CN216860226U - Silicon rod cutting equipment and system - Google Patents

Abstract

The embodiment of the application provides a silicon rod cutting equipment and system, wherein, silicon rod cutting equipment includes: a base; the vertical base is vertically arranged on the base; the side surface of the vertical base is provided with a sliding guide piece extending along the vertical direction; the silicon rod bearing device comprises a bearing table, a positioning device and a positioning device, wherein the bearing table is used for bearing a silicon rod, and the silicon rod is vertically arranged on the bearing table; a wire cutting device; the linear cutting device is matched with the sliding guide piece to vertically slide, or the plummer is matched with the sliding guide piece to vertically slide; the linear cutting device comprises at least three cutting line wheel sets, cutting lines wound on the cutting line wheel sets are parallel to each other, and the linear cutting device is used for cutting the silicon rod along a first cutting line to obtain at least two middle rods and a side material; the middle rod is provided with two parallel planes and an arc surface connected between the two planes; the edge leather material is provided with a plane and a cambered surface connected with the plane. The silicon rod cutting equipment and the silicon rod cutting system provided by the embodiment of the application can solve the technical problem existing in the traditional scheme that small silicon wafers are cut through large silicon wafers.

Description

Silicon rod cutting equipment and system

Technical Field

The application relates to a hard and brittle material cutting technology, in particular to silicon rod cutting equipment and a system.

Background

With the development of heterojunction cells, the market demands for small silicon wafers and thin wafers are higher and higher, the thickness of the silicon wafers ranges from 180 micrometers to 150 micrometers, the future market may need silicon wafers with the thickness of 90 micrometers, even 70 micrometers or 80 micrometers, and thinner silicon wafers need smaller silicon wafer specifications to ensure the cutting quality and process.

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer, but in the laser scribing process, damage and defect states can be generated on the cross section of the small silicon wafer, and the conversion efficiency of the finally processed heterojunction battery is seriously influenced.

At present, the size of the silicon rod is larger and larger from 166mm to 182mm, and then to 210mm, and may reach 230mm or even 250mm in the future, the yield of large silicon rods cut into large silicon wafers is reduced, and meanwhile, the subsequent process is too high in requirement and is very easy to break.

Disclosure of Invention

In order to solve one of the technical defects, the embodiment of the application provides silicon rod cutting equipment and a silicon rod cutting system.

According to a first aspect of embodiments of the present application, there is provided a silicon rod cutting apparatus comprising:

a base;

the vertical base is vertically arranged on the base; the side surface of the vertical base is provided with a sliding guide piece extending along the vertical direction;

the silicon rod bearing device comprises a bearing table, a positioning device and a positioning device, wherein the bearing table is used for bearing a silicon rod, and the silicon rod is vertically arranged on the bearing table;

a wire cutting device; the linear cutting device is matched with the sliding guide piece to vertically slide, or the plummer is matched with the sliding guide piece to vertically slide; the linear cutting device comprises at least three cutting line wheel sets, cutting lines wound on the cutting line wheel sets are parallel to each other, and the linear cutting device is used for cutting the silicon rod along a first cutting line to obtain at least two middle rods and a side material; the middle rod is provided with two parallel planes and an arc surface connected between the two planes; the edge leather material is provided with a plane and an arc surface connected with the plane.

According to a second aspect of embodiments of the present application, there is provided a silicon rod cutting system comprising:

the cutting equipment is used for cutting the silicon rod to obtain the middle rod with two planes and the arc shape connected between the two planes;

the middle rod cutting equipment is used for cutting the middle rod to obtain a small silicon rod with a rectangular section;

the grinding equipment is used for grinding the small silicon rod;

and/or the slicing equipment is used for slicing the small silicon rod.

In the embodiment, the silicon rod is cut by adopting at least three first cutting surfaces to obtain two small middle rods, so that the middle rods are cut by two second cutting surfaces subsequently, at least two small silicon rods with smaller cross sectional areas are directly obtained, the cutting steps are fewer, the efficiency is higher, small silicon wafers meeting the size requirements of the silicon wafers are directly obtained by cutting the small silicon rods subsequently and are used for preparing small heterojunction batteries, the step of laser scribing is not needed, the product quality of the small silicon wafers is improved, and the conversion efficiency of the heterojunction batteries is further ensured.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a silicon rod cutting method provided in an embodiment of the present application for cutting a silicon rod;

FIG. 3 is a cross-sectional view of a mid-rod cut in a method provided by an embodiment of the present application;

fig. 4 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application;

fig. 5 is a schematic structural view of a silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 6 is a schematic view illustrating a structure in which the silicon rod is cut by the wire cutting device in the silicon rod cutting apparatus shown in fig. 5;

fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 8 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 9 is a schematic view of an assembly structure of a cutting wire wheel in the silicon rod cutting apparatus provided in the embodiment of the present application;

fig. 10 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 11 is a schematic structural view of still another silicon rod cutting apparatus provided in the embodiments of the present application;

fig. 12 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 13 is a schematic structural view of still another silicon rod cutting apparatus provided in an embodiment of the present application;

fig. 14 is a schematic view illustrating a structure in which the silicon rod is cut by the wire cutting device in the silicon rod cutting apparatus shown in fig. 13;

fig. 15 is a schematic structural view of still another silicon rod cutting apparatus provided in the embodiment of the present application;

fig. 16 is a first structural schematic diagram of a wire cutting device in a silicon rod cutting apparatus according to an embodiment of the present application;

fig. 17 is a second schematic view illustrating a configuration of a wire cutting device in a silicon rod cutting apparatus according to an embodiment of the present disclosure;

fig. 18 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 19 is a cross-sectional view of a clamping mechanism in a cutting device according to an embodiment of the present application;

fig. 20 is a schematic structural diagram of another carrier table in the cutting apparatus provided in the embodiment of the present application;

FIG. 21 is a cross-sectional view of a cutting reel in the cutting apparatus provided in an embodiment of the present application;

fig. 22 is a first schematic structural view illustrating a clamping device in the cutting apparatus according to the embodiment of the present application gripping a leather material at a clamping edge;

fig. 23 is a second schematic structural view illustrating that a clamping device of the cutting apparatus provided in the embodiment of the present application grabs the edge leather;

fig. 24 is a schematic structural view of a silicon rod grinding apparatus provided in an embodiment of the present application;

FIG. 25 is a schematic structural view illustrating a small silicon rod clamped on a sliding table device in the grinding apparatus shown in FIG. 24;

fig. 26 is a schematic structural view of a slide table device in the grinding apparatus shown in fig. 24;

fig. 27 is a schematic view showing a structure of a grinding unit in the grinding apparatus shown in fig. 24.

Reference numerals:

a 1-silicon rod; a 2-middle rod; a 4-small silicon rods; a 5-small raw material pieces; a 6-offcut; a 61-arc top; a 62-corner; a 63-flaw-piece bar;

b 1-first cut plane; b 2-second cut surface; b 3-third cut surface; b 4-fourth cut surface;

1-a base; 11-a vertical base;

2-a bearing platform; 211-1-a primary load bearing portion; 211-2-an auxiliary carrier; 221-a limiting mechanism; 23-a clamping mechanism; 321-a clamp drive member mechanism; 232-telescopic rod; 233-clamping head; 251-flat plate type abutting plates; 252-L-shaped abutment plates; 261-a first preset opening;

301-main support; 302-a reel support; 31-a cutting wire wheel; 311-wire chase; 32-a cutting line; 34-a pay-off mechanism; 35-a wire arranging mechanism; 36-a take-up mechanism;

401-feeding area; 402-grinding the area; 41-a base assembly; 42-a feeding assembly; 421-a feeding sliding table; 422-head frame; 423-tailstock; 424-headgear clip; 425-tailstock chuck; 426-grinding the fixed seat; 427-a collet; 431-grinding head;

51-a fixture; 52-a jaw; 521-a mounting part; 522-jaw body.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The embodiment provides a silicon rod cutting device, which is used for cutting a silicon rod to obtain a small sheet-shaped silicon wafer. The silicon rod may be a polysilicon material, a single crystal silicon material, etc., and the embodiment only takes the single crystal silicon material as an example to specifically describe the cutting method. The technical solution provided by this embodiment can be directly applied to cutting other materials by those skilled in the art, and can also be applied to cutting other materials after being subjected to adaptive modification.

The cutting device that this embodiment provided includes: base, plummer and wire cutting device. The bearing table is arranged on the base and used for bearing the silicon rod; the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the linear cutting device comprises at least three cutting line wheel sets, cutting lines wound on the cutting line wheel sets are parallel to each other, and the linear cutting device is used for cutting the silicon rod along a first cutting line to obtain at least two middle rods and a side material; the middle rod is provided with two parallel planes and an arc surface connected between the two planes; the edge leather material is provided with a plane and a cambered surface connected with the plane.

For the purpose of describing the cutting device in detail, the present embodiment further provides a cutting method as follows:

fig. 1 is a flowchart of a silicon rod slicing method according to an embodiment of the present disclosure, fig. 2 is a schematic diagram of a silicon rod slicing method according to an embodiment of the present disclosure for slicing a silicon rod, and fig. 3 is a cross-sectional view of an intermediate rod being sliced according to the method according to the embodiment of the present disclosure. As shown in fig. 1 to fig. 3, the cutting method provided in this embodiment includes:

101, cutting the silicon rod by using first cut surfaces parallel to the length direction of the silicon rod, wherein the number of the first cut surfaces is at least three, and each first cut surface is parallel to and arranged at intervals to obtain at least two middle rods with two parallel planes and arc surfaces connected between the two planes, and an edge leather with a plane and the arc surfaces connected with the plane.

In this embodiment, the silicon rod is a single crystal silicon rod, and has a cylindrical shape, and the length direction of the silicon rod is the central line direction of the cylindrical shape, which may also be referred to as the axial direction.

At least three first cut surfaces b1 are parallel and distributed at intervals, and the silicon rod a1 is cut to obtain the edge leather materials at the upper side and the lower side and at least two middle rods a2 in the middle. The central rod a2 has two opposite planes and an arc surface connected between the two planes. The edge leather material is provided with a plane and an arc surface connected with the plane.

102, cutting the intermediate rod by using a second tangent plane parallel to the length direction of the silicon rod, wherein the second tangent plane is vertical to the first tangent plane; the number of the second sections is two, and the second sections are distributed on two sides of the central line of the silicon rod to obtain the small silicon rod with the rectangular section.

The second cut surface b2 is perpendicular to the first cut surface b1, is located on two sides of the center line of the silicon rod a1, and may be symmetrically arranged. The second cut surfaces b2 at both sides cut off corner portions at both left and right ends of the intermediate rod a 2.

Silicon rod a1 is cut synchronously by at least three first cut surfaces b1 and two second cut surfaces b2, and at least two small silicon rods a4 and the edge coatings on the upper side and the lower side are obtained.

In the traditional scheme, a cylindrical silicon rod is cut into a square rod with a rectangular cross section, then the square rod is cut to obtain a large silicon wafer with a larger size, and then the large silicon wafer is cut into small silicon wafers by adopting a laser scribing technology, so that the small silicon wafers are damaged.

In the embodiment, the silicon rod is cut by sequentially adopting the at least three first cutting surfaces and the two second cutting surfaces, so that at least two small silicon rods a4 with smaller cross-sectional areas are directly obtained, the cutting steps are fewer, the efficiency is higher, and the small silicon rods a4 are subsequently sliced to directly obtain small silicon wafers meeting the size requirement of the silicon wafers for preparing small heterojunction batteries without the step of laser scribing, so that the product quality of the small silicon wafers is improved, and the conversion efficiency of the heterojunction batteries is further ensured.

The cutting step of the small silicon rod a4 specifically comprises the following steps: the small silicon rod a4 was sliced along the longitudinal direction of the small silicon rod a4 in a slice perpendicular to the longitudinal direction of the small silicon rod a4, to obtain a plurality of small starting pieces a 5. The step of slicing may be performed by a microtome known in the art.

On the basis of the above technical solution, before slicing the small silicon rod a4, the small silicon rod a4 needs to be ground. Referring to the above steps, the small silicon rod a4 having a rectangular cross section and four surfaces parallel to the longitudinal direction thereof as side surfaces was obtained. After the small silicon rod a4 was obtained, four side surfaces of the small silicon rod a4 were ground, and then an edge angle between two adjacent side surfaces of the small silicon rod a4 was ground to form a chamfered surface between the two side surfaces, so that a ground small silicon rod was obtained.

The side face of the small silicon rod is ground, so that the surface of the small silicon rod is smooth, the edge of a small silicon wafer formed by subsequent slicing is smooth, trimming is not needed in a laser scribing mode, and the quality of the small silicon wafer is improved. The edges and corners of the small silicon rods are ground to form a chamfer surface, so that the cutting line can be prevented from contacting the edges and corners of the small silicon rods in the slicing process, and the corners of the silicon wafers are damaged.

One implementation is as follows: the number of the first cut planes b1 is three, resulting in a ratio of the cross-sectional areas of the two intermediate rods a2 of more than 1: 3.

When the outer two first tangential planes b1 are symmetrically arranged, and the first tangential plane b1 in the middle passes through the center line of the silicon rod, the cross-sectional areas of the two middle rods a2 are equal.

In the above solution, the distance between the two second cut surfaces b2 is smaller than the width of the surface formed by the first cut surface b1 for cutting the silicon rod a 1. So that the plane contact of second tangent plane b2 and intermediate rod, rather than the handing-over department contact of intermediate rod plane and cambered surface, and then make the cutting process comparatively steady accurate, guaranteed size precision.

Furthermore, the edge skin material obtained by cutting can be cut to obtain a silicon rod with a smaller sectional area, and the silicon rod can be utilized to reduce waste of raw materials.

Fig. 4 is a schematic structural view illustrating a cutting process performed on an edge skin material in the silicon rod cutting method according to the embodiment of the present application. As shown in fig. 4, the edge skin a6 is cut by a third cut surface b3 parallel to the length direction of the edge skin, and the third cut surface b3 is parallel to the bottom surface of the edge skin a6 to cut off the arc-shaped top a61 of the edge skin.

Cutting the edge leather a6 by a fourth cut surface b4 parallel to the length direction of the edge leather, wherein the fourth cut surface b4 is vertical to the bottom surface of the edge leather a 6; the number of the fourth cut surfaces b4 is two, and the four cut surfaces b4 are symmetrically arranged on two sides of the flaw-piece material a6 to cut off corner portions a62 on two sides of the flaw-piece material a6, so that the flaw-piece silicon rod a63 with a rectangular cross section is obtained.

The above-mentioned order of cutting off limit cladding material arc top and corner portion can be exchanged, promptly: the arc-shaped top part can be cut off first, and then the corner part can be cut off; or the corner part can be cut off firstly, and then the arc-shaped top part can be cut off.

On the basis of the technical scheme, the embodiment also provides silicon rod cutting equipment, and the silicon rod cutting method is applied to cut the silicon rod made of the hard and brittle material.

Fig. 5 is a schematic structural view of a silicon rod cutting apparatus according to an embodiment of the present application, and fig. 6 is a schematic structural view of a silicon rod being cut by a wire cutting device in the silicon rod cutting apparatus shown in fig. 5. As shown in fig. 5 and 6, the cutting apparatus includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 and wire cutting device all set up on base 1.

The carrying table 2 is used for carrying the silicon rod a1, the silicon rod a1 is horizontally placed on the carrying table 2, and a part for fixing and limiting the silicon rod a1 can be further arranged on the carrying table 2 so as to limit the silicon rod a1 to move in the cutting process.

The wire cutting device and the carrier 2 can be moved relatively in the longitudinal direction of the silicon rod a1, in one way: the carrier 2 is fixed on the base 1, and the wire cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the wire wheel support moves relative to the base 1 under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed on the base 1, and the bearing table 2 moves relative to the linear cutting device under the driving action of the bearing table driving mechanism.

Specifically, the top surface of the base 1 is provided with a sliding guide extending along the horizontal direction, and the linear cutting device and the sliding guide are matched and horizontally move, or the plummer and the sliding guide are matched and horizontally move.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wound on the first cutting wire wheel set is used for forming a first section or a second section to cut the silicon rod.

In a specific implementation, as shown in fig. 5 and 6, the cutting device includes: base 1, plummer 2 and wire cutting device. Wherein, plummer 2 is fixed to be set up in the middle part of base 1, and silicon rod a1 level is placed on plummer 2, and the both ends of plummer 2 are provided with stop gear and the tight mechanism in top respectively, follow the tight silicon rod a1 in both ends top. The sliding guide members are slide rails and are arranged on two sides of the bearing table 2.

The wire cutting device includes: a reel support 302 and a cutting reel 31. The reel support 302 is a portal support, and two legs of the portal support are slidably disposed on the base 1 and are engaged with the slide rail, so that the reel support 302 can slide relative to the slide rail along the length direction of the silicon rod a 1.

The cutting wire wheel 31 is fixed on the wire wheel bracket 302 through a wire wheel mounting seat. A plurality of stations can be arranged on the reel bracket 302, and a plurality of silicon rods a1 can be cut simultaneously. At least two cutting wire wheels 31 are arranged at each station, and the cutting wires 32 are wound on the two cutting wire wheels 31 along the horizontal direction to form a loop to cut the silicon rod a1, so that an intermediate rod a2 is obtained. The cutting wire wheels 31 are divided into three groups, and three first cutting planes are formed by three cutting wires to cut the silicon rod. The cutting wire wheel 31 is installed on the wire wheel support through a wire wheel installation seat, the wire wheel installation seat is L-shaped, one end of the wire wheel installation seat is fixed on the wire wheel support, and the other end of the wire wheel installation seat is provided with the cutting wire wheel.

Specifically, set up six cutting wire wheels on a station: 31-1, 31-2, 31-3, 31-4, 31-5 and 31-6. Wherein 31-1, 31-2 are arranged as a group at intervals in the horizontal direction, extending in the horizontal direction around the cutting line 32 provided thereon. 31-3, 31-4 are arranged as a group at intervals in the horizontal direction, extending in the horizontal direction around the cutting line 32 provided thereon. 31-5, 31-6 are arranged as a group at intervals in the horizontal direction, extending in the horizontal direction around the cutting line 32 provided thereon. The three cutting lines cut the silicon rod as three first cuts.

The distance between the two cutting wire wheels in each group is unequal, so that the wire wheels are staggered left and right. The wire wheels can be staggered from front to back so that the cutting wires wound on the cutting wire wheels of each group are contacted with the silicon rod successively for cutting. Specifically, the distance between 31-1 and 31-2 is less than the distance between 31-3 and 31-4, and the distance between 31-5 and 31-6 is less than the distance between 31-3 and 31-4.

It will be appreciated that the set of cutting lines comprises at least two cutting drums, wherein the two cutting drums are coplanar and the annular cutting line is wound around the two cutting drums. Further, the cutting line wheel set further comprises: tension pulley and action wheel, annular line of cut still around locating on tension pulley and the action wheel, the output at the line wheel driver is connected to the action wheel, drives the action wheel through the line wheel driver and rotates, and then drives the line of cut and rotate around each line wheel.

Fig. 7 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 5 is that: in the cutting apparatus shown in fig. 7, the reel support 302 is fixed on the base 1, and the plummer 2 is matched with the slide rail, and horizontally slides along the slide rail arranged on the base 1 under the driving action of the plummer driving mechanism, so as to drive the silicon rod to move relative to the reel support.

Fig. 8 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 5 and 7 is that: the cutting apparatus shown in fig. 8 cuts the silicon rod in a long wire cutting manner. Specifically, set up paying out machine structure 34, admission machine structure 36 and winding displacement mechanism 35 on base 1, paying out machine structure 34 and admission machine structure 36 set up respectively in the both sides of line of cut wheelset, and the line of cut is that single long line is around locating between paying out machine structure 35, admission machine structure 36, winding displacement mechanism 35 and the line of cut wheelset.

During the cutting process, the cutting line 32 is wound out from the pay-off mechanism 34, guided by the wire arranging mechanism 35, passes through each cutting wire wheel 31, and then is retracted by the take-up mechanism 35. In one cutting process, the pay-off mechanism 34 also functions as a take-up mechanism 36, and the take-up mechanism 36 also functions as the pay-off mechanism 34 to reciprocate the cutting wire 31.

Fig. 9 is a schematic view of an assembly structure of a cutting wire wheel in the silicon rod cutting apparatus provided in the embodiment of the present application. As shown in fig. 9, three groups of cutting wheels 31 are provided, each group comprising at least two cutting wheels 31, taking the annular cutting wheels as an example. When there are two cutting drums 31, the two cutting drums 31 are arranged one above the other. The cutting wire wheels 31 positioned above in each group can be connected to the same rotating shaft, and the rotating shaft is connected with the driving motor in a direct connection driving mode, a belt driving mode, a chain driving mode or a gear driving mode, so that the driving motor drives the rotating shaft to rotate, and then the cutting wire wheels 31 are driven to rotate. The wire wheels positioned below in each group are connected in the same way.

In another mode: the cutting wire wheels above the two groups are connected to the same rotating shaft and connected to one side bracket, and the cutting wire wheels above the other group are connected to the other side bracket.

In yet another way: each set comprises three cutting wire wheels 31, one of which acts as a tension wheel to provide tension to the cutting wire. Or each group comprises more than four cutting line wheels 31, one of the cutting line wheels is used as a tension wheel, the other one is used as a driving wheel and is connected with a driver, the driving wheel is driven by the driver to rotate, and then the cutting lines are driven to rotate.

The arrangement shown in fig. 9 is suitable for cutting a silicon rod a1 placed in the direction shown in fig. 9, so that the cutting line cuts in a vertical direction. In addition, a stopper mechanism 221 and a tightening mechanism are provided on the susceptor 2, and the silicon rod is tightened from both ends. For the scheme shown in fig. 9, the silicon rod is cut into four parts by three first cutting surfaces, and four pairs of limiting mechanisms 221 and jacking mechanisms are adopted.

The cutting equipment adopts a horizontal cutting mode, namely: and horizontally placing the silicon rod on a bearing platform for cutting. Several vertical cutting modes are provided below, namely: and vertically placing the silicon rod on the bearing platform for cutting.

Fig. 10 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. As shown in fig. 10, the cutting apparatus includes: base 1, vertical base 11, plummer 2 and wire cutting device. The side of the vertical base 11 is provided with a slide guide extending in the vertical direction. The silicon rod a1 is vertically disposed on the susceptor 2. Means for fixing and limiting the silicon rod a1 may be further provided on the carrier table 2 to limit the movement of the silicon rod a1 during cutting.

The wire cutting device and the carrier 2 can be moved relatively in the longitudinal direction of the silicon rod a1, in one way: the carrier 2 is fixed on the base 1 or the vertical base 11, and the wire cutting device moves relative to the carrier 2, for example: the wire cutting device includes: the wire wheel support moves relative to the bearing table 2 under the driving action of the support driving mechanism. The other mode is as follows: the linear cutting device is fixed, and the bearing table 2 moves relative to the linear cutting device under the driving action of the bearing table driving mechanism.

Specifically, the vertical base 11 is provided with a sliding guide extending vertically, and the wire cutting device slides up and down in cooperation with the sliding guide, or the plummer slides up and down in cooperation with the sliding guide.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wound on the first cutting wire wheel set is used for forming a first section or a second section to cut the silicon rod.

In a specific implementation manner, as shown in fig. 10, the bearing platform 2 is fixedly disposed in the middle of the vertical base 11, the silicon rod a1 is vertically placed on the bearing platform 2, and the two ends of the bearing platform 2 are respectively provided with a limiting mechanism and a tightening mechanism for tightening the silicon rod a1 from the two ends. The sliding guide members are slide rails and are arranged on two sides of the bearing table 2.

The wire cutting device includes: a reel support 302 and a cutting reel 31. The reel support 302 is a door-shaped support, and two leg portions of the reel support are slidably disposed on the vertical base 11 and are matched with the slide rail, so that the reel support 302 can slide up and down relative to the slide rail along the length direction of the silicon rod a 1. The arrangement of the cutting wire wheel 31 can be seen in fig. 6, and three cutting wires form three first cutting planes to cut the silicon rod.

Fig. 11 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 10 is that: in the cutting apparatus shown in fig. 11, the reel support 302 is fixed on the vertical base 11, and the plummer 2 is matched with the slide rail and slides up and down along the slide rail under the driving action of the plummer driving mechanism, so as to drive the silicon rod to move up and down relative to the reel support.

Fig. 12 is a schematic structural view of another silicon rod cutting apparatus provided in the embodiment of the present application. The difference from fig. 10 and 11 is that: the cutting apparatus shown in fig. 12 cuts the silicon rod using a long wire cutting method. Specifically, set up paying out machine structure 34, admission machine structure 36 and winding displacement mechanism 35 on base 1, paying out machine structure 34 and admission machine structure 36 set up respectively in the both sides of line of cut wheelset, and the line of cut is that single long line is around locating between paying out machine structure 35, admission machine structure 36, winding displacement mechanism 35 and the line of cut wheelset.

The cutting device provided in the above is used for cutting the silicon rod by the first cutting plane. The embodiment also provides several cutting devices for cutting the second section.

Fig. 13 is a schematic configuration view of another silicon rod cutting apparatus according to an embodiment of the present disclosure, and fig. 14 is a schematic configuration view of a wire cutting device cutting a silicon rod in the silicon rod cutting apparatus shown in fig. 13. Fig. 13 and 14 provide apparatus similar to the previous embodiments, each comprising a base 1, a carrier 2 and a wire cutting device. The wire cutting apparatus may be moved relative to the base 1, or the carrier 2 may be moved relative to the base 1. The cutting wire wheel can be wound with an annular cutting wire and can also be wound with a single long wire for cutting.

The apparatus shown in figures 13 and 14 is generally similar to that described above, except for the arrangement of the cutting wheels in the wire cutting apparatus: the wire cutting device is provided with two stations, and can simultaneously cut two intermediate rods a 2. Take one of them station as an example, be provided with four cutting wire wheels: 31-1, 31-2, 31-3 and 31-4. The cutting wire wheels 31-1 and 31-2 are arranged up and down as a group, and extend vertically around a cutting wire 32 arranged on the cutting wire wheels to serve as a second tangent plane. The cutting reels 31-3 and 31-4 are arranged one above the other as a group and extend vertically around a cutting line 32 provided thereon as a further second section. The two second cutting planes cut off the corner parts of the intermediate rod a2 to obtain a small silicon rod a 4.

The cutting wire mentioned in the embodiment is a diamond wire, and is used for cutting a monocrystalline silicon material.

According to the scheme, the monocrystalline silicon rod can be directly cut and processed into small silicon wafers, and the defects of processing the small silicon wafers from large silicon wafers in the prior art are overcome.

The length L of the small silicon rod is greater than the width W and the height H thereof, and the longitudinal direction of the small silicon rod is understood to be the same as the axial direction of the silicon rod a 1.

In some embodiments of the present application, the plurality of small silicon rods have equal or unequal cross-sectional length and width values. When the sectional length and width values of the plurality of small silicon rods are equal, the small silicon wafers prepared by the plurality of small silicon rod slices have the same size; when the sectional length and width values of the plurality of small silicon rods are different, the small silicon wafers prepared from the plurality of small silicon rods are different in size, so that the small batteries with different specifications and sizes can be manufactured.

In some embodiments of the present application, in the step "slicing", each small silicon rod is individually sliced with a cutting plane parallel to the end face of the small silicon rod; alternatively, a plurality of small silicon rods are sliced simultaneously. Preferably, the slices are simultaneously sliced, so that the efficiency is higher.

In some embodiments of the present application, the method further comprises the steps of trimming the leather: and cutting the edge leather materials in the direction of which the section is parallel to the axis of the silicon rod, wherein each edge leather material can be cut to obtain an outer edge leather material and at least one middle edge leather material. The outer side leather and the middle side leather are used for subsequent processing so as to improve the utilization rate of the silicon rod.

In some embodiments of the present application, the thicknesses of the outer side leather and the middle leather are equal or different, so as to meet the processing requirements of different subsequent products.

This embodiment also provides a device for cutting edge cladding material, as shown in fig. 15, the cutting device includes: the wire cutting machine comprises a base 1, a bearing table 2 and a wire cutting device, wherein the bearing table 2 and the wire cutting device move relatively, the bearing table 2 can move relative to the base, and the wire cutting device can also move relative to the base. The edge leather can be horizontally placed on the bearing table 2 or vertically placed on the bearing table. The wire cutting device may be an annular cutting wire, or a single long wire, as described above.

The wire cutting apparatus includes a gate-shaped reel holder 302 on which a plurality of sets of cutting reels 32 are disposed. Fig. 15 is provided with four stations, and four edge leather materials can be cut simultaneously. For one station, the cutting device comprises a group of cutting wire wheels, at least two cutting wire wheels 32 are arranged horizontally or vertically, and cutting lines arranged on the two cutting wire wheels 32 are wound to form a cutting surface along horizontal extension or vertical extension so as to cut off the arc-shaped top or corner of the edge leather. Fig. 16 shows the horizontal arrangement. When one station comprises two groups of cutting wire wheels, two corner parts of the edge leather can be cut off simultaneously by winding the cutting wires arranged on the two groups of cutting wire wheels. Figure 17 shows a view of two sets of cutter wheels.

In the structure shown in fig. 15, the cutting wire wheels are connected to the same rotating shaft, and the rotating shaft is driven to rotate by a driver, so that the cutting wire wheels are driven to synchronously rotate. The connection between the driver and the rotating shaft can be direct drive, belt drive, chain drive or gear drive.

For the above-mentioned plummer 2 that cuts through silicon rod, middle rod and border strip, this embodiment also provides a concrete implementation, and the following drawings all take the border strip as an example for explanation, and the scheme is not limited to be used for bearing and cutting the border strip, but also is applicable to cutting a cylindrical silicon rod or middle rod.

Fig. 18 is a schematic structural diagram of a carrier table in the cutting apparatus provided in the embodiment of the present application. Fig. 18 shows four stations for cutting four trimmings simultaneously. For one of the stations, the carrier 2 has a first preset opening 261, giving way to the cutting line. The first preset opening 261 divides the front end of the bearing table into a main bearing part 211-1 and an auxiliary bearing part 211-2, and the main bearing part 211-1 and the auxiliary bearing part 211-2 are used for bearing the to-be-cut edge leather which is horizontally placed together.

When the edge leather material needs to be cut, the edge leather material is fixed on the bearing table in a flat mode, and at the moment, the edge leather material is located on the main bearing part, the auxiliary bearing part and the two first preset openings. The vertical cutting line enters between the main bearing part and the auxiliary bearing part from the first preset opening, and cutting is started from one end face of the edge leather until the end face of the other end is cut.

It can be understood that after the corner part of the edge leather is cut off, the edge leather side with the corner part cut off can be placed on the bearing table in the process of cutting off the arc-shaped top, and the bearing table does not need to be provided with a preset opening.

Fig. 19 is a cross-sectional view of a clamping mechanism in a cutting device provided in an embodiment of the present application. As shown in fig. 15 and 19, the carrier table is further provided with a position limiting mechanism 221 and a clamping mechanism 23. The clamping mechanism comprises a clamping driving mechanism 231, an expansion link 232 and a clamping head 233, one end of the expansion link is fixed on the side face of the clamping driving mechanism, and the other end of the expansion link, which can expand and contract, is fixed on the clamping head and the clamping head 233 is arranged opposite to the limiting mechanism. The clamping driving mechanism is used for driving the telescopic rod to stretch and adjust the distance between the clamping head 233 and the limiting mechanism 221 so as to place the edge leather between the clamping head and the limiting mechanism, and the limiting mechanism 221 and the clamping head 233 are used for being pushed against the end faces of the two ends of the edge leather to fix the edge leather.

A close-up plate is arranged on the bearing platform and is vertical to the surface of the bearing platform; and a holding space for holding the silicon rod is reserved between the two abutting plates and is used for stopping the silicon rod.

Specifically, the bearing device further comprises: and the flat-plate-type abutting plate 251 is fixedly arranged on the upper surfaces of the main bearing part 211-1 and the auxiliary bearing part 211-2, the upper surface of the main bearing part 211-1 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the main bearing part, and the upper surface of the auxiliary bearing part 211-2 is tightly attached to the plate surface of the flat-plate-type abutting plate fixed on the auxiliary bearing part.

The flat plate type abutting plate 251 is a full-length flat plate type abutting plate, and one flat plate type abutting plate is fixed on each of the main bearing part 211-1 and the auxiliary bearing part 211-2. Or at least two flat plate type abutting plates are respectively fixed on the main bearing part and the auxiliary bearing part at intervals.

The carrier table is made of rigid material in order to support the edge leather and the components mounted thereon. The edge skin material of the brittle and hard material is brittle and hard. In order to avoid hard-to-hard contact between the edge leather of the brittle and hard material and the bearing table of the rigid material, an elastic flat-plate type abutting plate is arranged. When the bottom surface that the terminal surface was curved limit cladding was placed on elastic plate leans on tight board, for the border cladding provides the buffering, played the effect of protection to the side cladding.

Fig. 20 is a schematic structural diagram of another carrier table in the cutting apparatus according to the embodiment of the present application. As shown in FIG. 20, the L-shaped abutment plate 252 is fixed to the upper surface of at least one of the sub-bearing portions 211-2, the lateral arm of the L-shaped abutment plate 252 is fixed to the upper surface of the sub-bearing portion 211-2, and the sub-bearing portion 211-2 is flush with the end of the lateral arm of the L-shaped abutment plate fixed thereto. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be adapted. The L-shaped abutting plate can stably bear the edge leather with two adjacent vertical planes.

Fig. 21 is a cross-sectional view of a cutting reel in the cutting device provided by the embodiment of the application. As shown in fig. 21, the embodiment provides a structure of a cutting reel, a plurality of wire slots 311 arranged in parallel are arranged at the outer edge of the cutting reel, a cutting wire 32 is embedded in one of the wire slots 311, the cutting wire 32 is limited in the wire slot 311, and the cutting wire is prevented from being separated from the cutting reel in the rotating process. In addition, because the sliding friction exists between the cutting line and the wire groove 311, a lot of diamonds are distributed on the cutting line, so that the wire groove is seriously worn. After one wire groove is worn, other wire grooves can be directly used, the cutting wire wheel does not need to be frequently replaced, the maintenance is convenient, and the material and the maintenance cost are saved.

For the apparatus for cutting the intermediate rod or the flaw-piece, the present embodiment also provides another way: as shown in fig. 22 and 23, the cutting apparatus provided in this embodiment further includes a clamping device for grabbing the offcut material, and placing the offcut material on the carrier or leaving the carrier. Specifically, the clamping device includes: the clamping device comprises a fixing piece 51 and two oppositely arranged clamping jaws 52, wherein at least one clamping jaw 52 is slidably arranged on the lower bottom surface of the fixing piece 51, so that the distance between the two clamping jaws 52 can be adjusted to adapt to the edge leather materials with different widths.

When the edge leather needs to be clamped, adjusting the distance between the two clamping jaws to be larger than the width of the edge leather, and moving the position of the clamping device to enable the two clamping jaws to be respectively positioned at two sides of the width direction of the edge leather; and then, adjusting the distance between the two clamping jaws to be smaller until the width direction of the edge leather is clamped. The cutting equipment that this application embodiment provided, realization that can be convenient through clamping device carries out the centre gripping to the side cladding, provides the advantage for the removal of side cladding.

Specifically, the holding jaw 52 includes: a vertical mounting plate 521 and a jaw body 522. At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51. The jaw body 522 is fixed to the inner surface of the mounting plate 521. The jaws themselves are not of unitary construction, but are formed as two separate pieces of mounting plate and jaw body. The vertical mounting plate is a mounting base of the clamping jaw body and is a base on which the clamping jaw can move. Two independent parts of mounting panel and clamping jaw body, at the in-process of clamping jaw body centre gripping raw material stick, the wearing and tearing of clamping jaw body are very serious, only need to change clamping jaw body can, the mounting panel need not be changed.

Use the cutting equipment of the limit cladding of this application, can realize the cutting of the limit cladding that the terminal surface is the arc. The cutting process comprises the steps of firstly, cutting corner parts at two ends of the edge leather to form the edge leather with the end surface in a rectangular and arc combined shape; then, the arc on the top of the edge leather with the end face in the shape of the combination of the rectangle and the arc is cut to form a rectangular rod with the end face in the rectangle.

Before cutting the corners of the edge leather material, after the edge leather material is placed on the bearing device, laser marking positioning is firstly carried out through the laser positioning device, and the edge leather material is guaranteed to be placed at a proper and correct position. A bottom sensing device is fixed on the bearing table 2, whether the side leather is installed in place or not is detected, and only after all detection conditions are met, the clamping mechanism can move to tightly push the side leather and tightly compress and fix the side leather together with the limiting mechanism.

Before the cutting device cuts the arc top, the flaw-piece material is placed on the bearing device, then the material inductive switch is triggered, and the flaw-piece material is detected to be placed in position. At the moment, the laser positioner and the lateral sensing device fixed on the auxiliary bearing part of the bearing device are used for marking and positioning the leather materials, so that the leather materials are placed at the correct position, and the leather materials are positioned under all detection conditions. And starting the clamping mechanism to start extending movement, and finishing the positioning and clamping process of the edge leather.

As shown in fig. 15, a laser alignment device 38 and a spray lubrication device 39 are also included.

Laser alignment device sets up in the top of boundary leather material plummer, realizes the accurate installation material loading function of boundary leather material. Set up a plurality of laser generator on the laser alignment device, install before the flaw-piece material plummer at the flaw-piece material, laser generator opens the laser that forms the linearity, projects on the load-bearing device. When the edge cover material is installed on the bearing device, alignment is firstly carried out through linear laser, so that a rectangular block made of brittle and hard materials is formed after cutting, and the size of the rectangular block is just the required size. Wherein, the position and the distance of each laser generator are adjustable, specifically according to different flaw-piece material specifications and confirm.

The specific working process of the laser alignment device is as follows: finding out the center line of the two wheels by using a tool or a measuring tool (a vernier caliper or a steel plate ruler). And adjusting the position of the focused laser marker to enable the laser emitted by the laser marker to be aligned to the middle line of the two wheels, and fixing the laser marker. Finding out the center line position on the edge leather material and marking. And adjusting the position of the edge leather material during feeding to enable the central line of the edge leather material to be aligned with the laser emitted by the laser line marker.

Spray lubricating arrangement and constantly spray cutting fluid toward vertical buddha's warrior attendant line in cutting process, promote the quality after the cutting of boundary leather material. The spraying and lubricating device is normally required to be installed above the edge leather cutting table, cutting liquid is continuously sprayed to the vertical diamond wire in the cutting process, the cutting liquid can vertically and directly flow to the position point of the edge leather to be cut, and the purpose of cooling and lubricating is achieved.

Before the silicon rod is cut, after the silicon rod is placed on the bearing table, laser marking is firstly carried out through the laser positioning device, and the silicon rod is placed at a proper and correct position. The bottom or the lateral part of plummer is provided with induction system, whether installs the silicon rod and targets in place and detect, and only after whole testing condition satisfied, the tight mechanism in top just can move and carry out the top tightly to the silicon rod, compresses tightly fixed silicon rod together with stop gear.

Furthermore, a position detection device is used for detecting the position of the silicon rod, and the cutting wire wheel is controlled to move to the target cutting position according to the position of the silicon rod. The position of the silicon rod is detected through the position detection device, the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the target cutting position to cut the silicon rod.

The apparatus structure for cutting edge cladding material provided by this embodiment may also be applied to cutting the silicon rod and the middle rod, for example: detection devices, induction devices, spray lubrication devices, laser alignment devices, and the like, can be used for the above-described apparatus.

Further, the embodiment also provides a grinding device for grinding the small silicon rod in the above steps. As shown in fig. 24 to 27, the grinding apparatus includes: a base assembly 41, a feeding assembly 42 and a grinding assembly 43. The whole grinding equipment comprises: a loading area 401 and a grinding area 402. Wherein, the feeding assembly 42 is arranged in the feeding area 401, and the small silicon rods to be ground are assembled on the feeding assembly 42 from the feeding area 401, and then delivered to the grinding area 402. The grinding assembly 43 is arranged in the grinding region 402 for grinding the surface and/or corners of the small silicon rod.

Taking grinding of the small silicon rod a4 as an example, fig. 26 and 27 show the implementation of the feeding assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a loading sliding table 421, a headstock 422 and a tailstock 423. One implementation is as follows: the sliding table is fixed, and the headstock 422 and the tailstock 423 move relative to the sliding table; alternatively, the headstock 422 is fixed relative to the slide, the tailstock 423 moves relative to the slide, and the slide moves relative to the base. Taking the second scheme as an example: the small silicon rod a4 is placed between the headstock 422 and the tailstock 423, and the position of the tailstock 423 with respect to the slide table is adjusted to clamp the small silicon rod a 4. The small silicon rod a4 is moved to the mold area 402 by the moving slide table to be ground by the grinding unit 43.

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 and the tailstock chuck 425 are arranged in opposite directions, the small silicon rod a4 is arranged between the headstock chuck 424 and the tailstock chuck 425, and the headstock chuck 424 and the tailstock chuck 425 clamp the small silicon rod a4 from both ends.

As shown in fig. 27, in another implementation, the feeding assembly includes: a grinding holder 426 and a collet 427, both disposed one above the other. The small silicon rod a3 is vertically disposed between the grinding holder 426 and the collet 427, and the collet 427 downwardly grips the small silicon rod. The grinding assembly comprises a grinding head 431 and a grinding head driver which are respectively positioned at the left side and the right side of the small silicon rod. The grinding head driver is used for driving the grinding head 431 to horizontally move to be in contact with the small silicon rod or move away from the small silicon rod in the opposite direction.

The grinding head 431 is vertically movable to grind the surface of the small silicon rod during the elevation. Or the grinding fixing seat and the chuck drive the small silicon rod to lift, and the grinding head is fixed.

The grinding fixing seat 426 and the chuck can drive the small silicon rod to horizontally rotate, and after two side faces of the small silicon rod are ground, the grinding fixing seat drives the small silicon rod to rotate 90 degrees to grind the other two side faces. After all the side surfaces are ground, rotating the small silicon rods for 45 degrees, and grinding the edges and corners of the small silicon rods; and then the other three edges and corners are ground by sequentially rotating 90 degrees.

The grinding unit 43 is provided with a grinding wheel for grinding the small silicon rod a 4. The grinding wheels comprise a rough grinding wheel and a fine grinding wheel, and the rough grinding and the fine grinding are respectively carried out on the small silicon rod a 4.

In the above-described embodiment, the small silicon rod is ground, typically by grinding its side surface, and in special cases also by grinding its end surface.

The present embodiment also provides a silicon rod cutting system, including: the cutting equipment provided with three groups of cutting wire wheels is used for cutting the silicon rod by a first tangent plane to obtain an intermediate rod; cutting equipment provided with two groups of cutting wire wheels cuts the intermediate rod by a second tangent plane to obtain a small silicon rod; grinding equipment for grinding the small silicon rod; and slicing equipment for slicing the small silicon rod. The leather cutting machine further comprises a cutting device for cutting the leather. And cutting the silicon rod by each cutting device according to the assembly line operation to obtain small silicon wafers.

Claims (11)

1. A silicon rod cutting apparatus, comprising:

a base;

the bearing table is arranged on the base and used for bearing a silicon rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the silicon rod; the wire cutting device comprises at least three cutting wire wheel sets, cutting wires wound on the cutting wire wheel sets are parallel to each other, and the cutting wire wheel sets are used for cutting the silicon rod along a first cutting line to obtain at least two middle rods and a side material; the middle rod is provided with two parallel planes and an arc surface connected between the two planes; the edge leather material is provided with a plane and an arc surface connected with the plane.

2. The cutting apparatus of claim 1, wherein the carrier is fixedly disposed on a base;

the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to the base under the driving action of the bracket driving mechanism; the cutting line wheel set is arranged on the wire wheel support.

3. The cutting apparatus according to claim 1, wherein the wire cutting device comprises: a wire wheel bracket; the wire wheel bracket is fixedly arranged on the base; the cutting wire wheel set is arranged on the wire wheel bracket;

the bearing table slides relative to the base under the driving action of the bearing table driving mechanism.

4. The cutting apparatus according to claim 2 or 3, characterized in that each group of cutting line wheel sets comprises at least two cutting wire wheels, wherein the two cutting wire wheels are coplanar and form a first tangent plane around the annular cutting line provided thereon.

5. The cutting apparatus of claim 4, wherein a set of cutting line wheels further comprises: a tension pulley and a driving pulley; the annular cutting line is still around locating tension pulley and action wheel, and the action wheel is connected to the output of line wheel driver.

6. The cutting apparatus according to claim 2 or 3, wherein the wire cutting device further comprises: the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the pay-off mechanism and the take-up mechanism.

7. The cutting apparatus according to claim 2 or 3, wherein the cutting reel is mounted to the reel bracket by a reel mounting seat;

the wire wheel mounting seat is L-shaped, one end of the wire wheel mounting seat is fixed on the wire wheel support, and the other end of the wire wheel mounting seat is provided with a cutting wire wheel.

8. A cutting apparatus according to claim 2 or 3, characterized in that the distance between two cutting reels in one set of cutting reel sets is different from the distance between two cutting reels in an adjacent set of cutting reel sets.

9. Cutting device according to claim 2 or 3, characterized in that the reel support or carrier table is moved in a horizontal direction relative to the base;

alternatively, the cutting apparatus further comprises: the vertical base is vertically arranged on the base; the reel bracket or the bearing table moves relative to the vertical base along the vertical direction.

10. A silicon rod cutting system, comprising:

the cutting apparatus as claimed in any one of claims 1 to 9, for cutting a silicon rod to give an intermediate rod having two planes and an arc shape adjoining between the two planes;

the middle rod cutting equipment is used for cutting the middle rod to obtain a small silicon rod with a rectangular cross section;

the grinding equipment is used for grinding the small silicon rods;

and/or the slicing equipment is used for slicing the small silicon rod.

11. The silicon rod cutting system as recited in claim 10, wherein the intermediate rod cutting apparatus comprises:

a base;

the bearing table is arranged on the base and used for bearing the middle rod;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the middle rod; the wire cutting device comprises two cutting wire wheel sets, and cutting wires wound on the cutting wire wheel sets are used for cutting the middle rod to obtain at least two small silicon rods with rectangular sections.

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