CN1134064C - 半导体芯片用的载体元件 - Google Patents
半导体芯片用的载体元件 Download PDFInfo
- Publication number
- CN1134064C CN1134064C CNB971946736A CN97194673A CN1134064C CN 1134064 C CN1134064 C CN 1134064C CN B971946736 A CNB971946736 A CN B971946736A CN 97194673 A CN97194673 A CN 97194673A CN 1134064 C CN1134064 C CN 1134064C
- Authority
- CN
- China
- Prior art keywords
- carrier element
- printed
- film
- breach
- printed conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19620025A DE19620025A1 (de) | 1996-05-17 | 1996-05-17 | Trägerelement für einen Halbleiterchip |
DE19635732A DE19635732A1 (de) | 1996-09-03 | 1996-09-03 | Trägerelement für einen Halbleiterchip |
DE19635732.2 | 1996-09-03 | ||
DE19620025.3 | 1996-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1218575A CN1218575A (zh) | 1999-06-02 |
CN1134064C true CN1134064C (zh) | 2004-01-07 |
Family
ID=26025806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB971946736A Expired - Fee Related CN1134064C (zh) | 1996-05-17 | 1997-05-14 | 半导体芯片用的载体元件 |
Country Status (13)
Country | Link |
---|---|
US (1) | US6326683B1 (zh) |
EP (1) | EP0902973B1 (zh) |
JP (1) | JP3080175B2 (zh) |
KR (1) | KR20000010876A (zh) |
CN (1) | CN1134064C (zh) |
AT (1) | ATE207243T1 (zh) |
BR (1) | BR9709319A (zh) |
DE (1) | DE59704976D1 (zh) |
ES (1) | ES2166082T3 (zh) |
IN (1) | IN190208B (zh) |
RU (1) | RU2156521C2 (zh) |
UA (1) | UA46842C2 (zh) |
WO (1) | WO1997044823A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928431A (zh) * | 2012-10-31 | 2014-07-16 | 矽力杰半导体技术(杭州)有限公司 | 一种倒装封装装置 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6803656B2 (en) * | 1997-12-31 | 2004-10-12 | Micron Technology, Inc. | Semiconductor device including combed bond pad opening |
JP3532123B2 (ja) * | 1999-07-06 | 2004-05-31 | 日本圧着端子製造株式会社 | 集積回路内蔵カード |
JP3494100B2 (ja) * | 2000-01-11 | 2004-02-03 | 富士通株式会社 | 半導体装置及びその実装方法 |
EP1119047A1 (de) * | 2000-01-18 | 2001-07-25 | Infineon Technologies AG | Flächiger Träger für ein Chipmodul und Herstellungsverfahren für ein Chipmodul |
ES2177447B1 (es) * | 2000-12-29 | 2004-08-16 | Lear Automotive (Eeds) Spain, S.L. | Circuito electronico con terminales de conexion integrados y metodo para su fabricacion. |
CA2524328C (en) * | 2003-05-09 | 2011-01-04 | Widex A/S | A method for manufacturing a carrier element for a hearing aid and a carrier element for a hearing aid |
JP4037332B2 (ja) * | 2003-07-10 | 2008-01-23 | シャープ株式会社 | Icモジュールおよびicカード |
DE10352079A1 (de) * | 2003-11-08 | 2005-06-02 | Robert Bosch Gmbh | Elektromotor, sowie Verfahren zur Herstellung eines solchen |
DE102004011702B4 (de) * | 2004-03-10 | 2006-02-16 | Circle Smart Card Ag | Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte |
JP4472582B2 (ja) * | 2005-05-27 | 2010-06-02 | 日本メクトロン株式会社 | 可撓性回路基板の実装処理方法 |
EP2189928A1 (fr) * | 2008-11-21 | 2010-05-26 | Gemalto SA | Dispositif à circuit integré muni de différents moyens de connexion |
WO2011087168A1 (ko) * | 2010-01-15 | 2011-07-21 | 삼성엘이디 주식회사 | 인쇄회로기판 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9368427B2 (en) * | 2013-02-01 | 2016-06-14 | Mxtran Inc. | Integrated circuit film and method of manufacturing the same |
US9418254B2 (en) * | 2013-02-01 | 2016-08-16 | Mxtran Inc. | Integrated circuit film and method for manipulating the same |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
US20160314721A1 (en) * | 2015-04-24 | 2016-10-27 | Kabushiki Kaisha Toshiba | Anti-tamper label and storage device with the same |
CN107025481B (zh) * | 2016-02-02 | 2021-08-20 | 上海伯乐电子有限公司 | 柔性印制电路板及应用其的智能卡模块和智能卡 |
DE102016110780A1 (de) | 2016-06-13 | 2017-12-14 | Infineon Technologies Austria Ag | Chipkartenmodul und Verfahren zum Herstellen eines Chipkartenmoduls |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
DE3046192A1 (de) * | 1980-12-08 | 1982-07-15 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer ic-bausteine |
DE3123198C2 (de) | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
DE3234745C2 (de) | 1982-09-20 | 1986-03-06 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Handhabung von filmmontierten integrierten Schaltkreisen und Vorrichtung zu seiner Durchführung |
FR2548857B1 (fr) | 1983-07-04 | 1987-11-27 | Cortaillod Cables Sa | Procede de fabrication en continu d'une carte imprimee |
FR2588695B1 (fr) * | 1985-10-11 | 1988-07-29 | Eurotechnique Sa | Procede de fabrication d'un microboitier, microboitier a contacts effleurants et application aux cartes contenant des composants |
FR2617668B1 (fr) * | 1987-07-03 | 1995-07-07 | Radiotechnique Compelec | Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant |
GB8723734D0 (en) | 1987-10-09 | 1987-11-11 | De La Rue Co Plc | Ic modules |
FR2624651B1 (fr) * | 1987-12-14 | 1991-09-06 | Sgs Thomson Microelectronics | Procede de mise en place d'un composant electronique et de ses connexions electriques sur un support et produit ainsi obtenu |
DE3809005A1 (de) * | 1988-03-17 | 1989-09-28 | Hitachi Semiconductor Europ Gm | Chipmodul und seine herstellung und verwendung |
US5162894A (en) * | 1988-05-24 | 1992-11-10 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit having a dummy lead and shaped inner leads |
DE3901402A1 (de) | 1989-01-19 | 1990-07-26 | Telefonbau & Normalzeit Gmbh | Verfahren zur herstellung einer chipkarte |
US5294829A (en) * | 1990-01-26 | 1994-03-15 | Sgs-Thomson Microelectronics, Inc. | IC package having direct attach backup battery |
US5289034A (en) * | 1990-01-26 | 1994-02-22 | Sgs-Thomson Microelectronics, Inc. | IC package having replaceable backup battery |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
JPH05294093A (ja) * | 1991-03-22 | 1993-11-09 | Toshiba Corp | 携帯可能記憶媒体 |
JP2509422B2 (ja) * | 1991-10-30 | 1996-06-19 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
FR2684236B1 (fr) * | 1991-11-27 | 1998-08-21 | Gemplus Card Int | Dispositif de connexion de circuit integre. |
JPH0653277A (ja) * | 1992-06-04 | 1994-02-25 | Lsi Logic Corp | 半導体装置アセンブリおよびその組立方法 |
DE4232625A1 (de) | 1992-09-29 | 1994-03-31 | Siemens Ag | Verfahren zur Montage von integrierten Halbleiterschaltkreisen |
CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
JPH1032221A (ja) * | 1996-07-12 | 1998-02-03 | Nec Corp | プリント配線基板 |
JP3176307B2 (ja) * | 1997-03-03 | 2001-06-18 | 日本電気株式会社 | 集積回路装置の実装構造およびその製造方法 |
-
1997
- 1997-05-14 WO PCT/DE1997/000977 patent/WO1997044823A1/de active IP Right Grant
- 1997-05-14 ES ES97923818T patent/ES2166082T3/es not_active Expired - Lifetime
- 1997-05-14 EP EP97923818A patent/EP0902973B1/de not_active Expired - Lifetime
- 1997-05-14 AT AT97923818T patent/ATE207243T1/de active
- 1997-05-14 RU RU98122611/28A patent/RU2156521C2/ru not_active IP Right Cessation
- 1997-05-14 JP JP09541367A patent/JP3080175B2/ja not_active Expired - Fee Related
- 1997-05-14 DE DE59704976T patent/DE59704976D1/de not_active Expired - Lifetime
- 1997-05-14 KR KR1019980709020A patent/KR20000010876A/ko active IP Right Grant
- 1997-05-14 UA UA98116047A patent/UA46842C2/uk unknown
- 1997-05-14 BR BR9709319-0A patent/BR9709319A/pt not_active IP Right Cessation
- 1997-05-14 CN CNB971946736A patent/CN1134064C/zh not_active Expired - Fee Related
- 1997-05-16 IN IN885CA1997 patent/IN190208B/en unknown
-
1998
- 1998-11-17 US US09/193,577 patent/US6326683B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928431A (zh) * | 2012-10-31 | 2014-07-16 | 矽力杰半导体技术(杭州)有限公司 | 一种倒装封装装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1218575A (zh) | 1999-06-02 |
KR20000010876A (ko) | 2000-02-25 |
JP3080175B2 (ja) | 2000-08-21 |
IN190208B (zh) | 2003-06-28 |
WO1997044823A1 (de) | 1997-11-27 |
EP0902973A1 (de) | 1999-03-24 |
BR9709319A (pt) | 2000-05-09 |
ES2166082T3 (es) | 2002-04-01 |
UA46842C2 (uk) | 2002-06-17 |
DE59704976D1 (de) | 2001-11-22 |
US6326683B1 (en) | 2001-12-04 |
ATE207243T1 (de) | 2001-11-15 |
RU2156521C2 (ru) | 2000-09-20 |
EP0902973B1 (de) | 2001-10-17 |
JPH11510652A (ja) | 1999-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: INFINEON TECHNOLOGIES AG Free format text: FORMER OWNER: SIEMENS AG Effective date: 20120222 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120222 Address after: Federal Republic of Germany City, Laura Ibiza Berger Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: Siemens AG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040107 Termination date: 20160514 |
|
CF01 | Termination of patent right due to non-payment of annual fee |