CN112533395B - Method for embedding resistor in printed circuit board and printed circuit board thereof - Google Patents
Method for embedding resistor in printed circuit board and printed circuit board thereof Download PDFInfo
- Publication number
- CN112533395B CN112533395B CN202011517359.8A CN202011517359A CN112533395B CN 112533395 B CN112533395 B CN 112533395B CN 202011517359 A CN202011517359 A CN 202011517359A CN 112533395 B CN112533395 B CN 112533395B
- Authority
- CN
- China
- Prior art keywords
- groove
- connecting cylinder
- circuit board
- needle
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
Abstract
The invention discloses a method for embedding resistors in a printed circuit board and the printed circuit board, which comprises a connecting cylinder, a fixed plate is arranged at the inner side of the connecting cylinder, a plurality of air holes are arranged on the fixed plate, a moving block is arranged below the fixed plate, the moving block and the inner wall of the connecting cylinder are in a matching structure, a bottom detecting spring is arranged between the moving block and the fixed plate, a bottom detecting needle is arranged at the lower side of the moving block, the lower end of the bottom detecting needle penetrates through the bottom of the connecting cylinder and extends to the outer side, the bottom detecting needle is of a hollow structure, the bottom detecting needle is provided with a plurality of vent grooves, and an air blowing device and a liquid suction device are arranged outside the bottom detecting device, the protection of the protective layer, the blowing device and the liquid absorbing device prevents excessive erosion, and has the characteristics of no damage to the circuit board and small resistance deviation.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for embedding resistors in a printed circuit board and the printed circuit board.
Background
With the rapid increase of digital products for transmitting and receiving signals at high speed of electronic products, high-density packaging technology has increasingly shown its importance. The embedded components can shorten the distance of signal transmission, improve the electrical characteristics, improve and increase the effective area of packaging, reduce welding parts and improve the reliability of packaging. Meanwhile, the small-sized and easy-to-package structure is very beneficial to reducing the cost and particularly improving the electrical characteristics. The embedded plane type sheet resistor is generally used for manufacturing a special printed circuit information printed board of a multilayer board, a resistor or a capacitor is directly manufactured on an inner layer board by adopting an etching printing mode, and the inner layer board is synthesized to be made into the multilayer board, so that the resistor on a board surface is replaced, the board surface area is saved, and active elements or high-power elements are arranged, and the function of the whole system is enhanced.
When the existing circuit board is used for digging a resistor groove, chemical erosion or abrasive drilling grooving is adopted on the same city, but when the circuit board is used for abrasive drilling grooving, although a large abrasive drilling grooving is fast, the circuit board is easy to damage, and meanwhile, the chemical erosion is safest, but the thickness and the width of the grooving are difficult to control, so that the resistor deviation is easy to cause. Therefore, it is necessary to design a method of embedding resistors in a printed circuit board having small variations in resistance without damaging the printed circuit board, and a printed circuit board thereof.
Disclosure of Invention
The present invention is directed to a method for embedding resistors in a printed circuit board and a printed circuit board thereof, so as to solve the problems of the related art.
In order to solve the technical problems, the invention provides the following technical scheme: a method for embedding resistors in a printed circuit board comprises a bottom probing device, wherein the bottom probing device comprises a connecting cylinder, a fixed plate is arranged on the inner side of the connecting cylinder, a plurality of vent holes are formed in the fixed plate, a moving block is arranged below the fixed plate, the inner wall of the moving block and the inner wall of the connecting cylinder are of a matched structure, a bottom probing spring is arranged between the moving block and the fixed plate, a bottom probing needle is arranged on the lower side of the moving block, the lower end of the bottom probing needle penetrates through the bottom of the connecting cylinder and extends to the outer side, the bottom probing needle is of a hollow structure and is provided with a plurality of vent grooves, the bottom probing device is used for probing the erosion depth of erosion liquid, when the printed circuit board is eroded, the bottom probing spring can push the moving block to drive the bottom end of the bottom probing needle to abut against the bottom layer of the resistor groove to continuously descend, and when the moving block moves to the bottom end, the moving block is corroded to the required depth, the vent groove is used for sucking and blowing air at the bottom of the bottom detecting needle.
According to the technical scheme, the blowing device is installed outside the bottom detection device, the blowing clamping groove is formed in the upper side of the moving block of the blowing device, the blowing clamping block is arranged on the lower side of the fixing plate of the blowing device, the blowing clamping groove and the blowing clamping block are of a matched structure, the upper end of the bottom detection needle of the blowing device extends to the bottom of the blowing clamping groove, a circular vent pipe is arranged on one side of the connecting cylinder of the blowing device and is used for conducting the interior of the blowing device to blow air, the blowing clamping groove is blocked by the blowing clamping block at first and cannot blow air, when the position is eroded to a required depth, the blowing clamping block is just moved out of the blowing clamping groove to conduct the bottom of the bottom detection needle, the erosion liquid is blown away from the position through the vent groove, the erosion liquid is prevented from being eroded too deeply, the erosion liquid is gradually blown out of the resistance groove along with the continuous erosion of the resistance groove, and the thickness of the resistance groove is ensured, the resistance deviation of the resistance is reduced, and the production quality is improved.
According to the technical scheme, still install the suction means outward at the end device of spying, the end needle upper end of spying of suction means extends to the movable block upside, connecting cylinder one side of suction means is provided with the rectangle breather pipe, and the rectangle breather pipe is used for switching on inside the suction means, lets the end needle of spying constantly breathe in around the resistance groove, and the erosion liquid that is blown out can be inhaled the connecting cylinder by the suction means, has reached the effect of retrieving the erosion liquid and protecting other parts of printed circuit board.
According to the technical scheme, the equipment for embedding the resistors into the printed circuit board further comprises an erosion table, the erosion table comprises a fixed table, a lifting table is installed on the upper side of the fixed table, an air pump is installed on the upper side of the lifting table, a clamping plate is installed in the lifting table, a plurality of lifting blocks which are uniformly distributed are arranged in the clamping plate, a telescopic rod is installed between the upper side of each lifting block and the lifting table, and the lifting table drives an air blowing device and a liquid suction device to descend together to prop against a resistor groove of the printed circuit board during erosion so as to guarantee erosion thickness of the resistor groove.
According to the technical scheme, a connecting cylinder clamping groove is formed below the lifting block, the connecting cylinder clamping groove and the connecting cylinder are of a matched structure, a circular vent hole and a rectangular vent hole are formed in two sides of the connecting cylinder clamping groove respectively, the upper ends of the circular vent hole and the rectangular vent hole are connected with an air outlet and an air suction port of the air pump through air pipes respectively, vent baffles are mounted at the lower ends of the circular vent hole and the rectangular vent hole respectively, a user can mount an air blowing device and a liquid suction device at required positions according to needs, the vent baffles are pushed open by the circular vent pipe and the rectangular vent pipe during mounting, the air blowing device and the liquid suction device are automatically communicated with the air pump, and the heights of the lifting block are adjusted through a system, so that the electric resistance tank can be used for resistance tanks with different shapes, and a plurality of resistance tanks with different depths can be corroded simultaneously.
According to the technical scheme, the equipment for embedding the resistors in the printed circuit board further comprises a glue taking device, the glue taking device comprises an outer cylinder, a pressing rod is installed in the outer cylinder, pressing plates are respectively arranged at the upper ends of the outer cylinder and the pressing rod, a pricking pin is installed at the lower end of the outer cylinder, a pressing block groove is formed in the upper end of the pricking pin, elastic sheet grooves are formed in two sides inside the pricking pin and conduct the upper end and the lower end of the pricking pin, the elastic sheet grooves are outwards bent at the lower end of the pricking pin, a pressing block is installed at the lower end of the pressing rod, the pressing block and the pressing block groove are of a matched structure, an elastic sheet is installed at the lower end of the pressing block and is of a matched structure, a needle head is arranged at the tail end of the elastic sheet, an elastic cushion is installed around the pressing block, when the protective glue is taken out, the pricking pin is firstly inserted into the protective glue, then the pressing rod drives the elastic sheet to move downwards through the pressing block, the elastic sheet penetrates into the protective glue, the protection glue can be conveniently pulled out of the resistance groove by bending the lower end of the elastic sheet groove and self elasticity, the pressure rod is loosened after the protection glue is pulled out, the elastic cushion pushes the pressure rod through the elasticity to drive the elastic sheet to reset, the protection glue can be conveniently taken down, and the effect of cleaning the protection glue is achieved.
According to the technical scheme, the method for embedding the resistor in the printed circuit board comprises the following steps:
s1, drawing a resistance slot outline on a printed circuit board;
s2, drilling a perfusion groove along the contour of the resistance groove by using a small-sized grinding drill bit;
s3, pouring protective glue into the pouring groove;
s4, pouring erosion liquid into the contour of the resistance groove after the protective glue is solidified;
s5, starting an erosion table to wait for erosion to finish;
s6, taking out the protective glue by using a glue taking device;
s7, pouring resistance ink into the resistance groove and drying;
s8, sealing and polishing.
According to the above technical scheme, in the step S6, after the protective glue is taken out, the pricking pin is used for scraping the residual protective glue on the inner wall of the resistor groove, so that the protective glue is sufficiently cleaned.
Compared with the prior art, the invention has the following beneficial effects: in the invention, the raw materials are mixed,
(1) by arranging the air blowing device, when a certain position of the resistance groove is corroded to a required depth, the bottom detecting needle of the air blowing device blows air into the resistance groove through the vent groove to blow erosion liquid away from the position, so that the erosion at the position is prevented from being too deep, the erosion liquid is gradually blown out of the resistance groove along with the continuous completion of the erosion at each position of the resistance groove, the thickness of the resistance groove is ensured, the resistance value deviation of the resistance is reduced, and the production quality is improved;
(2) by arranging the liquid suction device, the bottom detection needle continuously sucks air around the resistor groove, and the blown erosion liquid is sucked into the connecting cylinder by the liquid suction device, so that the effects of recovering the erosion liquid and protecting other parts of the printed circuit board are achieved;
(3) through being provided with and getting mucilage binding and putting, can conveniently pull out the resistance groove with the protection glue, guarantee that the resistance inslot clearance is abundant.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the blowing and aspirating apparatus of the present invention;
FIG. 3 is a schematic view of the lift block structure of the present invention;
FIG. 4 is a schematic structural view of the glue dispensing device of the present invention;
FIG. 5 is a schematic view of the lancet structure of the present invention;
in the figure: 1. a bottom probing device; 11. a connecting cylinder; 12. a fixing plate; 13. a vent hole; 14. a moving block; 15. a bottom detecting spring; 16. a bottom detecting needle; 17. a vent channel; 2. a blowing device; 21. a blowing clamping groove; 22. a blowing clamping block; 23. a circular vent pipe; 3. a liquid suction device; 31. a rectangular vent pipe; 4. an erosion station; 41. a fixed table; 42. a lifting platform; 43. an air pump; 44. clamping a plate; 45. a lifting block; 46. a telescopic rod; 47. a card slot; 48. a circular vent; 49. a rectangular vent hole; 4a, a vent baffle; 5. a glue taking device; 51. an outer cylinder; 52. a pressure lever; 53. pressing a plate; 54. a needle; 55. a block pressing groove; 56. a spring sheet groove; 57. briquetting; 58. a spring plate; 59. a needle head; 5a, an elastic pad; 6. a protective layer; 7. an erosion layer; 8. the required layers.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: referring to fig. 2, a method for embedding resistors in a printed circuit board, the device used in the method comprises a bottom detecting device 1, the bottom detecting device 1 comprises a connecting cylinder 11, a fixing plate 12 is arranged on the inner side of the connecting cylinder 11, a plurality of vent holes 13 are arranged on the fixing plate 12, a moving block 14 is arranged below the fixing plate 12, the moving block 14 and the inner wall of the connecting cylinder 11 are in a matching structure, a bottom detecting spring 15 is arranged between the moving block 14 and the fixing plate 12, a bottom detecting needle 16 is arranged on the lower side of the moving block 14, the lower end of the bottom detecting needle 16 penetrates through the bottom of the connecting cylinder 11 and extends to the outer side, the bottom detecting needle 16 is of a hollow structure, the bottom detecting needle 16 is provided with a plurality of vent grooves 17, the bottom detecting device 1 is used for detecting the erosion depth of erosion liquid, when the printed circuit board is eroded, the bottom detecting spring 15 can push the moving block 14 to drive the bottom end of the bottom detecting needle 16 to push against the bottom layer of the resistor groove to descend continuously, when the moving block 14 moves to the bottom end, indicating that it has eroded to the desired depth, a vent slot 17 is used to draw and blow air at the bottom of the stylus 16;
as shown in fig. 2, an air blowing device 2 is installed outside a bottom detecting device 1, an air blowing clamping groove 21 is arranged on the upper side of a moving block 14 of the air blowing device 2, an air blowing clamping block 22 is arranged on the lower side of a fixing plate 12 of the air blowing device 2, the air blowing clamping groove 21 and the air blowing clamping block 22 are of a matched structure, the upper end of a bottom detecting needle 16 of the air blowing device 2 extends to the bottom of the air blowing clamping groove 21, a circular vent pipe 23 is arranged on one side of a connecting cylinder 11 of the air blowing device 2, the circular vent pipe 23 is used for conducting the inside of the air blowing device 2 to blow air, the air blowing clamping groove 21 is blocked by the air blowing clamping block 22 at first and cannot blow air, when the position is eroded to a required depth, the air blowing clamping block 22 is just moved out of the air blowing clamping groove 21, the bottom of the bottom detecting needle 16 is conducted, air is blown into a resistor groove through the vent groove 17, erosion liquid is blown away from the position to prevent the position from being eroded too deeply, and as erosion of the resistor groove is continuously completed, the erosion liquid is gradually blown out of the resistor groove, the thickness of the resistance groove is ensured, the resistance value deviation of the resistance is reduced, and the production quality is improved;
as shown in fig. 2, a liquid suction device 3 is further installed outside the bottom detection device 1, the upper end of a bottom detection needle 16 of the liquid suction device 3 extends to the upper side of the moving block 14, a rectangular vent pipe 31 is arranged on one side of a connecting cylinder 11 of the liquid suction device 3, the rectangular vent pipe 31 is used for conducting the interior of the liquid suction device 3, so that the bottom detection needle 16 continuously sucks air around the resistance groove, the blown erosion liquid can be sucked into the connecting cylinder 11 by the liquid suction device 3, and the effects of recovering the erosion liquid and protecting other parts of the printed circuit board are achieved;
as shown in fig. 1 and fig. 3, the apparatus for embedding resistors in a printed circuit board further includes an erosion table 4, the erosion table 4 includes a fixed table 41, an elevating table 42 is installed on the upper side of the fixed table 41, an air pump 43 is installed on the upper side of the elevating table 42, a clamping plate 44 is installed in the elevating table 42, the clamping plate 44 is provided with a plurality of elevating blocks 45 which are uniformly distributed, telescopic rods 46 are installed between the upper side of the elevating blocks 45 and the elevating table 42, during erosion, the elevating table 42 drives the air blowing device 2 and the liquid suction device 3 to descend together to prop against the resistor groove of the printed circuit board, so as to ensure the erosion thickness of the resistor groove;
as shown in fig. 3, a connecting cylinder clamping groove 47 is arranged below the lifting block 45, the connecting cylinder clamping groove 47 and the connecting cylinder 11 are in a matching structure, a circular vent hole 48 and a rectangular vent hole 49 are respectively arranged on two sides of the connecting cylinder clamping groove 47, the upper ends of the circular vent hole 48 and the rectangular vent hole 49 are respectively connected with an air outlet and an air suction port of the air pump 43 through air pipes, vent baffles 4a are respectively arranged at the lower ends of the circular vent hole 48 and the rectangular vent hole 49, a user can install the air blowing device 2 and the liquid suction device 3 at required positions according to needs, the vent baffles 4a are pushed open by the circular vent pipe 23 and the rectangular vent pipe 31 during installation, so that the air blowing device 2 and the liquid suction device 3 are automatically communicated with the air pump 43, and the respective heights of the lifting block 45 are adjusted by a system, so that the electric resistance groove can be used for different shapes and a plurality of electric resistance grooves with different depths can be corroded at the same time;
as shown in fig. 4 and 5, the apparatus for embedding resistors in a printed circuit board further includes a glue taking device 5, the glue taking device 5 includes an outer cylinder 51, a pressing rod 52 is installed in the outer cylinder 51, pressing plates 53 are respectively installed at the upper ends of the outer cylinder 51 and the pressing rod 52, a pricking pin 54 is installed at the lower end of the outer cylinder 51, a pressing block groove 55 is installed at the upper end of the pricking pin 54, elastic sheet grooves 56 are installed at two sides inside the pricking pin 54, the upper and lower ends of the pricking pin 54 are conducted by the elastic sheet grooves 56, the elastic sheet grooves 56 are outwardly bent at the lower end of the pricking pin 54, a pressing block 57 is installed at the lower end of the pressing rod 52, the pressing block 57 and the pressing block groove 55 are of a matching structure, an elastic sheet 58 is installed at the lower end of the pressing block 57, the elastic sheet 58 and the elastic sheet groove 56 are of a matching structure, a needle 59 is installed at the tail end of the elastic pad 5a is installed around the pressing block 57, when the protection glue is taken out, the pricking pin 54 is firstly inserted into the protection glue, then the pressing rod 52 is pressed, the pressing rod 52 drives the pressing block 58 to move down through the pressing block 57, the elastic sheet 58 penetrates into the protective adhesive through the needle 59, and is bent in the protective adhesive through the bending and self-elasticity of the lower end of the elastic sheet groove 56 to form a barb, so that the protective adhesive can be conveniently pulled out of the resistor groove, the pressure rod 52 is released after the protective adhesive is pulled out, the elastic pad 5a pushes the pressure rod 52 through the elasticity to drive the elastic sheet 58 to reset, the protective adhesive can be conveniently taken down, and the effect of cleaning the protective adhesive is achieved;
the method for embedding the resistor in the printed circuit board comprises the following steps:
s1, drawing a resistance slot outline on a printed circuit board;
s2, drilling a perfusion groove along the contour of the resistance groove by using a small-sized grinding drill bit;
s3, pouring protective glue into the pouring groove;
s4, pouring erosion liquid into the contour of the resistance groove after the protective glue is solidified;
s5, starting the erosion table 4 to wait for the completion of erosion;
s6, taking out the protective glue by using a glue taking device;
s7, pouring resistance ink into the resistance groove and drying;
s8, sealing and polishing;
in step S6, after the protective glue is taken out, the residual protective glue on the inner wall of the resistor groove can be scraped by the puncture needle 54, so that the protective glue can be cleaned sufficiently.
The working principle is as follows: the bottom detection device 1 is used for detecting the erosion depth of erosion liquid, when a printed circuit board is eroded, the bottom detection spring 15 can push the moving block 14 to drive the bottom end of the bottom detection needle 16 to prop against the bottom layer of the resistance groove to continuously descend, when the moving block 14 moves to the bottom end, the erosion position is eroded to a required depth, the vent groove 17 is used for sucking and blowing air at the bottom of the bottom detection needle 16, the circular vent pipe 23 is used for conducting the inside of the blowing device 2 to blow air, the blowing clamp groove 21 is blocked by the blowing clamp block 22 at first and cannot blow air, when the erosion position is eroded to the required depth, the blowing clamp block 22 is just moved out of the blowing clamp groove 21 to conduct the bottom of the bottom detection needle 16, the air is blown into the resistance groove through the vent groove 17, the erosion liquid is blown away from the erosion position to prevent the erosion position from being excessively deep, and the erosion liquid is gradually blown out of the resistance groove along with the continuous erosion completion of the resistance groove, so as to ensure the thickness of the resistance groove, the resistance deviation of the resistance is reduced, the production quality is improved, the rectangular vent pipe 31 is used for conducting the inside of the liquid suction device 3, the bottom detection needle 16 continuously sucks air around the resistance groove, the blown erosion liquid can be sucked into the connecting cylinder 11 by the liquid suction device 3, the effects of recovering the erosion liquid and protecting other parts of the printed circuit board are achieved, the lifting table 42 drives the air blowing device 2 and the liquid suction device 3 to descend together during erosion to prop against the resistance groove of the printed circuit board, the erosion thickness of the resistance groove is ensured, a user can install the air blowing device 2 and the liquid suction device 3 at required positions according to needs, the circular vent pipe 23 and the rectangular vent pipe 31 prop open the ventilation baffle 4a during installation, the air blowing device 2 and the liquid suction device 3 are automatically communicated with the air pump 43, the heights of the lifting block 45 are adjusted through a system, the resistance groove can be used for resistance grooves with different shapes, and a plurality of resistance grooves with different depths can be eroded simultaneously, when taking out the protective adhesive, insert the felting needle 54 into the protective adhesive first, then press depression bar 52, depression bar 52 drives shell fragment 58 through briquetting 57 and moves down, shell fragment 58 pierces the protective adhesive through syringe needle 59 in to through the crooked and self elasticity of shell fragment groove 56 lower extreme, it is crooked in the protective adhesive, form the barb, can conveniently pull out the resistance groove with the protective adhesive, loosen depression bar 52 after pulling out, elastic pad 5a passes through elasticity, promote depression bar 52, drive shell fragment 58 and reset, can conveniently take off the protective adhesive, reached the effect of clearance protective adhesive.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. Method for embedding resistors in a printed circuit board, the method using equipment comprising a bottom probing device (1), characterized in that: the bottom detecting device (1) comprises a connecting cylinder (11), a fixing plate (12) is arranged on the inner side of the connecting cylinder (11), a plurality of vent holes (13) are formed in the fixing plate (12), a moving block (14) is installed below the fixing plate (12), the moving block (14) and the inner wall of the connecting cylinder (11) are of a matched structure, a bottom detecting spring (15) is installed between the moving block (14) and the fixing plate (12), a bottom detecting needle (16) is installed on the lower side of the moving block (14), the lower end of the bottom detecting needle (16) penetrates through the bottom of the connecting cylinder (11) and extends to the outer side, the bottom detecting needle (16) is of a hollow structure, and a plurality of vent grooves (17) are formed in the bottom detecting needle (16);
the device is characterized in that an air blowing device (2) is installed outside the bottom detecting device (1), an air blowing clamping groove (21) is formed in the upper side of a moving block (14) of the air blowing device (2), an air blowing clamping block (22) is arranged on the lower side of a fixing plate (12) of the air blowing device (2), the air blowing clamping groove (21) and the air blowing clamping block (22) are of a matched structure, the upper end of a bottom detecting needle (16) of the air blowing device (2) extends to the bottom of the air blowing clamping groove (21), and a circular vent pipe (23) is arranged on one side of a connecting cylinder (11) of the air blowing device (2);
a liquid suction device (3) is further mounted outside the bottom detection device (1), the upper end of a bottom detection needle (16) of the liquid suction device (3) extends to the upper side of a moving block (14), and a rectangular vent pipe (31) is arranged on one side of a connecting cylinder (11) of the liquid suction device (3);
the corrosion platform is characterized by further comprising a corrosion platform (4), wherein the corrosion platform (4) comprises a fixed platform (41), a lifting platform (42) is installed on the upper side of the fixed platform (41), an air pump (43) is installed on the upper side of the lifting platform (42), a clamping plate (44) is installed in the lifting platform (42), the clamping plate (44) is provided with a plurality of lifting blocks (45) which are uniformly distributed, and a telescopic rod (46) is installed between the upper side of each lifting block (45) and the lifting platform (42);
a connecting cylinder clamping groove (47) is formed below the lifting block (45), the connecting cylinder clamping groove (47) and the connecting cylinder (11) are of a matched structure, a circular vent hole (48) and a rectangular vent hole (49) are formed in two sides of the connecting cylinder clamping groove (47) respectively, the upper ends of the circular vent hole (48) and the rectangular vent hole (49) are connected with an air outlet and an air suction port of the air pump (43) respectively through air pipes, and vent baffles (4a) are mounted at the lower ends of the circular vent hole (48) and the rectangular vent hole (49) respectively;
the glue taking device (5) comprises an outer cylinder (51), a pressure rod (52) is installed in the outer cylinder (51), pressure plates (53) are respectively arranged at the upper ends of the outer cylinder (51) and the pressure rod (52), a puncture needle (54) is installed at the lower end of the outer cylinder (51), a pressing block groove (55) is formed in the upper end of the puncture needle (54), elastic sheet grooves (56) are formed in two sides inside the puncture needle (54), the upper end and the lower end of the puncture needle (54) are communicated through the elastic sheet grooves (56), the elastic sheet grooves (56) are outwards bent at the lower end of the puncture needle (54), a pressing block (57) is installed at the lower end of the pressure rod (52), the pressing block (57) and the pressing block groove (55) are of a matched structure, an elastic sheet (58) is installed at the lower end of the pressing block (57), the elastic sheet (58) and the elastic sheet groove (56) are of a matched structure, and the tail end of the elastic sheet (58) is a needle head (59), an elastic pad (5a) is arranged around the pressing block (57);
the method for embedding the resistor in the printed circuit board comprises the following steps:
s1, drawing a resistance slot outline on a printed circuit board;
s2, drilling a perfusion groove along the contour of the resistance groove by using a small-sized grinding drill bit;
s3, pouring protective glue into the pouring groove;
s4, pouring erosion liquid into the contour of the resistance groove after the protective glue is solidified;
s5, starting an erosion table (4) to wait for erosion to finish;
s6, taking out the protective glue by using a glue taking device;
s7, pouring resistance ink into the resistance groove and drying;
s8, sealing and polishing.
2. The method of embedding resistors in a printed circuit board of claim 1, wherein: in the step S6, after the protective glue is taken out, the pricking pin (54) is used for scraping the residual protective glue on the inner wall of the resistor groove, so that the protective glue is cleaned sufficiently.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011517359.8A CN112533395B (en) | 2020-12-21 | 2020-12-21 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011517359.8A CN112533395B (en) | 2020-12-21 | 2020-12-21 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112533395A CN112533395A (en) | 2021-03-19 |
| CN112533395B true CN112533395B (en) | 2021-12-24 |
Family
ID=75001994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011517359.8A Active CN112533395B (en) | 2020-12-21 | 2020-12-21 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112533395B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR7309375D0 (en) * | 1972-11-30 | 1974-09-05 | Ibm | PROCESS FOR MANUFACTURING A PANEL OF A GAS DISCHARGE STRUCTURE |
| CN1070287A (en) * | 1991-02-11 | 1993-03-24 | 波音公司 | Multichip module and integrated circuit substrate with plane composition surface |
| CN1615070A (en) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | Manufacture of PCB with resistors embedded |
| TW200845127A (en) * | 2007-03-22 | 2008-11-16 | Micron Technology Inc | Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers |
| KR20100124148A (en) * | 2009-05-18 | 2010-11-26 | 두성산업 주식회사 | Conductive contactor for substrate surface mount |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN102548238A (en) * | 2011-12-31 | 2012-07-04 | 东莞生益电子有限公司 | Method for improving resistance accuracy of buried resistor in PCB (printed circuit board) |
| CN103079356A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process for copper-based printed circuit board with embedded circuits |
| CN104797085A (en) * | 2015-04-23 | 2015-07-22 | 广州杰赛科技股份有限公司 | Method for forming blind groove in buried copper block of circuit board |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511106A (en) * | 2020-05-21 | 2020-08-07 | 罗真旗 | L ED double-sided circuit board with low-resistance carbon oil filling hole and carbon oil filling hole conduction processing method thereof |
-
2020
- 2020-12-21 CN CN202011517359.8A patent/CN112533395B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR7309375D0 (en) * | 1972-11-30 | 1974-09-05 | Ibm | PROCESS FOR MANUFACTURING A PANEL OF A GAS DISCHARGE STRUCTURE |
| CN1070287A (en) * | 1991-02-11 | 1993-03-24 | 波音公司 | Multichip module and integrated circuit substrate with plane composition surface |
| CN1615070A (en) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | Manufacture of PCB with resistors embedded |
| TW200845127A (en) * | 2007-03-22 | 2008-11-16 | Micron Technology Inc | Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers |
| KR20100124148A (en) * | 2009-05-18 | 2010-11-26 | 두성산업 주식회사 | Conductive contactor for substrate surface mount |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN102548238A (en) * | 2011-12-31 | 2012-07-04 | 东莞生益电子有限公司 | Method for improving resistance accuracy of buried resistor in PCB (printed circuit board) |
| CN103079356A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process for copper-based printed circuit board with embedded circuits |
| CN104797085A (en) * | 2015-04-23 | 2015-07-22 | 广州杰赛科技股份有限公司 | Method for forming blind groove in buried copper block of circuit board |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112533395A (en) | 2021-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112533395B (en) | Method for embedding resistor in printed circuit board and printed circuit board thereof | |
| JP2013212683A (en) | Recording apparatus | |
| CN110626019A (en) | Back-drilling aluminum foil cover plate | |
| KR20100026306A (en) | Automatic taping apparatus for fixing pcb | |
| KR101227049B1 (en) | EMI shield apparatus and method for removing the transfer film | |
| CN116528499A (en) | Manufacturing process of ultrathin hard board printing ink for keyboard | |
| CN215096322U (en) | Printing device for processing circuit board | |
| CN214110630U (en) | Cutting mechanism with follow-up dust extraction | |
| CN215320709U (en) | Be applied to model taking-out structure of 3D printer | |
| CN109078918B (en) | PCB cleaning device and using method thereof | |
| CN219564481U (en) | High-precision solder paste printer | |
| CN107580427A (en) | A kind of preparation method of thin plate HDI plates | |
| CN112584609A (en) | Step plate and manufacturing process thereof | |
| CN114501812B (en) | Hole plugging device and PCB resin hole plugging method | |
| TWI389611B (en) | Device and method for stuffing printing ink into holes in printed circuit board | |
| JP2005064251A (en) | Printing tool for printed circuit board | |
| CN111800949A (en) | Method for back drilling resin plug hole and aluminum sheet screen | |
| CN219204854U (en) | Universal backing plate of PCB | |
| CN212763889U (en) | Novel anti-scratch's circuit board stamping die | |
| CN213988576U (en) | Automatic pin cutting device for vertical magnetic ring inductor | |
| CN212259475U (en) | Paster mouth for paster machine | |
| CN214056855U (en) | Vacuum silk screen printing automatic pressing plate top plate working table surface | |
| CN213213972U (en) | Printing nail bed | |
| KR100462488B1 (en) | Making machine for metaldome plate and making method | |
| CN214675883U (en) | Double-sided circuit board engraving machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211202 Address after: Room 0501, 5 / F, tower a, Tsinghua Tongfang science and technology building, No. 1 Wangzhuang Road, Haidian District, Beijing 100089 Applicant after: Beijing Tongfang Information Safety Technology Co.,Ltd. Address before: 224000 Yan Long Street office, Yan Du District, Yancheng City, Jiangsu, the intersection of wee eight road and Qinchuan Road (D) Applicant before: YANCHENG HUAYU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |