CN100359682C - 电子标签及其制造方法 - Google Patents
电子标签及其制造方法 Download PDFInfo
- Publication number
- CN100359682C CN100359682C CNB028183177A CN02818317A CN100359682C CN 100359682 C CN100359682 C CN 100359682C CN B028183177 A CNB028183177 A CN B028183177A CN 02818317 A CN02818317 A CN 02818317A CN 100359682 C CN100359682 C CN 100359682C
- Authority
- CN
- China
- Prior art keywords
- substrate
- conductive layer
- window
- electronic component
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000010410 layer Substances 0.000 claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000011230 binding agent Substances 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 2
- 239000012939 laminating adhesive Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 10
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229920000297 Rayon Polymers 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000007634 remodeling Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH17182001 | 2001-09-18 | ||
CH1718/2001 | 2001-09-18 | ||
CH1718/01 | 2001-09-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1555576A CN1555576A (zh) | 2004-12-15 |
CN100359682C true CN100359682C (zh) | 2008-01-02 |
Family
ID=4566019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028183177A Expired - Fee Related CN100359682C (zh) | 2001-09-18 | 2002-09-17 | 电子标签及其制造方法 |
Country Status (12)
Country | Link |
---|---|
US (1) | US7150406B2 (zh) |
EP (1) | EP1428258B1 (zh) |
JP (1) | JP4257679B2 (zh) |
CN (1) | CN100359682C (zh) |
AU (1) | AU2002337402B2 (zh) |
BR (1) | BRPI0212612B1 (zh) |
CA (1) | CA2460840C (zh) |
ES (1) | ES2649545T3 (zh) |
MX (1) | MXPA04002588A (zh) |
RU (1) | RU2300159C2 (zh) |
WO (1) | WO2003026010A1 (zh) |
ZA (1) | ZA200402147B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4109039B2 (ja) * | 2002-08-28 | 2008-06-25 | 株式会社ルネサステクノロジ | 電子タグ用インレットおよびその製造方法 |
JP4066929B2 (ja) * | 2003-10-08 | 2008-03-26 | 株式会社日立製作所 | 電子装置及びその製造方法 |
FR2885718B1 (fr) * | 2005-05-11 | 2007-09-21 | Gemplus Sa | Adaptateur de format a adhesif pour dispositif a memoire et procede de fabrication |
EP1724712A1 (fr) * | 2005-05-11 | 2006-11-22 | Stmicroelectronics Sa | Micromodule, notamment pour carte à puce |
WO2007147729A1 (fr) * | 2006-06-19 | 2007-12-27 | Nagraid S.A. | Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire |
WO2007147727A1 (fr) * | 2006-06-19 | 2007-12-27 | Nagraid S.A. | Procede de fabrication de cartes comprenant chacune un module electronique et produits intermediaires |
WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
PL2132684T3 (pl) | 2007-02-09 | 2013-03-29 | Nagravision Sa | Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
GB2453765A (en) * | 2007-10-18 | 2009-04-22 | Novalia Ltd | Product packaging with printed circuit and means for preventing a short circuit |
FI121592B (fi) * | 2008-03-26 | 2011-01-31 | Tecnomar Oy | Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti |
CN101345330A (zh) * | 2008-08-25 | 2009-01-14 | 合隆科技(杭州)有限公司 | 射频天线及其制作方法 |
WO2013175261A1 (en) * | 2012-05-21 | 2013-11-28 | Linxens Holding | Interconnection substrate and method of manufacturing the same |
FR2992141B1 (fr) * | 2012-06-14 | 2015-03-20 | Microconnections Sas | Procede de realisation de circuit electronique a protection de couche conductrice |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
WO2015085086A1 (en) | 2013-12-04 | 2015-06-11 | Temptime Corporation | Condition change labels |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
CN110077135B (zh) * | 2019-04-23 | 2020-07-17 | 捷卡(厦门)工业科技有限公司 | 一种带窗口的标签的生产工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4835846A (en) * | 1987-09-14 | 1989-06-06 | Em Microelectronic Marin Sa | Method of manufacture of electronic modules for cards with microcircuits |
CN1144571A (zh) * | 1994-02-04 | 1997-03-05 | 吉赛克与德弗连特股份有限公司 | 有电子模块的数据载体及其生产方法 |
JP2001175829A (ja) * | 1999-10-08 | 2001-06-29 | Dainippon Printing Co Ltd | 非接触式データキャリアおよびicチップ |
CN1068546C (zh) * | 1995-05-18 | 2001-07-18 | 株式会社日立制作所 | 半导体器件 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3019207A1 (de) | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
US4727246A (en) * | 1984-08-31 | 1988-02-23 | Casio Computer Co., Ltd. | IC card |
FR2673041A1 (fr) | 1991-02-19 | 1992-08-21 | Gemplus Card Int | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
FR2674681A1 (fr) | 1991-03-28 | 1992-10-02 | Em Microelectronic Marin Sa | Composant electronique ultramince et procede pour sa fabrication. |
US5776278A (en) * | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
DE69831592T2 (de) * | 1997-11-14 | 2006-06-22 | Toppan Printing Co. Ltd. | Zusammengesetzte ic-karte |
FR2796183B1 (fr) * | 1999-07-07 | 2001-09-28 | A S K | Ticket d'acces sans contact et son procede de fabrication |
EP1167068A4 (en) | 1999-10-08 | 2007-04-04 | Dainippon Printing Co Ltd | TOUCH-FREE DATA CARRIER AND IC CHIP |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
-
2002
- 2002-09-17 WO PCT/IB2002/003953 patent/WO2003026010A1/fr active Application Filing
- 2002-09-17 CN CNB028183177A patent/CN100359682C/zh not_active Expired - Fee Related
- 2002-09-17 EP EP02772644.7A patent/EP1428258B1/fr not_active Expired - Lifetime
- 2002-09-17 BR BRPI0212612A patent/BRPI0212612B1/pt not_active IP Right Cessation
- 2002-09-17 US US10/489,476 patent/US7150406B2/en not_active Expired - Fee Related
- 2002-09-17 RU RU2004107999/28A patent/RU2300159C2/ru not_active IP Right Cessation
- 2002-09-17 CA CA2460840A patent/CA2460840C/en not_active Expired - Fee Related
- 2002-09-17 ES ES02772644.7T patent/ES2649545T3/es not_active Expired - Lifetime
- 2002-09-17 AU AU2002337402A patent/AU2002337402B2/en not_active Ceased
- 2002-09-17 MX MXPA04002588A patent/MXPA04002588A/es active IP Right Grant
- 2002-09-17 JP JP2003529527A patent/JP4257679B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-17 ZA ZA2004/02147A patent/ZA200402147B/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4835846A (en) * | 1987-09-14 | 1989-06-06 | Em Microelectronic Marin Sa | Method of manufacture of electronic modules for cards with microcircuits |
CN1144571A (zh) * | 1994-02-04 | 1997-03-05 | 吉赛克与德弗连特股份有限公司 | 有电子模块的数据载体及其生产方法 |
CN1068546C (zh) * | 1995-05-18 | 2001-07-18 | 株式会社日立制作所 | 半导体器件 |
JP2001175829A (ja) * | 1999-10-08 | 2001-06-29 | Dainippon Printing Co Ltd | 非接触式データキャリアおよびicチップ |
Also Published As
Publication number | Publication date |
---|---|
CA2460840C (en) | 2011-12-20 |
JP2005503625A (ja) | 2005-02-03 |
WO2003026010A1 (fr) | 2003-03-27 |
BRPI0212612B1 (pt) | 2016-01-19 |
CA2460840A1 (en) | 2003-03-27 |
BR0212612A (pt) | 2004-08-17 |
JP4257679B2 (ja) | 2009-04-22 |
AU2002337402B2 (en) | 2007-08-16 |
MXPA04002588A (es) | 2004-06-18 |
CN1555576A (zh) | 2004-12-15 |
RU2004107999A (ru) | 2005-05-10 |
ZA200402147B (en) | 2005-07-27 |
US20040256466A1 (en) | 2004-12-23 |
ES2649545T3 (es) | 2018-01-12 |
EP1428258A1 (fr) | 2004-06-16 |
RU2300159C2 (ru) | 2007-05-27 |
EP1428258B1 (fr) | 2017-08-30 |
US7150406B2 (en) | 2006-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NAGRAVISION SA Free format text: FORMER OWNER: NAGRAID SA Effective date: 20150709 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150709 Address after: geneva Patentee after: Nagravision SA Address before: La Chaux-de-Fonds Patentee before: Nagraid SA |
|
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: Swiss Lausanne shesuo Patentee after: Nagravision SA Address before: geneva Patentee before: Nagravision SA |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080102 Termination date: 20180917 |
|
CF01 | Termination of patent right due to non-payment of annual fee |