CN113196460A - 保持工作台 - Google Patents

保持工作台 Download PDF

Info

Publication number: CN113196460A
Authority: CN; China
Prior art keywords: holding; support portion; circumferential support; inner circumferential; holding table
Prior art date: 2018-12-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201980082928.XA

Other languages

English (en)

Chinese (zh)

Inventor

竹岛诚

久保祐辉

山口隆平

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toray Engineering Co Ltd

Original Assignee

Toray Engineering Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-12-25

Filing date

2019-12-11

Publication date

2021-07-30

2019-12-11 Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd

2021-07-30 Publication of CN113196460A publication Critical patent/CN113196460A/zh

Status Pending legal-status Critical Current

Links

230000002093 peripheral effect Effects 0.000 claims abstract description 23
230000001070 adhesive effect Effects 0.000 claims abstract description 8
239000000853 adhesive Substances 0.000 abstract description 6
230000037303 wrinkles Effects 0.000 abstract description 6
238000001179 sorption measurement Methods 0.000 abstract description 2
230000007480 spreading Effects 0.000 description 13
239000004065 semiconductor Substances 0.000 description 7
239000012790 adhesive layer Substances 0.000 description 3
230000005484 gravity Effects 0.000 description 3
230000007246 mechanism Effects 0.000 description 3
230000004048 modification Effects 0.000 description 3
238000012986 modification Methods 0.000 description 3
238000000926 separation method Methods 0.000 description 3
238000005520 cutting process Methods 0.000 description 2
238000000034 method Methods 0.000 description 2
239000005020 polyethylene terephthalate Substances 0.000 description 2
229920000139 polyethylene terephthalate Polymers 0.000 description 2
229920000098 polyolefin Polymers 0.000 description 2
230000008569 process Effects 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
238000009825 accumulation Methods 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
230000008602 contraction Effects 0.000 description 1
230000007423 decrease Effects 0.000 description 1
230000000694 effects Effects 0.000 description 1
230000005489 elastic deformation Effects 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000007731 hot pressing Methods 0.000 description 1
238000007689 inspection Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000000465 moulding Methods 0.000 description 1
-1 polyethylene terephthalate Polymers 0.000 description 1
239000004800 polyvinyl chloride Substances 0.000 description 1
230000009467 reduction Effects 0.000 description 1
238000007665 sagging Methods 0.000 description 1
238000005488 sandblasting Methods 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Dicing (AREA)

CN201980082928.XA 2018-12-25 2019-12-11 保持工作台 Pending CN113196460A (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2018240772A JP2020102569A (ja)	2018-12-25	2018-12-25	保持テーブル
JP2018-240772		2018-12-25
PCT/JP2019/048444 WO2020137543A1 (ja)	2018-12-25	2019-12-11	保持テーブル

Publications (1)

Publication Number	Publication Date
CN113196460A true CN113196460A (zh)	2021-07-30

Family

ID=71128223

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201980082928.XA Pending CN113196460A (zh)	2018-12-25	2019-12-11	保持工作台

Country Status (4)

Country	Link
JP (1)	JP2020102569A (ja)
CN (1)	CN113196460A (ja)
TW (1)	TW202042338A (ja)
WO (1)	WO2020137543A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW202414547A (zh) *	2022-07-13	2024-04-01	日商三星鑽石工業股份有限公司	刻劃台及刻劃裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005057158A (ja) *	2003-08-07	2005-03-03	Tokyo Seimitsu Co Ltd	エキスパンド方法及びエキスパンド装置
JP2010108996A (ja) *	2008-10-28	2010-05-13	Lintec Corp	エキスパンド装置及びエキスパンド方法
JP2014103196A (ja) *	2012-11-19	2014-06-05	Disco Abrasive Syst Ltd	チップ間隔維持装置
JP2016021501A (ja) *	2014-07-15	2016-02-04	株式会社ディスコ	ウェーハの加工方法
CN107808847A (zh) *	2016-09-09	2018-03-16	株式会社迪思科	芯片间隔维持方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4090416B2 (ja) *	2003-09-30	2008-05-28	日東電工株式会社	粘着テープ付ワークの離脱方法及び離脱装置
JP2007067278A (ja) *	2005-09-01	2007-03-15	Tokyo Seimitsu Co Ltd	エキスパンド方法及びエキスパンド装置
JP5563423B2 (ja) *	2010-10-19	2014-07-30	リンテック株式会社	シート貼付装置および貼付方法
JP5992803B2 (ja) *	2012-11-07	2016-09-14	リンテック株式会社	シート貼付装置及び貼付方法
JP6842352B2 (ja) *	2017-04-25	2021-03-17	株式会社ディスコ	バーコードシールの保護方法

2018
- 2018-12-25 JP JP2018240772A patent/JP2020102569A/ja active Pending
2019
- 2019-12-11 CN CN201980082928.XA patent/CN113196460A/zh active Pending
- 2019-12-11 WO PCT/JP2019/048444 patent/WO2020137543A1/ja active Application Filing
- 2019-12-20 TW TW108146907A patent/TW202042338A/zh unknown

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005057158A (ja) *	2003-08-07	2005-03-03	Tokyo Seimitsu Co Ltd	エキスパンド方法及びエキスパンド装置
JP2010108996A (ja) *	2008-10-28	2010-05-13	Lintec Corp	エキスパンド装置及びエキスパンド方法
JP2014103196A (ja) *	2012-11-19	2014-06-05	Disco Abrasive Syst Ltd	チップ間隔維持装置
JP2016021501A (ja) *	2014-07-15	2016-02-04	株式会社ディスコ	ウェーハの加工方法
CN107808847A (zh) *	2016-09-09	2018-03-16	株式会社迪思科	芯片间隔维持方法

Also Published As

Publication number	Publication date
JP2020102569A (ja)	2020-07-02
TW202042338A (zh)	2020-11-16
WO2020137543A1 (ja)	2020-07-02

Legal Events

Date	Code	Title	Description
2021-07-30	PB01	Publication
2021-07-30	PB01	Publication
2021-09-17	SE01	Entry into force of request for substantive examination
2021-09-17	SE01	Entry into force of request for substantive examination
2024-05-17	WD01	Invention patent application deemed withdrawn after publication	Application publication date: 20210730
2024-05-17	WD01	Invention patent application deemed withdrawn after publication

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