CN104797085A - Method for forming blind groove in buried copper block of circuit board - Google Patents
Method for forming blind groove in buried copper block of circuit board Download PDFInfo
- Publication number
- CN104797085A CN104797085A CN201510198074.5A CN201510198074A CN104797085A CN 104797085 A CN104797085 A CN 104797085A CN 201510198074 A CN201510198074 A CN 201510198074A CN 104797085 A CN104797085 A CN 104797085A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- photoresist
- copper billet
- blind slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 98
- 239000010949 copper Substances 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 26
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 42
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 17
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 12
- 239000007921 spray Substances 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 6
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 6
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 claims description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000007127 saponification reaction Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000003801 milling Methods 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract 6
- 239000000110 cooling liquid Substances 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000012809 cooling fluid Substances 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000001261 hydroxy acids Chemical group 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
Abstract
The invention discloses a method for forming a blind groove in a buried copper block of a circuit board. The method comprises the following steps of adhering a light-sensitive anti-corrosion film on a surface, which is buried with the copper block, of the circuit board; shielding a position, which corresponds to a position at which the blind hole needs to be formed on the copper block, of the light-sensitive anti-corrosion film; performing polymerization reaction on other positions of the light-sensitive anti-corrosion film through light irradiation; removing the position, which corresponds to the position at which the blind hole needs to be formed on the copper block, of the light-sensitive anti-corrosion film and exposing a copper surface; spraying etching liquid on the copper surface; and etching the blind groove. The light-sensitive anti-corrosion film protects the portion, which does not need the blind groove, of the circuit board after polymerization reaction of the light-sensitive anti-corrosion film, the depth of the blind groove can be controlled well by an etching mode, walls of the etched blind groove are smooth owing to etching uniformity, the problem that the bottom of a blind groove machined by the traditional numerical-control machine tool has milling cutter marks is solved, the later heat dissipation effect of heating elements is improved, and the problem that cooling oil and cooling liquid on the surface of a PCB (printed circuit board) cannot be cleaned thoroughly after grooves are formed in the PCB in a milling manner and copper is buried in the PCB is solved.
Description
Technical field
The present invention relates to circuit board technology, particularly a kind of circuit board buries copper billet blind slot manufacture method.
Background technology
Along with the development of electronics industry, electronic product volume is more and more less, power density is increasing, heat dissipation problem seems particularly important, and for solving heat dissipation for circuit board problem, general employing imbeds copper billet on circuit boards, on copper billet, the dark blind slot of control is made by CNC milling machine mode, heating element is directly mounted the mode in copper billet blind slot, heat is conducted by copper billet, meets the demand of heat radiation.And traditional CNC milling machine mode of passing through makes the mode controlling dark blind slot on copper billet, there is following shortcoming: existing PCB equipment cannot meet processing request, need the Digit Control Machine Tool of professional intermetallic composite coating to process; CNC milling machine processing needs cold oil or cooling fluid cooling, needs professional cleaning equipment to clean and bury copper circuit board after having made; After Digit Control Machine Tool processing, milling cutter print in blind slot, can be left, easily occur difference in height during attachment heating element, affect heating element radiating effect.
Summary of the invention
Based on this, be necessary the defect for prior art, provide a kind of circuit board to bury copper billet blind slot manufacture method, can realize burying copper billet blind slot well and make, without the need to the circuit board after surface cleaning, in the blind slot produced, also can not leave milling cutter print.
Its technical scheme is as follows:
A kind of circuit board buries copper billet blind slot manufacture method, comprises the steps:
The one side imbedding copper billet on circuit boards attaches photoresist;
Need the position of open-blind groove to block corresponding for photoresist copper billet, polymerization reaction take place is irradiated by light in other positions of photoresist;
Need the position of open-blind groove to be removed by developing reaction corresponding for photoresist copper billet, expose copper face;
Copper face sprays etching solution, etches blind slot.
Its further technical scheme is as follows:
Described photoresist is photosensitive resist dry film.
Before imbedding the one side attaching photoresist of copper billet on circuit boards, also comprise the steps:
Cleaning circuit plate plate face;
Microetch is carried out to copper block surface;
Drying circuit plate plate face.
Copper face sprays etching solution, after etching blind slot, also comprises the steps:
Photoresist after polymerization reaction is removed.
Photoresist after polymerization reaction is removed, specifically comprises the steps:
Photopolymer in photoresist and hydroxide ion produce saponification and dissolve;
Binder polymer in photoresist and hydroxide ion produce in soda acid to close to react and dissolve.
Copper face sprays the step that etching solution etches blind slot, is carry out in vacuum etch machine.
Described etching solution is the mixed liquor of sodium chlorate and hydrochloric acid.
Needed by corresponding for photoresist copper billet the position of open-blind groove to be removed by developing reaction and expose copper face, specifically comprise the steps:
Need the position of open-blind groove to spray sodium bicarbonate solution at the corresponding copper billet of photoresist, the photoresist of this position and sodium bicarbonate solution react, and expose the copper face that this position is corresponding.
Described circuit board buries copper billet blind slot manufacture method and also comprises the step making and bury copper circuit board:
First substrate layer is offered the through hole placing copper billet;
First substrate layer, prepreg, the second substrate layer successively lamination are placed, copper billet is placed in the through hole of the first substrate layer;
Perform lamination, utilize the resin gummosis of the high pressure of lamination process and prepreg to be heated solidification, copper billet is fixed in the through hole of the first substrate layer;
Perform grinding, removing copper block surface overflows the resin gummosis of coming.
Below the advantage of preceding solution or principle are described:
Foregoing circuit plate buries copper billet blind slot manufacture method, by adopting the photoresist protection after polymerization reaction without the need to the circuit board section of open-blind groove, the degree of depth of blind slot can be controlled well by etching mode, and utilize the uniformity of etching, blind slot wall after etching is smooth, thus solve milling cutter print problem bottom traditional blind slot adopting Digit Control Machine Tool processing, for the heating element welding in later stage provides good contact plane, thus promote the heating element radiating effect in later stage, and make in blind slot process need not cold oil or cooling fluid cooling, copper PCB surface cool oil is buried after thorough solution groove milling, the cleaning dirty problem of cooling fluid.
Accompanying drawing explanation
Fig. 1 buries the block diagram of copper billet blind slot manufacture method for the circuit board described in the embodiment of the present invention;
Fig. 2 is the structural representation burying copper circuit board described in the embodiment of the present invention;
Fig. 3 is the structural representation buried after copper circuit board open-blind groove described in the embodiment of the present invention.
Description of reference numerals:
10, the first substrate layer, 110, blind slot, 20, prepreg, 210, resin gummosis, the 30, second substrate layer, 40, copper billet, 50, photoresist.
Embodiment
With reference to Fig. 1,3, a kind of circuit board buries copper billet blind slot manufacture method, comprises the steps:
S100: cleaning circuit plate plate face; Microetch is carried out to copper billet 40 surface; Drying circuit plate plate face.
S200: the one side imbedding copper billet 40 on circuit boards attaches photoresist 50;
Polymerization reaction take place is irradiated by light in other positions of photoresist 50 by S300: need the position of open-blind groove 110 to block corresponding for photoresist 50 copper billet 40;
S400: need the position of open-blind groove 110 to be removed by developing reaction corresponding for photoresist 50 copper billet 40, expose copper face;
S500: spray etching solution on copper face, etches blind slot 110.
S600: the photoresist 50 after polymerization reaction is removed.
Circuit board described in the present embodiment buries copper billet blind slot manufacture method, the circuit board section without the need to open-blind groove is protected by the photoresist 50 after employing polymerization reaction, the degree of depth of blind slot 110 can be controlled well by etching mode, and utilize the uniformity of etching, blind slot 110 wall after etching is smooth, thus solve milling cutter print problem bottom traditional blind slot adopting Digit Control Machine Tool processing, for the heating element welding in later stage provides good contact plane, thus promote the heating element radiating effect in later stage, and make in blind slot 110 process need not cold oil or cooling fluid cooling, copper PCB surface cool oil is buried after thorough solution groove milling, the cleaning dirty problem of cooling fluid.
Wherein, step S100 mainly in order to remove greasy dirt, the oxide layer in plate face, is reacted by microetch: adopt the hydrogen peroxide with strong oxidizing property, copper is oxidized to the copper ion of divalent state, exist with cupric oxide form, cupric oxide and sulfuric acid reaction generate copper sulphate, alligatoring copper face, make photoresist 50 good in the absorption of plate face, by drying plate face, prevent copper face to be oxidized, this step, according to Production requirement, can be selected to perform or do not perform.
Wherein, the preferably photosensitive resist dry film of photoresist 50 described in step S200.The hydroxy-acid group contained in dry film and unsaturated organic compound (-) can produce chemical action with copper (+), generate chemical bond, and produce mutual interlocking between the copper surface of dry film and irregular micro-rough, can firmly be attached on plate face.
Wherein, step S300 is irradiated by light, dry film polymerization reaction take place, and the dry film after polymerization effectively can stop the erosion of developer solution and etching solution, becomes the resist layer in baffle face.
Wherein, corresponding for photoresist 50 copper billet 40 is needed the position of open-blind groove 110 to be removed by developing reaction and exposes copper face by step S400, specifically comprises the steps:
Need the position spray developing liquid sodium bicarbonate solution of open-blind groove 110 at the corresponding copper billet 40 of photoresist 50, photoresist 50 and the sodium bicarbonate solution of this position react, and expose the copper face that this position is corresponding.
Wherein, etching solution described in step S500 is the mixed liquor of sodium chlorate and hydrochloric acid, and its concentration is prepared according to etching speed and the degree of depth, and this step is carried out in vacuum etch machine, effectively guarantee the uniformity that etching solution sprays, make the plate face after etching smooth, smooth, without obvious burr.
Wherein, the photoresist 50 after polymerization reaction is removed by step S600, specifically comprises the steps:
Photopolymer in photoresist 50 and hydroxide ion produce saponification and dissolve;
Binder polymer in photoresist 50 and hydroxide ion produce in soda acid to close to react and dissolve.
According to Production requirement, this step can be selected to perform or do not perform, or adopts other modes to remove dry film, and in this example, this step is also carry out in vacuum etch machine, convenient and swift.
With reference to Fig. 2, Fig. 3, described circuit board buries copper billet blind slot manufacture method and also comprises the step making and bury copper circuit board:
First substrate layer 10 is offered the through hole placing copper billet 40;
First substrate layer 10, prepreg 20, second substrate layer 30 successively lamination are placed, copper billet 40 is placed in the through hole of the first substrate layer 10;
Perform lamination, utilize the resin gummosis 210 of the high pressure of lamination process and prepreg 20 to be subject to hot curing, copper billet 40 is fixed in the through hole of the first substrate layer 10;
Perform grinding, the resin gummosis 210 of coming is overflowed on removing copper billet 40 surface.
Make the dark blind slot 110 of control by the method, the heating element being convenient to bury copper circuit board directly mounts in the blind slot 110 of copper billet 40, and heat is conducted by copper billet 40, meets the demand of heat radiation, and the method is simple, convenient, cost is low.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (9)
1. circuit board buries a copper billet blind slot manufacture method, it is characterized in that, comprises the steps:
The one side imbedding copper billet on circuit boards attaches photoresist;
Need the position of open-blind groove to block corresponding for photoresist copper billet, polymerization reaction take place is irradiated by light in other positions of photoresist;
Need the position of open-blind groove to be removed by developing reaction corresponding for photoresist copper billet, expose copper face;
Copper face sprays etching solution, etches blind slot.
2. circuit board as claimed in claim 1 buries copper billet blind slot manufacture method, and it is characterized in that, described photoresist is photosensitive resist dry film.
3. circuit board as claimed in claim 2 buries copper billet blind slot manufacture method, it is characterized in that, before imbedding the one side attaching photoresist of copper billet on circuit boards, also comprises the steps:
Cleaning circuit plate plate face;
Microetch is carried out to copper block surface;
Drying circuit plate plate face.
4. circuit board as claimed in claim 3 buries copper billet blind slot manufacture method, it is characterized in that, copper face sprays etching solution, after etching blind slot, also comprise the steps:
Photoresist after polymerization reaction is removed.
5. circuit board as claimed in claim 4 buries copper billet blind slot manufacture method, it is characterized in that, is removed by the photoresist after polymerization reaction, specifically comprises the steps:
Photopolymer in photoresist and hydroxide ion produce saponification and dissolve;
Binder polymer in photoresist and hydroxide ion produce in soda acid to close to react and dissolve.
6. circuit board as claimed in claim 5 buries copper billet blind slot manufacture method, and it is characterized in that, copper face sprays the step that etching solution etches blind slot, is carry out in vacuum etch machine.
7. circuit board as claimed in claim 1 buries copper billet blind slot manufacture method, and it is characterized in that, described etching solution is the mixed liquor of sodium chlorate and hydrochloric acid.
8. circuit board as claimed in claim 1 buries copper billet blind slot manufacture method, it is characterized in that, is needed by corresponding for photoresist copper billet the position of open-blind groove to be removed by developing reaction and exposes copper face, specifically comprise the steps:
Need the position of open-blind groove to spray sodium bicarbonate solution at the corresponding copper billet of photoresist, the photoresist of this position and sodium bicarbonate solution react, and expose the copper face that this position is corresponding.
9. the circuit board as described in any one of claim 1 to 8 buries copper billet blind slot manufacture method, it is characterized in that, it also comprises the step making and bury copper circuit board:
First substrate layer is offered the through hole placing copper billet;
First substrate layer, prepreg, the second substrate layer successively lamination are placed, copper billet is placed in the through hole of the first substrate layer;
Perform lamination, utilize the resin gummosis of the high pressure of lamination process and prepreg to be heated solidification, copper billet is fixed in the through hole of the first substrate layer;
Perform grinding, removing copper block surface overflows the resin gummosis of coming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510198074.5A CN104797085B (en) | 2015-04-23 | 2015-04-23 | Circuit board buries copper billet blind slot preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510198074.5A CN104797085B (en) | 2015-04-23 | 2015-04-23 | Circuit board buries copper billet blind slot preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104797085A true CN104797085A (en) | 2015-07-22 |
| CN104797085B CN104797085B (en) | 2018-01-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510198074.5A Expired - Fee Related CN104797085B (en) | 2015-04-23 | 2015-04-23 | Circuit board buries copper billet blind slot preparation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104797085B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611720A (en) * | 2016-03-14 | 2016-05-25 | 江苏普诺威电子股份有限公司 | PCB acoustic cavity structure and processing method thereof |
| CN105792548A (en) * | 2016-05-23 | 2016-07-20 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with stepped slot structure through electroplating and etching method |
| CN106132089A (en) * | 2016-06-30 | 2016-11-16 | 景旺电子科技(龙川)有限公司 | A kind of printed wiring board buries copper billet method |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN109475051A (en) * | 2018-09-26 | 2019-03-15 | 江门崇达电路技术有限公司 | A kind of production method of the thick copper printed circuit board in part |
| CN112533395A (en) * | 2020-12-21 | 2021-03-19 | 盐城华昱光电技术有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
| CN114126187A (en) * | 2020-08-26 | 2022-03-01 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN114126187B (en) * | 2020-08-26 | 2024-05-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611720A (en) * | 2016-03-14 | 2016-05-25 | 江苏普诺威电子股份有限公司 | PCB acoustic cavity structure and processing method thereof |
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| CN105792548B (en) * | 2016-05-23 | 2018-12-14 | 上海美维科技有限公司 | A method of ladder slot structure printed circuit board is made with plating and engraving method |
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| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN109475051A (en) * | 2018-09-26 | 2019-03-15 | 江门崇达电路技术有限公司 | A kind of production method of the thick copper printed circuit board in part |
| CN114126187A (en) * | 2020-08-26 | 2022-03-01 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN114126187B (en) * | 2020-08-26 | 2024-05-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN112533395A (en) * | 2020-12-21 | 2021-03-19 | 盐城华昱光电技术有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
| CN112533395B (en) * | 2020-12-21 | 2021-12-24 | 北京同方信息安全技术股份有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
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