CN113801599B - 电子产品用制程保护贴膜 - Google Patents

电子产品用制程保护贴膜 Download PDF

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CN113801599B
CN113801599B CN202110901438.7A CN202110901438A CN113801599B CN 113801599 B CN113801599 B CN 113801599B CN 202110901438 A CN202110901438 A CN 202110901438A CN 113801599 B CN113801599 B CN 113801599B
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夏厚君
涂大记
潘华
杨晓明
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Zhejiang Ouren New Materials Co ltd
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Abstract

本发明公开了一种电子产品用制程保护贴膜，包括基材层和涂布于基材层表面的有机硅胶层，所述基材层进一步包括PET薄膜和PE薄膜，此PET薄膜和PE薄膜通过一胶粘层复合在一起；所述有机硅胶层由以下重量份组分组成：甲基乙烯基硅橡胶、聚异戊二烯橡胶、硅酮树脂、乙烯基硅油、含氢硅油、3‑硫氰基丙基三乙氧基硅烷、2‑氨基苯并咪唑、甲基丁炔醇、铂催化剂、过氧化环己酮、纳米石墨粉、单十二烷基磷酸酯钾、甲苯、乙酸乙酯。本发明保护膜使得本发明保护膜在使用过程中不易出现翘边甚至脱落的问题，且容易移除，在取下时不留残胶。

Description

电子产品用制程保护贴膜
技术领域
本发明涉及一种保护膜，尤其涉及一种电子产品用制程保护贴膜。
背景技术
在智能手机组装完成以前，其边框周围需要用中等粘性的保护膜进行粘贴临时固定，在智能手机组装完成以后，再撕掉其边框周围粘贴的保护膜。目前这类保护膜来自于国外供应商，国产的产品存在以下几个技术问题而不能替代进口产品，主要问题是：1、粘性太低或太高，以至于在使用过程中发生翘边甚至脱落，或是在去除时产生残胶；2、基材太硬或太软，以至于容易翘边，或是拉断；3、抗静电效果不佳，影响自动化连续生产。
因此，开发和研制一种粘性适中、容易移除，抗静电效果优异的保护膜，以取代进口产品具有重要的经济效益和社会效益。
发明内容
本发明目的在于提供一种电子产品用制程保护贴膜，该保护膜粘性适中、容易移除不残胶，且抗静电效果优异，能够满足智能手机制程中临时固定的工艺需求。
为达到上述目的，本发明采用的技术方案是：一种电子产品用制程保护贴膜，包括基材层和涂布于基材层表面的有机硅胶层，所述基材层进一步包括PET薄膜和PE薄膜，此PET薄膜和PE薄膜通过一胶粘层复合在一起；
所述有机硅胶层由以下重量份组分组成：甲基乙烯基硅橡胶200份、聚异戊二烯橡胶15份、硅酮树脂20份、乙烯基硅油5份、含氢硅油4份、3-硫氰基丙基三乙氧基硅烷 0.3份、2-氨基苯并咪唑2份、甲基丁炔醇0.5份、铂催化剂1.5份、过氧化环己酮0.5份、纳米石墨粉0.2份、单十二烷基磷酸酯钾1份、甲苯600份、乙酸乙酯250份。
上述技术方案中进一步改进的技术方案如下：
1. 上述方案中，所述PE薄膜的厚度为15~25μm。
2. 上述方案中，所述胶粘层为聚酯胶粘层。
3. 上述方案中，所述含氢硅油的含氢量为0.1~1.2%。
由于上述技术方案的运用，本发明与现有技术相比具有下列优点：
1. 本发明电子产品用制程保护贴膜，其采用PET/PE复合薄膜作为基材，该复合薄膜兼具PET薄膜良好的机械性能和PE薄膜的柔韧性，作为保护膜基材使用时不易翘边，且拉伸剥离时也不容易拉断；此外，本发明采用特殊配方的有机硅胶黏剂，剥离力适中、内聚力强，使得本发明保护膜在使用过程中不易出现翘边甚至脱落的问题，且容易移除，在取下时不留残胶。
2. 本发明电子产品用制程保护贴膜，其采用的有机硅胶黏剂配方在纳米石墨粉基础上，又额外添加了2-氨基苯并咪唑和单十二烷基磷酸酯钾，显著提升了其抗静电效果，表面电阻率达到107Ω以下，该胶黏剂用于制程用保护膜时，可解决由于静电无法排放而影响自动化连续生产的问题，降低生产过程中的人力与时间成本。
附图说明
附图1为本发明电子产品用制程保护贴膜结构示意图；
附图2为附图1的局部结构示意图。
以上附图中：1、基材层；101、PET薄膜；102、胶粘层；103、PE薄膜；2、有机硅胶层。
具体实施方式
下面结合实施例对本发明作进一步描述：
实施例：一种电子产品用制程保护贴膜，包括基材层1和涂布于基材层1表面的有机硅胶层2，所述基材层1进一步包括PET薄膜101和PE薄膜103，此PET薄膜101和PE薄膜103通过一胶粘层102复合在一起；
所述PET薄膜101的厚度为20μm，所述PE薄膜103的厚度为20μm，所述胶粘层102的厚度为10μm，所述有机硅胶层2的厚度为15μm；
所述胶粘层102为聚酯胶粘层。
所述有机硅胶层2具体由以下重量份组分组成：甲基乙烯基硅橡胶200份、聚异戊二烯橡胶15份、硅酮树脂20份、乙烯基硅油5份、含氢硅油4份、3-硫氰基丙基三乙氧基硅烷0.3份、2-氨基苯并咪唑2份、甲基丁炔醇0.5份、铂催化剂1.5份、过氧化环己酮0.5份、纳米石墨粉0.2份、单十二烷基磷酸酯钾1份、甲苯600份、乙酸乙酯250份。
该电子产品用制程保护贴膜的制备方法包括以下步骤：
S1. 在一PET薄膜101表面涂布胶黏剂，烘干，形成胶粘层102，然后将所述PET薄膜101和一PE薄膜103热压复合，制得基材层1；
S2. 将甲基乙烯基硅橡胶、聚异戊二烯橡胶、硅酮树脂、乙烯基硅油、含氢硅油、3-硫氰基丙基三乙氧基硅烷、2-氨基苯并咪唑、纳米石墨粉、单十二烷基磷酸酯钾、甲苯、乙酸乙酯混合均匀，搅拌30~60min，然后加入甲基丁炔醇、铂催化剂、过氧化环己酮，搅拌10~20min，制得有机硅胶黏剂；
S3. 将所述有机硅胶黏剂均匀涂布于基材层1表面，经140~150℃固化形成有机硅胶层2，制得保护膜半成品；
S4. 将所述保护膜半成品根据需要进行分条切割，即制得所述电子产品用制程保护贴膜。
对比例1~3：一种保护膜，包括基材层1和涂布于基材层1表面的有机硅胶层2，所述基材层1进一步包括PET薄膜101和PE薄膜103，此PET薄膜101和PE薄膜103通过一胶粘层102复合在一起；
所述PET薄膜101的厚度为20μm，所述PE薄膜103的厚度为20μm，所述胶粘层102的厚度为10μm，所述有机硅胶层2的厚度为15μm；
所述胶粘层102为聚酯胶粘层。
所述有机硅胶层2具体由以下重量份组分组成：
表1
Figure 100929DEST_PATH_IMAGE002
制备工艺方法同实施例。
上述实施例和对比例1~3制得的保护膜的产品性能如表2所示：
表2
Figure 985708DEST_PATH_IMAGE004
如表2的评价结果所示，本发明各实施例中的电子产品用制程保护贴膜剥离力适中，在使用过程中不易出现翘边甚至脱落的问题，且容易移除，在取下时不留残胶；其表面电阻率显著低于各对比例中制备的保护膜，能够改善由于静电无法排放而影响自动化连续生产的问题。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (4)

1.一种电子产品用制程保护贴膜，其特征在于：包括基材层（1）和涂布于基材层（1）表面的有机硅胶层（2），所述基材层（1）进一步包括PET薄膜（101）和PE薄膜（103），此PET薄膜（101）和PE薄膜（103）通过一胶粘层（102）复合在一起；
所述有机硅胶层（2）由以下重量份组分组成：甲基乙烯基硅橡胶200份、聚异戊二烯橡胶15份、硅酮树脂20份、乙烯基硅油5份、含氢硅油4份、3-硫氰基丙基三乙氧基硅烷 0.3份、2-氨基苯并咪唑2份、甲基丁炔醇0.5份、铂催化剂1.5份、过氧化环己酮0.5份、纳米石墨粉0.2份、单十二烷基磷酸酯钾1份、甲苯600份、乙酸乙酯250份。
2.根据权利要求1所述的电子产品用制程保护贴膜，其特征在于：所述PE薄膜（103）的厚度为15~25μm。
3.根据权利要求1所述的电子产品用制程保护贴膜，其特征在于：所述胶粘层（102）为聚酯胶粘层。
4.根据权利要求1所述的电子产品用制程保护贴膜，其特征在于：所述含氢硅油的含氢量为0.1~1.2%。
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