CN112297264A

CN112297264A - Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Info

Publication number: CN112297264A
Application number: CN201910844426.8A
Authority: CN
Inventors: 卢建伟; 潘雪明; 苏静洪; 李鑫
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2019-08-02
Filing date: 2019-09-06
Publication date: 2021-02-02
Also published as: WO2021022844A1; CN211492322U; CN212218917U; CN112297263A

Abstract

The application discloses silicon rod surely grinds all-in-one and silicon rod surely grinds method, silicon rod surely grinds all-in-one has assembleed cutting device and grinder, and usable silicon rod conversion equipment can shift the silicon rod between each processingequipment orderly and seamlessly to utilize cutting device to carry out twice side cutting to the silicon rod so as to form square silicon rod and utilize grinder to grind square silicon rod after the evolution cutting, thereby accomplish the integration operation of evolution and grinding multiple operation of silicon rod, improve the quality of production efficiency and product processing operation.

Description

Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.

In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; after the cutting is finished, cutting the cut short silicon rod by using a silicon rod cutting machine to form a single crystal silicon rod; then, processing operations such as surface grinding, chamfering and the like are carried out on each single crystal silicon rod, so that the surface of each single crystal silicon rod is shaped to meet the corresponding requirements on flatness and dimensional tolerance; and subsequently, slicing the single crystal silicon rod by using a slicing machine to obtain the single crystal silicon slice.

However, in general, in the related art, operations required for each process operation (for example, cutting and squaring, grinding, chamfering, and the like) are independently arranged, the corresponding processing devices are distributed in different production units or different production areas of a production workshop or a production workshop, the conversion of workpieces performing different process operations requires carrying and allocating, and a pretreatment operation may be required before each process operation is performed, so that the process is complicated, the efficiency is low, the quality of the silicon rod processing operation is easily affected, more manpower or transfer equipment is required, the potential safety hazard is great, in addition, the flow links among the operation equipment of each process are many, the risk of workpiece damage is increased in the workpiece transfer process, disqualification caused by non-production factors is easily generated, the yield of products and unreasonable loss caused by the existing processing mode are reduced, is a major improvement subject faced by each company.

Disclosure of Invention

In view of the above disadvantages of the related art, an object of the present invention is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between each process operation and poor silicon rod processing operation effect in the related art.

To achieve the above and other related objects, the present application discloses a silicon rod cutting and grinding all-in-one machine, comprising:

the base is provided with a silicon rod processing platform;

the cutting device is arranged on the base and is used for carrying out first-direction side face cutting on the silicon rod on a first processing position of the silicon rod processing platform and carrying out second-direction side face cutting on the silicon rod on a second processing position of the silicon rod processing platform to form a square silicon rod; wherein the second direction is perpendicular or parallel to the first direction;

the grinding device is arranged on the base and is used for grinding and chamfering the square silicon rod on a third processing position of the silicon rod processing platform; and

and the silicon rod conversion device is arranged on the silicon rod processing platform and used for converting the silicon rod in a first processing position, a second processing position and a third processing position.

The application discloses silicon rod surely grinds all-in-one has assembleed cutting device and grinder, and usable silicon rod conversion equipment can shift the silicon rod between each processingequipment in order and seamlessly to utilize cutting device to carry out twice side cutting to the silicon rod in order to form square silicon rod and utilize grinder to grind square silicon rod after the evolution cutting, thereby accomplish the evolution of silicon rod and grind the integration operation of multiple operation, improve the quality of production efficiency and product processing operation.

In certain embodiments of the first aspect of the present application, the cutting device comprises: the first cutting device is arranged at a first processing position of the silicon rod processing platform, and the second cutting device is arranged at a second processing position of the silicon rod processing platform.

In certain embodiments of the first aspect of the present application, the first cutting device comprises: a first cutting frame; the first cutting support is movably lifted on the first cutting frame; the first cutting unit is arranged on the first cutting support; the first cutting unit comprises a first wire frame arranged on the first cutting support, a plurality of first cutting wheels arranged on the first wire frame, and a first cutting wire, wherein the first cutting wire is sequentially wound on the first cutting wheels to form a first cutting wire section arranged in a first direction.

In certain embodiments of the first aspect of the present application, the first cutting device further comprises a first flaw-piece discharging device for discharging a flaw-piece formed by the first cutting device after the first-direction lateral cutting of the silicon rod.

In certain embodiments of the first aspect of the present application, the second cutting device comprises: a second cutting frame; the second cutting support is movably lifted on the second cutting frame; the second cutting unit is arranged on the second cutting support; the second cutting unit comprises a second wire frame arranged on the second cutting support, a plurality of second cutting wheels arranged on the second wire frame, and a second cutting line, and the second cutting line is sequentially wound on the second cutting wheels to form a second cutting line segment arranged in a second direction.

In certain embodiments of the first aspect of the present application, the second cutting device further includes a second flaw-piece discharging device for discharging a flaw-piece formed after the second cutting device performs the second-direction side cutting on the silicon rod.

In certain embodiments of the first aspect of the present application, the cutting device comprises: a cutting frame; the cutting support is movably lifted on the cutting frame; the cutting support comprises a support main body, a first support side wing and a second support side wing, wherein the first support side wing and the second support side wing are positioned on two opposite lateral sides of the support main body; the first cutting unit is arranged at the first side of the cutting support; the first cutting unit comprises a first wire frame arranged on a side wing of a first support in the cutting support, a plurality of first cutting wheels arranged on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound on the plurality of first cutting wheels to form a first cutting wire section arranged in a first direction; the second cutting unit is arranged on the second side of the cutting support; the second cutting unit comprises a second wire frame arranged on a second support side wing in the cutting support, a plurality of second cutting wheels arranged on the second wire frame and a second cutting line, and the second cutting line is sequentially wound on the second cutting wheels to form a second cutting line segment arranged in a second direction.

In certain embodiments of the first aspect of the present application, the first cutting line and the second cutting line are the same cutting line, and a guide wheel is further disposed on the cutting support and located between the first cutting unit and the second cutting unit, so that the cutting line can be wound around the guide wheel.

In certain embodiments of the first aspect of the present application, the first cutting unit further comprises a first flaw-piece discharging device for discharging a flaw-piece formed after the first cutting unit performs the first-direction side cutting on the silicon rod; the second cutting unit further comprises a second flaw-piece discharging device which is used for discharging flaw-pieces formed after the second cutting unit performs second-direction side cutting on the silicon rods.

In certain embodiments of the first aspect of the present application, an intersection of the cutting line when the first cutting unit performs the first-direction side cut on the silicon rod and the cutting line when the second cutting unit performs the second-direction side cut on the silicon rod is located within a cross section of the silicon rod.

In certain embodiments of the first aspect of the present application, the grinding apparatus comprises: the grinding surface support is arranged on the machine base; at least one pair of grinding tools which are oppositely arranged on the grinding surface support; the at least one pair of grinding tools movably lift relative to the grinding surface support so as to be used for grinding and chamfering the square silicon rod.

In certain embodiments of the first aspect of the present application, the abrasive article comprises: a main shaft; and the at least one grinding wheel is arranged at the working end of the main shaft.

In certain embodiments of the first aspect of the present application, the abrasive article comprises: a rotary chassis; the double-head main shaft is arranged on the rotary chassis, the first end of the double-head main shaft is provided with at least one coarse grinding wheel, and the second end of the double-head main shaft is provided with at least one fine grinding wheel; and the driving motor is used for driving the rotary chassis to rotate so that the first end and the second end of the double-head spindle can interchange positions.

In certain embodiments of the first aspect of the present application, the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are distributed at 120 ° between two adjacent processing locations, and the rotation angle range of the silicon rod conversion device is ± 240 °.

In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting location, and the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transferring device, which is adjacently disposed in the waiting location of the silicon rod processing platform, and is configured to transfer a silicon rod to be processed to the waiting location of the silicon rod processing platform or transfer a processed silicon rod in the waiting location out of the silicon rod processing platform.

In certain embodiments of the first aspect of the present application, the silicon rod transfer device comprises: the transferring base is arranged on the base in a sliding manner through a sliding mechanism; the silicon rod platform is movably arranged on the transferring base and used for transversely arranging the silicon rod; the silicon rod fastening mechanism is arranged on the silicon rod platform and used for fastening the silicon rod in the silicon rod transferring process; and the platform turnover mechanism is used for driving the silicon rod platform to turn over relative to the transfer base, so that the silicon rod is vertically placed on the silicon rod transfer device.

In certain embodiments of the first aspect of the present application, the silicon rod slicing and grinding all-in-one machine further comprises a positioning detection device for performing ridge line detection and center positioning on the silicon rod located at the waiting location.

In certain embodiments of the first aspect of the present application, the position detection device comprises: the silicon rod edge line detection device comprises a ridge line detection unit and a detection controller, wherein the ridge line detection unit comprises a contact detection mechanism, a rotating mechanism and a detection controller electrically connected with the contact detection mechanism and the rotating mechanism, the contact detection mechanism is used for sending an on-off signal to the detection controller through contact with a ridge line of the silicon rod, and the rotating mechanism is used for adjusting the position of the silicon rod according to the control of the detection controller; the shaft center adjusting unit is used for positioning the shaft center of the silicon rod in the center of the pretreatment area and comprises a clamping mechanism, wherein the clamping mechanism is used for forming a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the pretreatment area.

In certain embodiments of the first aspect of the present application, the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are distributed at 90 ° between two adjacent processing locations, and the rotation angle range of the silicon rod conversion device is ± 270 °.

In certain embodiments of the first aspect of the present application, the silicon rod transfer device comprises: a conveying body; the silicon rod positioning mechanism is arranged on the conveying body and used for positioning the silicon rod; and the conversion driving mechanism is used for driving the conveying body to rotate so as to drive the silicon rod positioned by the silicon rod positioning mechanism to convert between the processing areas.

The second aspect of the application discloses a silicon rod cutting and grinding method, is applied to a silicon rod cutting and grinding all-in-one machine, silicon rod cutting and grinding all-in-one machine is including the frame that has silicon rod processing platform, silicon rod processing platform is equipped with first processing position, second processing position and third processing position, silicon rod cutting and grinding all-in-one still includes cutting device, grinder and silicon rod conversion equipment, silicon rod cutting and grinding method includes following step:

enabling the silicon rod conversion device to convert the first silicon rod to a first processing position, and enabling the cutting device to cut the first silicon rod on the first processing position in the first direction;

rotating the silicon rod conversion device by a first preset angle to convert the first silicon rod from the first processing position to the second processing position and convert the second silicon rod to the first processing position, and enabling the cutting device to perform second-direction side face cutting on the first silicon rod on the second processing position and perform first-direction side face cutting on the second silicon rod on the first processing position;

the silicon rod conversion device rotates by a first preset angle to convert the first silicon rod from the second processing position to the third processing position, convert the second silicon rod from the first processing position to the second processing position and convert the third silicon rod to the first processing position, the grinding device grinds and chamfers the first silicon rod on the third processing position, and at the stage, the cutting device performs second-direction side face cutting on the second silicon rod on the second processing position and performs first-direction side face cutting on the third silicon rod on the first processing position;

and rotating the silicon rod conversion device by a second preset angle to convert the first silicon rod from the third processing position to the first processing position, convert the second silicon rod from the second processing position to the third processing position, convert the third silicon rod from the first processing position to the second processing position, unloading the first silicon rod from the first processing position and loading the fourth silicon rod, and enabling the cutting device to carry out first-direction side face cutting on the fourth silicon rod on the first processing position.

According to the silicon rod cutting and grinding method applied to the silicon rod cutting and grinding all-in-one machine, the silicon rod conversion device can transfer the silicon rods among the processing devices orderly and seamlessly, the cutting device cuts the side surfaces of the silicon rods twice to form square silicon rods, and the grinding device grinds the square silicon rods after being cut, so that the silicon rod cutting and grinding multi-process integrated operation is completed, and the production efficiency and the product processing operation quality are improved.

In certain embodiments of the second aspect of the present application, the first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 120 ° therebetween; when the direction according to the sequence of the first processing location, the second processing location and the third processing location is defined as a forward direction, the first preset angle for rotating the silicon rod conversion device is 120 degrees of forward rotation, and the second preset angle for rotating the silicon rod conversion device is 120 degrees of forward rotation or 240 degrees of reverse rotation.

The third aspect of the application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding all-in-one machine, the silicon rod cutting and grinding all-in-one machine comprises a machine base with a silicon rod processing platform, the silicon rod processing platform is arranged in a waiting position, a first processing position, a second processing position and a third processing position, the silicon rod cutting and grinding all-in-one machine further comprises a cutting device, a grinding device and a silicon rod conversion device, and the silicon rod cutting and grinding method is characterized by comprising the following steps:

loading a first silicon rod at a waiting position, and preprocessing the first silicon rod;

the silicon rod conversion device rotates by a first preset angle to convert the first silicon rod from the waiting position to the first processing position, the cutting device cuts the first silicon rod on the first processing position in the first direction, and at the stage, the second silicon rod is loaded in the waiting position and is preprocessed;

the silicon rod conversion device rotates by a first preset angle to convert the first silicon rod from the first processing position to the second processing position and convert the second silicon rod from the waiting position to the first processing position, the cutting device performs second-direction side face cutting on the first silicon rod on the second processing position and performs first-direction side face cutting on the second silicon rod on the first processing position, and at this stage, a third silicon rod is loaded in the waiting position and is preprocessed;

the silicon rod conversion device rotates a first preset angle to convert the first silicon rod from the second processing position to a third processing position, convert the second silicon rod from the first processing position to the second processing position, convert the third silicon rod from the waiting position to the first processing position, enable the grinding device to grind and chamfer the first silicon rod on the third processing position, enable the cutting device to perform second-direction side face cutting on the second silicon rod on the second processing position and perform first-direction side face cutting on the third silicon rod on the first processing position at the stage, and meanwhile, load the fourth silicon rod in the waiting position and perform pretreatment on the fourth silicon rod;

and in the stage, the grinding device grinds and chamfers the second silicon rod on the third processing position, and the cutting device performs second direction side face cutting on the third silicon rod on the second processing position and performs first direction side face cutting on the fourth silicon rod on the first processing position.

In certain embodiments of the third aspect of the present application, the waiting location, the first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 90 ° therebetween; when the trend according to the order of waiting position, first processing position, second processing position and third processing position is defined as forward, make silicon rod conversion equipment pivoted first predetermine the angle and rotate 90 for the forward, make silicon rod conversion equipment rotate the second predetermine the angle and rotate 90 or reverse rotation 270 for the forward.

Drawings

Fig. 1 is a schematic perspective view of a silicon rod cutting and grinding all-in-one machine according to an embodiment of the present disclosure.

Fig. 2 shows a top view of the silicon rod slicing and grinding all-in-one machine of the present application in one embodiment.

Fig. 3 is a partially enlarged view of a portion a of fig. 1.

Fig. 4 is a schematic structural diagram of a cutting device in a silicon rod cutting and grinding all-in-one machine according to an embodiment of the present application.

Fig. 5 is a schematic cross-sectional view showing the intersection point of the first cutting line when the first cutting unit performs the first-direction side cutting on the silicon rod and the second cutting line when the second cutting unit performs the second-direction side cutting on the silicon rod inside the cross section of the silicon rod.

Fig. 6 is a schematic cross-sectional view of the silicon rod in which the intersection point of the first cutting line when the first cutting unit performs the first-direction side cutting on the silicon rod and the second cutting line when the second cutting unit performs the second-direction side cutting on the silicon rod is located on the cross-sectional circumference of the silicon rod.

Fig. 7 to 13 are schematic structural views of the silicon rod slicing and grinding all-in-one machine in each step of executing the silicon rod slicing and grinding method.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first direction may be referred to as a second direction, and similarly, a second direction may be referred to as a first direction, without departing from the scope of the various described embodiments.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the related art for processing a silicon rod, several steps such as cutting, grinding, chamfering, and the like are involved.

In general, most of conventional silicon rods have a cylindrical structure, and are cut by a silicon rod cutting device so that the silicon rods have a quasi-rectangular (including a quasi-square) cross section after cutting, and the processed silicon rods have a quasi-rectangular (including a quasi-cubic) shape as a whole.

Taking a single crystal silicon rod as an example, a process for forming the single crystal silicon rod may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; and after the cutting is finished, cutting the cut short silicon rod by using a silicon rod cutting machine to form the silicon single crystal rod with the rectangular-like cross section. Among them, patent publications such as CN105856445A, CN105946127A, and CN105196433A are referred to as a specific embodiment of forming a multi-stage short silicon rod by cutting an original long silicon rod with a silicon rod cutting machine, and patent publication such as CN105818285A is referred to as a specific embodiment of forming a single crystal silicon rod having a rectangular-like cross section by cutting a cut short silicon rod with a silicon rod cutting machine. However, the process for forming the single crystal silicon rod is not limited to the foregoing technique, and in alternative examples, the process for forming the single crystal silicon rod may further include: firstly, using a full silicon rod squaring machine to perform squaring operation on an original long silicon rod to form a long monocrystalline silicon rod with a quasi-rectangular cross section; and after the cutting is finished, cutting off the cut long monocrystalline silicon rod by using a silicon rod cutting machine to form a short crystalline silicon rod. Among them, a specific embodiment of the above-described method for forming a long single crystal silicon rod having a substantially rectangular shape by squaring an initial long silicon rod using an all-silicon-rod squarer is disclosed in patent publication CN106003443A, for example.

After the cylindrical silicon single crystal rod is cut into the quasi-rectangular silicon rod by the squaring equipment, the quasi-rectangular silicon rod can be ground, chamfered and the like by the grinding equipment.

The inventors of the present application have found that in the related art of the processing operation for the silicon rod, the processing devices such as the squaring and the polishing (for example, the surface polishing and the chamfering) are disposed separately and independently from each other, and the conversion of the silicon rod to perform different process operations requires the transfer and preparation and the pretreatment before the processing, which causes problems such as complicated processes and low efficiency.

In view of this, the present application provides a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method, which integrate a plurality of processing devices in one device through device transformation, and can automatically realize the cutting and grinding (such as surface grinding, chamfering and the like) of the silicon rod, and the processing operations are seamlessly connected, so that the labor cost is saved, the production efficiency is improved, and the quality of the silicon rod processing operations is improved.

Referring to fig. 1 to 2, fig. 1 is a schematic view illustrating a three-dimensional structure of a silicon rod slicing and grinding machine according to an embodiment of the present disclosure, and fig. 2 is a top view of the silicon rod slicing and grinding machine according to the present disclosure.

In the embodiment, the silicon rod cutting and grinding all-in-one machine is used for performing processing operations such as cutting and grinding on a silicon rod, and the silicon rod is a single crystal silicon rod, but the silicon rod is not limited thereto, and for example, a polycrystalline silicon rod shall also belong to the scope of protection of the present application.

As shown, the silicon rod squaring apparatus disclosed herein comprises: a machine base 1, a cutting device 2, a grinding device 3 and a silicon rod conversion device 4. The base 1 has a silicon rod processing platform. The cutting device 2 is arranged on the base 1 and used for cutting the silicon rod on the first processing position of the silicon rod processing platform in the first direction and cutting the silicon rod on the second processing position of the silicon rod processing platform in the second direction to form a square silicon rod. The grinding device 3 is arranged on the base 1 and used for grinding and chamfering the square silicon rod on the third processing position of the silicon rod processing platform.

The machine base 1 serves as a main body part of the silicon rod multi-station processing machine and is provided with a silicon rod processing platform, wherein the silicon rod processing platform can be divided into a plurality of functional areas according to specific operation contents of silicon rod processing operation. Specifically, in the embodiment shown in fig. 1 and 2, the silicon rod processing platform comprises at least a waiting zone, a first processing zone, a second processing zone, and a third processing zone.

The silicon rod conversion device 4 is arranged in the central area of the silicon rod processing platform and used for converting the silicon rod 100 among a waiting area, a first processing area, a second processing area and a third processing area on the silicon rod processing platform. In an embodiment, the silicon rod transfer device 4 is rotatably disposed on the silicon rod processing platform, and the silicon rod transfer device 4 may further include: a conveying body 41 in a disc shape, a square disc shape or the like; a silicon rod positioning mechanism 43 arranged on the conveying body 41 and used for positioning the silicon rod; and the conversion driving mechanism is used for driving the conveying body 41 to rotate so as to drive the silicon rod positioning mechanism 43 to position the silicon rod conversion position.

As described above, the silicon rod processing platform in this embodiment includes the waiting location, the first processing location, the second processing location, and the third processing location, and for being adapted to these functional locations, the number of the silicon rod positioning mechanisms 43 on the conveying body 41 may be set to four, and each silicon rod positioning mechanism 43 may position at least one silicon rod. Further, the angles set between every two of the four silicon rod positioning mechanisms 43 are consistent with the angle distribution between every two of the four functional areas. Thus, when one silicon rod positioning mechanism 43 corresponds to one functional zone, inevitably, the other three silicon rod positioning mechanisms 43 also correspond to the other three functional zones, respectively. Thus, in the pipelining, when at least one silicon rod is positioned on each silicon rod positioning mechanism 43 and the silicon rod positioning mechanism 43 corresponds to a functional region, the silicon rods are positioned at a corresponding functional region to perform a corresponding processing operation, for example: the silicon rod in the waiting zone can be subjected to pretreatment operation, the silicon rod in the first processing zone can be subjected to first processing operation, the silicon rod in the second processing zone can be subjected to second processing operation, and the silicon rod in the third processing zone can be subjected to third processing operation. In an alternative embodiment, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90 ° with respect to each other, and therefore, correspondingly, the four silicon rod positioning mechanisms 43 on the conveying body 41 are also distributed at 90 ° with respect to each other. Of course, the number of the silicon rod positioning mechanisms 43 may be varied according to actual requirements, but is not limited thereto, for example, the number of the silicon rod positioning mechanisms 43 may be determined according to the number of the functional areas provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotary bearing platform 431, a rotary pressing device 433, a lifting driving device (not shown), and a rotary driving device (not shown).

The rotary support 431 is arranged on the conveying body 41 in the silicon rod transfer device 4 for supporting the silicon rods 100(200) and for allowing the silicon rods 100(200) to stand, i.e. the bottoms of the silicon rods 100(200) are seated on the rotary support 431. In the present embodiment, the rotary susceptor 431 is rotated and rotated together with the rotation of the conveying body 41 in the silicon rod changing device 4. In some embodiments, the rotating platform 431 may be configured to rotate, for example, the rotating platform 431 may have a rotation axis with respect to the conveying body 41 to rotate, such that after the silicon rod 100(200) is supported by the rotating platform 431, the rotating platform 431 and the silicon rod 100(200) thereon may rotate together. Further, the contact surface of the rotary susceptor 431 for contacting the silicon rod is damped to provide a certain friction force that can move the silicon rod. The rotary bearing 431 is adapted to the silicon rod 100(200), and in some embodiments, the rotary bearing 431 may be a circular bearing or a square bearing adapted to the cross-sectional size of the silicon rod 100 (200).

The rotary pressing device 433 is disposed above the rotary susceptor 431 and presses against the top of the silicon rods 100(200) to press the silicon rods 100 (200). The rotary pressing device 433 may further include a support movably disposed and a pressing block disposed at the bottom of the support. The support is movably mounted on a central mounting frame, which is located in the central area of the conveying body 41 and rotates along with the conveying body 41. The top pressure movable block is matched with the silicon rod 100(200), and in an optional embodiment, the top pressure movable block can be a round cake-shaped pressing block or a square pressing block matched with the cross section size of the silicon rod 100 (200). Further, the pressing movable block of the rotary pressing device 433 is pivotally connected to the support and can rotate relative to the support.

As can be seen from the foregoing, the rotary holder 431 is configured to rotate and the pressing movable block of the rotary pressing device 433 is pivotally connected to the support, so that the rotary holder 431 or the pressing movable block can be linked to a rotary driving device. In one case, when the rotary platform 431 is coupled to a rotary driving device, the rotary platform 431 serves as a driving rotating component and the pressing movable block serves as a driven rotating component; in another case, when the pressing movable block is linked to a rotation driving device, the pressing movable block serves as a driving rotation member and the rotation platform 431 serves as a driven rotation member.

In practical applications, the rotary pressing device 433 may cooperate with the rotary supporting platform 431 therebelow, specifically, after the silicon rod 100(200) is vertically placed on the rotary supporting platform 431, the lifting driving device drives the support to move down along the central mounting frame until the pressing movable block on the support presses against the top of the silicon rod 100 (200). Subsequently, when the silicon rod 100(200) needs to be rotated, the rotary bearing platform 431 or the top pressure movable block which is driven by the rotary driving device to be linked rotates, and the silicon rod 100(200) is driven to rotate together by utilizing the friction force among the rotary bearing platform 431, the silicon rod 100(200) and the top pressure movable block, so that the operation surface or the operation area in the silicon rod 100(200) is adjusted, and the processing operation is performed on the adjusted operation surface or the adjusted operation area in the silicon rod 100. The rotation speed and the rotation angle of the silicon rods 100(200) can be controlled by the rotation driving device. In a specific implementation manner, the lifting driving device may be, for example, an air cylinder or a lifting motor, and the rotation driving device may be, for example, a rotating motor.

Further, as can be seen from the above, in some cases, the rotary carrying platform 431 or the top pressing movable block can be controlled by the rotary driving device to rotate to drive the silicon rod 100(200) to rotate to change the working surface or the working area, and sometimes, when the silicon rod 100(200) rotates to the required working surface or working area, the operation needs to be stopped and positioned to receive the processing operation of the processing device in the corresponding functional area. Therefore, in the present application, the silicon rod positioning mechanism may also be provided with a locking mechanism, if necessary. In one implementation, a carrier locking mechanism (not shown) may be provided at the bottom of the central mounting frame and adjacent to the rotary carrier 431, and may include a lock bolt and a lock cylinder coupled to the lock bolt. In practical application, when the rotary bearing platform 431 needs to be locked, a locking cylinder in the bearing platform locking mechanism drives a locking bolt to extend out and act on the bottom or the neck of the rotary bearing platform 431, so that the rotary bearing platform 431 is ensured to be stable and immovable; when the silicon rod needs to be rotated to change the working surface or the working area, the locking cylinder in the bearing table locking mechanism drives the locking bolt to contract, so that the rotary bearing table 431 is unlocked, and the rotary bearing table 431 can rotate.

The conveying body 41 is driven by the switching driving mechanism to rotate, and the silicon rod positioning mechanism 43 on the conveying body 41 and the silicon rod 100(200) positioned by the silicon rod positioning mechanism 43 are switched between different functional areas through the rotation of the conveying body 41.

In some embodiments, the transition drive mechanism further comprises: a conversion toothed belt provided on the circumferential side of the conveying body 41; the silicon rod processing device comprises a driving motor and a linkage structure which is connected with the driving motor and driven by the driving motor, the linkage structure is arranged on a silicon rod processing platform of the base 1, and the linkage structure comprises a rotating gear meshed with the conversion toothed belt. In this way, the rotating gear drives the conveying body 41 to rotate under the driving of the driving motor to drive the silicon rod positioning mechanism 43 and the silicon rods 100(200) thereon to be switched to other functional areas to complete conveying, and the driving motor may be a servo motor.

In certain embodiments, the silicon rod transfer device 4 may further comprise a locking mechanism (not shown in the figures) for locking the conveying body 41. For example, the locking mechanism may include a plurality of locking bolts and a locking cylinder connected to the locking bolts, where the number of the locking bolts may be multiple and the locking bolts are uniformly distributed at the edge of the conveying body 41 (for example, the number of the locking bolts is four and the locking bolts are uniformly distributed in a 90 ° angle manner), and in practical applications, when the silicon rod needs to be transferred from a certain processing region to another processing region, the locking cylinder drives the locking bolts to contract to unlock the disc-shaped or ring-shaped conveying body, so that the conveying body 41 can rotate; after the silicon rod is converted, that is, after the silicon rod is converted from a certain processing region to a target processing region, the locking cylinder in the locking mechanism drives the locking bolt to extend out and act on the conveying body 41, so as to lock the conveying body 41.

As mentioned above, the silicon rods located at the waiting area can be pretreated. The silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transferring device 6 which is adjacently arranged at a waiting position of the silicon rod processing platform and used for transferring the silicon rod 100(200) to be processed to the waiting position of the silicon rod processing platform or transferring the processed silicon rod on the waiting position out of the silicon rod processing platform.

Referring to fig. 3, a partial enlarged view of a portion a of fig. 1 is shown. As shown in fig. 3, the silicon rod transfer device 6 further includes: a transferring base 61, a silicon rod platform 63 and a platform turnover mechanism.

The transferring base 61 is slidably disposed on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least two directions. For example, the sliding mechanism includes a support portion 621, a switching portion 623, a first direction sliding unit disposed between the support portion 621 and the switching portion 623, and a second direction sliding unit disposed between the switching portion 623 and the transfer base 61, wherein the first direction sliding unit may include a first direction slide rail, a first direction slider or slide bar corresponding to the first direction slide rail, and a first direction driving source, and the second direction sliding unit may include a second direction slide rail, a second direction slider or slide bar corresponding to the second direction slide rail, and a second direction driving source.

Wherein, first slide rail, first direction slider or draw runner, second slide rail, second direction slider or draw runner are laid with the horizontality, any one in first direction driving source and the second direction driving source can include: a sliding rack, a rotating gear (not shown in the drawing) meshed with the sliding rack and a sliding driving motor. In the first direction sliding unit, the first driving source can drive the converting portion 623 and the transfer base 61 thereon to slide along the first direction by the first direction slider or slider and the first direction slide rail. And a second direction sliding unit, wherein the second driving source can drive the transfer base 61 to slide along the second direction through a second direction sliding block or strip and a second direction sliding rail.

In some examples, the first direction may be, for example, a left-right direction (i.e., an X-axis direction in fig. 2 and 3), and the second direction may be, for example, a front-back direction (i.e., a Y-axis direction in fig. 2 and 3).

The silicon rod platform 63 is movably disposed on the transfer base 61, and is used for laterally (i.e., horizontally) disposing the silicon rod 100 (200). In the present embodiment, the silicon rod platform 63 is a plate-shaped structure or a frame structure, and at least one silicon rod support bracket is disposed at least at the front and rear ends of the silicon rod platform 63, respectively, for supporting the front and rear ends of the silicon rods 100(200), so that the silicon rods 100(200) can be laterally arranged. Meanwhile, stopper structures may be provided at both left and right sides of the silicon rod platform, respectively, for restricting movement of the silicon rods 100(200) in the left-right direction.

It is known that the silicon rod 100 needs to be converted from a horizontal state (horizontal placement) to an upright state (vertical placement) in a subsequent processing operation, and therefore, in the present application, a silicon rod fastening mechanism may also be provided for fastening the silicon rod (not shown in the drawings) during the silicon rod transfer. In certain embodiments, the silicon rod fastening mechanism may comprise a fastening jaw and a fastening motor or a fastening cylinder controlling the fastening jaw. Furthermore, the silicon rod fastening mechanism comprises at least two pairs of fastening claws, wherein the at least two pairs of fastening claws correspond to the two silicon rod support brackets respectively, namely, one pair of fastening claws corresponds to one silicon rod support bracket, two fastening claws of the pair of fastening claws are oppositely arranged on the left side and the right side of the silicon rod support bracket respectively, and each fastening claw is provided with a fastening motor or a fastening air cylinder. In practical applications, when the silicon rod 100(200) is lying on the silicon rod platform, the fastening motor or the fastening cylinder drives the respective fastening jaw towards the silicon rod 100(200) on the silicon rod platform, so that the silicon rod 100(200) is fastened as a whole by the cooperation of at least two pairs of fastening jaws. Preferably, the pressing part of the fastening claw contacting with the silicon rod 100(200) may be provided with a buffer part to avoid or reduce damage to the silicon rod 100 (200).

In order to convert the silicon rod 100 from the horizontal state (horizontal placement) to the vertical state (vertical placement), the silicon rod transfer device 6 further includes a platform-overturning mechanism. The platform turnover mechanism is used for driving the silicon rod platform 63 to turn over relative to the transfer base 61, so that the silicon rods 100(200) are vertically placed on the silicon rod conversion device 4. In this embodiment, the platform turnover mechanism includes: mounting bracket, removal frame, upset cylinder or upset motor, upset rack and upset gear. The mounting bracket is fixedly arranged on the transferring base. In some embodiments, the mounting bracket is a plate-like structure or a frame structure. The movable frame is movably arranged above the mounting frame. In some embodiments, the movable frame is a hollow plate-like structure or a frame structure. Further, the left and right opposite sides of the position adjacent to the silicon rod conversion device 4 in the movable frame are respectively provided with a turnover rack, correspondingly, the left and right opposite sides of the turnover end adjacent to the silicon rod conversion device 4 in the silicon rod platform 63 are respectively provided with a turnover gear, and the turnover gear is correspondingly arranged on and meshed with the turnover rack. The overturning cylinder or the overturning motor is used for driving the moving frame to move relative to the mounting frame. Taking a turning cylinder as an example, the turning cylinder is integrally arranged in a hollow area of the moving frame, specifically, a cylinder body (for example, including a cylinder barrel and a piston) in the turning cylinder is arranged on the mounting frame, and a piston rod in the turning cylinder is connected to the moving frame. In practical application, aiming at the problem that the silicon rod platform is turned from a horizontal state to a vertical state: the upset cylinder actuates, and the piston rod extends and promotes the carriage for the carriage moves relative mounting bracket under promoting, and the upset rack on the carriage also follows the carriage and removes, rotates under the drive of upset rack with upset rack engaged with upset gear on the silicon rod platform, thereby drives the silicon rod platform and overturns, finally realizes that the silicon rod platform is overturned into vertical state by the horizontality. Aiming at the problem that the silicon rod platform is turned from a vertical state to a horizontal state: the upset cylinder actuates, and the piston rod contracts and stimulates the carriage for the carriage moves relative mounting bracket under promoting, and the upset rack on the carriage also follows the carriage and removes, rotates under the drive of upset rack with upset rack engaged with upset gear on the silicon rod platform, thereby drives the silicon rod platform and overturns, finally realizes that the silicon rod platform overturns into the horizontality by vertical state.

What is needed is: in addition, in order to enable the movable frame to smoothly and stably move relative to the mounting frame, slide rails are arranged on the left and right opposite sides of the mounting frame, and slide blocks or slide bars for sliding on the slide rails are arranged on the left and right opposite sides of the bottom of the movable frame. For example, in other embodiments, the slide rail may be disposed on the movable frame instead, and the slide block or the slide bar may be disposed on the mounting frame instead. Furthermore, in order to avoid or reduce the collision damage of the silicon rod platform to the movable frame, the mounting frame or the overturning cylinder or the overturning motor in the overturning process (for example, when the silicon rod platform is overturned from the vertical state to the horizontal state), a relatively convex buffer can be further arranged on the movable frame or the mounting frame.

The silicon rod transfer device 6 may further include a lifting mechanism. The lifting mechanism is arranged on the silicon rod platform and is used for lifting and descending the overturned silicon rod 100 (200). In this embodiment, the lifting mechanism may include a slide rail or a slide rod and a lifting motor or a lifting cylinder, wherein to realize the lifting motion of the silicon rod 100(200), the silicon rod support bracket is disposed on the silicon rod platform through the slide rail or the slide rod (the silicon rod fastening mechanism is mounted and connected to the silicon rod support bracket), and the lifting motor or the lifting cylinder controls the silicon rod support bracket (together with the silicon rod fastening mechanism) to perform the lifting motion, so as to drive the silicon rod 100(200) to realize the lifting. Still take the lifting cylinder as an example, the whole lifting cylinder is arranged in the middle of the silicon rod platform, specifically, the cylinder body (for example, including the cylinder barrel and the piston) in the lifting cylinder is arranged on the silicon rod platform, and the piston rod in the lifting cylinder is connected to the silicon rod support bracket. In practical application, the lifting cylinder is actuated, the piston rod extends and retracts (extends or contracts) and pushes and pulls (pushes or pulls) the silicon rod support bracket, so that the silicon rod support bracket moves up and down relative to the mounting frame under pushing and pulling, and the silicon rods 100(200) on the silicon rod support bracket also move up and down along with the silicon rod support bracket.

The silicon rod transfer device 6 is only an exemplary one, but not limited thereto, and other variations of the silicon rod transfer device may be made.

In certain embodiments, the silicon rod transfer device may include: the silicon rod fixture comprises a reversing carrier, a silicon rod fixture arranged on the reversing carrier and a reversing driving mechanism used for driving the reversing carrier to do reversing motion.

The reversing carrier is a main body device used for arranging other various components in the silicon rod transfer device, the other various components mainly comprise a silicon rod clamp, but not limited to the silicon rod clamp, and the other components can also be a mechanical structure, an electrical control system, numerical control equipment and the like. In this embodiment, the reversing carrier may include a base, a top frame opposite to the base, and a supporting structure disposed between the base and the top frame. In addition, the reversing carrier has another important function of supporting the reversing conversion of the silicon rod clamp through reversing movement. The reversing vehicle can be moved in a reversing manner, for example, by means of a reversing drive. By using the reversing driving mechanism, the reversing carrier can be driven to perform reversing motion so that the silicon rod clamp on the reversing carrier clamps the silicon rod 100 to be processed and transfers the silicon rod from the loading and unloading area to the waiting area, or clamps the processed silicon rod 200 corresponding to the waiting area and transfers the silicon rod from the waiting area to the loading and unloading area.

In a specific implementation manner, the reversing driving mechanism for realizing the reversing motion of the reversing carrier can comprise a rotating shaft and a rotating motor, and the reversing carrier is connected with the installation foundation structure below the reversing carrier through the rotating shaft. When the steering movement is implemented, the rotating motor is started to drive the rotating shaft to rotate so as to drive the reversing carrier to rotate to realize the reversing movement. The aforementioned rotation of the drive rotation shaft can be designed as a unidirectional rotation, which can be, for example, a unidirectional clockwise rotation or a unidirectional counterclockwise rotation, and also as a bidirectional rotation, which can be, for example, a clockwise rotation and a counterclockwise rotation. In addition, the angle at which the driving rotation shaft rotates may be set according to the actual configuration of the silicon rod transfer device. Moreover, the base in the reversing carrier can adopt a disc structure, a rectangular disc or an elliptical disc, and the central position of the base is connected with the rotating shaft, but the shape of the base is not limited to the above, and in other embodiments, the base can also adopt other shapes.

And a silicon rod clamp is arranged on the reversing carrier and used for clamping a corresponding silicon rod. For example, in some embodiments, a silicon rod clamp is arranged on a certain mounting surface of the reversing carrier, and the silicon rod clamp may include at least two silicon rod clamping parts, wherein the at least two silicon rod clamping parts are arranged at intervals. The silicon rod holder in the silicon rod clamp may be used for holding a round silicon rod (i.e. a silicon rod to be processed) as well as a square silicon rod (i.e. a processed silicon rod). Therefore, the silicon rod clamp on the reversing carrier is switched between the loading and unloading area and the waiting area to transfer the silicon rod to be processed and between the waiting area and the loading and unloading area to transfer the processed silicon rod by driving the reversing carrier to perform reversing motion. In practical applications, the rotation angle of the reversing carrier for reversing motion is determined according to the position relationship between the loading and unloading area and the waiting area. In some embodiments, the loading and unloading area and the waiting area are arranged oppositely, and the silicon rod transfer device is positioned between the loading and unloading area and the waiting area, so that the reversing carrier is driven by the reversing driving mechanism to rotate by 180 degrees. In some embodiments, the loading and unloading area and the waiting area are disposed at an angle of 90 °, and the reversing carrier is driven by the reversing driving mechanism to rotate at an angle of 90 °. However, no matter how, the positional relationship between the loading and unloading area and the waiting area is not particularly limited, and the arrangement order and the arrangement angle therebetween can be changed, so long as unnecessary interference is not generated between the stations, and thus the rotation direction and the rotation angle of the reversing carrier can be adjusted adaptively.

In certain embodiments, both the silicon rod to be processed and the processed silicon rod are placed vertically, so that at least two silicon rod holders of the silicon rod clamp are spaced up and down. Any one of the silicon rod holders may further comprise: the reversing carrier comprises a clamping arm mounting seat and two clamping arms, wherein the clamping arm mounting seat is arranged on the reversing carrier, and at least two clamping arms are movably arranged on the clamping arm mounting seat. The two clamping arms are arranged in bilateral symmetry, and the two clamping arms can form a clamping space for clamping a single-crystal-circle silicon rod or a silicon cube. Additionally, the silicon rod clamping piece can have the function of centering adjustment. In general, when the clamping arms in the silicon rod clamping part are in a clamping state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod to be processed and the center of the processed silicon rod. Therefore, when the silicon rod clamping piece is used for clamping a vertically placed silicon rod to be processed or a processed silicon rod, the two clamping arms in the silicon rod clamping piece are contracted and are abutted against the silicon rod to be processed or the processed silicon rod by the clamping arms. In the process that the clamping arms shrink and clamp the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamping arms at two sides and moves towards the central area of the clamping space until the silicon rod to be processed or the processed silicon rod is clamped by the two clamping arms in the silicon rod clamping piece, and at the moment, the center of the silicon rod to be processed or the processed silicon rod can be located at the center of the clamping space of the silicon rod clamping piece.

In order to enable the at least two clamping arms in the silicon rod clamping part to smoothly and stably clamp silicon rods to be processed or processed silicon rods with different sizes, at least one of the clamping arms in the silicon rod clamping part is of an adjustable design. Taking two clamping arms as an example, at least one of the two clamping arms is designed to be movable (one or two of the two clamping arms are designed to be movable), so that the clamping distance between the two clamping arms can be adjusted.

In addition, the silicon rod clamp in the silicon rod transfer device of the present application may have other variations. For example, the silicon rod transfer device may be provided with two silicon rod clamps, which may be respectively disposed on two opposite mounting surfaces of the reversing carrier. And, the two silicon rod clamps may be the same or different. In embodiments where two silicon rod furniture are identical, the two silicon rod clamps are used to clamp a round and a square silicon rod. In an embodiment in which the two silicon rod fixtures are not identical, one of the two silicon rod fixtures is used for holding a round silicon rod and the other silicon rod fixture is used for holding a square silicon rod.

Furthermore, the silicon rod transfer device 6 according to the present application may further provide movement in at least one direction. For example, the silicon rod transfer device may further include a forward and backward direction advancing and retreating mechanism, and the advancing and retreating mechanism may include: the reversing device comprises a forward and backward guide rail and a forward and backward motor, wherein the forward and backward guide rail is arranged along the front and back direction, and a base of the reversing carrier can be rested on the forward and backward guide rail through a sliding block.

This application silicon rod surely grinds all-in-one still includes location detection device. In the present exemplary embodiment, the position detection device (not shown in the figures) serves for the edge detection and the centering of the silicon rod 100 located at the waiting position.

The positioning detection device further includes: ridge line detection unit and axle center adjusting unit.

In some embodiments, the ridge line detection unit includes a contact detection mechanism for sending an on-off signal to a detection controller by contacting with the ridge line of the silicon rod, a rotation mechanism for adjusting the position of the silicon rod according to the control of the detection controller, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism.

The number of the silicon rod positioning mechanisms 43 may vary according to practical requirements, but is not limited thereto, for example, the number of the silicon rod positioning mechanisms 43 may be determined according to the number of the functional areas provided on the silicon rod processing platform.

In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotary bearing platform 431,

In certain embodiments, the axis center adjusting unit is configured to position the axis center of the silicon rod 100 at the center of the pretreatment region, and includes a clamping mechanism configured to form a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the pretreatment region.

In a specific implementation, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

In view of the circular cross-section of the silicon rod, in some examples, the clamping element as a whole is a circular workpiece holder, the two clamping arms forming the clamping element are of symmetrical design, the single clamping arm is designed to have an arc-shaped clamping surface, preferably, the arc-shaped clamping surface of the single clamping arm exceeds 100-quarter of the arc of the silicon rod, and thus, the arc-shaped clamping surface of the clamping element formed by the two clamping arms exceeds 100-half of the arc of the silicon rod. Certainly, the arc-shaped clamping surface in the clamping arm can be additionally provided with a buffer cushion for avoiding the damage to the surface of the silicon rod in the process of clamping the silicon rod and playing a good role in protecting the silicon rod. In general, when the clamping arms of the clamping member are in a clamped state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when the silicon rod 100 vertically placed on the to-be-processed region is clamped by the clamping member, the two clamping arms of the clamping member are contracted and abutted against the silicon rod by the arc-shaped clamping surfaces of the clamping arms. During the process of contracting and clamping silicon rod 100 by the clamping arms, silicon rod 100 is pushed by the two clamping arms on both sides and moves towards the central region of the clamping space until silicon rod 100 is clamped by the clamping arms in the clamping member, at which time, the center of silicon rod 100 can be located at the center of the clamping space of the clamping member.

After the silicon rod 100 to be processed is transferred to the waiting location of the silicon rod processing platform by the silicon rod transfer device 6 and is pretreated, the silicon rod may be transferred from the waiting location to another processing location by the silicon rod transfer device 4.

The cutting device 2 is arranged on the base 1 and is used for cutting the silicon rod 100 on the first processing position of the silicon rod processing platform in the first direction and cutting the silicon rod 100 on the second processing position of the silicon rod processing platform in the second direction to form a square silicon rod.

Fig. 4 is a schematic structural view of a cutting device in a silicon rod cutting and grinding machine according to an embodiment of the present disclosure. In the silicon rod slicing and grinding all-in-one machine shown in fig. 1, 2 and 4, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

The cutting frame 21 is arranged on the machine base 1. In the present embodiment, the cutting frame 21 is a column structure or a frame structure, and serves as a support body of the cutting device 2, and can provide support for other components in the cutting device 2.

The cutting support 22 is arranged on the cutting frame 21 in a lifting manner by a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism that can realize the vertical movement of the cutting support 22, such as a lifting motor, a lifting guide rail, and a lifting slider, wherein the lifting guide rail is vertically disposed on the cutting frame 21, the lifting slider is disposed on the back of the cutting support 22 and is matched with the lifting guide rail, and a dual-guide design may be adopted, that is, two lifting guide rails are adopted, and the two lifting guide rails are disposed in parallel, so that the cutting support 22 can realize stable lifting on the mounting structure of the machine base 1. The cutting support 22 can be moved up and down relative to the cutting frame 21 and the machine base 1 by means of a lifting guide and the lifting slide, driven by the lifting motor (which can be, for example, a servo motor).

In the present embodiment, since the cutting support 22 may be provided with the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Thus, in the present embodiment, on the one hand, the cutting frame 21 and the cutting support 22 of the cutting device 2 are provided in a central position between the first and second machining locations. On the other hand, the cutting support 22 is specially designed. As shown in fig. 1 to 4, the cutting support 22 in the present embodiment may include a support main body 221 and a first support flank 223 and a second support flank 225 located on opposite sides of the support main body 221, wherein an included angle between the first support flank 223 and the support main body 221 is an obtuse angle, and an included angle between the second support flank 225 and the support main body 221 is an obtuse angle, such that the first support flank 223 is disposed perpendicular to the second support flank 225, i.e., the first support flank 223 is disposed along the Y-axis and the second support flank 225 is disposed along the X-axis. For example, in some embodiments, the holder body 221 in the cutting holder 22 is disposed at 45 ° to the X-axis or Y-axis, the first holder flap 223 is disposed at 145 ° to the holder body 221 and is disposed along the Y-axis, and the second holder flap 225 is disposed at 145 ° to the holder body 221 and is disposed along the X-axis.

The first cutting unit 23 is disposed at a first side of the cutting support 22, and is configured to perform first-direction side cutting on the silicon rod 100 at the first processing location of the silicon rod processing platform.

In the present embodiment, as previously described, the cutting support 22 includes the support main body 221 and the first and

second support wings

223 and 225 located at opposite lateral sides of the support main body 221, and thus the first cutting unit 23 is mounted at the first support wing 223 of the cutting support 22. Specifically, the first cutting unit 23 includes a first frame 231 disposed on the first support wing 223, a plurality of first cutting wheels 233 disposed on the first frame 231, and a first cutting line 235, wherein the first cutting line 235 sequentially winds the plurality of first cutting wheels 233 to form a first cutting line segment disposed in a first direction. In this embodiment, the first direction is an X-axis direction.

In practical applications, the first cutting unit 23 may include at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into a pair of first cutting wheel sets, that is, one first cutting wheel set is formed by two first cutting wheels oppositely arranged along the first direction (i.e., along the X-axis direction), and one pair of first cutting wheel sets is formed by two first cutting wheel sets arranged along the second direction (i.e., along the Y-axis direction). Specifically, the first cutting unit 23 includes a pair of first cutting wheel sets, which may include two first cutting wheel sets that are respectively arranged at the left and right sides of the first bobbin 231 in the second direction (i.e., in the Y-axis direction), wherein one first cutting wheel set is located at the left side of the first bobbin 231 and includes two first cutting wheels 233 arranged in the first direction (i.e., in the X-axis direction), and the other first cutting wheel set is located at the right side of the first bobbin 231 and includes two first cutting wheels 233 arranged in the first direction (i.e., in the X-axis direction).

The first cutting lines 235 are sequentially wound around the first cutting wheels 233 of the first cutting unit 23 to form a first wire mesh. In practical applications, the first cutting line 235 sequentially winds around the four first cutting wheels 233 of the first cutting unit 23 to form two first cutting line segments, and the two first cutting line segments are arranged along the X axis and parallel to each other to form a first cutting line network. Specifically, the first cutting line 235 forms one first cutting line segment after being wound around two first cutting wheels 233 arranged in one first cutting wheel set along the first direction (i.e., along the X-axis direction), and the first cutting line 235 forms another first cutting line segment after being wound around two first cutting wheels 233 arranged in another first cutting wheel set along the first direction (i.e., along the X-axis direction). In this way, the two first cutting wire sections parallel to each other cooperate to form a first cutting wire web which is "in the shape of a word" in the first direction (i.e. in the direction of the X axis).

Of course, the first cutting unit 23 is not limited to the embodiment shown in fig. 1 to 3, and other variations can be made in other embodiments.

In some embodiments, the first cutting unit 23 may comprise at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into a pair of first cutting wheel sets, that is, one first cutting wheel set is formed by two first cutting wheels oppositely arranged along the Y-axis, and one first cutting wheel set is formed by two first cutting wheel sets along the X-axis. Specifically, the first cutting unit 23 includes a pair of first cutting wheel sets, which may include two first cutting wheel sets that are respectively arranged at front and rear sides of the first bobbin 231 in the first direction (i.e., in the X-axis direction), wherein one first cutting wheel set is located at a front side of the first bobbin 231 and includes two first cutting wheels 233 arranged in the second direction (i.e., in the Y-axis direction), and the other first cutting wheel set is located at a rear side of the first bobbin 231 and includes two first cutting wheels 233 arranged in the second direction (i.e., in the Y-axis direction). The first cutting lines 235 are sequentially wound around the first cutting wheels 233 of the first cutting unit 23 to form a first wire mesh. In practical applications, the first cutting line 235 sequentially winds around the four first cutting wheels 233 arranged in the first cutting unit 23 to form two first cutting line segments, and the two first cutting line segments are arranged along the second direction (i.e. along the Y-axis direction) and are parallel to each other to form a first cutting line network. Specifically, the first cutting line 235 forms one first cutting line segment after being wound around the two first cutting wheels 233 arranged in the second direction (i.e., along the Y-axis direction) in one first cutting wheel set, and the first cutting line 235 forms another first cutting line segment after being wound around the two first cutting wheels 233 arranged in the second direction (i.e., along the Y-axis direction) in the other first cutting wheel set. In this way, the two first cutting wire segments parallel to each other cooperate to form a first cutting wire web that is "═ shaped" in the second direction (i.e., in the Y-axis direction).

In some embodiments, the number of first cutting wheels 233 and first cutting line segments in the first cutting unit 23 may vary. For example, the first cutting unit includes two first cutting wheels, the two first cutting wheels are oppositely disposed along a first direction (i.e., along the X-axis direction) or along a second direction (i.e., along the Y-axis direction), and the first cutting line sequentially winds around the two first cutting wheels in the first cutting unit to form a first cutting line segment in a shape of "one" along the first direction (i.e., along the X-axis direction) or along the second direction (i.e., along the Y-axis direction) as a first cutting line web.

In addition, in the present embodiment, the first cutting unit 23 may further include at least one of: a guide roller provided on the first bobbin 231 and/or the first holder side 223 for guiding the first cutting wire 235; a tension pulley provided on the first bobbin 231 and/or the first holder side 223 for adjusting the tension of the first cutting line 235; and a wire storage cylinder (the wire storage cylinder can further comprise a pay-off cylinder and a take-up cylinder) arranged on the base 1 and used for winding and unwinding the first cutting wire.

The second cutting unit 25 is disposed at a second side of the cutting support 22, and is configured to perform second-direction side cutting on the silicon rod 100 at a second processing location of the silicon rod processing platform.

In the present embodiment, as previously described, the cutting support 22 includes a support main body 221 and first and

second support wings

223 and 225 located on opposite sides of the support main body 221, and thus, the second cutting unit 25 is mounted at the second support wing 225 of the cutting support 22. Specifically, the second cutting unit 25 includes a second bobbin 251 disposed on the second support wing 225, a plurality of second cutting wheels 253 disposed on the second bobbin 251, and a second cutting line 255, and the second cutting line 255 sequentially winds around the plurality of second cutting wheels 253 to form a second cutting line segment disposed in the second direction. In this embodiment, the second direction is a Y-axis direction.

In practical applications, the second cutting unit 25 may include at least four second cutting wheels 253, and the four second cutting wheels 253 may be combined into a pair of second cutting wheel sets, that is, two second cutting wheels oppositely disposed along the second direction (i.e., along the Y-axis direction) form one second cutting wheel set, and two second cutting wheel sets along the first direction (i.e., along the X-axis direction) form one second cutting wheel set. Specifically, the second cutting unit 25 includes a pair of second cutting wheel groups, which may include two second cutting wheel groups that are arranged at left and right sides of the second bobbin 251 in the first direction (i.e., in the X-axis direction), wherein one second cutting wheel group is located at a left side of the second bobbin 251 and includes two second cutting wheels 253 arranged in the second direction (i.e., in the Y-axis direction), and the other second cutting wheel group is located at a right side of the second bobbin 251 and includes two second cutting wheels 253 arranged in the second direction (i.e., in the Y-axis direction).

The second cutting lines 255 sequentially wind around each of the second cutting wheels 253 of the second cutting unit 25 to form a second cutting line net. In practical applications, the second cutting lines 255 sequentially wind around the four second cutting wheels 253 of the second cutting unit 25 to form two second cutting line segments, and the two second cutting line segments are arranged along a second direction (i.e. along the Y-axis direction) and are parallel to each other to form a second cutting line network. Specifically, the second cutting line 255 is wound around two second cutting wheels 253 arranged in a second direction (i.e., along the Y-axis direction) in one second cutting wheel group to form one second cutting line segment, and the second cutting line 255 is wound around two second cutting wheels 253 arranged in a second direction (i.e., along the Y-axis direction) in another second cutting wheel group to form another second cutting line segment. In this way, the two second cutting line segments parallel to each other cooperate to form a second cutting line web that is "in the shape of a letter" in the second direction (i.e., in the Y-axis direction).

Of course, the second cutting unit 25 is not limited to the embodiment shown in fig. 1 to 3, and other variations can be made in other embodiments.

In some embodiments, the second cutting unit 25 may include at least four second cutting wheels 253, and the four second cutting wheels 253 may be combined into a pair of second cutting wheel sets, that is, one second cutting wheel set is formed by two second cutting wheels oppositely arranged along the first direction (i.e., along the X-axis direction), and one second cutting wheel set is formed by two second cutting wheel sets along the second direction (i.e., along the Y-axis direction). Specifically, the second cutting unit 25 includes a pair of second cutting wheel groups, which may include two second cutting wheel groups that are arranged at both front and rear sides of the second bobbin 251 in the second direction (i.e., in the Y-axis direction), wherein one second cutting wheel group is located at a front side of the second bobbin 251 and includes two second cutting wheels 253 arranged in the first direction (i.e., in the X-axis direction), and the other second cutting wheel group is located at a rear side of the second bobbin 251 and includes two second cutting wheels 253 arranged in the first direction (i.e., in the X-axis direction). The second cutting lines 255 sequentially wind around each of the second cutting wheels 253 of the second cutting unit 25 to form a second cutting line net. In practical applications, the second cutting lines 255 sequentially wind around the four second cutting wheels 253 of the second cutting unit 25 to form two second cutting line segments, and the two second cutting line segments are arranged along the first direction (i.e. along the X-axis direction) and are parallel to each other to form a second cutting line network. Specifically, the second cutting line 255 is wound around two second cutting wheels 253 arranged in a first direction (i.e., along the X-axis direction) in one second cutting wheel group to form one second cutting line segment, and the second cutting line 255 is wound around two second cutting wheels 253 arranged in a first direction (i.e., along the X-axis direction) in another second cutting wheel group to form another second cutting line segment. In this way, the two second cutting line segments parallel to each other cooperate to form a second cutting line web that is "in the shape of a letter" in the first direction (i.e., in the direction of the X axis).

In some embodiments, the number of second cutting wheels 253 and second cutting line segments in the second cutting unit 25 may be varied. For example, the second cutting unit includes two second cutting wheels, the two second cutting wheels are oppositely disposed along a second direction (i.e., along the Y-axis direction) or along a first direction (i.e., along the X-axis direction), and the second cutting lines sequentially wind around the two second cutting wheels disposed in the second cutting unit to form a second cutting line segment in a shape of a straight line along the second direction (i.e., along the Y-axis direction) or along the first direction (i.e., along the X-axis direction) as a second cutting line web.

In addition, in the present embodiment, the second cutting unit 25 may further include at least one of: a wire guide wheel arranged on the second wire frame 251 and/or the second support flank 225 for guiding the second cutting wire 255; a tension pulley provided on the second string carrier 251 and/or the second holder wing 225 for adjusting the tension of the second cutting string 255; and a wire storage cylinder (the wire storage cylinder can further comprise a pay-off cylinder and a take-up cylinder) arranged on the machine base 1 and used for winding and unwinding the second cutting wire.

Further, the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 are aligned.

In some embodiments, the first cutting unit 23 and the second cutting unit 25 are two independent cutting units, and the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 may be two independent cutting lines.

In certain embodiments, the first cutting line 235 in the first cutting unit 23 and the second cutting line in the second cutting unit 25 may be the same cutting line. In this case, the common cutting lines sequentially wind the plurality of first cutting wheels 233 disposed in the first cutting unit 23 to form a first cutting line net, and then are transferred to the second cutting unit at the side to sequentially wind the plurality of second cutting wheels 253 disposed in the second cutting unit 25 to form a second cutting line net. In this embodiment, therefore, the cutting support 22 is also provided with one or more guide wheels around which the common cutting line is wound, between the first cutting unit 23 and the second cutting unit 25. Specifically, in the embodiment shown in fig. 2, a guide wheel 26 around which the common cutting line is wound is provided on the holder body 221 between the first cutting unit 23 and the second cutting unit 25 in the cutting holder 22. The first cutting unit 23 and the second cutting unit 25 share the same cutting line, so that the structure of the cutting unit can be simplified (for example, a set of paying-off cylinder and a set of winding cylinder are omitted), the integrity is good, the winding process is simplified, the efficiency is improved, and the line tension and the like of the two cutting units can be better controlled.

When the silicon rods on the first processing location and the silicon rods on the second processing location of the silicon rod processing platform are cut by means of the cutting device 2 in the embodiment shown in figure 2, the cutting support 22 is driven to descend relative to the cutting frame 21, the silicon rod on the first processing position and the silicon rod on the second processing position corresponding to the first cutting unit 23 and the second cutting unit 25 on the left side and the right side of the cutting support 22 are simultaneously cut, the first cutting unit 23 performs side cutting on the silicon rod in the first processing area along a first direction (i.e., along the X-axis direction) (the first cutting unit 23 is provided with a first cutting wire net in a shape of a Chinese character ═ along the X-axis direction), and the second cutting unit 25 performs side cutting on the silicon rod in the second processing area along a second direction (i.e., along the Y-axis direction) (the second cutting unit 25 is provided with a second cutting wire net in a shape of a Chinese character ═ along the Y-axis direction). Of course, in other embodiments, if the first cutting unit 23 is provided with a first cutting wire web in a shape of "═ type" in the second direction (i.e., in the Y-axis direction), the first cutting unit 23 performs side cutting of the silicon rod at the first processing location in the second direction (i.e., in the Y-axis direction), and likewise, if the second cutting unit 25 is provided with a first cutting wire web in a shape of "═ type" in the first direction (i.e., in the X-axis direction), the first cutting unit 23 performs side cutting of the silicon rod at the first processing location in the first direction (i.e., in the X-axis direction). As can be seen, in the present embodiment, the first cutting unit 23 and the second cutting unit 25 in the cutting device 2 share the cutting support 22, and by driving the shared cutting support 22 to perform the lifting motion, the first cutting unit 23 and the second cutting unit 25 thereon can perform the side cutting of the silicon rod at the first processing location along the first direction (i.e., along the X-axis direction) and the side cutting of the silicon rod at the second processing location along the second direction (i.e., along the Y-axis direction), respectively, at the same time. The cutting device 2 is simple in structure on the whole, convenient to control and capable of improving the cutting efficiency and quality of the silicon rod.

It should be noted that, in the present embodiment, the intersection point of the first cutting line 235 when the first cutting unit 23 performs the first-direction side cutting on the silicon rod 100 and the second cutting line 255 when the second cutting unit 25 performs the second-direction side cutting on the silicon rod 100 is located in the cross section of the silicon rod 100 (including the case that the intersection point is located on the circumference of the cross section), so that the formed square silicon rod has a cross section as large as possible (the surface area of the silicon wafer obtained after the subsequent slicing is large), and the material loss in the subsequent grinding (such as surface grinding and chamfering) operation can be reduced, thereby improving the utilization rate of the silicon material. Referring to fig. 5 and 6, fig. 5 is a schematic cross-sectional view showing that an intersection point of a first cutting line when the first cutting unit performs the first-direction side surface cutting on the silicon rod and a second cutting line when the second cutting unit performs the second-direction side surface cutting on the silicon rod is located inside a cross section of the silicon rod, fig. 6 is a schematic cross-sectional view showing that an intersection point of the first cutting line when the first cutting unit performs the first-direction side surface cutting on the silicon rod and the second cutting line when the second cutting unit performs the second-direction side surface cutting on the silicon rod is located on a circumference of the cross section of the silicon rod, and 101 shown in fig. 5 and 6 is a flaw-piece formed after the silicon rod is cut.

With the above-described slicing apparatus 2, after the first slicing operation (the first-direction side-cutting operation of the silicon rod 100 by the first slicing unit 23) and the second slicing operation (the second-direction side-cutting operation of the silicon rod 100 by the second slicing unit 25) are performed on the silicon rod 100, a square silicon rod (i.e., a silicon rod shaped like a rectangular body) is formed.

In the embodiment, as can be seen from the above, the silicon rod may form a boundary skin after being cut by the cutting device, and in order not to hinder the rising of the wire cutting device, the boundary skin needs to be timely unloaded, and for the unloading of the boundary skin, in most of the common boundary skin unloading methods, the boundary skin is still manually separated from the cut silicon rod by an operator and is removed from the silicon rod cutting device, which is not only inefficient, but also increases the risk of damage to the cut silicon rod due to collision between the boundary skin and the cut silicon rod during the transportation process. In view of the above, the silicon rod cutting and grinding all-in-one machine further includes a flaw-piece discharging device for discharging a flaw-piece formed after the silicon rod is subjected to the cutting by the wire cutting device, that is, in this embodiment, the first cutting unit further includes a first flaw-piece discharging device for discharging a flaw-piece formed after the silicon rod is subjected to the cutting by the first cutting unit in the first direction; the second cutting unit further comprises a second flaw-piece discharging device which is used for discharging flaw-pieces formed after the second cutting unit performs second-direction side cutting on the silicon rods.

Since the first and second flaw-piece discharging devices have the same structure, only the first flaw-piece discharging device will be described as an example.

Generally, the first flaw-piece discharging device can comprise a flaw-piece lifting mechanism for lifting the flaw-piece to enable the top end of the flaw-piece to protrude out of the cut silicon rod. The flaw-piece lifting mechanism comprises a jacking piece arranged on a first framework in the first cutting unit, the jacking piece can be driven by a telescopic part to move in a telescopic mode, and the jacking piece is controlled to move in a stretching mode and then supports the bottom of the flaw-piece to lift the flaw-piece.

In some embodiments, the jacking member includes an abutting plate and a supporting plate, the abutting plate extends upwards from the bottom of the supporting plate, further, the abutting plate may be an arc-shaped plate adapted to the arc-shaped surface of the flaw-piece, when the abutting plate abuts against the flaw-piece, the abutting plate can fully contact with the arc-shaped surface of the flaw-piece, the contact portion of the abutting plate and the flaw-piece is smooth, or a cushion pad is added to the inner surface of the abutting plate, which is in contact with the flaw-piece. The supporting plate is used for supporting the bottom of the side leather, and further the supporting plate can be an arched plate matched with the bottom surface of the side leather. In other embodiments, the chord edge of the arched plate as the bearing plate can be additionally provided with a convex block so as to increase the contact area with the bottom surface of the side skin.

In some embodiments, the telescopic member may be, for example, an air cylinder with a telescopic rod, wherein the telescopic rod may be connected to the support plate in the jacking member through a connecting structure, and the air cylinder may drive the telescopic rod to drive the jacking member to perform telescopic motion. Here, jacking piece does concertina movement include jacking piece's shrink motion with jacking piece's extension motion, wherein, jacking piece's shrink motion specifically indicates the cylinder drive the telescopic link shrink is in order to drive jacking piece is kept away from the boundary leather, jacking piece's extension motion specifically indicates the cylinder drive the telescopic link extends in order to drive jacking piece is close to the boundary leather. Of course, the aforementioned telescopic component may also adopt other implementation manners, for example, the telescopic component may also be, for example, a servo motor with a lead screw, the lead screw is connected to the jacking member, and the lead screw is driven by the servo motor to rotate so as to drive the jacking member to make telescopic motion, for example, the lead screw is driven to rotate forward to drive the jacking member to make contraction motion and drive the lead screw rotates reversely to drive the jacking member to make extension motion, or the lead screw is driven to rotate forward to drive the jacking member to make extension motion and drive the lead screw rotates reversely to drive the jacking member to make contraction motion. As to the specific structure of the first pelt discharging device and its implementation, reference can be made to patent publications such as CN 208148230U.

In practical application, in an initial state, the telescopic rod drives the jacking part to be in a contraction state, the first cutting unit is driven to descend along with the cutting support so that the first cutting line section in the first cutting unit cuts the silicon rod on the first processing position in the first direction until the first cutting line section penetrates through the silicon rod, the first direction side face of the silicon rod is cut and a flaw-piece is formed, at the moment, the flaw-piece lifting mechanism descends to the bottom along with the first bobbin, the cylinder drives the telescopic rod to extend so as to drive the jacking part to be close to the flaw-piece until a butting plate in the jacking part is in contact with the flaw-piece and is butted against the flaw-piece, subsequently, the first cutting unit is driven to ascend along with the cutting support, the flaw-piece lifting mechanism ascends along with the cutting support to drive the flaw-piece to generate ascending displacement relative to the silicon rod which is subjected to one-time cutting, so that the top end of the flaw-piece protrudes, when the top end of the flaw-piece meets the set conditions compared with the projecting part of the silicon rod, the cutting support can be controlled to stop rising, so that the top end of the flaw-piece can be used as a force application part for grabbing, the flaw-piece is grabbed and unloaded, then the air cylinder drives the telescopic rod to contract to drive the jacking piece to return to the initial state, and simultaneously the cutting support is controlled to drive the first cutting unit and the flaw-piece lifting mechanism to continuously rise above the silicon rod for executing next cutting operation.

In other embodiments, the lifting mechanism may include an absorbing member and a telescopic member for driving the absorbing member to perform telescopic movement, and the absorbing member is controlled by the telescopic member to abut against the hem and absorb the hem. The adsorption piece further comprises an abutting plate and an adsorption element. The abutting plate can be an arc-shaped plate matched with the arc-shaped surface of the edge leather, and can be fully contacted with the arc-shaped surface of the edge leather when the abutting plate abuts against the edge leather. The suction element may be, for example, a vacuum cup, and a plurality of vacuum cups may be arranged on a contact surface of the abutment plate to be in contact with the flaw-piece. The telescopic component can be, for example, an air cylinder with a telescopic rod or a servo motor with a screw rod, taking the air cylinder with a telescopic rod as an example, the telescopic rod can be connected with the abutting plate in the jacking piece through a connecting structure, the air cylinder can drive the telescopic rod to contract to drive the abutting plate to be away from the flaw-piece, and the air cylinder can drive the telescopic rod to extend to drive the abutting plate to be close to the flaw-piece and to be adsorbed to the flaw-piece by the adsorbing element after the abutting plate is contacted with the flaw-piece. Subsequently, the cutting support is driven to rise, the flaw-piece lifting mechanism and the first cutting unit rise along with the cutting support, and the flaw-piece lifting mechanism can drive the flaw-piece to move upwards relative to the silicon rod by utilizing the adsorption force, so that the top end of the flaw-piece protrudes out of the silicon rod.

In addition, the flaw-piece discharging device also comprises a clamping and transferring unit which is arranged above the base and used for clamping the top end of the flaw-piece and lifting the flaw-piece to separate the silicon rod and transfer the flaw-piece to a flaw-piece discharging area.

In some embodiments, the holding and transferring unit may include a moving mechanism providing movement in at least one direction and a flaw-piece holding mechanism coupled to the moving mechanism and driven to move in at least one direction.

The flaw-piece clamping mechanism can comprise a lifting driving structure and a clamping assembly arranged at the bottom of the lifting driving structure.

The lifting driving structure is used for driving the clamping assembly to perform lifting motion, and the lifting driving structure may be, for example, a lifting cylinder with a lifting rod, the lifting rod is connected to the clamping assembly, and the lifting cylinder is used to control the lifting rod to extend and retract to drive the clamping assembly to perform lifting motion, but not limited thereto. For example, the lifting driving structure can also be a screw rod assembly driven by a motor, the screw rod assembly is connected with the clamping assembly, and the motor is used for driving the screw rod assembly to lift so as to drive the clamping assembly to do lifting motion.

The clamping assembly can include the cover body and telescopic holder, the telescopic holder is located cover internal, the holder with form between the cover body and supply the centre gripping space of flaw-piece. In an embodiment, the cover body is used for covering the flaw-piece, the size of the cover body can be covered into a cross-section circle which is slightly larger than the silicon rod to be cut, and the cover body is a closed or non-closed circular cover, but not limited to this.

The structure of the clamping assembly is not limited to this, and in other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the flaw-piece is formed between the clamping member and the arc-shaped plate.

In the silicon rod slicing and grinding all-in-one machine shown in fig. 1 and 2, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, the invention is not limited thereto, and in other embodiments, other variations of the cutting device of the silicon rod cutting and grinding integrated machine can be made.

In certain embodiments, the cutting device may comprise a first cutting device disposed at the first processing location of the silicon rod processing platform and a second cutting device disposed at the second processing location of the silicon rod processing platform, wherein the first cutting device and the second cutting device are two separate devices.

The first cutting device includes: the cutting device comprises a first cutting frame, a first cutting support and a first cutting unit.

The first cutting frame is arranged on the machine base. The first cutting frame is of a columnar structure or a frame structure and serves as a supporting body of the first cutting device, and the first cutting frame can provide support for other components in the first cutting device.

The first cutting support is movably lifted on the first cutting frame. In some embodiments, the first cutting support is movably elevated from the first cutting frame by an elevating mechanism. The lifting mechanism can be including the mechanism that can realize that first cutting support carries out vertical removal by elevator motor, riser guide and elevator slide block etc. wherein, riser guide vertically sets up on first cutting frame, elevator slide block sets up in the back of first cutting support and cooperatees with riser guide, for making first cutting support can realize stablizing the mounting structure who goes up and down in the frame, can adopt the design of two guide rails, namely, adopt two riser guide, these two riser guide set up in parallel. The first cutting support can be driven by the lifting motor (the lifting motor can be a servo motor for example) to perform lifting motion relative to the first cutting frame and the base by virtue of the lifting guide rail and the lifting slide block.

The first cutting unit may include at least four first cutting wheels, and the four first cutting wheels may be combined into a pair of first cutting wheel sets, that is, one first cutting wheel set is formed by two first cutting wheels oppositely disposed along the first direction (i.e., along the X-axis direction), and one pair of first cutting wheel sets is formed by two first cutting wheel sets arranged along the second direction (i.e., along the Y-axis direction). In particular, the amount of the solvent to be used,

the first cutting unit includes a pair of first cutting wheel sets, the pair of first cutting wheel sets may include two first cutting wheel sets, the two first cutting wheel sets are respectively arranged at left and right sides of the first bobbin along the second direction (i.e. along the Y-axis direction), wherein one first cutting wheel set is located at left side of the first bobbin and includes two first cutting wheels arranged along the first direction (i.e. along the X-axis direction), and the other first cutting wheel set is located at right side of the first bobbin and includes two first cutting wheels arranged along the first direction (i.e. along the X-axis direction). The first cutting lines are sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting line net. In practical applications, the first cutting line sequentially winds around the four first cutting wheels in the first cutting unit to form two first cutting line segments, and the two first cutting line segments are arranged along a first direction (i.e., along the X-axis direction) and are parallel to each other to form a first cutting line network. Specifically, the first cutting line is wound around two first cutting wheels arranged in one first cutting wheel set in the first direction (i.e., in the X-axis direction) to form one first cutting line segment, and the first cutting line is wound around two first cutting wheels arranged in the other first cutting wheel set in the first direction (i.e., in the X-axis direction) to form another first cutting line segment. In this way, the two first cutting wire sections parallel to each other cooperate to form a first cutting wire web which is "in the shape of a word" in the first direction (i.e. in the direction of the X axis).

Of course, in some embodiments, the arrangement position, direction, number, etc. of the first cutting wheel and the first cutting line segment in the first cutting unit may be varied.

The second cutting device includes: the second cutting frame, the second cutting support and the second cutting unit.

The second cutting frame is arranged on the machine base. The second cutting frame is a columnar structure or a frame structure and serves as a supporting main body of the second cutting device, and the second cutting frame can provide support for other components in the second cutting device.

The second cutting support is movably lifted on the second cutting frame. In some embodiments, the second cutting support may be movably elevated with respect to the second cutting frame by an elevating mechanism. The lifting mechanism can be including the mechanism that can realize that the second cutting support carries out vertical removal by elevator motor, riser guide and elevator slide block etc. wherein, riser guide vertically sets up on the second cutting frame, elevator slide block sets up in the back of second cutting support and cooperatees with riser guide, for making the second cutting support can realize stablizing the mounting structure who goes up and down in the frame, can adopt two guide rail designs, promptly, adopts two riser guide, and these two riser guide set up in parallel. The second cutting support can be driven by the lifting motor (the lifting motor can be a servo motor for example) to perform lifting movement relative to the second cutting frame and the machine base by virtue of the lifting guide rail and the lifting slide block.

The second cutting unit may include at least four second cutting wheels, and the four second cutting wheels may be combined into a pair of second cutting wheel sets, that is, one second cutting wheel set is formed by two second cutting wheels oppositely arranged along the second direction (i.e., along the Y-axis direction), and the pair of second cutting wheel sets is formed by two second cutting wheel sets arranged along the first direction (i.e., along the X-axis direction). Specifically, the second cutting unit includes a pair of second cutting wheel sets, and the pair of second cutting wheel sets may include two second cutting wheel sets, which are respectively arranged at left and right sides of the second wire frame along the first direction (i.e., along the X-axis direction), wherein one second cutting wheel set is located at the left side of the second wire frame and includes two second cutting wheels arranged along the second direction (i.e., along the Y-axis direction), and the other second cutting wheel set is located at the right side of the second wire frame and includes two second cutting wheels arranged along the second direction (i.e., along the Y-axis direction). The second cutting lines are sequentially wound around each second cutting wheel in the second cutting units to form a second cutting line net. In practical applications, the second cutting lines sequentially wind around the four second cutting wheels in the second cutting unit to form two second cutting line segments, and the two second cutting line segments are arranged along a second direction (i.e. along the Y-axis direction) and are parallel to each other to form a second cutting line network. Specifically, the second cutting line is wound around two second cutting wheels arranged in one second cutting wheel set along the second direction (i.e. along the Y-axis direction) to form one second cutting line segment, and the second cutting line is wound around two second cutting wheels arranged in the other second cutting wheel set along the second direction (i.e. along the Y-axis direction) to form another second cutting line segment. In this way, the two second cutting line segments parallel to each other cooperate to form a second cutting line web that is "in the shape of a letter" in the second direction (i.e., in the Y-axis direction).

Of course, in some embodiments, the arrangement position, direction, number, etc. of the second cutting wheel and the second cutting line segment in the second cutting unit may be changed.

The grinding device 3 is arranged on the base 1 and is used for grinding the square silicon rod which is subjected to the squaring and cutting in the third processing area of the silicon rod processing platform. In this embodiment, the polishing operation includes polishing and chamfering.

The grinding device 3 has a receiving space for receiving a silicon rod which has been subjected to an open cut and is transferred from the second processing location to the third processing location by means of the silicon rod transfer device 4. The grinding device 3 mainly includes a grinding frame 31 and at least one pair of grinding tools 33, wherein the at least one pair of grinding tools 33 is oppositely disposed on the grinding frame 31 and is used for grinding the silicon rod which is located at the third processing location and has been subjected to the cutting operation.

In the present embodiment, the silicon rod after the cutting is square in cross section (the silicon rod is a rectangular body as a whole), and has four vertical cutting surfaces and four connecting edge surfaces, so that the grinding tools 33 are at least one pair disposed opposite to each other, and a receiving space for receiving the silicon rod 200 is left between the two, and after the silicon rod 200 is transferred to the third processing location and is located in the receiving space between the at least one pair of grinding tools 33, the at least one pair of grinding tools 33 can contact the pair of vertical cutting surfaces or the pair of connecting edge surfaces opposite to each other in the silicon rod 200, and then the silicon rod is movably ground up and down.

Wherein, the grinding machine frame 31 can be slidably disposed on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can realize sliding in at least one direction. For example, the sliding mechanism may allow the grinder frame 31 to slide in a first direction (i.e., in the X-axis direction). Specifically, the sliding mechanism may include a first direction slide rail, a first direction slider or slide corresponding to the first direction slide rail, and a first direction driving source. The first direction driving source may be, for example, a driving motor.

The grinding tool 33 can be slidably disposed on the grinding frame 31 through a sliding mechanism.

In certain embodiments, at least one pair of abrasive articles 33 in the abrading device 3 are independently provided. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are respectively slidably disposed on the grinding rack 31 through respective sliding mechanisms, wherein the sliding mechanisms can realize sliding movement in at least two directions. Specifically, the sliding mechanism may include a first sliding unit and a second sliding unit, wherein the first sliding unit is a lifting sliding unit, and includes a lifting guide rail disposed on the grinding machine frame 31, a lifting slider or a sliding strip disposed on a movable mounting rack, and a lifting driving source. The elevating driving source may be, for example, a driving motor. The second sliding unit includes a second direction guide rail (the second direction is the Y-axis direction shown in fig. 2) disposed on the movable mounting frame, a second direction slider or slider disposed on the grinding tool 33, and a second direction driving source. The second direction driving source may be, for example, a driving motor.

In certain embodiments, at least one pair of abrasive articles 33 in the abrading device 3 are associated. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are slidably disposed on the grinding machine frame 31 through a sliding mechanism, wherein the sliding mechanism can realize sliding movement in at least two directions. Specifically, the sliding mechanism may include a first sliding unit and a second sliding unit, wherein the first sliding unit is a lifting sliding unit, and includes a lifting guide rail disposed on the grinding machine frame 31, a lifting slider or a sliding bar disposed on a common movable mounting frame, and a lifting driving source. The elevating driving source may be, for example, a driving motor. The two grinding tools 33 are slidably disposed on the common movable mounting frame through a second sliding unit, and the second sliding unit includes a second direction guide rail (the second direction is the Y-axis direction shown in fig. 2) disposed on the common movable mounting frame, a second direction slider or slider disposed on the grinding tool 33, and a second direction driving source. The second direction driving source may be, for example, a driving motor.

In the present embodiment, the grinding frame 31 may be slidably disposed on the machine base 1 through a sliding mechanism, so as to enable the grinding frame 31 to advance and retract, i.e. to approach or move away from the silicon rod. The grinding tool 33 can be slidably arranged on the grinding rack 31 through the first sliding unit to realize the lifting of the grinding tool 33, and the grinding tool 33 can also be slidably arranged on the grinding rack 31 through the second sliding unit to realize the advancing and retreating of the grinding tool 33, namely, the grinding tool is close to or far away from the silicon rod to control the grinding amount of the silicon rod.

In some embodiments, the abrasive article may include a spindle and at least one grinding wheel, wherein the at least one grinding wheel is disposed at a working end of the spindle.

Specifically, as shown in fig. 2, in the present embodiment, each grinding tool 33 in the grinding device 3 is of a double-headed structure. Specifically, each abrasive article comprises: a rotary chassis; a double-head main shaft 332 arranged on the rotary chassis, wherein a coarse grinding wheel 331 is arranged at the first end of the double-head main shaft 332, and a fine grinding wheel 333 is arranged at the second end of the double-head main shaft 332; and the driving motor is used for driving the rotary chassis to rotate so as to enable the rough grinding wheel 331 and the fine grinding wheel 333 in the double-head main shaft 332 to exchange positions. In practical application, during grinding, the silicon rod 200 which is already subjected to the square cutting is firstly subjected to rough grinding by using the rough grinding wheel 331 of the double-head main shaft 332 in at least one pair of grinding tools 33 in the grinding device 3, then the rotary chassis is driven to rotate so as to exchange the positions of the rough grinding wheel 331 and the finish grinding wheel 333 in the double-head main shaft 332, and then the silicon rod 200 which is already subjected to the square cutting is subjected to finish grinding by using the finish grinding wheel 333 of the double-head main shaft 332 in at least one pair of grinding tools 33 in the grinding device 3. Wherein, the rough grinding operation can include roughly grinding the surface of the vertical tangent plane of the silicon rod 200 that has finished the cutting of evolution and roughly chamfering the connecting edge surface, and the finish grinding operation can include finely grinding the surface of the vertical tangent plane of the silicon rod 200 that has finished the cutting of evolution and finely chamfering the connecting edge surface.

Taking rough grinding of the vertical section of the silicon rod 200 after the cutting is completed as an example: firstly, the silicon rod is switched from the second processing position to the third processing position by the silicon rod switching device 4, the silicon rod 200 is positioned and adjusted by the silicon rod positioning mechanism 43, the grinding rack 31 moves towards the silicon rod 200 relative to the machine base 1 along a first direction (namely along the X-axis direction), so that the silicon rod 200 is positioned between two grinding tools 33 of a pair of grinding tools 33, namely, a first pair of vertical cutting surfaces in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; feeding the grinding tool 33 relative to the grinding frame 31 in a second direction (i.e., in the Y-axis direction) according to the feeding amount, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to roughly grind the first pair of vertical cut surfaces in the silicon rod 200; the silicon rod 200 is driven by the rotary bearing platform 431 in the silicon rod positioning mechanism 43 to rotate forward (or backward) by 90 degrees, so that the second pair of vertical cutting surfaces in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3, and the rough grinding wheel 331 in the grinding tool 33 is rotated and drives the grinding tool 33 to move up and down to perform rough grinding on the second pair of vertical cutting surfaces in the silicon rod 200.

The rough grinding operation for any pair of vertical cutting planes may include, for example: providing a feeding amount, driving the rough grinding wheel 331 in the pair of grinding tools 33 to move from top to bottom to grind a pair of vertical sections of the silicon rod; the pair of rough grinding wheels 331 are ground to the bottom of the silicon rod, pass through the silicon rod and then stay at the lower limit, and then the feeding amount is increased to drive the pair of rough grinding wheels 331 to move from bottom to top to grind the silicon rod; the pair of rough grinding wheels 331 are ground to the top of the silicon rod, pass through the silicon rod and then stay at the upper limit, the feeding amount is continuously increased, and the pair of rough grinding wheels 331 are driven to move from top to bottom to grind the silicon rod; thus, after grinding, increasing the feeding amount, reversely grinding and increasing the feeding amount, and repeating for a plurality of times, the pair of vertical sections of the silicon rod can be ground to the preset size.

Taking the rough chamfering of the vertical section of the silicon rod 200 after the cutting is completed as an example: initially, when the silicon rod 200 is transferred to the first processing location by the silicon rod transfer device 4, the vertical section of the silicon rod 200 corresponds to the pair of grinding tools 33 in the grinding device 3, and thus, the positioning adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 may, for example, include rotating the silicon rod 200 forward (or backward) by 45 ° so that the first pair of connecting prism surfaces in the silicon rod 200 corresponds to the pair of grinding tools 33 in the grinding device 3; moving the grinding frame 31 towards the silicon rod 200 relative to the machine base 1 in a first direction (i.e. in the X-axis direction) such that the silicon rod 200 is located between two grinding tools 33 of a pair of grinding tools 33, i.e. a first pair of vertical cross-sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; feeding the grinding tool 33 relative to the grinding frame 31 in the second direction (i.e., in the Y-axis direction) according to the feeding amount, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first rough cutting on the first pair of connecting facets in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forwards for 5 degrees, the rough grinding wheel 331 in the rotary grinding tool 33 drives the grinding tool 33 to move up and down so as to perform the second rough cutting on the first pair of connecting prism surfaces in the silicon rod 200; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forwards by 80 degrees, so that the second pair of connecting edge surfaces in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3, the rough grinding wheel 331 in the grinding tool 33 is rotated, and the grinding tool 33 is driven to move up and down to perform the first rough cutting on the second pair of connecting edge surfaces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forwards for 5 degrees, and the rough grinding wheel 331 in the rotary grinding tool 33 drives the grinding tool 33 to move up and down so as to perform the second rough cutting on the second pair of connecting edge surfaces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forwards for 5 degrees, the rough grinding wheel 331 in the rotary grinding tool 33 drives the grinding tool 33 to move up and down so as to perform the third rough cutting on the second pair of connecting prism surfaces in the silicon rod 200; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forward by 80 degrees, the rough grinding wheel 331 in the rotary grinding tool 33 is rotated, and the grinding tool 33 is driven to move up and down to perform the third rough cutting on the first pair of connecting prism surfaces in the silicon rod 200.

It should be noted that, in the above-mentioned rough chamfering operation of the connecting edge surface, the first silicon rod 101 is driven by the first silicon rod positioning mechanism 53 to rotate by a corresponding angle, for example: the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward by 5 °, which is not the only implementation manner, and in other optional embodiments, the adjustment angle may be adapted, for example, 3 ° to 7 °, including 3 °, 4 °, 5 °, 6 °, 7 °, or other angles, and accordingly, the adjustment angle is adapted when the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward by 80 °.

Taking the fine grinding of the vertical section of the silicon rod 200 after the cutting is finished as an example: firstly, the silicon rod is switched from the second processing position to the third processing position by the silicon rod switching device 4, the silicon rod 200 is positioned and adjusted by the silicon rod positioning mechanism 43, the grinding rack 31 moves towards the silicon rod 200 relative to the machine base 1 along a first direction (namely along the X-axis direction), so that the silicon rod 200 is positioned between two grinding tools 33 of a pair of grinding tools 33, namely, a first pair of vertical cutting surfaces in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; feeding the grinding tool 33 relative to the grinding frame 31 in a second direction (i.e., in the Y-axis direction) according to the feeding amount, rotating the lapping grindstone 333 in the grinding tool 33 and driving the grinding tool 33 up and down to lap the first pair of vertical cut surfaces in the silicon rod 200; the silicon rod 200 is rotated forward (or backward) by 90 ° by the rotary bearing platform 431 in the silicon rod positioning mechanism 43, so that the second pair of vertical cutting surfaces in the silicon rod 200 corresponds to the pair of grinding tools 33 in the grinding device 3, and the lapping grinding wheels 333 in the rotary grinding tools 33 rotate and drive the grinding tools 33 to move up and down to lap the second pair of vertical cutting surfaces in the silicon rod 200.

Wherein, any pair of vertical tangent plane accurate grinding operation can for example include: providing a feeding amount, driving the fine grinding wheel 333 in the pair of grinding tools 33 to move from top to bottom to grind a pair of vertical sections of the silicon rod; the pair of fine grinding wheels 333 are ground to the bottom of the silicon rod, penetrate through the silicon rod and then stay at the lower limit, the feeding amount is increased, and the pair of fine grinding wheels 333 are driven to move from bottom to top to grind the silicon rod; the pair of fine grinding wheels 333 are ground to the top of the silicon rod, pass through the silicon rod and then stay at the upper limit, the feeding amount is continuously increased, and the pair of fine grinding wheels 333 are driven to move from top to bottom to grind the silicon rod; thus, after grinding, increasing the feeding amount, reversely grinding and increasing the feeding amount, and repeating for a plurality of times, the pair of vertical sections of the silicon rod can be ground to the preset size.

Taking the fine chamfering of the vertical section of the silicon rod 200 after the cutting is finished as an example: initially, when the silicon rod 200 is transferred to the first processing location by the silicon rod transfer device 4, the vertical section of the silicon rod 200 corresponds to the pair of grinding tools 33 in the grinding device 3, and thus, the positioning adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 may, for example, include rotating the silicon rod 200 forward (or backward) by 45 ° so that the first pair of connecting prism surfaces in the silicon rod 200 corresponds to the pair of grinding tools 33 in the grinding device 3; moving the grinding frame 31 towards the silicon rod 200 relative to the machine base 1 in a first direction (i.e. in the X-axis direction) such that the silicon rod 200 is located between two grinding tools 33 of a pair of grinding tools 33, i.e. a first pair of vertical cross-sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; feeding the grinding tool 33 relative to the grinding frame 31 in the second direction (i.e., in the Y-axis direction) according to the feeding amount, rotating the grindstone 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first finish-cut of the first pair of connecting lands in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forwards for 5 degrees, the fine grinding wheel 333 in the rotary grinding tool 33 is rotated, and the grinding tool 33 is driven to move up and down so as to perform secondary fine cutting on the first pair of connecting edge surfaces in the silicon rod 200; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forwards by 80 degrees, so that the second pair of connecting edge surfaces in the silicon rod 200 correspond to the pair of grinding tools 33 in the grinding device 3, and the fine grinding wheel 333 in the grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to perform primary fine cutting on the second pair of connecting edge surfaces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forwards for 5 degrees, the fine grinding wheel 333 in the rotary grinding tool 33 is rotated, and the grinding tool 33 is driven to move up and down so as to perform secondary fine cutting on a second pair of connecting edge surfaces in the silicon rod 200; the silicon rod positioning mechanism 43 drives the silicon rod 200 to rotate forwards for 5 degrees, the fine grinding wheel 333 in the rotary grinding tool 33 is rotated, and the grinding tool 33 is driven to move up and down to perform third fine cutting on the second pair of connecting edge surfaces in the silicon rod 200; the silicon rod 200 is driven by the silicon rod positioning mechanism 43 to rotate forward by 80 degrees, the finish grinding wheel 333 in the rotary grinding tool 33 is rotated and the grinding tool 33 is driven to move up and down to perform the third finish cutting on the first pair of connecting prism surfaces in the silicon rod 200.

For example, in the description of the polishing operation as the polishing device, the chamfering operation of the polycrystalline silicon rod is performed after the polishing operation of the silicon rod is performed, but the present invention is not limited thereto, and in other embodiments, the chamfering operation of the silicon rod is performed after the chamfering operation of the silicon rod is performed, and the present invention is also applicable and is within the scope of the present invention.

Subsequently, after the silicon rod 200 is ground by the grinding device 3, the silicon rod 200 is transferred from the third processing location to the waiting location by the silicon rod transfer device 4, and the processed silicon rod is unloaded from the waiting location of the silicon rod processing platform by the silicon rod loading and unloading device. Of course, before unloading the silicon rod 200, if necessary, in the waiting section, the silicon rod 200 after the machining operation may be inspected by an inspection device, for example, a flatness inspection apparatus for a plane flatness of the silicon rod. By using the flatness detector, on one hand, whether the silicon rod meets the product requirements after each processing operation can be detected by detecting the plane flatness of the silicon rod 200 so as to determine the effect of each processing operation; on the other hand, the wear condition of the processing parts in each processing device can be indirectly obtained through detecting the plane flatness of the silicon rod 200, so that the calibration or correction, even the maintenance or replacement can be conveniently carried out in real time.

Furthermore, in the cutting and grinding all-in-one machine, in an optional embodiment, a silicon rod cleaning device can be further included. The silicon rod cleaning device can be arranged on the base and used for cleaning the silicon rod. In the silicon rod cleaning apparatus, generally, after the silicon rod is subjected to the above-described processing operation, cutting chips generated during the operation adhere to the surface of the silicon rod, and therefore, it is necessary to clean the silicon rod as necessary. Generally, the silicon rod cleaning device comprises a cleaning brush head and a cleaning solution spraying device matched with the cleaning brush head, wherein during cleaning, the cleaning solution spraying device sprays cleaning solution towards the silicon rod, and meanwhile, the cleaning brush head is driven by a motor to act on the silicon rod to complete cleaning operation. In practice, the cleaning liquid may be pure water, for example, and the cleaning brush head may be a rotary brush head, for example.

In addition, the cutting and grinding integrated machine of the present application, it is particularly pointed out that, if the cutting and grinding integrated machine increases or decreases the corresponding processing operation device, the number and the position relationship of the functional location on the silicon rod processing platform and the silicon rod positioning mechanism on the conveying body need to be correspondingly adjusted.

In certain embodiments, the silicon rod changeover device is also reduced by a corresponding one of the silicon rod positioning means, provided that the silicon rod multi-station processing machine omits a waiting zone. Further, preferably, the angles set between two of the three silicon rod positioning mechanisms are also consistent with the angle distribution between two of the three functional areas. Thus, when one silicon rod positioning mechanism corresponds to one functional zone, the other two silicon rod positioning mechanisms also correspond to the other two functional zones respectively. Therefore, in the running water operation, at any moment, when one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the function areas, the silicon rods are positioned at the corresponding function areas to execute corresponding processing operation. In an alternative embodiment, the three functional regions on the silicon rod processing platform are arranged at 120 ° with respect to one another, so that correspondingly, the four silicon rod positioning means on the disk-shaped or ring-shaped conveying body are also arranged at 120 ° with respect to one another.

In addition, the cutting and grinding integrated machine is particularly provided with corresponding processing operation devices, so that the number and the position relationship of the functional regions on the silicon rod processing platform and the silicon rod positioning mechanisms on the conveying body need to be correspondingly adjusted. Supposing that a processing operation device is additionally arranged on the silicon rod multi-station processing machine, a functional zone bit is correspondingly additionally arranged on the silicon rod processing platform, and a silicon rod positioning mechanism is correspondingly additionally arranged on the silicon rod conversion device. Further, preferably, the angles set between every two of the five silicon rod positioning mechanisms are consistent with the angle distribution between every two of the five functional areas. Thus, when one silicon rod positioning mechanism corresponds to one functional zone, the other four silicon rod positioning mechanisms also correspond to the other four functional zones respectively. Therefore, in the running water operation, at any moment, when one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanisms correspond to the function areas, the silicon rods are positioned at the corresponding function areas to execute corresponding processing operation. In an alternative embodiment, the five functional regions on the silicon rod processing platform are arranged at 72 ° with respect to one another, so that correspondingly, the four silicon rod positioning means on the disk-shaped or ring-shaped conveying body are also arranged at 72 ° with respect to one another.

The application discloses a silicon rod cutting and grinding method which is applied to a silicon rod cutting and grinding all-in-one machine.

In some embodiments, as shown in fig. 2, the silicon rod cutting and grinding all-in-one machine comprises a base with a silicon rod processing platform, the silicon rod processing platform is provided with a waiting zone, a first processing zone, a second processing zone and a third processing zone, the silicon rod cutting and grinding all-in-one machine further comprises a cutting device, a grinding device and a silicon rod conversion device, and the waiting zone, the first processing zone, the second processing zone and the third processing zone of the silicon rod processing platform are distributed at 90 degrees between two adjacent positions. In the present embodiment, it is assumed that the sequence of the wait zone, the first processing zone, the second processing zone and the third processing zone is defined as forward direction.

The silicon rod cutting and grinding method at least comprises the following steps:

step S101, a first silicon rod is loaded in a waiting area, and the first silicon rod is preprocessed. In this embodiment, in step S101, the first silicon rod to be processed is transferred to the waiting section of the silicon rod processing platform by the silicon rod transfer device.

Referring specifically to fig. 7 and 8, the first silicon rod 100 to be processed may be transferred to the waiting section of the silicon rod platform using the silicon rod transfer device 6. The detailed manner of transferring the first silicon rod 100 to be processed to the waiting position of the silicon rod platform by using the silicon rod transfer device 6 may be referred to the above description, and will not be described herein again.

In addition, the pretreatment may include ridge detection and centering of the first silicon rod located at the waiting location with a positioning detection device.

Step S103, rotating the silicon rod conversion device by a first preset angle to convert the first silicon rod from the waiting position to the first processing position, and enabling the cutting device to cut the first silicon rod on the first processing position in the first direction, and at this stage, loading the second silicon rod in the waiting position and preprocessing the second silicon rod.

In step S103, since the waiting location and the first processing location are 90 °, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated by 90 ° in the forward direction.

Referring specifically to fig. 8 and 9, the silicon rod transfer device 4 is rotated in the forward direction (i.e., clockwise arrow in fig. 8) by 90 °, and the first silicon rod 100 to be processed is transferred from the waiting position in fig. 8 to the first processing position in fig. 9.

In this way, the first silicon rod 100 at the first processing location can be cut with the cutting device 2 in the embodiment shown in fig. 9.

When the first silicon rod 100 at the first processing location is cut by the cutting apparatus 2 in the embodiment shown in fig. 9, with reference to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first silicon rod 100 at the first processing location is cut laterally in the X-axis direction by the first cutting unit 23 at one side of the cutting support 22 (the first cutting unit is provided with a first cutting wire net in a shape of a letter ═ in the X-axis direction).

For loading the second silicon rod 102 in the waiting position and preprocessing the second silicon rod 102, reference may be made to the description of the first silicon rod 100 in step S101, which is not repeated herein.

Step S105, rotating the silicon rod conversion device by a first preset angle to convert the first silicon rod from the first processing area to the second processing area and convert the second silicon rod from the waiting area to the first processing area, enabling the cutting device to perform second-direction side face cutting on the first silicon rod on the second processing area and perform first-direction side face cutting on the second silicon rod on the first processing area, and loading the third silicon rod in the waiting area and preprocessing the third silicon rod at this stage.

In step S105, since the waiting location, the first processing location, and the second processing location of the silicon rod processing platform differ by 90 ° in sequence, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device rotates 90 ° in the forward direction.

Referring specifically to fig. 9 and 10, silicon rod transfer device 4 is rotated in a forward direction (i.e., clockwise arrow in fig. 9) by 90 °, to transfer first silicon rod 100 from the first processing zone to the second processing zone and to transfer second silicon rod 102 from the waiting zone to the first processing zone.

In this way, the cutting device 2 of the exemplary embodiment shown in fig. 10 can be used to cut a first silicon rod 100 in the second processing region of the silicon rod processing platform and a second silicon rod 102 in the first processing region.

When cutting of a first silicon rod 100 on the second processing location and a second silicon rod 102 on the first processing location of the silicon rod processing platform is carried out with the cutting device 2 in the embodiment shown in figure 10, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the second silicon rod 102 at the corresponding first processing location and the first silicon rod 100 at the corresponding second processing location, the first cutting unit 23 performs side cutting along the X-axis direction on the second silicon rod 102 in the first processing location (the first cutting unit 23 is provided with a first cutting wire web which is shaped like a Chinese character 'ri' along the X-axis direction), and the second cutting unit 25 performs side cutting along the Y-axis direction on the first silicon rod 100 in the second processing location (the second cutting unit 25 is provided with a second cutting wire web which is shaped like a Chinese character 'ri' along the Y-axis direction). Note that, before the second cutting unit 25 is used to cut the side surface of the first silicon rod 100 at the second processing location along the Y-axis direction, the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 is further used to drive the first silicon rod 100 to rotate forward or backward by 90 ° to adjust the cutting surface due to the above-mentioned problem of side surface cutting. In this way, after the first silicon rod 100 located at the second processing location is cut along the side surface in the Y-axis direction by the second cutting unit 25, a silicon rod having a square shape as a whole is formed.

For loading the third silicon rod 104 in the waiting position and preprocessing the third silicon rod 104, reference may be made to the description of the first silicon rod 100 in step S101, which is not repeated herein.

Step S107, the silicon rod conversion device rotates a first preset angle to convert the first silicon rod from the second processing position to the third processing position, convert the second silicon rod from the first processing position to the second processing position, convert the third silicon rod from the waiting position to the first processing position, the grinding device grinds and chamfers the first silicon rod on the third processing position, at this stage, the cutting device performs second direction side cutting on the second silicon rod on the second processing position and performs first direction side cutting on the third silicon rod on the first processing position, and meanwhile, the fourth silicon rod is loaded on the waiting position and performs pretreatment on the fourth silicon rod.

In step S107, since the waiting zone, the first processing zone, the second processing zone and the third processing zone of the silicon rod processing platform have a 90 ° phase difference in sequence, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated by 90 ° in the forward direction

Specifically, referring to fig. 10 and 11, the silicon rod transfer device 4 is rotated in the forward direction (i.e., clockwise arrow in fig. 10) by 90 °, the first silicon rod 100 is transferred from the second processing region to the third processing region, the second silicon rod 102 is transferred from the first processing region to the second processing region, and the third silicon rod 104 is transferred from the waiting region to the first processing region.

In this way, the first silicon rod 100 at the third processing location of the silicon rod processing platform can be ground by means of the grinding device 3 in the embodiment shown in fig. 11. For a specific manner of performing the grinding operation on the first silicon rod 100 at the third processing position of the silicon rod processing platform by using the grinding device 3, reference is made to the foregoing description, and no further description is given here.

At the same time, the cutting device 2 of the embodiment shown in fig. 11 can be used to cut a third silicon rod 104 in the first processing location and a second silicon rod 102 in the second processing location of the silicon rod processing platform.

When the cutting device 2 of the embodiment shown in fig. 11 is used for cutting a third silicon rod 104 in the first processing location and a second silicon rod 102 in the second processing location of the silicon rod processing platform, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the third silicon rod 104 at the first processing location and the second silicon rod 102 at the second processing location, the first cutting unit 23 performs side cutting along the X-axis direction on the third silicon rod 104 in the first processing location (the first cutting unit 23 is provided with a first cutting wire web which is shaped like a Chinese character 'ri' along the X-axis direction), and the second cutting unit 25 performs side cutting along the Y-axis direction on the second silicon rod 102 in the second processing location (the second cutting unit 25 is provided with a second cutting wire web which is shaped like a Chinese character 'ri' along the Y-axis direction). It should be noted that before the second silicon rod 102 at the second processing location is cut along the Y-axis direction by the second cutting unit 25, the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 is further used to drive the second silicon rod 102 to rotate forward or backward by 90 ° to adjust the cutting surface due to the aforementioned problem of cutting along the Y-axis. In this way, after the second silicon rod 102 located at the second processing location is cut along the side surface in the Y-axis direction by the second cutting unit 25, a silicon rod having a square shape as a whole is formed.

For loading the fourth silicon rod 106 in the waiting area and preprocessing the fourth silicon rod 106, reference may be made to the description of the first silicon rod 100 in step S101, which is not repeated herein.

Step S109, rotating the silicon rod conversion device by a second preset angle to convert the first silicon rod from the third processing position to a waiting position, convert the second silicon rod from the second processing position to the third processing position, convert the third silicon rod from the first processing position to the second processing position, convert the fourth silicon rod from the waiting position to the first processing position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and pre-process the fifth silicon rod.

In step S109, since the waiting location, the first processing location, the second processing location, and the third processing location of the silicon rod processing platform sequentially differ by 90 °, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated by 90 ° in the forward direction or 270 ° in the reverse direction. The silicon rod conversion device reversely rotates 270 degrees, so that the silicon rod conversion device can return to the initial position, and a cable wound in the forward rotation process can be released.

Referring specifically to fig. 11 and 12, silicon rod transfer device 4 is rotated in a reverse direction (i.e., counterclockwise arrow in fig. 10) through 270 °, to transfer first silicon rod 100 from the third processing location to the waiting location, second silicon rod 102 from the second processing location to the third processing location, third silicon rod 104 from the first processing location to the second processing location, and fourth silicon rod 106 from the waiting location to the first processing location.

In this way, the first silicon rod 100 processed at the waiting location may be transferred out of the silicon rod processing platform by means of the silicon rod transfer device 6, and the fifth silicon rod 108 to be processed may be transferred to the waiting location of the silicon rod processing platform (as shown in fig. 13).

Meanwhile, the second silicon rod 102 at the third processing location of the silicon rod processing platform may be ground by the grinding device 3 in the embodiment shown in fig. 12. For a specific manner of using the grinding device 3 to grind the second silicon rod 102 at the third processing position of the silicon rod processing platform, reference is made to the foregoing description, and no further description is given here.

At the same time, the cutting device 2 in the embodiment shown in fig. 12 can be used to cut a fourth silicon rod 106 in the first processing location and a third silicon rod 104 in the second processing location of the silicon rod processing platform.

When the cutting device 2 in the embodiment shown in fig. 12 is used for cutting a fourth silicon rod 106 in the first processing location and a third silicon rod 104 in the second processing location of the silicon rod processing platform, referring to fig. 1, the cutting support 22 is driven to descend relative to the cutting frame 21, the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the fourth silicon rod 106 at the first processing location and the third silicon rod 104 at the second processing location, the first cutting unit 23 performs side cutting along the X-axis direction on the fourth silicon rod 106 at the first processing location (the first cutting unit 23 is provided with a first cutting wire web which is shaped like a Chinese character 'ri' along the X-axis direction), and the second cutting unit 25 performs side cutting along the Y-axis direction on the third silicon rod 104 at the second processing location (the second cutting unit 25 is provided with a second cutting wire web which is shaped like a Chinese character 'ri' along the Y-axis direction). Note that, before the second cutting unit 25 is used to cut the side surface of the third silicon rod 104 at the second processing location along the Y-axis direction, the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 is further used to drive the third silicon rod 104 to rotate forward or backward by 90 ° to adjust the cutting surface due to the aforementioned problem of side surface cutting. In this way, after the third silicon rod 104 located at the second processing location is cut along the side surface in the Y-axis direction by the second cutting unit 25, a silicon rod having a square shape as a whole is formed.

In some embodiments, the silicon rod cutting and grinding all-in-one machine comprises a machine base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing position, a second processing position and a third processing position, the silicon rod cutting and grinding all-in-one machine further comprises a cutting device, a grinding device and a silicon rod conversion device, and the first processing position, the second processing position and the third processing position of the silicon rod processing platform are distributed at 120 degrees between adjacent positions. In the present embodiment, it is assumed that the sequence of the first processing zone, the second processing zone and the third processing zone is defined as forward direction.

step S201, loading the first silicon rod in the first processing location, and enabling the cutting device to perform first-direction side face cutting on the first silicon rod in the first processing location.

In this embodiment, in step S201, a first silicon rod to be processed is transferred to a first processing location of the silicon rod processing platform by the silicon rod transfer device.

When the cutting device is used for cutting the first silicon rod in the first processing position, the cutting support is driven to descend relative to the cutting frame, and the first cutting units on the left side and the right side of the cutting support cut the first silicon rod in the first processing position along the side face in the X-axis direction (the first cutting units are provided with first cutting wire nets in a shape like the Chinese character ═ X-shaped along the X-axis direction).

Step S203, rotating the silicon rod conversion device by a first preset angle to convert the first silicon rod from the first processing position to the second processing position and convert the second silicon rod to the first processing position, and enabling the cutting device to perform second-direction side face cutting on the first silicon rod on the second processing position and perform first-direction side face cutting on the second silicon rod on the first processing position.

In step S203, the waiting location and the first processing location are 120 °, so that the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 120 °.

When the cutting device is used for cutting the second silicon rod on the first processing area of the silicon rod processing platform and the second silicon rod on the first processing area, the cutting support is driven to descend relative to the cutting frame, the first cutting unit and the second cutting unit on the left side and the right side of the cutting support simultaneously cut the second silicon rod on the corresponding first processing area and the first silicon rod on the second processing area, wherein the first cutting unit cuts the second silicon rod on the first processing area along the side face in the X-axis direction (the first cutting unit is provided with a first cutting wire net which is shaped like a Chinese character ═ in the X-axis direction), and the second cutting unit cuts the first silicon rod on the second processing area along the side face in the Y-axis direction (the second cutting unit 25 is provided with a second cutting wire net which is shaped like a Chinese character ═ in the Y-axis direction). Before the first silicon rod on the second processing position is cut along the side surface in the Y-axis direction by the second cutting unit, the silicon rod positioning mechanism in the silicon rod conversion device needs to be used for driving the first silicon rod to rotate forward or reversely by 90 degrees to adjust the cutting surface due to the problem of the side surface cutting.

Step S205, rotating the silicon rod conversion device by a first preset angle to convert the first silicon rod from the second processing location to the third processing location, convert the second silicon rod from the first processing location to the second processing location, and convert the third silicon rod to the first processing location, and making the grinding device grind and chamfer the first silicon rod on the third processing location, at this stage, making the cutting device perform second-direction side cutting on the second silicon rod on the second processing location and perform first-direction side cutting on the third silicon rod on the first processing location.

In step S205, since the difference between the first processing location and the second processing location of the silicon rod processing platform is 90 ° in sequence, the first preset angle for rotating the silicon rod conversion device is that the silicon rod conversion device is rotated 90 ° in the forward direction.

The first silicon rod on the third processing area of the silicon rod processing platform can be ground by the grinding device.

When the cutting device is used for cutting a third silicon rod on a first processing position of the silicon rod processing platform and a second silicon rod on a second processing position, the cutting support is driven to descend relative to the cutting frame, the first cutting unit and the second cutting unit on the left side and the right side of the cutting support simultaneously cut the third silicon rod on the corresponding first processing position and the second silicon rod on the corresponding second processing position, wherein the first cutting unit cuts the third silicon rod on the first processing position along the side face of the X-axis direction (the first cutting unit is provided with a first cutting wire net which is shaped like a Chinese character ═ along the X-axis direction), and the second cutting unit cuts the second silicon rod on the second processing position along the side face of the Y-axis direction (the second cutting unit is provided with a second cutting wire net which is shaped like a Chinese character ═ along the Y-axis direction). Before the second silicon rod on the second processing position is cut along the side surface in the Y-axis direction by the second cutting unit, the silicon rod positioning mechanism in the silicon rod conversion device needs to be used for driving the second silicon rod to rotate forward or reversely by 90 degrees to adjust the cutting surface due to the problem of the side surface cutting.

Step S207, rotating the silicon rod conversion device by a second preset angle to convert the first silicon rod from the third processing position to the first processing position, convert the second silicon rod from the second processing position to the third processing position, convert the third silicon rod from the first processing position to the second processing position, unloading the first silicon rod from the first processing position and loading the fourth silicon rod, and enabling the cutting device to carry out first-direction side face cutting on the fourth silicon rod on the first processing position.

In step S207, since the first processing location, the second processing location, and the third processing location of the silicon rod processing platform are sequentially 120 ° apart from each other, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 120 ° or reversely by 240 °. The silicon rod conversion device is reversely rotated by 240 degrees, so that the silicon rod conversion device can return to the initial position, and a cable wound in the forward rotation process can be released.

In step S207, the first silicon rod processed at the first processing location may be transferred out of the silicon rod processing platform by using the silicon rod transfer device, and the fourth silicon rod to be processed may be transferred to the waiting location of the silicon rod processing platform.

And the second silicon rod on the third processing area of the silicon rod processing platform can be ground by utilizing the grinding device.

When the cutting device is used for cutting a fourth silicon rod on a first processing area of the silicon rod processing platform and a third silicon rod on a second processing area, the cutting support is driven to descend relative to the cutting frame, the first cutting unit and the second cutting unit on the left side and the right side of the cutting support simultaneously cut the fourth silicon rod on the corresponding first processing area and the third silicon rod on the corresponding second processing area, wherein the first cutting unit cuts the fourth silicon rod on the first processing area along the side face of the X-axis direction (the first cutting unit is provided with a first cutting wire net which is shaped like a Chinese character ═ along the X-axis direction), and the second cutting unit cuts the third silicon rod on the second processing area along the side face of the Y-axis direction (the second cutting unit 25 is provided with a second cutting wire net which is shaped like a Chinese character ═ along the Y-axis direction). Before the second cutting unit is used for cutting the side surface of the third silicon rod in the second processing position along the Y-axis direction, the silicon rod positioning mechanism 43 in the silicon rod conversion device needs to be used to drive the third silicon rod to rotate forward or backward by 90 degrees to adjust the cutting surface due to the aforementioned problem of side surface cutting.

According to the silicon rod cutting and grinding method, the silicon rods can be transferred among the processing devices orderly and seamlessly, the silicon rods can be cut twice on the side face to form square silicon rods, and the square silicon rods after cutting are ground, so that the integrated operation of cutting and grinding multiple processes of the silicon rods is completed, and the production efficiency and the quality of product processing operation are improved.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. The utility model provides a silicon rod surely grinds all-in-one which characterized in that includes:

the base is provided with a silicon rod processing platform;

2. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, wherein the cutting device comprises: the first cutting device is arranged at a first processing position of the silicon rod processing platform, and the second cutting device is arranged at a second processing position of the silicon rod processing platform.

3. The silicon rod cutting and grinding all-in-one machine as set forth in claim 2, wherein the first cutting device comprises:

a first cutting frame;

the first cutting support is movably lifted on the first cutting frame;

the first cutting unit is arranged on the first cutting support; the first cutting unit comprises a first wire frame arranged on the first cutting support, a plurality of first cutting wheels arranged on the first wire frame, and a first cutting wire, wherein the first cutting wire is sequentially wound on the first cutting wheels to form a first cutting wire section arranged in a first direction.

4. The silicon rod cutting and grinding all-in-one machine as recited in claim 3, wherein the first cutting device further comprises a first flaw-piece discharging device for discharging a flaw-piece formed after the first cutting device performs the first-direction side cutting on the silicon rod.

5. The silicon rod cutting and grinding all-in-one machine as recited in claim 3, wherein the second cutting device comprises:

a second cutting frame;

the second cutting support is movably lifted on the second cutting frame;

the second cutting unit is arranged on the second cutting support; the second cutting unit comprises a second wire frame arranged on the second cutting support, a plurality of second cutting wheels arranged on the second wire frame, and a second cutting line, and the second cutting line is sequentially wound on the second cutting wheels to form a second cutting line segment arranged in a second direction.

6. The silicon rod cutting and grinding all-in-one machine as recited in claim 5, wherein the second cutting device further comprises a second flaw-piece discharging device for discharging a flaw-piece formed after the second cutting device performs the second-direction side cutting on the silicon rod.

7. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, wherein the cutting device comprises:

a cutting frame;

the cutting support is movably lifted on the cutting frame; the cutting support comprises a support main body, a first support side wing and a second support side wing, wherein the first support side wing and the second support side wing are positioned on two opposite lateral sides of the support main body;

the first cutting unit is arranged at the first side of the cutting support; the first cutting unit comprises a first wire frame arranged on a side wing of a first support in the cutting support, a plurality of first cutting wheels arranged on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound on the plurality of first cutting wheels to form a first cutting wire section arranged in a first direction;

the second cutting unit is arranged on the second side of the cutting support; the second cutting unit comprises a second wire frame arranged on a second support side wing in the cutting support, a plurality of second cutting wheels arranged on the second wire frame and a second cutting line, and the second cutting line is sequentially wound on the second cutting wheels to form a second cutting line segment arranged in a second direction.

8. The silicon rod cutting and grinding all-in-one machine as claimed in claim 7, wherein the first cutting line and the second cutting line are the same cutting line, and a guide wheel is further arranged on the cutting support and positioned between the first cutting unit and the second cutting unit for winding the cutting line.

9. The silicon rod cutting and grinding all-in-one machine as recited in claim 7, wherein the first cutting unit further comprises a first flaw-piece discharging device for discharging a flaw-piece formed after the first cutting unit performs the first-direction side cutting on the silicon rod; the second cutting unit further comprises a second flaw-piece discharging device which is used for discharging flaw-pieces formed after the second cutting unit performs second-direction side cutting on the silicon rods.

10. The silicon rod cutting and grinding all-in-one machine as recited in claim 5 or 7, wherein an intersection point of a cutting line when the first cutting unit performs first-direction side cutting on the silicon rod and a cutting line when the second cutting unit performs second-direction side cutting on the silicon rod is located within a cross section of the silicon rod.

11. The silicon rod cutting and grinding all-in-one machine as set forth in claim 1, wherein the grinding device comprises:

the grinding surface support is arranged on the machine base;

at least one pair of grinding tools which are oppositely arranged on the grinding surface support; the at least one pair of grinding tools movably lift relative to the grinding surface support so as to be used for grinding and chamfering the square silicon rod.

12. The silicon rod slicing and grinding all-in-one machine as set forth in claim 11, wherein the grinding tool comprises:

a main shaft; and

and the at least one grinding wheel is arranged at the working end of the main shaft.

13. The silicon rod slicing and grinding all-in-one machine as set forth in claim 11, wherein the grinding tool comprises:

a rotary chassis;

the double-head main shaft is arranged on the rotary chassis, the first end of the double-head main shaft is provided with at least one coarse grinding wheel, and the second end of the double-head main shaft is provided with at least one fine grinding wheel;

and the driving motor is used for driving the rotary chassis to rotate so that the first end and the second end of the double-head spindle can interchange positions.

14. The silicon rod cutting and grinding all-in-one machine as recited in claim 1, wherein the first processing region, the second processing region and the third processing region of the silicon rod processing platform are distributed at 120 ° between adjacent two of them, and the rotation angle range of the silicon rod conversion device is ± 240 °.

15. The silicon rod cutting and grinding all-in-one machine as claimed in claim 1, wherein the silicon rod processing platform is further provided with a waiting area, and the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod transferring device, which is arranged adjacent to the waiting area of the silicon rod processing platform and is used for transferring a silicon rod to be processed to the waiting area of the silicon rod processing platform or transferring a processed silicon rod on the waiting area out of the silicon rod processing platform.

16. The silicon rod cutting and grinding all-in-one machine as set forth in claim 15, wherein the silicon rod transfer device comprises:

the transferring base is arranged on the base in a sliding manner through a sliding mechanism;

the silicon rod platform is movably arranged on the transferring base and used for transversely arranging the silicon rod;

the silicon rod fastening mechanism is arranged on the silicon rod platform and used for fastening the silicon rod in the silicon rod transferring process; and

and the platform turnover mechanism is used for driving the silicon rod platform to turn over relative to the transfer base, so that the silicon rod is vertically placed on the silicon rod transfer device.

17. The silicon rod cutting and grinding all-in-one machine as recited in claim 15, further comprising a positioning detection device for performing edge detection and center positioning on the silicon rod located at the waiting location.

18. The silicon rod cutting and grinding all-in-one machine as set forth in claim 17, wherein the positioning detection device comprises:

the silicon rod edge line detection device comprises a ridge line detection unit and a detection controller, wherein the ridge line detection unit comprises a contact detection mechanism, a rotating mechanism and a detection controller electrically connected with the contact detection mechanism and the rotating mechanism, the contact detection mechanism is used for sending an on-off signal to the detection controller through contact with a ridge line of the silicon rod, and the rotating mechanism is used for adjusting the position of the silicon rod according to the control of the detection controller; and

the shaft center adjusting unit is used for positioning the shaft center of the silicon rod in the center of the pretreatment area and comprises a clamping mechanism, wherein the clamping mechanism is used for forming a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the pretreatment area.

19. The silicon rod cutting and grinding all-in-one machine as recited in claim 15, wherein the waiting zone, the first processing zone, the second processing zone and the third processing zone of the silicon rod processing platform are distributed at 90 ° between adjacent two of them, and the rotation angle range of the silicon rod conversion device is ± 270 °.

20. The silicon rod slicing and grinding all-in-one machine as recited in claim 14 or 19, wherein the silicon rod transfer device comprises:

a conveying body;

the silicon rod positioning mechanism is arranged on the conveying body and used for positioning the silicon rod; and

and the conversion driving mechanism is used for driving the conveying body to rotate so as to drive the silicon rod positioned by the silicon rod positioning mechanism to convert between the processing areas.

21. A silicon rod cutting and grinding method is applied to a silicon rod cutting and grinding all-in-one machine, the silicon rod cutting and grinding all-in-one machine comprises a base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing position, a second processing position and a third processing position, the silicon rod cutting and grinding all-in-one machine further comprises a cutting device, a grinding device and a silicon rod conversion device, and the silicon rod cutting and grinding method is characterized by comprising the following steps:

22. The silicon rod slicing and grinding method as set forth in claim 21, wherein the first processing location, the second processing location and the third processing location on the silicon rod processing platform are distributed at 120 ° therebetween; when the direction according to the sequence of the first processing location, the second processing location and the third processing location is defined as a forward direction, the first preset angle for rotating the silicon rod conversion device is 120 degrees of forward rotation, and the second preset angle for rotating the silicon rod conversion device is 120 degrees of forward rotation or 240 degrees of reverse rotation.

23. The utility model provides a silicon rod surely grinds method, is applied to a silicon rod surely grinds all-in-one, silicon rod surely grinds all-in-one including the frame that has silicon rod processing platform, silicon rod processing platform locates to have and waits for position, first processing position, second processing position and third processing position, silicon rod surely grinds all-in-one still includes cutting device, grinder and silicon rod conversion equipment, its characterized in that, silicon rod surely grinds the method and includes following step:

24. The silicon rod slicing and grinding method as set forth in claim 23, wherein the waiting location, the first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 90 ° therebetween; when the trend according to the order of waiting position, first processing position, second processing position and third processing position is defined as forward, make silicon rod conversion equipment pivoted first predetermine the angle and rotate 90 for the forward, make silicon rod conversion equipment rotate the second predetermine the angle and rotate 90 or reverse rotation 270 for the forward.