CN113196460A - 保持工作台 - Google Patents
保持工作台 Download PDFInfo
- Publication number
- CN113196460A CN113196460A CN201980082928.XA CN201980082928A CN113196460A CN 113196460 A CN113196460 A CN 113196460A CN 201980082928 A CN201980082928 A CN 201980082928A CN 113196460 A CN113196460 A CN 113196460A
- Authority
- CN
- China
- Prior art keywords
- holding
- support portion
- circumferential support
- inner circumferential
- holding table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000037303 wrinkles Effects 0.000 abstract description 6
- 238000001179 sorption measurement Methods 0.000 abstract description 2
- 230000007480 spreading Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018240772A JP2020102569A (ja) | 2018-12-25 | 2018-12-25 | 保持テーブル |
JP2018-240772 | 2018-12-25 | ||
PCT/JP2019/048444 WO2020137543A1 (ja) | 2018-12-25 | 2019-12-11 | 保持テーブル |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113196460A true CN113196460A (zh) | 2021-07-30 |
Family
ID=71128223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980082928.XA Pending CN113196460A (zh) | 2018-12-25 | 2019-12-11 | 保持工作台 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2020102569A (ja) |
CN (1) | CN113196460A (ja) |
TW (1) | TW202042338A (ja) |
WO (1) | WO2020137543A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202414547A (zh) * | 2022-07-13 | 2024-04-01 | 日商三星鑽石工業股份有限公司 | 刻劃台及刻劃裝置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005057158A (ja) * | 2003-08-07 | 2005-03-03 | Tokyo Seimitsu Co Ltd | エキスパンド方法及びエキスパンド装置 |
JP2010108996A (ja) * | 2008-10-28 | 2010-05-13 | Lintec Corp | エキスパンド装置及びエキスパンド方法 |
JP2014103196A (ja) * | 2012-11-19 | 2014-06-05 | Disco Abrasive Syst Ltd | チップ間隔維持装置 |
JP2016021501A (ja) * | 2014-07-15 | 2016-02-04 | 株式会社ディスコ | ウェーハの加工方法 |
CN107808847A (zh) * | 2016-09-09 | 2018-03-16 | 株式会社迪思科 | 芯片间隔维持方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4090416B2 (ja) * | 2003-09-30 | 2008-05-28 | 日東電工株式会社 | 粘着テープ付ワークの離脱方法及び離脱装置 |
JP2007067278A (ja) * | 2005-09-01 | 2007-03-15 | Tokyo Seimitsu Co Ltd | エキスパンド方法及びエキスパンド装置 |
JP5563423B2 (ja) * | 2010-10-19 | 2014-07-30 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP5992803B2 (ja) * | 2012-11-07 | 2016-09-14 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP6842352B2 (ja) * | 2017-04-25 | 2021-03-17 | 株式会社ディスコ | バーコードシールの保護方法 |
-
2018
- 2018-12-25 JP JP2018240772A patent/JP2020102569A/ja active Pending
-
2019
- 2019-12-11 CN CN201980082928.XA patent/CN113196460A/zh active Pending
- 2019-12-11 WO PCT/JP2019/048444 patent/WO2020137543A1/ja active Application Filing
- 2019-12-20 TW TW108146907A patent/TW202042338A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005057158A (ja) * | 2003-08-07 | 2005-03-03 | Tokyo Seimitsu Co Ltd | エキスパンド方法及びエキスパンド装置 |
JP2010108996A (ja) * | 2008-10-28 | 2010-05-13 | Lintec Corp | エキスパンド装置及びエキスパンド方法 |
JP2014103196A (ja) * | 2012-11-19 | 2014-06-05 | Disco Abrasive Syst Ltd | チップ間隔維持装置 |
JP2016021501A (ja) * | 2014-07-15 | 2016-02-04 | 株式会社ディスコ | ウェーハの加工方法 |
CN107808847A (zh) * | 2016-09-09 | 2018-03-16 | 株式会社迪思科 | 芯片间隔维持方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2020102569A (ja) | 2020-07-02 |
TW202042338A (zh) | 2020-11-16 |
WO2020137543A1 (ja) | 2020-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210730 |
|
WD01 | Invention patent application deemed withdrawn after publication |