JP7458329B2 - 両面金属張積層体とその製造方法、絶縁フィルムおよび電子回路基板 - Google Patents
両面金属張積層体とその製造方法、絶縁フィルムおよび電子回路基板 Download PDFInfo
- Publication number
- JP7458329B2 JP7458329B2 JP2020568181A JP2020568181A JP7458329B2 JP 7458329 B2 JP7458329 B2 JP 7458329B2 JP 2020568181 A JP2020568181 A JP 2020568181A JP 2020568181 A JP2020568181 A JP 2020568181A JP 7458329 B2 JP7458329 B2 JP 7458329B2
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- Prior art keywords
- insulating film
- double
- liquid crystal
- clad laminate
- heating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
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- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H05K2201/01—Dielectrics
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Description
熱可塑性液晶ポリマーとは、溶融時に液晶状態あるいは光学的に複屈折する性質を有する熱可塑性ポリマーを指す。熱可塑性液晶ポリマーとしては、溶液状態で液晶性を示すリオトロピック液晶ポリマーや溶融時に液晶性を示すサーモトロピック液晶ポリマーがある。熱可塑性液晶ポリマーは、熱変形温度によって、I型、II型、III型と分類され、いずれの型であっても構わない。
絶縁フィルムは、熱可塑性液晶ポリマーを成形して製造されたフィルムである。熱可塑性液晶ポリマーから絶縁フィルムを製造する成形方法は特に限定されず、インフレーション法やTダイ法等の押出成形法、キャスト法、カレンダー法等の公知の成形方法を挙げることができる。これらの中では、Tダイ法が最も汎用的である。しかしながら、Tダイ法でフィルム成形した場合には、Tダイを通過するときにMD方向にシェアがかかり、熱可塑性液晶ポリマー分子が配向して、MD方向に異方性が発現し易い。ここで、MD方向とはフィルム面内における成形流れ方向(Machine Direction)であり、TD方向とはフィルム面内においてMD方向と垂直の方向である。
面配向度(%)={A/(A+B)}×100
図1は、本実施形態の両面金属張積層体の製造装置20の模式的断面図である。両面金属張積層体の製造装置20は、液圧式ダブルベルトプレス方式の製造装置であり、絶縁フィルムを2枚の金属箔で挟んだ状態で、連続的に加熱加圧して積層体とすることができ、両面金属張積層体の生産性に優れている。
本実施形態の両面金属張積層体の製造方法は、(1)一対のエンドレスベルト間に絶縁フィルムと2枚の金属箔とを連続的に供給する供給工程、(2)エンドレスベルト間で絶縁フィルムを2枚の金属箔で挟んだ状態で加熱加圧して積層体とする加熱加圧工程、(3)積層体を冷却する冷却工程、および(4)積層体を巻き取る巻き取り工程を有している。図1には、これらの4つの工程が示されている。両面金属張積層体の製造方法の各工程は、バッチ方式でも実施することができるが、生産性の点から連続方式で実施する方が好ましい。以下、各工程について説明する。
供給工程は、製造装置20の2台のコンベヤ装置14が有する一対のエンドレスベルト3間に、絶縁フィルムと2枚の金属箔とを連続的に供給する工程である。絶縁フィルムは、ロール11から供給され、絶縁フィルムの両面に積層される2枚の金属箔は、ロール12から供給される。
加熱加圧工程は、エンドレスベルト3間で、絶縁フィルムを2枚の金属箔で挟んだ状態で加熱加圧して積層体とする工程である。
冷却工程は、加熱加圧工程で得られた積層体を熱可塑性液晶ポリマーの固化温度以下の温度に冷却する工程である。加熱加圧工程において加熱加圧して異方性が低減された絶縁フィルムを冷却固化して、異方性が緩和低減された熱可塑性液晶ポリマー層とする。冷却工程では、成形ひずみが残らないように、均等に冷却することが好ましい。
製造装置20において、加熱加圧工程および冷却工程を経て一体化された積層体は、両面金属張積層体として、巻き取りロール13に巻き取られる。また、巻き取り工程を行わずに、所定の長さの長方形の両面金属張積層体として切り取って、積み重ねていってもよい。製造装置20のライン速度は、加熱加圧工程における加熱加圧時間として30~360秒が確保できる速度に調整される。
本実施形態の両面金属張積層体は、前記の両面金属張積層体の製造装置20を用いて、両面金属張積層体の製造方法に従って製造される。本実施形態の両面金属張積層体の製造方法によれば、用いた絶縁フィルムの異方性が大きく改善されるため、両面金属張積層体の熱可塑性液晶ポリマー層は、面配向度が小さく、加熱時の寸法変化の異方性も小さいものとなる。すなわち、得られた両面金属張積層体は、金属箔を除去した後の熱可塑性液晶ポリマー層が、面配向度が30%未満であり、MD方向の平均線膨張率が0~40ppm/Kであり、TD方向の平均線膨張率が0~40ppm/Kである。尚、熱可塑性液晶ポリマー層の面配向度は、20%以下が好ましい。
(1)絶縁フィルム
絶縁フィルム1:上野製薬社製LCP樹脂(品番A-5000、融点280℃、結晶化温度230℃)を単軸押出機とTダイで製膜した厚み12μm、100μm、480μmおよび600μmのフィルム
絶縁フィルム2:ポリプラスチック社製LCP樹脂(品番C950RX、融点320℃、結晶化温度275℃)を単軸押出機とTダイで製膜した厚み100μmのフィルム
絶縁フィルム3:上野製薬社製LCP樹脂(品番P-9000、融点340℃、結晶化温度305℃)を単軸押出機とTダイで製膜した厚み100μmのフィルム
(2)金属箔
銅箔:三井金属鉱業社製、品番TQ-M7-VSP、厚み12μm
図1に示す製造装置20を用いて、表1に記載した各種市販の絶縁フィルムの両面を2枚の金属箔と接触させた状態で、表1に記載した種々の条件で加熱加圧工程を行って積層体とし、その後冷却して、両面金属張積層体を作製した。
全自動多目的X線回折装置(株式会社リガク製、SmartLab(3kW)、2D-WAXS構成)を用いて、X線回折を行った。測定条件を以下に示す。
X線源:Cu封入管
印加電圧:40kV
電流:40mA
X線出力:1.6kW
検出器:多次元ピクセル検出器 HyPix-3000
X線照射方向:フィルム面に対して垂直
積算時間:10分
解析2θ角度範囲:10°~30°
2次元回折画像の円周方向において強度をプロットする際のサンプリング幅:5°
熱可塑性液晶ポリマー層を測定したときの強度から、同層を装置にセットせずに測定した場合の強度をブランクとして差し引いて、熱可塑性液晶ポリマー層の強度とした。
得られた2次元回折画像(図2(a))において、円周方向の回転角度βに対して強度をプロットすることにより、図2(b)の強度曲線を得た。図2(b)において、円周360°分の測定強度のベース部分の積分値(ベース面積)をBとし、測定されたピーク部分からベース部分を差し引いた部分の積分値(ピーク面積)をAとした。このとき、面配向度を下記式で算出した。
面配向度(%)={A/(A+B)}×100
面配向度が、30%未満のとき、合格と判定した。
JIS K 7197に準拠して、TMA法によって、MD方向、TD方向における23~200℃の温度範囲での平均線膨張率(ppm/K)を求めた。膨張したときは、+(プラス)の数値であり、収縮したときは、-(マイナス)の数値である。
JIS C 6481に準拠して、両面金属張積層体の銅箔を、巾10mmで速度50mm/分で、180°剥離したときの剥離力(N/mm)を測定した。
銅箔剥離強度は、0.5N/mm以上のとき良好と判定した。
3 エンドレスベルト
4 加圧ブロック
5 加熱ヒーターブロック
6 冷却ブロック
7 ガイドロール
11、12、13 ロール
14 コンベヤ装置
20 製造装置
Claims (3)
- 熱可塑性液晶ポリマーからなる絶縁フィルムを2枚の金属箔で挟んだ構成を有する両面金属張積層体の製造方法であって、
一対のエンドレスベルト間に前記絶縁フィルムと2枚の前記金属箔とを連続的に供給する供給工程、
前記エンドレスベルト間で前記絶縁フィルムを2枚の前記金属箔で挟んだ状態で加熱加圧して積層体とする加熱加圧工程、および
前記積層体を冷却する冷却工程を有し、
前記絶縁フィルムは、厚みが10~500μm、面配向度が30%以上、MD方向の平均線膨張率が-40~0ppm/K、TD方向の平均線膨張率が0~120ppm/Kであり、
前記熱可塑性液晶ポリマーの融点をTm(℃)としたとき、前記加熱加圧工程における加熱温度T(℃)が、(Tm+20)<T≦(Tm+70)を満足し、
前記加熱加圧工程における圧力が、0.5~10MPaであり、
前記加熱加圧工程における加熱加圧時間が、30~360秒であり、
得られた両面金属張積層体の前記金属箔を除去した後の熱可塑性液晶ポリマー層は、面配向度が30%未満である
ことを特徴とする両面金属張積層体の製造方法。 - 得られた両面金属張積層体の前記金属箔を除去した後の熱可塑性液晶ポリマー層は、MD方向の平均線膨張率が0~40ppm/K、TD方向の平均線膨張率が0~40ppm/Kであることを特徴とする請求項1に記載の両面金属張積層体の製造方法。
- 前記金属箔が銅箔である請求項1または請求項2に記載の両面金属張積層体の製造方法。
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