and only the bottom of the tungsten filament bundle is in contact with the copper. The interface control tungsten filament bundle reinforced copper-based composite material prepared by the invention has the following advantages: (1) the composite material has the characteristic of armor piercing self-sharpening. And (2) the tungsten wires are not in direct contact with each other. (3) After the interface modification, the plasticity of the composite material is obviously improved on the premise of little strength change.
Description
Technical Field
The invention belongs to the field of novel material manufacturing, and particularly relates to a preparation method of a novel fiber reinforced composite material.
Background
Currently, armor-piercing rounds are an important weapon for anti-armor and anti-ballistic targets in various countries, and the core is the body of the armor-piercing round. The properties of the core material have a direct influence on the armor-piercing power of armor-piercing projectiles.
In order to puncture the tank armor, the bullet core is required to have enough hardness, strength and toughness, and the bullet core also has the characteristic of penetrating armor and self-sharpening, so that the bullet core is ensured to always keep a sharp head shape in the process of penetrating through a target plate, and the energy is more concentrated.
Because of satisfying the above characteristics, the tungsten filament reinforced metal matrix composite material is receiving attention from researchers in the field of armor piercing bullets. The conventional preparation method of the tungsten wire reinforced metal matrix composite mainly comprises the following steps: pressure infiltration and conventional infiltration, wherein the conventional infiltration raises the temperature above the melting point of the binder phase, and when the metal is molten, the molten metal level is higher than the sample and then cooled, the desired material is obtained. The method has simple process, but in the infiltration process, the defects of shrinkage cavity and the like are easily generated in the bonding phase.
In the past research of the inventor, the tungsten wire reinforced copper-zinc-based composite material is prepared by adopting a novel capillary infiltration method, a middle gap after the tungsten wires are densely arranged is used as a capillary, and infiltration is carried out by utilizing the capillary force, so that the possibility of generating shrinkage cavities inside a binding phase is greatly reduced.
Disclosure of Invention
Although the inventor discloses a method for preparing a tungsten wire reinforced copper-based composite material by adopting a novel capillary infiltration method in the previous research, the infiltration method needs to utilize the capillary effect, so that the tungsten wire reinforced copper-based composite material can only be prepared when tungsten wires are densely arranged, the volume fraction of tungsten is certain, and the adjustment cannot be carried out; meanwhile, because the melting temperature of tungsten is far lower than the infiltration temperature of copper, metallurgical bonding cannot be formed between the tungsten wire and the tungsten wire, so that cracks are easily generated in the using process, and the application of the tungsten wire in the field of armor piercing bullets is limited.
In order to overcome the defect that the interface of a tungsten wire and the tungsten wire is easy to crack when the tungsten wire reinforced copper-zinc-based composite material prepared by the prior art is used, the inventor provides a thought for controlling the interface of the tungsten wire and the tungsten wire, the interface of the tungsten wire and the tungsten wire is separated by a bonding phase, and the bonding phase and the interface of the tungsten wire are used for replacing the original interface of the tungsten wire and the tungsten wire, so that the interface of the tungsten wire and the tungsten wire is reduced from the source. Meanwhile, the inventor proposes a feasible solution for the idea, that is, copper is plated on the surface of a tungsten wire, the tungsten wire and tungsten wire interface is replaced by a tungsten wire and tungsten wire bonding phase interface by using a copper plating layer, then copper infiltration is performed by using capillary force of a middle gap after the copper-plated tungsten wire is densely arranged, and due to the copper plating treatment on the surface of the tungsten wire, on the premise that the tungsten wire and the tungsten wire are not in contact, specifically, when the distance between the tungsten wires (namely, as shown in fig. 4, the difference between the distance between the circle centers of the cross sections of two adjacent tungsten wires and the radius of the two tungsten wires is subtracted) is 10um to 2mm, preferably 10um to 50um, the capillary effect can be ensured, so that the infiltration process can be completed. While the material keeps high density, the tungsten wire and the tungsten wire are not contacted and still exist after infiltration is finished.
Therefore, the invention aims to overcome the defect that the tungsten wire reinforced copper-zinc-based composite material prepared by the prior art is easy to crack in use, and provides the preparation method of the interface control tungsten wire bundle reinforced copper-based composite material.
In order to achieve the purpose, the purpose of the invention is realized by the following technical scheme: the surface of the tungsten wire is electroplated with copper, a certain amount of electroplated tungsten wires are bound into a bundle, and then the tungsten wire bundle is infiltrated with copper, wherein the copper is used as a binding phase of the alloy.
Specifically, the invention provides a preparation method of an interface control tungsten filament bundle reinforced copper-based composite material, which is characterized by comprising the following steps: the preparation method comprises the following steps:
(1) Electroplating copper on the surface of the tungsten wire;
(2) Binding a certain amount of copper-plated tungsten wires into a bundle;
(3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; when infiltration begins, copper is placed at the bottom of an infiltration device in a state that a matrix is a block or powder, and a tungsten filament bundle is erected in the infiltration device and only the bottom of the tungsten filament bundle is in contact with the copper.
The invention also provides an interface control tungsten filament bundle reinforced copper-based composite material prepared by the method.
Compared with the existing alloy, the interface control tungsten filament bundle reinforced copper-based composite material prepared by the invention has the following advantages:
(1) After the surface of the tungsten wire is plated with copper and then bound into a beam, the tungsten wire can be uniformly distributed in a binding phase, and the tungsten wire is easy to shear and damage in the armor piercing process, so that the composite material has the armor piercing self-sharpening characteristic.
(2) There is no direct contact between the filaments.
(3) The material prepared by the invention and the tungsten filament bundle reinforced copper-based composite material without interface control are subjected to quasi-static compression mechanical property test, and as a result, after interface modification, the plasticity of the composite material is obviously improved on the premise of small strength change.
Drawings
FIG. 1 is a schematic view of an electrolytic copper plating apparatus;
FIG. 2 is a schematic view of the production principle of the present invention, in which a tungsten wire is schematically shown in a cross-sectional view;
FIG. 3 is a schematic view of the copper infiltration process of the present invention;
FIG. 4 is a scanning electron micrograph of a cross-section of a composite prepared according to an example of the present invention;
FIG. 5 is a graph showing the quasi-static compressive true stress and true strain mechanical properties of the interface-controlled tungsten filament bundle reinforced copper-based composite material of example 1 and the non-interface-controlled tungsten filament bundle reinforced copper-based composite material of comparative example 1.
Detailed Description
The invention provides a preparation method of an interface control tungsten filament bundle reinforced copper-based composite material, which is characterized by comprising the following steps of: the preparation method comprises the following steps:
(1) Electroplating copper on the surface of the tungsten wire;
(2) Binding a certain amount of copper-plated tungsten wires into a bundle;
(3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; wherein, the copper is arranged at the bottom of the infiltration device in a state that the matrix is a block or powder at the beginning of the infiltration, the tungsten filament bundle is erected in the infiltration device and only the bottom of the tungsten filament bundle is contacted with the copper, as shown in figure 3.
The diameter of the tungsten wire and the thickness of the copper plating layer in the present invention are not particularly limited, and may be in the range of data commonly used in the art, for example, the diameter of the tungsten wire may be 0.2 to 0.25mm, and the thickness of the plating layer may be 0.1 to 0.15mm.
In the step (1), the tungsten wires are straightened, and then each tungsten wire is electroplated with copper. In the present invention, the method for electroplating copper is not particularly limited, and any conventional method may be used. For example, the electrolytic copper plating may be performed by using an electrolytic copper plating apparatus shown in FIG. 1.
In the present invention, the infiltration method is not particularly limited, and any conventional method may be employed.
FIG. 2 is a schematic diagram of the preparation principle of the present invention, and a schematic diagram of a tungsten filament in a cross section is shown in the diagram.
In the step (3), during infiltration, the tungsten filaments are arranged in a bundling manner, the distance between the tungsten filaments is 10um to 50um, and within the range, smooth capillary action can be ensured, so that copper is effectively infiltrated into the tungsten filaments. Wherein the matrix is copper or copper alloy doped with Zn, al, sn and other elements. In the matrix, the mass percent of copper is 50-100%, preferably 80-100%.
The invention also provides an interface control tungsten filament bundle reinforced copper-based composite material prepared by the method. In the interface control tungsten filament bundle reinforced copper-based composite material prepared by the invention, tungsten filaments are arranged in a bundling manner, finally the tungsten filaments are uniformly distributed in a binding phase, the tungsten filaments are completely not contacted, and the distance between the tungsten filaments is 10-50 um, for example, a scanning electron microscope photo of the interface control tungsten filament bundle reinforced copper-based composite material prepared by one example of the invention is shown in figure 4.
In the tungsten filament bundle reinforced copper-based composite material, the content of tungsten in the total material is 50-95% by mass, preferably 80-95%; the mass percentage of copper in the binder phase is 50-100%, preferably 80-100%, that is, the binder phase may be pure copper, or may be added with elements such as Zn, al, sn, etc.
The material prepared by the invention and the tungsten filament bundle reinforced copper-based composite material without interface control are subjected to quasi-static compression mechanical property test, the result is shown in figure 5, and after interface modification, the plasticity of the composite material is obviously improved on the premise that the strength is not changed greatly.
Examples
The following is a description of six specific examples, a comparative example, and to aid in a further understanding of the invention. However, the specific details of the embodiments are only for illustrating the present invention and do not represent all technical solutions under the concept of the present invention, and therefore, the present invention should not be construed as being limited to the technical solutions of the present invention. Insubstantial modifications, e.g. simple changes or substitutions in technical features having the same or similar technical effects without departing from the spirit of the invention are intended to be covered by the claims.
Example 1
A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material comprises the following components and contents (weight percentage): 90% of tungsten and 100% of copper in a binding phase, and the preparation method comprises the following steps:
step one, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of a coating is 0.1mm.
And step two, cleaning the electroplated tungsten wires in an ultrasonic cleaning device by using alcohol, and binding the tungsten wires into bundles after drying.
And step three, infiltration, wherein copper is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper, and the distance between the tungsten filaments is 10um to 50um. Carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1100 ℃, the infiltration time is 4h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
Example 2
A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material comprises the following components and contents (weight percentage): 90% of tungsten and 100% of copper in a binding phase, and the preparation method comprises the following steps:
step one, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of a plating layer is 0.15mm.
And step two, cleaning the electroplated tungsten wires in an ultrasonic cleaning device by using alcohol, and binding the tungsten wires into bundles after drying.
And step three, infiltration, wherein copper is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper, and the distance between the tungsten filaments is 10um to 50um. Carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1400 ℃, the infiltration time is 4h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
Example 3
A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material comprises the following components and contents (weight percentage): 90% of tungsten and 100% of copper in a binding phase, and the preparation method comprises the following steps:
step one, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.15mm, and the thickness of a plating layer is 0.1mm.
And step two, cleaning the electroplated tungsten wires in an ultrasonic cleaning device by using alcohol, and binding the tungsten wires into bundles after drying.
And step three, infiltration, wherein copper is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper, and the distance between the tungsten filaments is 10um to 50um. And (3) carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1100 ℃, the infiltration time is 4h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
Example 4
A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material comprises the following components and contents (weight percentage): 85% of tungsten and 100% of copper in a binding phase, and the preparation method comprises the following steps:
step one, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of a plating layer is 0.1mm.
And step two, cleaning the electroplated tungsten wires in an ultrasonic cleaning device by using alcohol, and binding the tungsten wires into a bundle after drying.
And step three, infiltration, wherein copper is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper, and the distance between the tungsten filaments is 10um to 50um. Carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1200 ℃, the infiltration time is 3h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
Example 5
A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material comprises the following components and contents (weight percentage): 90% of tungsten, 90% of copper in a binding phase and 10% of zinc, and the preparation method comprises the following steps:
step one, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of a plating layer is 0.1mm.
And step two, cleaning the electroplated tungsten wires in an ultrasonic cleaning device by using alcohol, and binding the tungsten wires into bundles after drying.
And step three, infiltration, wherein the copper-zinc alloy is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper-zinc alloy, and the distance between the tungsten filaments is 10-50 um. Carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1100 ℃, the infiltration time is 4h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
Example 6
A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material comprises the following components and contents (weight percentage): 90% of tungsten and 100% of copper in a binding phase, and the preparation method comprises the following steps:
step one, electroplating copper on the surface of a tungsten wire, wherein the diameter of the tungsten wire is 0.25mm, and the thickness of a plating layer is 0.1mm.
And step two, cleaning the electroplated tungsten wires in an ultrasonic cleaning device by using alcohol, and binding the tungsten wires into a bundle after drying.
And step three, infiltration, wherein copper is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper, and the distance between the tungsten filaments is 10um to 50um. And (3) carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1100 ℃, the infiltration time is 4h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
Comparative example 1
A preparation method of a tungsten filament bundle reinforced copper-based composite material comprises the following components in percentage by weight: 90% of tungsten and 100% of copper in a binding phase, and the preparation method comprises the following steps:
step one, cleaning the electric tungsten wires by alcohol in an ultrasonic cleaning device, and binding the electric tungsten wires into bundles after drying.
And step two, infiltration, wherein copper is a block during infiltration and is arranged below the infiltration device, the tungsten filament bundle is vertically arranged above the copper, and the distance between the tungsten filaments is 10um to 50um. And (3) carrying out infiltration in a hydrogen atmosphere, wherein the infiltration temperature is 1100 ℃, the infiltration time is 4h, the heating rate is 7 ℃/min, and the cooling mode is furnace cooling.
According to the national standard GB/T7314-2005, the tungsten filament bundle reinforced copper-based composite material prepared in the comparative example 1 and the tungsten filament bundle reinforced copper-based composite material prepared in the comparative example 1 have almost the same strength as shown in FIG. 5, but the critical failure strain of the tungsten filament reinforced copper-based composite material after interface control in the example 1 is about 0.24 and is much higher than 0.15 of the tungsten filament reinforced copper-based composite material without interface improvement in the comparative example 1, and the plasticity of the material after interface modification is remarkably improved.
Claims (10)
1. A preparation method of an interface control tungsten filament bundle reinforced copper-based composite material is characterized by comprising the following steps: the method comprises the following steps:
(1) Electroplating copper on the surface of the tungsten wire;
(2) Binding a certain amount of copper-plated tungsten wires into a bundle;
(3) Infiltrating copper into the tungsten filament bundle prepared in the step (2) by utilizing capillary action; when infiltration begins, copper is placed at the bottom of an infiltration device in a state that a matrix is a block or powder, and a tungsten filament bundle is erected in the infiltration device and only the bottom of the tungsten filament bundle is in contact with the copper.
2. The method of claim 1, wherein: in the step (1), the tungsten wires are straightened, and then each tungsten wire is electroplated with copper.
3. The method of claim 1, wherein: in the step (3), during infiltration, the tungsten filaments are arranged in a bundling manner, and the distance between the tungsten filaments is 10um to 50um.
4. The method of claim 1, wherein: in the step (3), the matrix is copper or copper alloy doped with Zn, al or Sn elements.
5. The method of claim 4, wherein: in the matrix, the mass percent of copper is 50-100%.
6. The method of claim 5, wherein: in the matrix, the mass percent of copper is 80-100%.
7. An interface-controlled tungsten-filament-bundle-reinforced copper-based composite material prepared by the method of any one of claims 1 to 6.
8. The interface control tungsten filament bundle reinforced copper-based composite material according to claim 7, wherein: in the tungsten filament bundle reinforced copper-based composite material, tungsten filaments are uniformly distributed in a bonding phase, the tungsten filaments are not contacted completely, and the distance between the tungsten filaments is 10um to 50um.
9. The interface control tungsten filament bundle reinforced copper-based composite material according to claim 7, wherein: in the tungsten filament bundle reinforced copper-based composite material, the mass percentage of tungsten in the total material is 50-95%; the mass percentage of copper in the binding phase is 50-100%.
10. The interface control tungsten filament bundle reinforced copper-based composite material according to claim 9, wherein: in the tungsten filament bundle reinforced copper-based composite material, the tungsten accounts for 80-95% of the total material by mass; the mass percentage of copper in the binding phase is 80-100%.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6324026A (en) * | 1986-07-17 | 1988-02-01 | Toshiba Corp | Production of tungsten wire-reinforced composite material |
| CN1651590A (en) * | 2005-02-03 | 2005-08-10 | 西安建筑科技大学 | Preparation technology of tungsten copper or tungsten silver composite material |
| CN102433480A (en) * | 2011-12-01 | 2012-05-02 | 北京理工大学 | Tungsten-copper alloy with low skeleton connectivity and preparation method thereof |
| CN106119817A (en) * | 2016-06-28 | 2016-11-16 | 西安理工大学 | A kind of method of W fiber surface chemical deposition morphology controllable nickel dam |
-
2022
- 2022-07-20 CN CN202210856986.7A patent/CN115161567B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6324026A (en) * | 1986-07-17 | 1988-02-01 | Toshiba Corp | Production of tungsten wire-reinforced composite material |
| CN1651590A (en) * | 2005-02-03 | 2005-08-10 | 西安建筑科技大学 | Preparation technology of tungsten copper or tungsten silver composite material |
| CN102433480A (en) * | 2011-12-01 | 2012-05-02 | 北京理工大学 | Tungsten-copper alloy with low skeleton connectivity and preparation method thereof |
| CN106119817A (en) * | 2016-06-28 | 2016-11-16 | 西安理工大学 | A kind of method of W fiber surface chemical deposition morphology controllable nickel dam |
Non-Patent Citations (2)
| Title |
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| 陈文革等, 冶金工业出版社 * |
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