CN113329871B - 两面覆金属层叠体和其制造方法、绝缘膜及电子电路基板 - Google Patents
两面覆金属层叠体和其制造方法、绝缘膜及电子电路基板 Download PDFInfo
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- CN113329871B CN113329871B CN202080010195.1A CN202080010195A CN113329871B CN 113329871 B CN113329871 B CN 113329871B CN 202080010195 A CN202080010195 A CN 202080010195A CN 113329871 B CN113329871 B CN 113329871B
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- metal
- insulating film
- clad laminate
- heating
- liquid crystal
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Abstract
提供一种两面覆金属层叠体和其制造方法,其能够使用由热塑性液晶聚合物构成的各向异性强的绝缘膜,且热塑性液晶聚合物层的面取向度小,加热时的尺寸变化的各向异性也小。并且提供一种绝缘膜和电子电路基板。两面覆金属层叠体的制造方法具有:供给工序,在一对环形带(3)之间连续地供给绝缘膜和两片金属箔;加热加压工序,在环形带(3)之间将绝缘膜用金属箔夹持,在该状态下按特定的条件进行加热加压而制成层叠体;以及冷却工序,对层叠体进行冷却,其中,绝缘膜的厚度为10~500μm,面取向度为30%以上,MD方向的平均线膨胀系数为‑40~0ppm/K,TD方向的平均线膨胀系数为0~120ppm/K。并且涉及基于该制造方法的两面覆金属层叠体、用于该制造方法的绝缘膜、使用了有该两面覆金属层叠体的电子电路基板。
Description
技术领域
本发明涉及一种两面覆金属层叠体和其制造方法、用于该制造方法的绝缘膜及使用了两面覆金属层叠体的电子电路基板。
背景技术
热塑性液晶聚合物(LCP)的耐热性、机械强度、电特性等优异,因此在电气-电子领域、车载零部件领域中,被广泛地用作电子电路基板等的绝缘膜。
热塑性液晶聚合物膜由于具有直链状的刚性分子链有规则地排列的结构,所以容易产生各向异性。因此,对于将热塑性液晶聚合物通过T模等挤出成型得到的膜而言,通常在平面内容易在挤出方向上产生高度的分子取向。其结果,在挤出方向和与其垂直的方向上,加热时的线膨胀系数产生差异,外观有可能会变形。
因此,在将热塑性液晶聚合物膜用作绝缘膜来制造两面覆金属层叠体的情况下,采取的方法是:进行了使热塑性液晶聚合物膜所具有的各向异性降低的处理之后,将其与金属箔层叠而一体化。
关于使用热塑性液晶聚合物膜来制造两面覆金属层叠体的方法,已经公开了多个制造技术。例如,在专利文献1中公开了以下的制造方法,即在一对环形带之间连续地供给由液晶聚合物构成的绝缘膜和金属箔,并对其进行热压成形,从而制造出柔性印刷配线板用层叠板。在该方法中,规定了金属箔的表面粗糙度和热压成形时的加热温度。另外,在专利文献2中公开了以下的制造方法,即在一对环形带之间连续地供给由液晶聚合物构成的绝缘膜和金属箔,并使其热压接,从而制造出柔性层叠板。在该方法中,规定了柔性层叠板的最高温度和被从环形带输送出时的出口温度。
现有技术文献
专利文献
专利文献1:日本特许第5411656号公报
专利文献2:日本特开2016-129949号公报
发明内容
发明所要解决的技术问题
但是,在专利文献1所公开的制造方法中,虽然热压成形时的加热温度为液晶聚合物的熔点以上,但是当使用各向异性强的热塑性液晶聚合物膜时,各向异性有可能会有残留。当膜残留有各向异性时,层叠板有可能会产生翘曲、变形,或者在开孔加工时有可能会产生毛刺、裂纹。另外,在专利文献2所公开的制造方法中,由于热压接时的加热温度小于液晶聚合物的熔点,因此,与专利文献1的方法同样地,当使用各向异性强的热塑性液晶聚合物膜时,各向异性有可能会有残留。
本发明是鉴于以上的这样的情况而作出的。即,本发明的课题在于提供一种两面覆金属层叠体和其制造方法,所述层叠体能够使用由热塑性液晶聚合物构成的各向异性强的绝缘膜,且两面覆金属层叠体的热塑性液晶聚合物层的面取向度小,加热时的尺寸变化的各向异性也小。另外,在于提供一种适用于所述制造方法的绝缘膜及使用有所述两面覆金属层叠体的电子电路基板。
用于解决问题的技术方案
本发明人等发现,在一对环形带之间将由热塑性液晶聚合物构成的绝缘膜用两片金属箔夹持的状态下,通过选择特定的温度、压力和时间而进行加热加压,由此令人惊讶的是,绝缘膜的各向异性比较容易地得到改善。另外发现,即使不进行以往所进行的用于预先使热塑性液晶聚合物膜所具有的各向异性降低的处理,使用各向异性强的绝缘膜,也可以得到各向异性降低了的两面覆金属层叠体。本发明是基于这样的见解而完成的。即,本发明具有以下这样的结构。
(1)本发明的两面覆金属层叠体的制造方法是具有如下构成的两面覆金属层叠体的制造方法,所述构成为将由热塑性液晶聚合物构成的绝缘膜用两片金属箔夹持而成,其特征在于,具有:供给工序,在一对环形带之间连续地供给所述绝缘膜和两片所述金属箔;加热加压工序,在所述环形带之间将所述绝缘膜用两片所述金属箔夹持,在该状态下对其进行加热加压而制成层叠体;以及冷却工序,对所述层叠体进行冷却,其中,所述绝缘膜的厚度为10~500μm,面取向度为30%以上,MD方向的平均线膨胀系数为-40~0ppm/K,TD方向的平均线膨胀系数为0~120ppm/K,在将所述热塑性液晶聚合物的熔点设为Tm(℃)时,所述加热加压工序的加热温度T(℃)满足(Tm+20)<T≤(Tm+70),并且所述加热加压工序的压力为0.5~10MPa,所述加热加压工序的加热加压时间为30~360秒。
(2)在本发明的两面覆金属层叠体的制造方法中,可以使所得到的两面覆金属层叠体的去除金属箔之后的热塑性液晶聚合物层的面取向度小于30%,MD方向的平均线膨胀系数为0~40ppm/K,TD方向的平均线膨胀系数为0~40ppm/K。
(3)在本发明的两面覆金属层叠体的制造方法中,优选所述金属箔为铜箔。
(4)本发明的绝缘膜是用于两面覆金属层叠体的制造方法的绝缘膜,其特征在于,所述两面覆金属层叠体的制造方法具有:供给工序,在一对环形带之间连续地供给绝缘膜和两片金属箔;加热加压工序,在所述环形带之间将所述绝缘膜用两片所述金属箔夹持,在该状态下对其进行加热加压而制成层叠体;以及冷却工序,对所述层叠体进行冷却,其中,所述绝缘膜由热塑性液晶聚合物构成,且其厚度为10~500μm,面取向度为30%以上,MD方向的平均线膨胀系数为-40~0ppm/K,TD方向的平均线膨胀系数为0~120ppm/K。
(5)本发明的两面覆金属层叠体具有如下构成的两面覆金属层叠体,所述构成为将由热塑性液晶聚合物构成的绝缘膜用两片金属箔夹持而成,其特征在于,由所述(1)或所述(2)记载的两面覆金属层叠体的制造方法进行制造,去除金属箔之后的热塑性液晶聚合物层的面取向度小于30%,MD方向的平均线膨胀系数为0~40ppm/K,TD方向的平均线膨胀系数为0~40ppm/K。
(6)在本发明的两面覆金属层叠体中,优选所述金属箔为铜箔。
(7)本发明的电子电路基板使用有所述(5)或所述(6)记载的两面覆金属层叠体。
发明效果
本发明的两面覆金属层叠体的制造方法能够使用由热塑性液晶聚合物构成的各向异性强的绝缘膜,并且能够得到两面覆金属层叠体的热塑性液晶聚合物层的面取向度小,加热时的尺寸变化的各向异性也小的两面覆金属层叠体。
附图说明
图1是本实施方式的两面覆金属层叠体的制造装置的示意性剖视图。
图2(a)是X射线衍射的二维衍射图像,图2(b)是强度曲线。
具体实施方式
以下,详细说明本发明的实施方式。但是,本发明的技术范围并不限定于以下说明的作为具体例的实施方式。
(热塑性液晶聚合物)
热塑性液晶聚合物是指在熔融时具有液晶状态或者光学双折射的性质的热塑性聚合物。作为热塑性液晶聚合物,具有在溶液状态下显示出液晶性的溶致液晶聚合物或在熔融时显示出液晶性的热致液晶聚合物。热塑性液晶聚合物根据热变形温度,被分类为I型、II型、III型,也可以为任一型。
作为热塑性液晶聚合物,例如可以列举出热塑性的芳香族液晶聚酯、或向其导入了酰胺键的热塑性的芳香族液晶聚酯酰胺等。热塑性液晶聚合物也可以为向芳香族聚酯或芳香族聚酯酰胺进一步导入了酰亚胺键、碳酸酯键、碳化二亚胺键或异氰脲酸酯键等源自异氰酸酯的键等的聚合物。
对于热塑性液晶聚合物的熔点而言,以DSC法计,优选为220~400℃,更优选为260~380℃。当热塑性液晶聚合物的熔点在所述范围内时,能够得到挤出成型性优异,且耐热性优异的膜。
热塑性液晶聚合物的分子具有刚性棒状结构,分子以与成型流动方向一致的状态凝固,因此,成型品的尺寸稳定性优异,但另一边是具有易于表现出各向异性的特性。
(绝缘膜)
绝缘膜为成型热塑性液晶聚合物而制造出的膜。由热塑性液晶聚合物制造绝缘膜的成型方法并未特别限定,可以列举出吹胀法或T模法等挤出成型法、流延法、压延法等公知的成型方法。在这些当中,T模法最通用。然而,在利用T模法进行膜成型的情况下,当从T模通过时,在MD方向上施加剪切,热塑性液晶聚合物分子进行取向,在MD方向上易于表现出各向异性。在此,MD方向是指膜面内的成型流动方向(Machine Direction:机械方向),TD方向是指膜面内与MD方向垂直的方向。
绝缘膜的厚度为10~500μm,优选为15~400μm。当绝缘膜的厚度在所述范围内时,在环形带之间将绝缘膜用两片金属箔夹持的状态下对其进行加热加压时,能够通过聚合物分子的流动使各向异性降低。
如上所述,在利用T模法由热塑性液晶聚合物成型膜时,在MD方向上施加剪切,膜发生取向,在MD方向上有时表现出各向异性。通常情况下,使利用T模法成型的膜的面取向度为30%以上,MD方向的平均线膨胀系数为-40~0ppm/K,TD方向的平均线膨胀系数为0~120ppm/K。在本实施方式的两面覆金属层叠体的制造方法中,如后面所述,作为绝缘膜,能够使用面取向度为30%以上、MD方向的平均线膨胀系数为-40~0ppm/K、TD方向的平均线膨胀系数为0~120ppm/K的各向异性强的绝缘膜。
面取向度按照以下操作求得。首先,使用广角X射线衍射装置,从与膜面垂直的方向向膜面照射X射线,得到二维衍射图像。接着,通过绘制得到二维衍射图像的圆周方向的强度,得到强度曲线。在所得到的强度曲线中,将测定强度的基础部分的积分值设为B,将从所测定出的峰部分减去基础部分而得到的部分的积分值设为A,此时,面取向度由下述式计算得出。
面取向度(%)={A/(A+B)}×100
平均线膨胀系数通过依据JIS K7167的TMA法测定得出。
[两面覆金属层叠体的制造装置]
图1是本实施方式的两面覆金属层叠体的制造装置20的示意性剖视图。两面覆金属层叠体的制造装置20为液压式双带压方式的制造装置,能够在将绝缘膜用两片金属箔夹持的状态下,连续地进行加热加压而制成层叠体,且两面覆金属层叠体的生产性优异。
制造装置20设置有绝缘膜的辊11和层叠于绝缘膜的两面的两片金属箔的辊12。被从辊11拉出的绝缘膜由从辊12拉出的两片金属箔夹持,在该状态下,向两台传送装置14之间供给。
制造装置20具有位于上下的两台传送装置14。传送装置14通过两个环形带辊1、2使环形带3被驱动。在传送装置14的内部中,具有内置加热块5和冷却块6的加压块4。两台传送装置14能够连续以规定的压力对向其中间投入的绝缘膜和金属箔进行加压且进行加热,之后对其进行冷却。环形带3的材质并未特别限定,能够使用金属、树脂、橡胶等,但从耐热性或热膨胀少的观点考虑,优选为金属。
加压块4具有能够以规定的压力对绝缘膜和金属箔进行加压的能力。在加压块4的内部中填充有油。加压块4内的油能够进行加压。当通过油压进行加压时,能够对膜面内均匀地施加压力,因此不易引起外观不良。加热块5具有将绝缘膜和金属箔加热至热塑性液晶聚合物的熔点以上的规定的温度的功能。冷却块6具有以规定的冷却速度将绝缘膜和金属箔冷却至热塑性液晶聚合物的固化温度以下的温度的功能。
制造装置20具备用于输送绝缘膜或金属箔的多个导辊7。另外,制造装置20能够将通过两台传送装置14一体化而成的由绝缘膜和金属箔构成的层叠体卷绕为辊13。
作为金属箔,能够使用铜、铜合金、铝、铝合金、铁、铁合金等金属箔。在将其用于电子电路基板等用途时,优选为铜箔。
优选金属箔的厚度为5~100μm,更优选为7~50μm。当金属箔的厚度大于100μm时,有可能会由于导热的关系,使制造装置20的热塑性液晶聚合物的加热熔融变得不充分。另外,为了提高金属箔与绝缘膜的密合性,优选对其实施表面处理。作为表面处理方法,具有糙面化处理、偶联剂等的涂布、酸-碱处理、氧化处理等方法。这些表面处理方法能够适当使用公知的方法。
[两面覆金属层叠体的制造方法]
本实施方式的两面覆金属层叠体的制造方法具有:(1)供给工序,在一对环形带之间连续地供给绝缘膜和两片金属箔;(2)加热加压工序,在环形带之间将绝缘膜用两片金属箔夹持,在该状态下对其进行加热加压而制成层叠体;(3)冷却工序,对层叠体进行冷却;以及(4)卷绕工序,对层叠体进行卷绕。在图1中,示出所述的四个工序。两面覆金属层叠体的制造方法的各工序也能够通过间歇方式实施,但从生产性的观点考虑,更优选通过连续方式实施。以下,针对各工序进行说明。
(供给工序)
供给工序为在制造装置20的两台传送装置14所具有的一对环形带3之间连续地供给绝缘膜和两片金属箔的工序。绝缘膜被从辊11供给,层叠于绝缘膜的两面的两片金属箔被从辊12供给。
(加热加压工序)
加热加压工序为在环形带3之间将绝缘膜用两片金属箔夹持,在该状态下对其进行加热加压而制成层叠体的工序。
本发明人等使用具有强各向异性的绝缘膜,针对其各向异性的降低方法进行了研究。针对使用制造装置20,在环形带3之间对两片金属箔和绝缘膜进行加热加压时的温度、压力和时间进行了各种研究。其结果表明:(1)当加热至热塑性液晶聚合物的熔点以上的特定的温度时,热塑性液晶聚合物熔融,在熔融状态下聚合物分子间的缠结解开,熔融粘度急剧下降,熔融聚合物的流动性显著增大;(2)通过在特定的压力下维持特定的时间、高流动状态,由此成型时形成的聚合物分子的取向被破坏,各向异性显著降低;(3)通过进行冷却使绝缘膜的聚合物分子的取向被破坏的状态固定,由此被金属箔夹持的热塑性液晶聚合物层中的面取向度变小,加热时的尺寸变化的各向异性也变小。
在将热塑性液晶聚合物的熔点设为Tm(℃)时,加热加压工序的加热温度T(℃)需要满足(Tm+20)<T≤(Tm+70)。加热加压工序的加热温度T(℃)更优选为(Tm+20)<T≤(Tm+60)。当加热加压工序中的加热温度在所述式的范围内时,能够使热塑性液晶聚合物的熔融粘度显著下降,使聚合物分子流动,解开分子间的缠结,能够使各向异性显著降低。当加热温度T(℃)大于(Tm+70)时,有可能会使热塑性液晶聚合物劣化,或者熔融聚合物流动从金属箔溢出而污染装置。
加热加压工序中的压力为0.5~10MPa,优选为0.8~8MPa。当加热加压工序的压力为0.5MPa以上时,绝缘膜与金属箔充分密合,因此能够容易地向绝缘膜传递热。另外,当加热加压工序中的压力为10MPa以下时,绝缘膜的厚度不会显著降低,因此熔融聚合物流动各向异化的可能性小。
加热加压工序中的加热加压时间为30~360秒,优选为60~300秒。当加热加压时间在所述范围内时,热塑性液晶聚合物熔融,能够确保使各向异性降低的时间。
在具有上述的加热加压工序的本实施方式的制造方法中,即使使用了如下的各向异性强的绝缘膜,也能够使两面覆金属层叠体的热塑性液晶聚合物层为各向异性少的层,所述绝缘膜的面取向度为30%以上,MD方向的平均线膨胀系数为-40~0ppm/K,TD方向的平均线膨胀系数为0~120ppm/K。各向异性少的热塑性液晶聚合物层是指,面取向度小于30%、MD方向的平均线膨胀系数为0~40ppm/K、TD方向的平均线膨胀系数为0~40ppm/K的聚合物的层。
此外,只要为面取向度、MD方向的平均线膨胀系数和TD方向的平均线膨胀系数的任一数值比所述各向异性强的绝缘膜小的绝缘膜,就能够将其用作本实施方式的两面覆金属层叠体的制造方法的绝缘膜。另外,优选绝缘膜的面取向度为80%以下。
在本实施方式的制造方法中,如上所述,作为热塑性液晶聚合物层的各向异性被显著改善的理由,可以考虑如下所述。由于绝缘膜在被两片金属箔夹持约束的状态下进行加热,因此即使熔融聚合物的熔融粘度显著下降,也不会存在熔融聚合物流动且形态显著被破坏的情况。而且,可以推测出其原因在于,在该状态下,通过膜内部的聚合物分子的微***,聚合物分子的取向会变得随机。
(冷却工序)
冷却工序为将在加热加压工序中所得到的层叠体冷却至热塑性液晶聚合物的固化温度以下的温度的工序。对在加热加压工序中进行加热加压,且各向异性被降低的绝缘膜进行冷却固化,制成各向异性被缓和降低的热塑性液晶聚合物层。在冷却工序中,为了不残留成型应变,优选均等地进行冷却。
(卷绕工序)
在制造装置20中,经过加热加压工序和冷却工序形成一体化的层叠体以两面覆金属层叠体的形式被卷绕于卷绕辊13。另外,也可以以规定长度的长方形的两面覆金属层叠体的方式进行切割并对其进行重叠,而不进行卷绕工序。制造装置20的线速度被调整为能够确保加热加压工序的加热加压时间为30~360秒。
(两面覆金属层叠体)
本实施方式的两面覆金属层叠体使用所述的两面覆金属层叠体的制造装置20,并按照两面覆金属层叠体的制造方法被制造。根据本实施方式的两面覆金属层叠体的制造方法,由于所使用的绝缘膜的各向异性被显著改善,因此使两面覆金属层叠体的热塑性液晶聚合物层的面取向度小,且加热时的尺寸变化的各向异性也小。即,所得到的两面覆金属层叠体的去除金属箔之后的热塑性液晶聚合物层的面取向度小于30%,MD方向的平均线膨胀系数为0~40ppm/K,TD方向的平均线膨胀系数为0~40ppm/K。此外,优选热塑性液晶聚合物层的面取向度为20%以下。
由于两面覆金属层叠体的热塑性液晶聚合物层的各向异性降低,因此不易产生翘曲、变形,在开孔加工时不易产生毛刺、裂纹。
此外,当着眼于本实施方式的两面覆金属层叠体去除金属箔之后的热塑性液晶聚合物层的规定时,也能够使用与本实施方式的两面覆金属层叠体的制造方法不同的制造方法进行制造。即,也能够利用以往的预先进行用于使绝缘膜所具有的各向异性降低的处理之后,将该绝缘膜用两片金属箔夹持,在该状态下进行加热加压而制成层叠体的方法来进行制造。然而,目前难以根据其结构或者特性来直接特定本实施方式的两面覆金属层叠体与利用前述以往的方法制造而成的两面覆金属层叠体的差异。因此,为了明确本实施方式的两面覆金属层叠体与利用其他的制造方法的两面覆金属层叠体的不同,用制造方法来规定本实施方式的两面覆金属层叠体。
以往,预先进行了用于使热塑性液晶聚合物膜所具有的各向异性降低的处理,然而,本实施方式的两面覆金属层叠体的制造方法能够省略这样的工序。即,本实施方式的两面覆金属层叠体的制造方法的制造工序是比以往简化,且生产性优异的制造方法。
作为两面覆金属层叠体的用途,有电气-电子领域、车载零部件领域的印刷配线板、模块基板等电子电路基板。另外,作为其他的用途,有高耐热性的柔性印刷基板、太阳能面板基板、高频用配线基板等。尤其,适用于将绝缘膜用作基板的柔性覆铜层叠板。
实施例
以下,使用实施例和比较例来进一步具体地说明本发明的实施方式,但本发明并不限定于这些例子。
用于实施例和比较例的材料如以下所示。
(1)绝缘膜
绝缘膜1:将上野制药公司制造的LCP树脂(产品编号A-5000、熔点280℃、结晶化温度230℃)用单螺杆挤出机和T模进行制膜而得到厚度为12μm、100μm、480μm和600μm的膜;
绝缘膜2:将宝理塑料公司制造的LCP树脂(产品编号C950RX、熔点320℃、结晶化温度275℃)用单螺杆挤出机和T模进行制膜而得到厚度为100μm的膜;
绝缘膜3:将上野制药公司制造的LCP树脂(产品编号P-9000、熔点340℃、结晶化温度305℃)用单螺杆挤出机和T模进行制膜而得到厚度为100μm的膜。
(2)金属箔
铜箔:三井金属矿业公司制造,产品编号TQ-M7-VSP,厚度为12μm。
(实施例1~8、比较例1~5)
使用图1所示的制造装置20,使表1中所记载的各种市售的绝缘膜的两面与两片金属箔接触,在该状态下,在表1中所记载的各种条件下进行加热加压工序而制成层叠体,之后进行冷却,制成两面覆金属层叠体。
将所得到的各两面覆金属层叠体浸渍于以氯化铁作为主要成分的基板制作用蚀刻液(Sunhayato公司制造、蚀刻液H-20L),溶解去除铜箔,取出各热塑性液晶聚合物层。对所得到的热塑性液晶聚合物层进行水洗,之后使其自然干燥。
针对各热塑性液晶聚合物层,按照以下所记载的方法,评价了面取向度、平均线膨胀系数。另外,针对各两面覆金属层叠体,评价了铜箔剥离强度。将评价结果在表1中示出。
(面取向度)
使用全自动多功能X射线衍射装置(株式会社理学制造、SmartLab(3kW)、2D-WAXS结构),进行了X射线衍射。测定条件在以下中示出。
X射线源:Cu密封管
施加电压:40kV
电流:40mA
X射线输出功率:1.6kW
检测器:多维像素检测器HyPix-3000
X射线照射方向:垂直于膜面
累计时间:10分钟
分析2θ角度范围:10°~30°
在二维衍射图像的圆周方向上绘制强度时的采样幅度:5°
从测定热塑性液晶聚合物层时的强度中减去作为空白的未将同一层设置于装置而进行测定时的强度,将其作为热塑性液晶聚合物层的强度。
在所得到的二维衍射图像(图2(a))中,通过对于圆周方向的旋转角度β绘制强度,得到了图2(b)的强度曲线。在图2(b)中,将圆周360°的量的测定强度的基线部分的积分值(基线面积)设为B,将从所测定出的峰部分减去基线部分而得到的部分的积分值(峰面积)设为A。此时,面取向度由下述式计算得出。
面取向度(%)={A/(A+B)}×100
当面取向度小于30%时,判定为合格。
(平均线膨胀系数)
依据JIS K 7167,通过TMA法,求出MD方向、TD方向上的23~200℃的温度范围内的平均线膨胀系数(ppm/K)。当膨胀时,为+(正)的数值,当收缩时,为-(负)的数值。
(铜箔剥离强度)
依据JIS C 6481,将两面覆金属层叠体的铜箔以宽度10mm、速度50mm/分钟,进行180°剥离,对此时的剥离力(N/mm)进行了测定。
当铜箔剥离强度为0.5N/mm以上时,判定为良好。
[表1]
根据表1的评价结果,实施例1~8的任一实施例的面取向度小于30%,MD方向和TD方向的平均线膨胀系数为0~40ppm/K,即便铜箔剥离强度也具有良好的性能。另一方面,对比较例1而言,由于其加热加压工序中的加热温度低,因此在面取向度和平均线膨胀系数方面不良。对比较例2而言,由于其加热加压工序中的加热温度过高,因此MD方向的平均线膨胀系数不良。对比较例3而言,由于其加热加压工序中的加热加压时间短,因此平均线膨胀系数不良。对比较例4而言,其绝缘膜的厚度过大,TD方向的平均线膨胀系数不良。对比较例5而言,由于其加热加压工序中的压力小,因此TD方向的平均线膨胀系数不良。
附图标记说明
1、2:环形带辊;3:环形带;4:加压块;5:加热块;6:冷却块;7:导辊;11、12、13:辊;14:传送装置;20:制造装置。
Claims (6)
1.一种两面覆金属层叠体的制造方法,其特征在于,是具有如下构成的两面覆金属层叠体的制造方法,所述构成为将由热塑性液晶聚合物构成的绝缘膜用两片金属箔夹持而成,所述制造方法具有:
供给工序,在一对环形带之间连续地供给所述绝缘膜和两片所述金属箔;
加热加压工序,在所述环形带之间将所述绝缘膜用两片所述金属箔夹持,在该状态下对其进行加热加压而制成层叠体;以及
冷却工序,对所述层叠体进行冷却,
其中,所述绝缘膜的厚度为10~500μm,面取向度为30%以上,MD方向的平均线膨胀系数为-40~0ppm/K,TD方向的平均线膨胀系数为0~120ppm/K,
在将所述热塑性液晶聚合物的熔点设为Tm时,所述加热加压工序的加热温度T满足(Tm+20)<T≤(Tm+70),其中,所述熔点和所述加热温度的单位均为℃,
所述加热加压工序的压力为0.5~10MPa,
所述加热加压工序的加热加压时间为30~360秒。
2.根据权利要求1所述的两面覆金属层叠体的制造方法,其特征在于,
所得到的两面覆金属层叠体中所述热塑性液晶聚合物层的面取向度小于30%,MD方向的平均线膨胀系数为0~40ppm/K,TD方向的平均线膨胀系数为0~40ppm/K。
3.根据权利要求1或2所述的两面覆金属层叠体的制造方法,其特征在于,
所述金属箔为铜箔。
4.一种两面覆金属层叠体,其特征在于,具有如下的构成,即将由热塑性液晶聚合物构成的绝缘膜用两片金属箔夹持而成,
并由权利要求1所述的两面覆金属层叠体的制造方法制造,
所述两面覆金属层叠体中所述热塑性液晶聚合物层的面取向度小于30%,MD方向的平均线膨胀系数为0~40ppm/K,TD方向的平均线膨胀系数为0~40ppm/K。
5.根据权利要求4所述的两面覆金属层叠体,其特征在于,
所述金属箔为铜箔。
6.一种电子电路基板,其特征在于,
使用有权利要求4或5所述的两面覆金属层叠体。
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JPWO2020153391A1 (ja) | 2021-12-02 |
TW202035167A (zh) | 2020-10-01 |
CN113329871A (zh) | 2021-08-31 |
EP3915779A4 (en) | 2022-10-19 |
EP3915779A1 (en) | 2021-12-01 |
WO2020153391A1 (ja) | 2020-07-30 |
JP2024071437A (ja) | 2024-05-24 |
US20220105707A1 (en) | 2022-04-07 |
KR20210119392A (ko) | 2021-10-05 |
JP7458329B2 (ja) | 2024-03-29 |
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