CN114193106B - Processing method for compounding copper-based material on inner hole surface of tungsten-based material - Google Patents
Processing method for compounding copper-based material on inner hole surface of tungsten-based material Download PDFInfo
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- CN114193106B CN114193106B CN202210046957.4A CN202210046957A CN114193106B CN 114193106 B CN114193106 B CN 114193106B CN 202210046957 A CN202210046957 A CN 202210046957A CN 114193106 B CN114193106 B CN 114193106B
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Abstract
The invention discloses a processing method of a composite copper-based material on the surface of an inner hole of a tungsten-based material, which comprises the following steps: 1. preparing a tungsten-based material and a copper-based bar material with inner holes; 2. preparing a tungsten-based material assembly and a copper-based rod core assembly; 3. glow cleaning and vacuum ion plating deposition are carried out on the copper-based rod core assembly, and a deposited copper-based rod core assembly is obtained; 4. assembling the tungsten-based material assembly and the copper-based rod core assembly to obtain a tungsten/copper assembly; 5. carrying out vacuum diffusion welding on the tungsten/copper combination body to obtain a tungsten/copper composite blank; 6. and removing the inner hole and the redundant copper-based material at the end part of the tungsten/copper composite blank to obtain the tungsten/copper composite module. According to the invention, the metal film is prepared on the surface of the copper-based rod core assembly by adopting vacuum multi-arc plasma plating to connect and combine the tungsten-based material and the copper-based material, and the metallurgical combination interface with transitional components is obtained by optimizing the combination interface components, so that the organization structure of the connection interface is optimized, and the service life of the tungsten/copper composite module is prolonged.
Description
Technical Field
The invention belongs to the technical field of composite material preparation, and particularly relates to a processing method for compounding copper-based materials on the surface of an inner hole of a tungsten-based material.
Background
The tungsten has extremely high melting point, extremely low vapor pressure, good heat conductivity and high temperature strength, particularly has high energy critical value in the physical sputtering process, does not form physical and chemical properties such as hydride and the like, and becomes the first-choice material facing the plasma in the nuclear fusion reaction device. In the nuclear fusion process, to avoid heat accumulation inside the tungsten material, it is necessary to connect it with a heat sink material (DSCu or CuCrZr copper alloy). Meanwhile, in order to further relieve the thermal stress of the connection interface, pure copper (TU 1) with the thickness of 0.5-5 mm needs to be arranged between the two as a transition layer. In practice, the basic form of a monolithic tungsten/copper composite module is shown in fig. 1. The structure is characterized in that: (1) The inside of the metal tungsten contains a through hole, and the cross section of the through hole is circular; (2) In the aspect of material composition, a tungsten layer, a pure copper layer and a copper alloy layer are sequentially arranged from outside to inside, and certain binding force is formed between two adjacent layers.
Currently, the processing of monolithic tungsten/copper composite modules is done in two steps: step one, compounding a pure copper layer with a certain thickness on the surface of an inner hole of metal tungsten; and step two, compounding a copper alloy layer on the surface of the pure copper layer. Aiming at the first step, the processing method of compounding copper on the surface of the inner hole of the metal tungsten mainly comprises three methods of a hot isostatic pressing method, an explosion welding method and a physical/chemical vapor deposition method. The hot isostatic pressing method can realize metallurgical bonding of tungsten and copper through interface component design, and can also realize the compounding of thick multi-layer copper on the inner wall of a through hole, and the high-pressure (more than 50 MPa) inert gas is beneficial to eliminating various defects of a bonding interface, and the relatively low connection temperature is also beneficial to obtaining fine grain structure, so the hot isostatic pressing method is a main method for processing the tungsten/copper composite module at present. However, the hot isostatic pressing method has very complex production process, which causes high processing cost; the processing process involves high-temperature high-pressure inert gas, so that a large safety risk exists; special processing equipment is needed, the structure is complex, the disposable investment is high, and the like, and the factors limit the popularization and application of products to a certain extent. The explosion welding method has unique advantages in the processing of composite products with circular and annular sections such as metal composite rods, composite pipes and the like, but the combination interface of the products is mainly mechanical combination, which is unfavorable for improving the fatigue life of the parts, especially for the combination of metals with large difference of linear expansion coefficients such as tungsten and copper, the stress concentration exists near the interface, and the service life of the products is seriously influenced. On the other hand, tungsten has high brittleness, and is difficult to bear the huge impact force generated by explosive explosion in the compounding process to break, so that the yield of products is low. In addition, when the inner pore diameter of tungsten is less than 20mm, the explosive is easily rejected, and these factors limit the application of the explosive welding method to some extent. The physical/chemical vapor deposition method covers a large class of deposition methods with different principles, and can realize the deposition of most metal layers and the compounding of surfaces with complex shapes. However, as the thickness of the deposited layer increases, the number of defects in the structure increases significantly, and the total thickness generally varies only in the micrometer range, while the thickness of the copper layer referred to in this patent is in the millimeter range. In addition, the physical/chemical vapor deposition method has high processing cost, and is not suitable for deposition compounding of large-size and thick multi-layer products.
Disclosure of Invention
The invention aims to solve the technical problem of providing a processing method for compounding copper-based materials on the surface of an inner hole of a tungsten-based material aiming at the defects of the prior art. According to the method, a metal film is prepared on the surface of the copper-based rod core assembly by adopting vacuum multi-arc plasma plating to connect and combine the tungsten-based material and the copper-based material, and a metallurgical bonding interface with component transition is obtained by optimizing bonding interface components, so that the organization structure of the connecting interface of the tungsten-based material and the copper-based material is optimized, and the service life of the tungsten/copper composite module is prolonged.
In order to solve the technical problems, the invention adopts the following technical scheme: the processing method of the composite copper-based material on the surface of the inner hole of the tungsten-based material is characterized by comprising the following steps:
step one, preparing raw materials: preparing a tungsten-based material with an inner hole and a copper-based bar, wherein the inner diameter of the tungsten-based material is phi mm, the outer diameter of the tungsten-based material is phi mm, the length of the tungsten-based material is Lmm, and the diameter of the copper-based bar is more than 8mm larger than the inner diameter phi of the tungsten-based material; the tungsten-based material is tungsten or tungsten alloy material, and the copper-based bar is copper bar or copper alloy bar;
step two, machining: grinding the inner hole surface of the tungsten-based material prepared in the first step by adopting a mechanical method to obtain a tungsten-based material assembly, then machining the copper-based bar prepared in the first step into a copper-based bar core by adopting turning, and grinding the outer circle surface of the copper-based bar core by adopting the mechanical method to obtain a copper-based bar core assembly consisting of a base and a core body, wherein the length L of the tungsten-based material assembly and the length H of the copper-based bar core assembly meet the following conditions: h=l+ (5-6) mm, the inner diameter Φ of the tungsten-based material assembly and the core outer diameter d of the copper-based rod core assembly satisfy: phi = d+ (0.02-0.06) mm, the height h of the base = 2-3 mm, the outer diameter D of the base = d+ (6-8) mm;
step three, vacuum ion plating: performing ultrasonic cleaning and dehydration drying on the copper-based bar core assembly obtained in the second step, then loading the copper-based bar core assembly into a multi-arc ion plating machine for glow cleaning, and then performing vacuum ion plating deposition to obtain a deposited copper-based bar core assembly;
step four, cleaning and assembling: cleaning the tungsten-based material assembly obtained in the second step and the deposited copper-based rod core assembly obtained in the third step by adopting analytically pure ethanol or acetone, and then inserting the cleaned deposited copper-based rod core assembly into an inner hole of the cleaned tungsten-based material assembly to obtain a tungsten/copper combination;
fifth, vacuum diffusion welding: placing the tungsten/copper combination obtained in the third step in a vacuum hot-pressing sintering furnace, paving graphite paper in contact areas of the tungsten/copper combination and an upper pressure head and a lower pressure head/a base of the vacuum hot-pressing sintering furnace, and performing vacuum diffusion welding to obtain a tungsten/copper composite blank;
step six, machining and shaping: and (3) removing the redundant copper-based material in the inner hole and the end part of the tungsten-based material in the tungsten/copper composite blank obtained in the step five by adopting a mechanical method, so as to compound the copper-based material on the surface of the inner hole of the tungsten-based material, thereby obtaining the tungsten/copper composite module.
The method comprises the steps of starting from the basic outline dimension of a tungsten-based material, grinding the tungsten-based material to obtain a tungsten-based material assembly, designing and processing a copper-based rod core assembly with a matched shape and dimension so that the outline dimension and the surface roughness of the tungsten-based material assembly are corresponding to each other, then carrying out ultrasonic cleaning and glow cleaning on the copper-based rod core assembly, preparing for subsequent surface physical deposition, and depositing on the surface of the cleaned copper-based rod core assembly by adopting vacuum multi-arc plasma plating to prepare a metal film with a certain composition and thickness; and inserting the cleaned deposited copper-based rod core assembly into the cleaned tungsten-based material assembly to obtain a tungsten/copper assembly, using a metal film on the surface of the copper-based rod core assembly as a medium, realizing effective connection between the tungsten-based material and the copper-based material by means of a vacuum diffusion welding process, and finally removing redundant copper-based material by means of machining and shaping, thereby realizing the composite copper-based material on the inner hole surface of the tungsten-based material and obtaining the tungsten/copper composite module. In the processing process of the invention, a metal film is prepared on the surface of the copper-based rod core assembly body by adopting vacuum multi-arc plasma plating deposition to connect and combine tungsten-based material and copper-based material, and a metallurgical bonding interface with component transition is obtained by optimizing bonding interface components, so that the structure of the connecting interface of the tungsten-based material and the copper-based material is optimized, the service life of the tungsten/copper composite module is prolonged, and simultaneously, the mobility of the copper-based material near the tungsten-copper interface is improved by adopting hot-pressing compounding in the vacuum diffusion welding process, so that the filling capacity of the copper-based material is improved, thereby being beneficial to eliminating microscopic tissue defects, improving the structure and improving the bonding strength of the tungsten-based material and the copper-based material interface in the tungsten/copper composite module.
The processing method of the composite copper-based material on the inner hole surface of the tungsten-based material is characterized in that in the second step, the roughness of the inner hole surface of the tungsten-based material assembly and the roughness of the outer circle surface of the copper-based rod core assembly are not lower than Ra0.8.
The processing method of the composite copper-based material on the inner hole surface of the tungsten-based material is characterized in that the ultrasonic cleaning in the third step adopts analytically pure ethanol, and the cleaning time is 10-15 min; the specific process of glow cleaning is as follows: starting the vacuum system, and keeping the residual gas pressure in the working chamber at 6.0X10 -3 Starting a heating system when the pressure is lower than Pa, and adjusting the bias voltage to 600-700V and the argon flow to 130-180 sccm for cleaning for 12-18 min when the temperature of the working chamber reaches 240-280 ℃.
The processing method for compounding copper-based materials on the inner hole surface of the tungsten-based material is characterized in that in the third step, cu-Cr-Fe alloy targets are selected for vacuum ion plating deposition, and the Cu-Cr-Fe alloy targets consist of the following components in percentage by mass: cr 1.2-2.6 wt%, fe 2.0-2.8 wt% and Cu for the rest; the technological parameters of the vacuum ion plating deposition are as follows: the substrate bias voltage is 800V-900V, the target current is 40A-60A, the argon flow is 90 sccm-110 sccm, and the deposition time is 180 min-210 min;
the processing method of the composite copper-based material on the inner hole surface of the tungsten-based material is characterized in that the specific process of vacuum diffusion welding in the fifth step is as follows: starting a hydraulic system to adjust the pressure to 2.2 MPa-3.8 MPa, closing a furnace door of the vacuum hot-pressing sintering furnace after the pressure is stable, starting the vacuum system to pump out air in the furnace body, and waiting for the pressure of residual air in the furnace body to be lower than 9.0 multiplied by 10 -3 And starting a heating system to heat when Pa, keeping the temperature for 20-30 min after the furnace temperature is raised to 850-870 ℃, continuously raising the temperature to 900-960 ℃ at a speed of not more than 3 ℃ per minute, keeping the temperature and the pressure for 90-120 min, reducing the temperature to 500 ℃ at a speed of not more than 5 ℃ per minute, and discharging after the furnace temperature is reduced to below 100 ℃.
Compared with the prior art, the invention has the following advantages:
1. according to the invention, the metal film is prepared on the surface of the copper-based rod core assembly by adopting vacuum multi-arc plasma plating to connect and combine the tungsten-based material and the copper-based material, and the metallurgical bonding interface with component transition is obtained by optimizing the bonding interface components, so that the tissue structure of the tungsten-based material and the copper-based material is optimized, and the service life of the tungsten/copper composite module is prolonged.
2. According to the invention, the hot-pressing compounding is adopted in the vacuum diffusion welding process, so that the fluidity of the copper-based material near the interface of the tungsten-based material and the copper-based material is improved, the filling capacity of the copper-based material is improved, the microstructure defect is eliminated, the structure is improved, and the interface bonding strength of the tungsten-based material and the copper-based material in the tungsten/copper composite module is improved.
3. The method has the advantages of simple process, no need of special equipment, good safety, strong process adaptability, no special requirements on the bore diameter of the tungsten-based material and the thickness of the copper-based material, high yield, low processing cost and easy realization of industrial application.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
Fig. 1 is a basic form of a prior art monolithic tungsten/copper composite module.
Fig. 2 is a schematic structural view of a tungsten-based material assembly according to the present invention.
FIG. 3 is a schematic structural view of a copper-based core assembly according to the present invention.
FIG. 4 is a schematic diagram of a tungsten/copper combination mechanism according to the present invention.
FIG. 5 is a schematic diagram of the loading structure of the tungsten/copper combination according to the present invention.
Fig. 6 is a physical diagram of a tungsten/copper composite module prepared in example 1 of the present invention.
FIG. 7 is a graph showing the interface between tungsten and copper in the tungsten/copper composite module prepared in example 1 of the present invention.
Detailed Description
Example 1
The embodiment comprises the following steps:
step one, preparing raw materials: preparing metal tungsten with an inner hole and a copper rod, wherein the metal tungsten is made of W1, the inner diameter is 17mm, the outer diameter cross section is a square with the diameter of 28mm multiplied by 28mm, the length is 12mm, the copper rod is made of TU1, and the diameter is 28mm;
step two, machining: grinding the inner hole surface of the metal tungsten prepared in the first step to have the roughness of Ra0.8 by adopting a mechanical method to obtain a tungsten-based material assembly with the inner hole diameter phi=18.10 mm, as shown in fig. 2, then machining the copper rod prepared in the first step into a copper core by adopting turning, and grinding the outer circle surface of the copper core to have the roughness of Ra0.8 by adopting a mechanical method to obtain a copper-based material assembly consisting of a base and a core body, as shown in fig. 3, wherein the length H=17 mm of the copper-based material assembly, the core body outer diameter d=17.08 mm of the copper-based material assembly, the height h=2 mm of the base and the outer diameter D=16.08 mm of the base;
step three, vacuum ion plating: ultrasonically cleaning the copper-based rod core assembly obtained in the second step by adopting analytically pure ethanol for 10min, dehydrating and drying, then loading into a multi-arc ion plating machine for glow cleaning, and then carrying out vacuum ion plating deposition to obtain a deposited copper-based rod core assembly;
the specific process of glow cleaning is as follows: starting the vacuum system, and keeping the residual gas pressure in the working chamber to be 6.0X10 -3 Starting a heating system in Pa, and adjusting bias voltage to 600V and argon flow to 130sccm for cleaning for 12min when the temperature of the working chamber reaches 240 ℃;
the vacuum ion plating deposition adopts a Cu-Cr-Fe alloy target material, wherein the Cu-Cr-Fe alloy target material comprises the following components in percentage by mass: cr 1.2%, fe 2.0% and Cu in balance; the technological parameters of the vacuum ion plating deposition are as follows: substrate bias voltage 800V, target current 40A, argon flow 90sccm, deposition time 180min;
step four, cleaning and assembling: cleaning the tungsten-based material assembly obtained in the second step and the deposited copper-based bar core assembly obtained in the third step by adopting analytically pure ethanol, and then inserting the cleaned deposited copper-based bar core assembly into an inner hole of the cleaned tungsten-based material assembly to obtain a tungsten/copper combination body, as shown in fig. 4;
fifth, vacuum diffusion welding: placing the tungsten/copper assembly obtained in the third step in a vacuum hot-pressing sintering furnace, paving graphite paper in contact areas of the tungsten/copper assembly and an upper pressure head and a base of the vacuum hot-pressing sintering furnace, as shown in fig. 5, setting a base in fig. 5, starting a hydraulic system to adjust the pressure to 2.2MPa, closing a furnace door of the vacuum hot-pressing sintering furnace after the pressure is stable, starting the vacuum system to pump out air in the furnace body, and keeping the pressure of residual air in the furnace body to be 1.0x10 -3 Starting a heating system to heat when Pa, keeping the temperature for 20min after the furnace temperature is raised to 850 ℃, continuously raising the temperature to 960 ℃ at the speed of 3 ℃/min, keeping the temperature and the pressure for 90min, reducing the temperature to 500 ℃ at the speed of 5 ℃/min, and discharging along with the furnace to 30 ℃ to obtain a tungsten/copper composite blank;
step six, machining and shaping: and D, adopting a numerical control lathe to process and remove the metal tungsten inner hole and the redundant copper at the end part in the tungsten/copper composite blank obtained in the step five, so as to compound copper with the thickness of 2mm on the surface of the inner hole of the metal tungsten, and obtaining a tungsten/copper composite module, as shown in figure 6.
FIG. 7 is a graph showing the interface between tungsten and copper in the tungsten/copper composite module prepared in this example, and as can be seen from FIG. 7, the interface between tungsten and copper has good bonding, and no microstructure defects such as holes, cracks, slag inclusion, etc.; the shear strength of the tungsten to copper interface was tested to be about 120MPa.
The metal tungsten in the embodiment can be replaced by tungsten alloy material, and the copper bar can be replaced by copper alloy bar.
Example 2
The embodiment comprises the following steps:
step one, preparing raw materials: preparing metal tungsten with an inner hole and a copper rod, wherein the metal tungsten is made of W1, the inner diameter is 40mm, the outer diameter is 80mm, the length is 25mm, the copper rod is made of TU2, and the diameter is 50mm;
step two, machining: grinding the inner hole surface of the metal tungsten prepared in the first step to have the roughness of Ra0.4 by adopting a mechanical method to obtain a tungsten-based material assembly with the inner hole diameter phi=40.02 mm, as shown in fig. 2, then machining the copper rod prepared in the first step into a copper core by adopting turning, and grinding the outer circle surface of the copper core to have the roughness of Ra0.4 by adopting a mechanical method to obtain a copper-based material assembly consisting of a base and a core body, as shown in fig. 3, wherein the length H=31 mm of the copper-based material assembly, the core body outer diameter d=39.96 mm of the copper-based material assembly, the height h=3 mm of the base and the outer diameter D=47.96 mm of the base;
step three, vacuum ion plating: ultrasonically cleaning the copper-based rod core assembly obtained in the second step by adopting analytically pure ethanol for 15min, dehydrating and drying, then loading into a multi-arc ion plating machine for glow cleaning, and then carrying out vacuum ion plating deposition to obtain a deposited copper-based rod core assembly;
the specific process of glow cleaning is as follows: starting the vacuum system, and keeping the residual gas pressure in the working chamber to be 1.0X10 -3 Starting a heating system by Pa, and adjusting bias voltage to 700V and argon flow to 180sccm for cleaning for 18min when the temperature of the working chamber reaches 280 ℃;
the vacuum ion plating deposition adopts a Cu-Cr-Fe alloy target material, wherein the Cu-Cr-Fe alloy target material comprises the following components in percentage by mass: cr 2.6%, fe 2.8% and Cu in balance; the technological parameters of the vacuum ion plating deposition are as follows: substrate bias 900V, target current 60A, argon flow 110sccm, deposition time 210min;
step four, cleaning and assembling: cleaning the tungsten-based material assembly obtained in the second step and the copper-based rod core assembly obtained in the third step by adopting acetone, and then inserting the cleaned copper-based rod core assembly into an inner hole of the cleaned tungsten-based material assembly to obtain a tungsten/copper assembly, as shown in fig. 4;
fifth, vacuum diffusion welding: placing the tungsten/copper assembly obtained in the third step in a vacuum hot-pressing sintering furnace, paving graphite paper in contact areas of the tungsten/copper assembly and an upper pressure head and a base of the vacuum hot-pressing sintering furnace, as shown in fig. 5, setting a base in fig. 5, starting a hydraulic system to adjust the pressure to 3.8MPa, closing a furnace door of the vacuum hot-pressing sintering furnace after the pressure is stable, starting the vacuum system to pump out air in the furnace body, and keeping the pressure of residual air in the furnace body to be 8.0x10 -3 Starting a heating system to heat when Pa, keeping the temperature for 30min after the furnace temperature rises to 870 ℃, continuously heating to 900 ℃ at the speed of 2 ℃/min, keeping the temperature and the pressure for 120min, cooling to 500 ℃ at the speed of 4 ℃/min, and discharging along with the furnace cooling to 25 ℃ to obtain a tungsten/copper composite blank;
step six, machining and shaping: and D, adopting a numerical control lathe to process and remove the metal tungsten inner hole and the redundant copper at the end part in the tungsten/copper composite blank obtained in the step five, so as to compound copper with the thickness of 5mm on the surface of the inner hole of the metal tungsten, and obtaining the tungsten/copper composite module.
The metal tungsten in the embodiment can be replaced by tungsten alloy material, and the copper bar can be replaced by copper alloy bar.
Example 3
The embodiment comprises the following steps:
step one, preparing raw materials: preparing a tungsten alloy with an inner hole and a copper rod, wherein the tungsten alloy is made of W85Re15, has an inner diameter of 28mm, an outer diameter of 80mm and a length of 40mm, and the copper rod is made of T1 and has a diameter of 40mm;
step two, machining: grinding the inner hole surface of the tungsten alloy prepared in the first step to have the roughness of Ra0.2 by adopting a mechanical method to obtain a tungsten-based material assembly with the inner hole diameter phi=28.04 mm, as shown in fig. 2, then machining the copper rod prepared in the first step into a copper core by adopting turning, and grinding the outer circle surface of the copper core to have the roughness of Ra0.2 by adopting a mechanical method to obtain a copper-based material assembly consisting of a base and a core body, as shown in fig. 3, wherein the length H=45.5 mm of the copper-based material assembly, the core body outer diameter d=28.00 mm of the copper-based material assembly, the height h=2.5 mm of the base and the outer diameter d=35.00 mm of the base;
step three, vacuum ion plating: ultrasonically cleaning the copper-based rod core assembly obtained in the second step by adopting analytically pure ethanol for 12min, dehydrating and drying, then loading into a multi-arc ion plating machine for glow cleaning, and then carrying out vacuum ion plating deposition to obtain a deposited copper-based rod core assembly;
the specific process of glow cleaning is as follows: starting the vacuum system, and keeping the residual gas pressure in the working chamber to be 8.0X10 -4 Starting a heating system in Pa, and adjusting bias voltage to 660V and argon flow to 160sccm for cleaning for 15min when the temperature of the working chamber reaches 260 ℃;
the vacuum ion plating deposition adopts a Cu-Cr-Fe alloy target material, wherein the Cu-Cr-Fe alloy target material comprises the following components in percentage by mass: cr 1.5%, fe 2.4% and Cu in balance; the technological parameters of the vacuum ion plating deposition are as follows: substrate bias 900V, target current 60A, argon flow 110sccm, deposition time 210min;
step four, cleaning and assembling: cleaning the tungsten-based material assembly obtained in the second step and the deposited copper-based bar core assembly obtained in the third step by adopting acetone, and then inserting the cleaned deposited copper-based bar core assembly into an inner hole of the cleaned tungsten-based material assembly to obtain a tungsten/copper combination body, as shown in fig. 4;
fifth, vacuum diffusion welding: placing the tungsten/copper assembly obtained in the third step in a vacuum hot-pressing sintering furnace, paving graphite paper in contact areas of the tungsten/copper assembly and an upper pressure head and a base of the vacuum hot-pressing sintering furnace, as shown in fig. 5, setting a base in fig. 5, starting a hydraulic system to adjust the pressure to 3.0MPa, closing a furnace door of the vacuum hot-pressing sintering furnace after the pressure is stable, starting the vacuum system to pump out air in the furnace body, and keeping the pressure of residual air in the furnace body to be 4.0x10 -3 Starting a heating system to heat when Pa, keeping the temperature for 22min after the furnace temperature is raised to 860 ℃, continuously raising the temperature to 900 ℃ at the speed of 1 ℃/min, keeping the temperature and the pressure for 110min, reducing the temperature to 500 ℃ at the speed of 3 ℃/min, and discharging along with the furnace to 35 ℃ to obtain a tungsten/copper composite blank;
step six, machining and shaping: and D, adopting a numerical control lathe to process and remove redundant copper in the inner hole and the end part of the tungsten alloy in the tungsten/copper composite blank obtained in the step five, so as to compound copper with the thickness of 4mm on the surface of the inner hole of the tungsten alloy, and obtaining the tungsten/copper composite module.
The tungsten alloy in this embodiment may also be replaced with tungsten material, and the copper rod may also be replaced with a copper alloy rod.
The above description is only of the preferred embodiments of the present invention, and is not intended to limit the present invention. Any simple modification, variation and equivalent variation of the above embodiments according to the technical substance of the invention still fall within the scope of the technical solution of the invention.
Claims (5)
1. The processing method of the composite copper-based material on the surface of the inner hole of the tungsten-based material is characterized by comprising the following steps:
step one, preparing raw materials: preparing a tungsten-based material with an inner hole and a copper-based bar, wherein the inner diameter of the tungsten-based material is phi mm, the outer diameter of the tungsten-based material is phi mm, the length of the tungsten-based material is Lmm, and the diameter of the copper-based bar is more than 8mm larger than the inner diameter phi of the tungsten-based material; the tungsten-based material is tungsten or tungsten alloy material, and the copper-based bar is copper bar or copper alloy bar;
step two, machining: grinding the inner hole surface of the tungsten-based material prepared in the first step by adopting a mechanical method to obtain a tungsten-based material assembly, then machining the copper-based bar prepared in the first step into a copper-based bar core by adopting turning, and grinding the outer circle surface of the copper-based bar core by adopting the mechanical method to obtain a copper-based bar core assembly consisting of a base and a core body, wherein the length L of the tungsten-based material assembly and the length H of the copper-based bar core assembly meet the following conditions: h=l+ (5-6) mm, the inner diameter Φ of the tungsten-based material assembly and the core outer diameter d of the copper-based rod core assembly satisfy: phi = d+ (0.02-0.06) mm, the height h of the base = 2-3 mm, the outer diameter D of the base = d+ (6-8) mm;
step three, vacuum ion plating: performing ultrasonic cleaning and dehydration drying on the copper-based bar core assembly obtained in the second step, then loading the copper-based bar core assembly into a multi-arc ion plating machine for glow cleaning, and then performing vacuum ion plating deposition to obtain a deposited copper-based bar core assembly;
step four, cleaning and assembling: cleaning the tungsten-based material assembly obtained in the second step and the deposited copper-based rod core assembly obtained in the third step by adopting analytically pure ethanol or acetone, and then inserting the cleaned deposited copper-based rod core assembly into an inner hole of the cleaned tungsten-based material assembly to obtain a tungsten/copper combination;
fifth, vacuum diffusion welding: placing the tungsten/copper combination obtained in the third step in a vacuum hot-pressing sintering furnace, paving graphite paper in contact areas of the tungsten/copper combination and an upper pressure head and a lower pressure head/a base of the vacuum hot-pressing sintering furnace, and performing vacuum diffusion welding to obtain a tungsten/copper composite blank;
step six, machining and shaping: and (3) removing the redundant copper-based material in the inner hole and the end part of the tungsten-based material in the tungsten/copper composite blank obtained in the step five by adopting a mechanical method, so as to compound the copper-based material on the surface of the inner hole of the tungsten-based material, thereby obtaining the tungsten/copper composite module.
2. The method for processing the composite copper-based material on the inner hole surface of the tungsten-based material according to claim 1, wherein in the second step, the roughness of the inner hole surface of the tungsten-based material assembly and the roughness of the outer circle surface of the copper-based rod core assembly are not lower than ra0.8.
3. The method for processing the composite copper-based material on the surface of the inner hole of the tungsten-based material according to claim 1, wherein in the third step, analytically pure ethanol is adopted for ultrasonic cleaning, and the cleaning time is 10-15 min; the specific process of glow cleaning is as follows: starting the vacuum system, and keeping the residual gas pressure in the working chamber at 6.0X10 -3 Starting a heating system when Pa is lower, and waiting for the temperature of the working chamber to reachAnd when the temperature reaches 240-280 ℃, regulating the bias voltage to 600-700V and the argon flow to 130-180 sccm for cleaning for 12-18 min.
4. The method for processing the composite copper-based material on the surface of the inner hole of the tungsten-based material according to claim 1, wherein in the third step, cu-Cr-Fe alloy targets are selected for vacuum ion plating deposition, and the Cu-Cr-Fe alloy targets consist of the following components in mass content: cr 1.2-2.6 wt%, fe 2.0-2.8 wt% and Cu for the rest; the technological parameters of the vacuum ion plating deposition are as follows: the substrate bias voltage is 800V-900V, the target current is 40A-60A, the argon flow is 90 sccm-110 sccm, and the deposition time is 180 min-210 min.
5. The method for processing the composite copper-based material on the surface of the inner hole of the tungsten-based material according to claim 1, wherein the specific process of vacuum diffusion welding in the fifth step is as follows: starting a hydraulic system to adjust the pressure to 2.2 MPa-3.8 MPa, closing a furnace door of the vacuum hot-pressing sintering furnace after the pressure is stable, starting the vacuum system to pump out air in the furnace body, and waiting for the pressure of residual air in the furnace body to be lower than 9.0 multiplied by 10 -3 And starting a heating system to heat when Pa, keeping the temperature for 20-30 min after the furnace temperature is raised to 850-870 ℃, continuously raising the temperature to 900-960 ℃ at a speed of not more than 3 ℃ per minute, keeping the temperature and the pressure for 90-120 min, reducing the temperature to 500 ℃ at a speed of not more than 5 ℃ per minute, and discharging after the furnace temperature is reduced to below 100 ℃.
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