CN112752392A - 印刷配线基板的接合部构造 - Google Patents
印刷配线基板的接合部构造 Download PDFInfo
- Publication number
- CN112752392A CN112752392A CN202011138850.XA CN202011138850A CN112752392A CN 112752392 A CN112752392 A CN 112752392A CN 202011138850 A CN202011138850 A CN 202011138850A CN 112752392 A CN112752392 A CN 112752392A
- Authority
- CN
- China
- Prior art keywords
- substrate
- printed wiring
- wiring board
- joint structure
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-196932 | 2019-10-30 | ||
JP2019196932A JP7325299B2 (ja) | 2019-10-30 | 2019-10-30 | プリント配線基板の接合部構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112752392A true CN112752392A (zh) | 2021-05-04 |
Family
ID=75648330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011138850.XA Pending CN112752392A (zh) | 2019-10-30 | 2020-10-22 | 印刷配线基板的接合部构造 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7325299B2 (ja) |
CN (1) | CN112752392A (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590748A (ja) * | 1991-09-27 | 1993-04-09 | Canon Inc | 基板の接続方法 |
CN1578588A (zh) * | 2003-07-08 | 2005-02-09 | 阿尔卑斯电气株式会社 | 挠性布线板及其制造方法 |
CN1747627A (zh) * | 2002-04-22 | 2006-03-15 | 日本电气株式会社 | 布线板、电子器件和电子元件的安装方法 |
JP2007258618A (ja) * | 2006-03-24 | 2007-10-04 | Fujikura Ltd | 接続部補強構造、プリント配線板及び接続部補強構造形成方法 |
JP2008091797A (ja) * | 2006-10-04 | 2008-04-17 | Olympus Corp | フレキシブル基板の接合装置 |
-
2019
- 2019-10-30 JP JP2019196932A patent/JP7325299B2/ja active Active
-
2020
- 2020-10-22 CN CN202011138850.XA patent/CN112752392A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590748A (ja) * | 1991-09-27 | 1993-04-09 | Canon Inc | 基板の接続方法 |
CN1747627A (zh) * | 2002-04-22 | 2006-03-15 | 日本电气株式会社 | 布线板、电子器件和电子元件的安装方法 |
CN1578588A (zh) * | 2003-07-08 | 2005-02-09 | 阿尔卑斯电气株式会社 | 挠性布线板及其制造方法 |
JP2007258618A (ja) * | 2006-03-24 | 2007-10-04 | Fujikura Ltd | 接続部補強構造、プリント配線板及び接続部補強構造形成方法 |
JP2008091797A (ja) * | 2006-10-04 | 2008-04-17 | Olympus Corp | フレキシブル基板の接合装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7325299B2 (ja) | 2023-08-14 |
JP2021072327A (ja) | 2021-05-06 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |