CN113557594A - 基板处理方法以及基板处理装置 - Google Patents
基板处理方法以及基板处理装置 Download PDFInfo
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- CN113557594A CN113557594A CN202080020030.2A CN202080020030A CN113557594A CN 113557594 A CN113557594 A CN 113557594A CN 202080020030 A CN202080020030 A CN 202080020030A CN 113557594 A CN113557594 A CN 113557594A
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- 239000008367 deionised water Substances 0.000 description 6
- 239000011550 stock solution Substances 0.000 description 6
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- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
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- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
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- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
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- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/02087—Cleaning of wafer edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-052732 | 2019-03-20 | ||
JP2019052732A JP7201494B2 (ja) | 2019-03-20 | 2019-03-20 | 基板処理方法および基板処理装置 |
PCT/JP2020/004588 WO2020189072A1 (ja) | 2019-03-20 | 2020-02-06 | 基板処理方法および基板処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113557594A true CN113557594A (zh) | 2021-10-26 |
Family
ID=72519277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080020030.2A Pending CN113557594A (zh) | 2019-03-20 | 2020-02-06 | 基板处理方法以及基板处理装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7201494B2 (ja) |
KR (1) | KR102648039B1 (ja) |
CN (1) | CN113557594A (ja) |
TW (1) | TWI787582B (ja) |
WO (1) | WO2020189072A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117316812A (zh) * | 2023-08-14 | 2023-12-29 | 深圳远荣半导体设备有限公司 | 一种晶圆清洗机及晶圆搬运的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243940A (ja) * | 2004-02-26 | 2005-09-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2009266951A (ja) * | 2008-04-23 | 2009-11-12 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP2015185803A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社Screenホールディングス | 基板処理装置 |
JP2016040812A (ja) * | 2014-08-13 | 2016-03-24 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3745214B2 (ja) * | 2000-09-27 | 2006-02-15 | 大日本スクリーン製造株式会社 | ベベルエッチング装置およびベベルエッチング方法 |
JP3917393B2 (ja) * | 2001-08-29 | 2007-05-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4089809B2 (ja) | 2002-03-13 | 2008-05-28 | Sumco Techxiv株式会社 | 半導体ウェーハのエッジ部の酸化膜除去装置 |
JP4446875B2 (ja) * | 2004-06-14 | 2010-04-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5203435B2 (ja) | 2010-09-17 | 2013-06-05 | 東京エレクトロン株式会社 | 液処理方法、その液処理方法を実行させるためのプログラムを記録した記録媒体及び液処理装置 |
JP6718714B2 (ja) * | 2016-03-25 | 2020-07-08 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP6916003B2 (ja) * | 2017-02-24 | 2021-08-11 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP7034634B2 (ja) * | 2017-08-31 | 2022-03-14 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
-
2019
- 2019-03-20 JP JP2019052732A patent/JP7201494B2/ja active Active
-
2020
- 2020-02-06 CN CN202080020030.2A patent/CN113557594A/zh active Pending
- 2020-02-06 KR KR1020217031485A patent/KR102648039B1/ko active IP Right Grant
- 2020-02-06 WO PCT/JP2020/004588 patent/WO2020189072A1/ja active Application Filing
- 2020-02-14 TW TW109104616A patent/TWI787582B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243940A (ja) * | 2004-02-26 | 2005-09-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2009266951A (ja) * | 2008-04-23 | 2009-11-12 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP2015185803A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社Screenホールディングス | 基板処理装置 |
JP2016040812A (ja) * | 2014-08-13 | 2016-03-24 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117316812A (zh) * | 2023-08-14 | 2023-12-29 | 深圳远荣半导体设备有限公司 | 一种晶圆清洗机及晶圆搬运的方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI787582B (zh) | 2022-12-21 |
KR102648039B1 (ko) | 2024-03-18 |
TW202036707A (zh) | 2020-10-01 |
JP7201494B2 (ja) | 2023-01-10 |
WO2020189072A1 (ja) | 2020-09-24 |
JP2020155588A (ja) | 2020-09-24 |
KR20210133288A (ko) | 2021-11-05 |
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