CN114454363A

CN114454363A - Silicon rod cutting method, device and system

Info

Publication number: CN114454363A
Application number: CN202110955059.6A
Authority: CN
Inventors: 杨保聚; 周波; 戴鑫辉; 东野广俊
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2021-07-13
Filing date: 2021-08-19
Publication date: 2022-05-10
Also published as: CN114454359B; CN114454359A; CN114454362A; CN114454368A; CN114454366A; CN114454370A; CN114454367A; CN114454365A

Abstract

The embodiment of the application provides a silicon rod cutting method, silicon rod cutting equipment and a silicon rod cutting system, wherein the method comprises the following steps: limiting the silicon rod on cutting equipment; synchronously cutting the silicon rod by using a first section and a second section which are parallel to the length direction of the silicon rod, wherein the number of the first sections is two, and the two first sections are parallel; the number of the second tangent planes is at least three, and the at least three second tangent planes are mutually parallel; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface. The silicon rod cutting method, the silicon rod cutting equipment and the silicon rod cutting system can overcome the defect of cutting a small structure by a large structure in the traditional scheme.

Description

Silicon rod cutting method, device and system

Technical Field

The application relates to a hard and brittle material cutting technology, in particular to a silicon rod cutting method, silicon rod cutting equipment and a silicon rod cutting system.

Background

With the development of heterojunction cells, the market demands for small silicon wafers and thin wafers are higher and higher, the thickness of the silicon wafers ranges from 180 micrometers to 150 micrometers, the future market may need silicon wafers with the thickness of 90 micrometers, even 70 and 80 micrometers, and thinner silicon wafers need smaller silicon wafer specifications to ensure the cutting quality and process.

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer, but in the laser scribing process, damage and defect states can be generated on the cross section of the small silicon wafer, and the conversion efficiency of the finally processed heterojunction battery is seriously influenced.

The silicon rods are larger and larger in size from 166mm to 182mm, then to 210mm, and may reach 230mm or even 250mm in the future, so that the yield of large silicon rods cut into large silicon wafers is reduced, and meanwhile, the subsequent process is too high in requirement and extremely easy to break.

Disclosure of Invention

In order to solve one of the technical defects, embodiments of the present application provide a silicon rod cutting method, apparatus and system.

According to a first aspect of embodiments of the present application, there is provided a silicon rod cutting method including:

limiting the silicon rod on cutting equipment;

synchronously cutting the silicon rod by using a first section and a second section which are parallel to the length direction of the silicon rod, wherein the number of the first sections is two, and the two first sections are parallel; the number of the second tangent planes is at least three, and at least three second tangent planes are parallel to each other; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface.

According to a second aspect of the embodiments of the present application, there is provided a cutting apparatus to which the above silicon rod cutting method is applied, including:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device is provided with a wire cutting wheel set;

the cutting wire wound on the cutting wire wheel set is used for cutting the silicon rod.

According to a third aspect of embodiments of the present application, there is provided a silicon rod cutting system comprising: the cutting equipment is used for cutting the silicon rod by the first cutting surface and the second cutting surface to obtain a small silicon rod; and the number of the first and second groups,

grinding equipment for grinding the small silicon rod.

In the embodiment, the silicon rod is cut through the first cut surface and the second cut surface simultaneously to directly obtain the small silicon rod with a smaller cross section area, so that the production efficiency is higher, the small silicon rod is subsequently sliced to directly obtain the small silicon wafer meeting the size requirement of the silicon wafer for preparing the small heterojunction battery, the step of laser scribing is not needed, the product quality of the small silicon wafer is improved, and the conversion efficiency of the heterojunction battery is further ensured.

Drawings

Fig. 1 is a flowchart of a silicon rod cutting method according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a silicon rod cutting method provided in an embodiment of the present application for cutting a silicon rod;

fig. 3 is a schematic view of a cutting structure for cutting edge skin in the silicon rod cutting method according to the embodiment of the present application;

fig. 4 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application;

FIG. 5 is a schematic view of a wire cutting device in the cutting apparatus shown in FIG. 4;

FIG. 6 is a schematic view illustrating a structure of the silicon rod cut by the wire cutting device in the cutting apparatus shown in FIG. 4;

fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 8 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 9 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 10 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 11 is a schematic structural view of still another silicon rod cutting apparatus provided in the embodiments of the present application;

fig. 12 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 13 is a first structural schematic view of a wire cutting device in a silicon rod cutting apparatus according to an embodiment of the present application;

fig. 14 is a second structural schematic view of a wire cutting device in the silicon rod cutting apparatus according to the embodiment of the present application;

fig. 15 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 16 is a cross-sectional view of a clamping mechanism in a cutting device according to an embodiment of the present application;

fig. 17 is a schematic structural diagram of another carrier table in the cutting apparatus according to the embodiment of the present application;

FIG. 18 is a cross-sectional view of a cutting reel in the cutting apparatus provided in the embodiments of the present application;

FIG. 19 is a first schematic structural diagram illustrating a clamping device of the cutting apparatus according to the embodiment of the present application gripping the edge leather;

FIG. 20 is a second schematic structural diagram illustrating the clamping device of the cutting apparatus provided in the embodiment of the present application gripping the edge leather;

FIG. 21 is a schematic structural view of a silicon rod grinding apparatus provided in an embodiment of the present application;

fig. 22 is a schematic structural view of the grinding apparatus shown in fig. 21, in which a small silicon rod is clamped on a sliding table device;

fig. 23 is a schematic structural view of a slide table device in the grinding apparatus shown in fig. 21;

fig. 24 is a schematic view showing a structure of a grinding unit in the grinding apparatus shown in fig. 21.

Reference numerals:

a 1-silicon rod; a 4-small silicon rods; a 5-small raw material pieces; a 6-offcut; a 61-arc top; a 62-corner portions; a 63-flaw-piece bar;

b 1-first cut plane; b 2-second cut surface; b 3-third cut surface; b 4-fourth cut surface;

1-a base;

2-a bearing platform; 211-1-a main load bearing portion; 211-2-an auxiliary carrier; 221-a limiting mechanism; 23-a clamping mechanism; 321-a clamp drive member mechanism; 232-telescopic rod; 233-clamping head; 251-flat plate type abutting plates; 252-L-shaped abutment plates; 261-a first preset opening;

301-main support; 302-reel support; 31-a cutting wire wheel; 311-wire chase; 32-a cutting line; 34-a pay-off mechanism; 35-a wire arranging mechanism; 36-a take-up mechanism; 38-laser alignment means; 39-spray lubrication device;

401-feeding area; 402-grinding the area; 41-a base assembly; 42-a feeding assembly; 421-a feeding sliding table; 422-head frame; 423-tailstock; 44-headstock chuck; 425-tailstock chuck;

51-a fixture; 52-a jaw; 521-a mounting plate; 522-jaw body.

Detailed Description

In order to make the technical solutions and advantages in the embodiments of the present application more clearly understood, the following description of the exemplary embodiments of the present application with reference to the accompanying drawings is made in further detail, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all the embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a silicon rod cutting method, which is used for cutting a silicon rod to obtain a small sheet-shaped silicon wafer. The silicon rod may be a polysilicon material, a single crystal silicon material, etc., and the embodiment only takes the single crystal silicon material as an example to specifically describe the cutting method. The technical solution provided by this embodiment can be directly applied to cutting other materials by those skilled in the art, and can also be applied to cutting other materials after being subjected to adaptive modification.

Fig. 1 is a flowchart of a silicon rod cutting method according to an embodiment of the present disclosure, and fig. 2 is a schematic view of a silicon rod cutting method according to an embodiment of the present disclosure. As shown in fig. 1 and fig. 2, the cutting method provided by the present embodiment includes:

step 101, limiting the silicon rod on cutting equipment.

Step 102, synchronously cutting the silicon rod by using a first section and a second section which are parallel to the length direction of the silicon rod, wherein the number of the first sections is two, and the two first sections are parallel; the number of the second sections is at least three, and the at least three second sections are mutually parallel; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface.

In this embodiment, the silicon rod is a single crystal silicon rod, and the shape of the silicon rod is a cylinder, and the length direction of the silicon rod is the central line direction of the cylinder, which may also be referred to as the axial direction.

The two first cut surfaces b1 are parallel and can be symmetrically arranged at two sides of the central line of the silicon rod a1, and the edge skin material at the top and the edge skin material at the bottom of the silicon rod are cut off. At least three second tangent planes b2 are parallel and distributed at intervals, the second tangent plane b2 is vertical to the first tangent plane b1, and the second tangent planes b2 at two sides cut off the edge leather at the left side and the edge leather at the right side. The silicon rod a1 is cut synchronously by the two first cut surfaces b1 and the at least three second cut surfaces b2, and at least two small silicon rods a4, as well as a left side leather, a right side leather, a top side leather and a bottom side leather are obtained.

The left and right side leather materials are provided with a plane and an arc surface, and the arc surface is connected with the plane. The top and bottom edge leather materials are provided with two vertical planes and arc surfaces connected between the two vertical planes.

In the traditional scheme, a cylindrical silicon rod is cut into a square rod with a rectangular cross section, then the square rod is cut to obtain a large silicon wafer with a large size, and then the large silicon wafer is cut into small silicon wafers by adopting a laser scribing technology, so that the small silicon wafers are damaged.

In the embodiment, the silicon rod is cut by the two first cut surfaces and the at least three second cut surfaces in the step 102, so that at least two small silicon rods a4 with smaller cross-sectional areas are directly obtained, the number of cutting steps is small, the efficiency is high, and the small silicon rods a4 are subsequently cut to directly obtain small silicon wafers meeting the size requirement of the silicon wafers for preparing small heterojunction batteries, so that the step of laser scribing is not needed, the product quality of the small silicon wafers is improved, and the conversion efficiency of the heterojunction batteries is further ensured.

The cutting step of the small silicon rod a4 specifically comprises the following steps: the small silicon rod a4 was sliced along the longitudinal direction of the small silicon rod a4 in a slice perpendicular to the longitudinal direction of the small silicon rod a4, to obtain a plurality of small starting pieces a 5. The step of slicing may be performed by a microtome known in the art.

On the basis of the technical scheme, before slicing the small silicon rod a4, the small silicon rod a4 needs to be ground. Referring to the above steps, the small silicon rod a4 having a rectangular cross section and four surfaces parallel to the longitudinal direction thereof as side surfaces was obtained. After obtaining the small silicon rod a4, four side surfaces of the small silicon rod a4 were ground, and then the edge angle between two adjacent side surfaces in the small silicon rod a4 was ground to form a chamfered surface between the two side surfaces, resulting in a ground small silicon rod a 4'.

The side face of the small silicon rod is ground, so that the surface of the small silicon rod is smooth, the edge of a small silicon wafer formed by subsequent slicing is smooth, trimming is not needed in a laser scribing mode, and the quality of the small silicon wafer is improved. The edges and corners of the small silicon rods are ground to form a chamfer surface, so that the cutting line can be prevented from contacting the edges and corners of the small silicon rods in the slicing process, and the corners of the silicon wafers are damaged.

In the scheme, when the number of the second cut surfaces b2 is three, two second cut surfaces positioned at the outer side are symmetrically arranged at two sides of the central line of the silicon rod, and the ratio of the cross sectional areas of the obtained two small silicon rods a4 is 1:1-1: 6. The number and specific cutting position of the third cut surface b3 can be determined according to the size of the small silicon rod a4 and the size of the small silicon wafer to be produced, so as to meet the preparation requirements of small batteries with different specifications and sizes. In the present embodiment, the number of the second cut surfaces b2 is three, and the second cut surface b2 located in the middle passes through the center line of the silicon rod a1, so that the cross-sectional areas of the two small silicon rods s4 are equal.

In the above solution, the distance between the two second cut surfaces b2 located at the outer side is smaller than the surface width of the first cut surface b1 formed by cutting the silicon rod a 1. So that the second tangent plane b2 is not contacted with the junction of the plane of the middle rod a2 and the cambered surface, the cutting process is stable and accurate, and the size precision of the small silicon rod a4 is ensured.

One implementation is as follows: the number of the second cut surfaces b2 is three, the distance between the two second cut surfaces b2 positioned at the outer side is equal to the distance between the two first cut surfaces b1, and the length-to-width ratio of the cross section of the obtained small silicon rod a4 is 2: 1.

Furthermore, the cut offcuts on the left side and the right side can be cut, so that a silicon rod with a smaller section area can be obtained and utilized, and the waste of raw materials is reduced.

Fig. 3 is a schematic view of a cutting structure for cutting edge skin in the silicon rod cutting method according to the embodiment of the present application. As shown in fig. 3, the side skin a6 is cut by a third cut surface b3 parallel to the length direction of the side skin, and the third cut surface b3 is parallel to the bottom surface of the side skin a6 to cut off the arc-shaped top a61 of the side skin.

Cutting the edge leather a6 by a fourth cut surface b4 parallel to the length direction of the edge leather, wherein the fourth cut surface b4 is vertical to the bottom surface of the edge leather a 6; the number of the fourth cut surfaces b4 is two, and the four cut surfaces b4 are symmetrically arranged on two sides of the flaw-piece material a6 to cut off corner portions a62 on two sides of the flaw-piece material a6, so that the flaw-piece silicon rod a63 with a rectangular cross section is obtained.

The sequence of cutting off the arc-shaped top a61 and the corner a62 of the edge leather can be interchanged, namely: the arc-shaped top part a61 can be cut off firstly, and then the corner part a62 can be cut off; the corner a62 may be cut off first, and then the arc top a61 may be cut off.

On the basis of the technical scheme, the embodiment also provides silicon rod cutting equipment, and the silicon rod is cut by applying the cutting method.

Fig. 4 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application. As shown in fig. 4, the cutting apparatus includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 and wire cutting device all set up on base 1.

The carrying table 2 is used for carrying the silicon rod a1, the silicon rod a1 is placed on the carrying table 2, and a part for fixing and limiting the silicon rod a1 can be further arranged on the carrying table 2 so as to limit the silicon rod a1 to move in the cutting process. The silicon rod a1 can be horizontally placed on the bearing platform 2, or vertically placed on the bearing platform 2, specifically, the silicon rod a1 is horizontally placed on the bearing platform 2, and the length direction of the silicon rod a1 extends along the horizontal direction; the silicon rod a1 is placed vertically on the susceptor 2, and the length direction of the silicon rod a1 extends in the vertical direction. When the silicon rod a1 is placed in different manners, the configuration and cutting manner of the wire cutting apparatus are also different.

The wire cutting device and the carrier 2 can be moved relatively along the length direction of the silicon rod a1 by one method: the carrier 2 is fixed on the base 1, and the wire cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the main support is fixedly arranged on the base, and the wire wheel support moves relative to the main support under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed on the base 1, and the bearing table 2 moves relative to the linear cutting device under the driving action of the driving mechanism.

The wire cutting device is provided with a wire cutting wheel set, and the cutting wire wound on the wire cutting wheel set is used for cutting the silicon rod.

Fig. 5 is a schematic structural view of a wire cutting device in the cutting apparatus shown in fig. 4, and fig. 6 is a schematic structural view of a silicon rod cut by the wire cutting device in the cutting apparatus shown in fig. 4. As shown in fig. 4 to 6, the stage 2 is provided on the base 1, and the silicon rod a1 is vertically placed on the stage 2.

And an annular cutting line is wound on a cutting line wheel in the line cutting device, and the cutting line wheel moves up and down to cut the silicon rod. Specifically, the wire cutting apparatus includes: the device comprises a main support 301, a wire wheel support 302 and a support driving mechanism, wherein the main support 301 is fixedly arranged on a base 1, a sliding rail is arranged on the main support 301, and the wire wheel support 302 moves along the sliding rail under the driving action of the support driving mechanism and moves up and down relative to the main support 301.

The carrier 2 comprises two parts: bearing part and tight portion in top, bearing part sets up on base 1, and the tight portion in top sets up on main support 301. The silicon rod is vertically arranged between the bearing part and the jacking part, and the top level part jacks the silicon rod downwards. The silicon rod is cut by moving the wire wheel support 302 up and down.

Be provided with first cutting line wheelset and second cutting line wheelset on the line wheel support 302, wherein, first cutting line wheelset includes: cutting wheels 31-1, 31-2, 31-3 and 31-4; the second cutting line wheel set comprises: 31-5, 31-6, 31-7, 31-8, 31-9 and 31-10.

From the view point of fig. 5 and 6 only, the cutting wheels 31-1, 31-2 are at the same level, and the cutting wheels 31-3, 31-4 are at the same level and below the cutting wheels 31-1, 31-2. Annular cutting lines are wound on the cutting line wheels 31-1 and 31-2 and used as first cutting lines to cut the silicon rod; the cutting wire wheels 31-3, 31-4 are provided with annular cutting wires around them, which are used as another first cutting surface for cutting the silicon rod. The cutting reels 31-1, 31-3 are respectively arranged on the reel support 302, or the two can be arranged on the same rotating shaft. The cutting wire wheels 31-2 and 31-4 are respectively arranged on the wire wheel bracket 302, or the cutting wire wheels and the wire wheel bracket can be arranged on the same rotating shaft.

The cutting wire wheels 31-5 and 31-6 are arranged up and down to form a pair of wire wheels, the cutting wire wheels 31-7 and 31-8 are arranged up and down to form a pair of wire wheels, and the cutting wire wheels 31-9 and 31-10 are arranged up and down to form a pair of wire wheels. The three pairs of wire wheels are arranged side by side, the annular cutting lines wound on the cutting wire wheels 31-5 and 31-6 are used as second tangent planes, the annular cutting lines wound on the cutting wire wheels 31-57 and 31-8 are used as second tangent planes positioned in the middle, and the annular cutting lines wound on the cutting wire wheels 31-9 and 31-10 are used as another second tangent plane to cut the silicon rod. The cutting reels 31-5, 31-7, 31-9 may be arranged on the same spindle. Or 31-5 and 31-9 are respectively arranged on the reel supports 302, and 31-7 can be arranged on the same rotating shaft with 31-5 or 31-9.

For each pair of wire wheels, at least one tension wheel can be adopted, and the annular cutting wire is also sleeved on the tension wheel and used for keeping the tension of the cutting wire. The cutting line can be driven by the line wheel driver, for example, the line wheel driver drives the driving wheel at the output end to rotate, and the driving wheel drives the cutting line sleeved on the driving wheel to move.

Spaces for silicon rods to pass through are reserved in the middle of the regions where the cutting wire wheels are arranged, and the silicon rods are cut through the cutting wires in the process that the wire wheel supports and the silicon rods move relatively.

Further, the cutting apparatus further comprises: the silicon rod cutting device comprises a sleeve capable of moving vertically and a boundary leather clamping jaw, wherein the sleeve is used for being sleeved on the outer side of a silicon rod, the boundary leather clamping jaw is inserted between a boundary leather material and the cut silicon rod from the top, and a clamping force is applied to the boundary leather material by the boundary leather clamping jaw and the sleeve. The edge leather clamping jaws and the sleeve clamp the edge leather and move the edge leather to an edge leather recovery area.

Fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Different from the above scheme, in the cutting device shown in fig. 7, the reel support 302 is fixedly arranged on the main support 301, and the plummer 2 is matched with the slide rail on the main support 301 to realize that the plummer 2 moves relative to the reel support 302. The silicon rod is driven to move up and down through the bearing platform 2, and the silicon rod is cut through the cutting line wheel.

Fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from the scheme is that: in the cutting device shown in fig. 8, the linear cutting device further includes, in a manner of long linear cutting: the device comprises a pay-off mechanism 34, a take-up mechanism 36 and a wire arrangement mechanism 35, wherein the pay-off mechanism 34 and the take-up mechanism 36 are respectively arranged on two sides of a cutting wire wheel set, and a cutting wire is a single long wire wound among the pay-off mechanism 35, the take-up mechanism 36, the wire arrangement mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used for uniformly winding the cutting wire on the wire winding mechanism 36 or the wire releasing mechanism 34.

During the cutting process, the cutting line 32 is wound out from the pay-off mechanism 34, guided by the wire arranging mechanism 35, passes through each cutting wire wheel 31, and then is retracted by the take-up mechanism 35. In one cutting process, the wire unwinding mechanism 34 also functions as the wire winding mechanism 36, and the wire winding mechanism 36 also functions as the wire winding mechanism 34 to reciprocate the cutting wire 31.

Fig. 9 is a schematic view of a still another silicon rod cutting apparatus provided in an embodiment of the present application. Different from fig. 8, in the cutting apparatus shown in fig. 9, the reel support 302 is fixedly arranged on the main support 301, and the carrier table 2 is matched with the slide rail on the main support 301 to realize that the carrier table 2 moves relative to the reel support 302. The silicon rod is driven to move up and down through the bearing platform 2, and the silicon rod is cut through a cutting line wound on the cutting line wheel.

Fig. 10 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Unlike the previous embodiment, fig. 10 shows a horizontal cutting method, wherein the main support 301 comprises a top plate and support legs vertically arranged at the bottoms of four top corners of the top plate, and the support legs are fixed on the base 1. The base 1 is provided with a slide rail, and the bottom of the wire wheel support 302 is matched with the slide rail, so that the wire wheel support 302 can move relative to the base 1. The plummer 2 is fixed to the lower surface of the top plate of the main support 301, and clamps the silicon rod from both ends. The silicon rod is cut by moving the wire wheel support 302 relative to the silicon rod.

Fig. 11 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. Different from fig. 10, in the cutting apparatus shown in fig. 11, the reel support 302 is fixedly disposed on the base 1, the lower surface of the top plate of the main support 301 is provided with a slide rail, the plummer 2 is matched with the slide rail to enable the plummer 2 to drive the silicon rod to move relative to the main support 301, and in the process of moving the silicon rod, the silicon rod is cut by winding the cutting line disposed on the cutting reel.

For the horizontal cutting device shown in fig. 10 and 11, a long-line cutting mode can also be adopted according to the above scheme, and one cutting line is wound on the pay-off mechanism, the wire arranging mechanism, the cutting wire wheel and the take-up mechanism, and the cutting line is driven by the pay-off mechanism and the take-up mechanism to reciprocate for cutting.

The cutting wire mentioned in this embodiment is a diamond wire, and is used for cutting a single crystal silicon material.

According to the scheme, the monocrystalline silicon rod can be directly cut and processed into small silicon wafers, and the defects of processing the small silicon wafers by large silicon wafers in the prior art are overcome.

The length L of the small silicon rod is greater than the width W and the height H thereof, and the longitudinal direction of the small silicon rod is understood to be the same as the axial direction of the silicon rod a 1.

In some embodiments of the present application, the plurality of small silicon rods have equal or unequal cross-sectional length and width values. When the sectional length and width values of the plurality of small silicon rods are equal, the small silicon wafers prepared by the plurality of small silicon rod slices have the same size; when the sectional length and width values of the plurality of small silicon rods are different, the small silicon wafers prepared from the plurality of small silicon rods are different in size, so that the small batteries with different specifications and sizes can be manufactured.

In some embodiments of the present application, in the step "slicing", each small silicon rod is individually sliced with a cutting plane parallel to the end face of the small silicon rod; alternatively, a plurality of small silicon rods are sliced simultaneously. Preferably, the slices are simultaneously sliced, so that the efficiency is higher.

In some embodiments of the present application, the method further comprises the steps of trimming the leather: and cutting the four pieces of the side leather materials in a direction that the section is parallel to the axis of the silicon rod, wherein each piece of the side leather material can be cut to obtain an outer side leather material and at least one middle side leather material. The outer side leather and the middle side leather are used for subsequent processing so as to improve the utilization rate of the silicon rod.

In some embodiments of the present application, the thicknesses of the outer and middle skins are equal or different to meet the processing requirements of different subsequent products.

This embodiment also provides a device for cutting edge cladding material, as shown in fig. 12, the cutting device includes: the wire cutting machine comprises a base 1, a bearing table 2 and a wire cutting device, wherein the bearing table 2 and the wire cutting device move relatively, the bearing table 2 can move relative to the base, and the wire cutting device can also move relative to the base. The edge leather can be horizontally placed on the bearing table 2 or vertically placed on the bearing table. The wire cutting device may be an annular cutting wire, or a single long wire, as described above.

The wire cutting apparatus includes a gate-shaped reel holder 302 on which a plurality of sets of cutting reels 32 are disposed. Fig. 12 is provided with four stations, and four edge leather materials can be cut simultaneously. For one station, the cutting device comprises a group of cutting wire wheels, at least two cutting wire wheels 32 are arranged horizontally or vertically, and cutting lines arranged on the two cutting wire wheels 32 are wound to form cutting surfaces along horizontal extension or vertical extension so as to cut off arc-shaped tops or corner parts of the boundary leather. Fig. 13 shows the horizontal arrangement. When one station comprises two groups of cutting wire wheels, two corner parts of the edge leather can be cut off simultaneously by winding the cutting wires arranged on the two groups of cutting wire wheels. Figure 14 shows a view of two sets of cutter wheels.

In the structure shown in fig. 12, the cutting reels are connected to the same rotating shaft, and the rotating shaft is driven to rotate by a driver, so that the cutting reels are driven to synchronously rotate. The connection between the driver and the rotating shaft can be direct drive, belt drive, chain drive or gear drive.

For the above-mentioned plummer 2, this embodiment further provides a specific implementation manner: fig. 15 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application. Fig. 15 shows four stations for cutting four trimmings simultaneously. For one of the stations, the carrier 2 has a first preset opening 261, giving way to the cutting line. The first preset opening 261 divides the front end of the bearing table into a main bearing part 211-1 and an auxiliary bearing part 211-2, and the main bearing part 211-1 and the auxiliary bearing part 211-2 are used for bearing the to-be-cut edge leather which is horizontally placed together.

When the edge leather material needs to be cut, the edge leather material is fixed on the bearing table in a flat mode, and at the moment, the edge leather material is located on the main bearing part, the auxiliary bearing part and the two first preset openings. The vertical cutting line enters the space between the main bearing part and the auxiliary bearing part from the first preset opening, and starts to cut from the end face of one end of the edge leather until the end face of the other end of the edge leather is cut.

It can be understood that after the edge portions of the edge leather are cut off, the edge leather side with the edge portions cut off can be placed on the bearing table in the process of cutting off the arc-shaped top, and the bearing table does not need to be provided with a preset opening.

Fig. 16 is a cross-sectional view of a clamping mechanism in a cutting device provided in an embodiment of the present application. As shown in fig. 15 and 16, the carrier table is further provided with a limiting mechanism 221 and a clamping mechanism 23. The clamping mechanism comprises a clamping driving mechanism 231, an expansion rod 232 and a clamping head 233, one end of the expansion rod is fixed on the side face of the clamping driving mechanism, and the other end of the expansion rod, which can expand and contract, is fixed on the clamping head and the clamping head 233 is arranged opposite to the limiting mechanism. The clamping driving mechanism is used for driving the telescopic rod to stretch and adjust the distance between the clamping head 233 and the limiting mechanism 221 so as to place the edge leather between the clamping head and the limiting mechanism, and the limiting mechanism 221 and the clamping head 233 are used for being pushed against the end faces of the two ends of the edge leather to fix the edge leather.

Further, the bearing device further comprises: and the flat-plate-type abutting plate 251 is fixedly arranged on the upper surfaces of the main bearing part 211-1 and the auxiliary bearing part 211-2, the upper surface of the main bearing part 211-1 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the main bearing part, and the upper surface of the auxiliary bearing part 211-2 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the auxiliary bearing part.

The flat plate type abutting plate 251 is a full-length flat plate type abutting plate, and one flat plate type abutting plate is fixed on each of the main bearing part 211-1 and the auxiliary bearing part 211-2. Or at least two flat plate type abutting plates are respectively fixed on the main bearing part and the auxiliary bearing part at intervals.

The carrier table is made of rigid material in order to support the edge leather and the components mounted thereon. The edge skin material of the brittle and hard material is brittle and hard. In order to avoid hard-to-hard contact between the edge leather of the brittle and hard material and the bearing table of the rigid material, an elastic flat-plate type abutting plate is arranged. When the bottom surface of the edge leather with the arc-shaped end surface is placed on the elastic flat plate type leaning plate, the buffer is provided for the edge leather, and the effect of protecting the edge leather is achieved.

Fig. 17 is a schematic structural diagram of another carrier table in the cutting apparatus according to the embodiment of the present application. As shown in FIG. 17, the L-shaped abutment plate 252 is fixed to the upper surface of at least one of the sub-bearing parts 211-2, the lateral arm of the L-shaped abutment plate 252 is fixed to the upper surface of the sub-bearing part 211-2, and the sub-bearing part 211-2 is flush with the end of the lateral arm of the L-shaped abutment plate fixed thereto. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be adapted. The L-shaped abutting plate can stably bear the edge leather with two adjacent vertical planes.

Fig. 18 is a cross-sectional view of a cutting reel in the cutting device provided by the embodiment of the application. As shown in fig. 18, in the structure of the cutting wheel provided in this embodiment, a plurality of parallel wire slots 311 are disposed on the outer edge of the cutting wheel, the cutting wire 32 is embedded in one of the wire slots 311, and the cutting wire 32 is limited in the wire slot 311, so as to avoid being separated from the cutting wheel during the rotation process. In addition, because the cutting line and the wire groove 311 are in sliding friction, a lot of diamonds are distributed on the cutting line, so that the wire groove is seriously abraded. After one wire groove is abraded, other wire grooves are directly used, the cutting wire wheel does not need to be frequently replaced, maintenance is facilitated, and materials and maintenance cost are saved.

Fig. 19 is a first structural schematic diagram of a clamping device in the cutting apparatus provided in the embodiment of the present application for clamping the selvage leather, and fig. 20 is a second structural schematic diagram of a clamping device in the cutting apparatus provided in the embodiment of the present application for clamping the selvage leather. As shown in fig. 19 and 20, the cutting apparatus provided in this embodiment further includes a clamping device for grabbing the offcut material, and placing the offcut material on the carrier or leaving the carrier.

Specifically, the clamping device includes: the clamping device comprises a fixing piece 51 and two oppositely arranged clamping jaws 52, wherein at least one clamping jaw 52 is slidably arranged on the lower bottom surface of the fixing piece 51, so that the distance between the two clamping jaws 52 can be adjusted to adapt to the edge leather materials with different widths.

When the edge leather needs to be clamped, adjusting the distance between the two clamping jaws to be larger than the width of the edge leather, and moving the position of the clamping device to enable the two clamping jaws to be respectively positioned at two sides of the edge leather in the width direction; and then, adjusting the distance between the two clamping jaws to be smaller until the width direction of the edge leather is clamped. The cutting equipment that this application embodiment provided, realization that can be convenient through clamping device carries out the centre gripping to the boundary leather material, provides the advantage for the removal of boundary leather material.

Specifically, the holding jaw 52 includes: a vertical mounting plate 521 and a jaw body 522. At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51. The jaw body 522 is fixed to the inner surface of the mounting plate 521. The jaws themselves are not of unitary construction, but are formed as two separate pieces of mounting plate and jaw body. The vertical mounting plate is a mounting base of the clamping jaw body and a base on which the clamping jaw can move. Two independent parts of mounting panel and clamping jaw body, at the in-process of clamping jaw body centre gripping raw material stick, the wearing and tearing of clamping jaw body are very serious, only need to change the clamping jaw body can, the mounting panel need not be changed.

Use the cutting equipment of the limit cladding of this application, can realize the cutting of the limit cladding that the terminal surface is the arc. The cutting process comprises the steps of firstly, cutting corner parts at two ends of the edge leather to form the edge leather with the end surface in a rectangular and arc combined shape; then, the arc on the top of the edge leather with the end face in the shape of the combination of the rectangle and the arc is cut to form a rectangular rod with the end face in the rectangle.

Before cutting the corners of the edge leather material, after the edge leather material is placed on the bearing device, laser marking positioning is firstly carried out through the laser positioning device, and the edge leather material is guaranteed to be placed at a proper and correct position. A bottom sensing device is fixed on the bearing platform 2, whether the side leather is installed in place is detected, and only after all detection conditions are met, the clamping mechanism can move to tightly push the side leather and press and fasten the side leather together with the limiting mechanism.

Before the cutting device cuts the arc top, the flaw-piece material is placed on the bearing device, then the material inductive switch is triggered, and the flaw-piece material is detected to be placed in position. At the moment, the laser positioner and the lateral sensing device fixed on the auxiliary bearing part of the bearing device are used for marking and positioning the leather materials, so that the leather materials are placed at the correct position, and the leather materials are positioned under the condition of meeting all detection conditions. And starting the clamping mechanism to start extending movement, and finishing the positioning and clamping process of the edge leather.

As shown in fig. 12, a laser alignment device 38 and a spray lubrication device 39 are also included.

The laser alignment device is arranged above the flaw-piece cutting table, and the function of accurately installing and feeding the flaw-piece is achieved. Set up a plurality of laser generator on the laser alignment device, install before the boundary material cutting bed at the boundary material, laser generator opens the linear laser of formation, projects on load-carrying device. When the edge leather is installed on the bearing device, alignment is firstly carried out through linear laser, so that a rectangular block made of brittle and hard materials is formed after cutting and is well aligned to the required size. Wherein, the position and the distance of each laser generator can be adjusted, and are specifically determined according to different flaw-piece material specifications.

The specific working process of the laser alignment device is as follows: finding out the center line of the two wheels by using a tool or a measuring tool (a vernier caliper or a steel plate ruler). And adjusting the position of the focused laser marker to enable the laser emitted by the laser marker to be aligned to the middle lines of the two wheels to fix the laser marker. Finding out the center line position on the edge leather material and marking. And adjusting the position of the edge leather material during feeding to enable the central line of the edge leather material to be aligned with the laser emitted by the laser line marker.

Spray lubricating arrangement and constantly spray cutting fluid toward vertical buddha's warrior attendant line in cutting process, promote the quality after the cutting of boundary leather material. The spraying and lubricating device is normally required to be installed above the flaw-piece cutting table, cutting liquid is continuously sprayed to the vertical diamond wire in the cutting process, the cutting liquid can vertically and directly flow to a position point of the flaw-piece to be cut, and the purpose of cooling and lubricating is achieved.

Before the silicon rod is cut, after the silicon rod is placed on the bearing table, laser marking is firstly carried out through the laser positioning device, and the silicon rod is placed at a proper and correct position. The bottom or the lateral part of plummer is provided with induction system, whether installs the silicon rod and targets in place and detect, and only after whole testing condition satisfied, the tight mechanism of top just can move and carry out the top tightly to the silicon rod, compresses tightly fixed silicon rod together with stop gear.

Further, the position of the silicon rod is detected through the sensing device, the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the preset cutting position to cut the silicon rod.

Further, the present embodiment also provides a grinding apparatus for grinding the small silicon rod in the above steps. As shown in fig. 21 to 24, the grinding apparatus includes: a base assembly 41, a feeding assembly 42 and a grinding assembly 43. The whole grinding equipment comprises: a loading area 401 and a grinding area 402. Wherein, the feeding assembly 42 is arranged in the feeding area 401, and the small silicon rods to be ground are assembled on the feeding assembly 42 from the feeding area 401, and then delivered to the grinding area 402. The grinding assembly 43 is disposed in the grinding region 402 for grinding the surface and/or corners of the small silicon rod.

Taking grinding of the small silicon rod a4 as an example, fig. 22 and 23 show an implementation manner of the feeding assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a loading sliding table 421, a headstock 422 and a tailstock 423. One implementation is as follows: the sliding table is fixed, and the headstock 422 and the tailstock 423 move relative to the sliding table; in another mode, the headstock 422 is fixed relative to the slide, the tailstock 423 moves relative to the slide, and the slide moves relative to the base. Taking the second scheme as an example: the small silicon rod a4 is placed between the headstock 422 and the tailstock 423, and the position of the tailstock 423 with respect to the slide table is adjusted to clamp the small silicon rod a 4. The small silicon rod a4 is moved to the mold area 402 by the moving slide table to be ground by the grinding unit 43.

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 and the tailstock chuck 425 are arranged in opposite directions, the small silicon rod a4 is arranged between the headstock chuck 424 and the tailstock chuck 425, and the headstock chuck 424 and the tailstock chuck 425 clamp the small silicon rod a4 from both ends.

As shown in fig. 21, in another implementation, the feeding assembly includes: a grinding holder 426 and a collet 427, both disposed one above the other. The small silicon rod a3 is vertically disposed between the grinding holder 426 and the collet 427, and the collet 427 downwardly grips the small silicon rod. The grinding assembly comprises a grinding head 431 and a grinding head driver which are respectively positioned at the left side and the right side of the small silicon rod. The grinding head driver is used for driving the grinding head 431 to horizontally move to be in contact with the small silicon rod or move away from the small silicon rod in the opposite direction.

The grinding head 431 is vertically movable to grind the surface of the small silicon rod during the elevation. Or the grinding fixing seat and the chuck drive the small silicon rod to lift, and the grinding head is fixed.

The grinding fixing seat 426 and the chuck can drive the small silicon rod to horizontally rotate, and after two side faces of the small silicon rod are ground, the grinding fixing seat drives the small silicon rod to rotate 90 degrees to grind the other two side faces. After all the side surfaces are ground, rotating the small silicon rod for 45 degrees, and grinding the edges and corners of the small silicon rod; and then the other three edges and corners are ground by sequentially rotating 90 degrees.

The grinding unit 43 is provided with a grinding wheel for grinding the small silicon rod a 4. The grinding wheel comprises a coarse grinding wheel and a fine grinding wheel, and the coarse grinding wheel and the fine grinding wheel respectively perform coarse grinding and fine grinding on the small silicon rod a 4.

In the above-described embodiment, the small silicon rod is ground, typically by grinding its side surface, and in special cases also by grinding its end surface.

The present embodiment also provides a silicon rod cutting system, including: the cutting device for cutting the silicon rod by the first cutting surface and the second cutting surface to obtain the small silicon rod and the grinding device for grinding the small silicon rod further comprise a cutting device for cutting the edge skin material. And cutting the silicon rod by each cutting device according to the assembly line operation to obtain small silicon wafers.

Claims

1. A method for cutting a silicon rod, comprising:

limiting the silicon rod on cutting equipment;

synchronously cutting the silicon rod by using a first section and a second section which are parallel to the length direction of the silicon rod, wherein the number of the first sections is two, and the two first sections are parallel; the number of the second tangent planes is at least three, and the at least three second tangent planes are mutually parallel; the second section is perpendicular to the first section to obtain at least two small silicon rods and a boundary material with a plane and a cambered surface.

2. The method according to claim 1, wherein two second cut surfaces located on the outer side are arranged on both sides of the center line of the silicon rod; the number of the second sections is three, so that two small silicon rods are obtained; the ratio of the cross sectional areas of the two small silicon rods is 1:1-1: 6.

3. The method according to claim 2, wherein the number of the second cut surfaces is three, and the second cut surface located in the middle passes through the center of the silicon rod, so that the two small silicon rods have the same cross-sectional area.

4. The method of claim 1, wherein the distance between the two second cut surfaces located at the outer side is equal to the distance between the two first cut surfaces.

5. The method according to any one of claims 1-4, further comprising:

and slicing the small silicon rods along the length direction of the small silicon rods by using a section vertical to the length direction of the small silicon rods to obtain a plurality of small raw material pieces.

6. The method of claim 5, further comprising, prior to slicing the small silicon rods:

grinding four side surfaces of the small silicon rod, wherein the side surfaces of the small silicon rod are surfaces parallel to the length direction of the small silicon rod;

and grinding the edge angle between two adjacent side surfaces in the small silicon rod to form a chamfer surface between the two side surfaces.

7. The method of claim 1, further comprising:

cutting the edge leather material by a third cut surface parallel to the length direction of the edge leather material, wherein the third cut surface is parallel to the bottom surface of the edge leather material so as to cut off the arc-shaped top of the edge leather material;

cutting the edge leather material by a fourth cut surface parallel to the length direction of the edge leather material, wherein the fourth cut surface is vertical to the bottom surface of the edge leather material; the number of the fourth tangent planes is two, and the fourth tangent planes are symmetrically arranged on two sides of the edge skin material so as to cut off corner parts on two sides of the edge skin material, and the edge skin silicon rod with a rectangular cross section is obtained.

8. A cutting apparatus to which the method for cutting the silicon rod as set forth in any one of claims 1 to 7 is applied, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

9. The cutting apparatus of claim 8, wherein the carrier is fixedly disposed on a base; the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to the base under the driving action of the bracket driving mechanism; the cutting wire wheel set is arranged on the wire wheel bracket;

or, the wire cutting device is fixed on the base; the bearing table moves relative to the linear cutting device under the driving action of the driving mechanism.

10. The cutting apparatus according to claim 9, wherein the silicon rod is arranged vertically on a carrier table; the wire wheel bracket and the bearing table move relatively along the vertical direction;

or the silicon rod is horizontally arranged on the bearing table, and the wire wheel support and the bearing table horizontally move relatively.

11. The cutting apparatus of claim 9, wherein the cutting wire is looped between the wheels of the set of cutting wire wheels;

or, the wire cutting device further comprises: the wire winding device comprises a wire unwinding mechanism, a wire winding mechanism and a wire arranging mechanism; the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the winding displacement mechanism and the cutting line wheel set.

12. A silicon rod cutting system, comprising:

the cutting apparatus as claimed in any of claims 8 to 11, for cutting silicon rods in a first cut and a second cut to obtain small silicon rods; and the number of the first and second groups,

and grinding equipment for grinding the small silicon rod.