CN110626019A - Back-drilling aluminum foil cover plate - Google Patents
Back-drilling aluminum foil cover plate Download PDFInfo
- Publication number
- CN110626019A CN110626019A CN201910830239.4A CN201910830239A CN110626019A CN 110626019 A CN110626019 A CN 110626019A CN 201910830239 A CN201910830239 A CN 201910830239A CN 110626019 A CN110626019 A CN 110626019A
- Authority
- CN
- China
- Prior art keywords
- layer
- drill bit
- drilling
- aluminum foil
- wood fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/12—Coating on the layer surface on paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/06—Vegetal fibres
- B32B2262/062—Cellulose fibres, e.g. cotton
- B32B2262/067—Wood fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The invention discloses a back-drilled aluminum foil cover plate which comprises a conductive layer, a glue layer, a wood fiber layer and a surface layer. The surface layer is coated on the wood fiber layer, is cured after being heated or irradiated by a light source, and is extruded and formed into a plate body together with the glue layer and the conducting layer; the surface layer is made of a material of thermosetting resin or light-cured resin, so that the insulating layer has strong adhesive property and a softer surface, the small drill bit is instantly adhered and stabilized on the surface of the contact surface layer of the back-drilling small drill bit during drilling, a drill bit on the small drill bit is vertically drilled downwards, the deflection or slipping or needle breakage of the drill bit is reduced, and the positioning accuracy of the back-drilling small drill bit is improved. Meanwhile, the wood fiber layer is made of paper or kraft paper mainly composed of a wood fiber material. The cutting powder generated after the cutting of the small back-drilling drill bit is converted into dust which is easily absorbed, a large amount of heat is generated when the back-drilling drill bit is favorable for carrying and drilling, the phenomenon that the drill bit is wound with wires and blocked by the drilled hole when the hole is drilled is reduced, and the surface quality of the processed hole position is favorably improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a back-drilling aluminum foil cover plate used for consumable materials in back-drilling and drilling processing.
[ background of the invention ]
With the continuous development of the social information industry and the large-scale popularization of 5G commercial products, the transmission speed of digital signals is faster and faster, and the frequency is higher and higher. So that higher requirements are put on the processing of the PCB board. As the transmission speed of digital signals is faster and faster, the requirement for high-frequency circuits of the PCB is inevitably higher and higher. However, in the prior art, the PCB board is back-drilled by conventional back-drilling of an aluminum sheet board. The back-drilling aluminum sheet plate consists of an aluminum sheet and a cold punching plate. Because the material hardness of the surface of the cold punching plate in the back drilling aluminum sheet plate is higher, the back drilling drill bit is easy to deflect or slip when contacting the surface of the aluminum sheet plate instantly, and the positioning accuracy of the back drilling small drill bit is lower.
[ summary of the invention ]
The technical purpose of the invention is to solve the problems existing in the prior art and provide a back-drilling aluminum foil cover plate capable of improving the positioning precision and hole site quality of a processed hole of a back-drilling small drill point during drilling.
In order to achieve the technical problem, the invention provides a back-drilled aluminum foil cover plate which is used for the aspect of using cover plate consumables when back-drilled holes are drilled, and comprises a conductive layer, a glue layer, a wood fiber layer and a surface layer; the surface layer is coated on the wood fiber layer, is cured after being heated or irradiated by a light source, and is extruded and formed with the glue layer and the conducting layer into a plate body; the board body comprises a conductive layer and an insulating layer arranged on the conductive layer; the insulating layer is composed of a surface layer, a wood fiber layer and a glue layer which are sequentially arranged from top to bottom; the surface layer is made of a thermosetting resin or a light-curing resin, and the wood fiber layer is made of paper or kraft paper mainly containing a wood fiber material.
Further, the conductive layer is made of conductive materials such as aluminum foil or alloy aluminum foil or aluminum foil paper or tin foil or alloy tin foil or tin foil paper.
Further defined, the glue layer is composed of a water-soluble or thermosetting resin material.
Further defined, the thickness of the conductive layer is between 0.001 mm and 0.2 mm, and the thickness of the insulating layer is between 0.1 mm and 0.6 mm.
Further, the optimal thickness parameter of the conductive layer is 0.11 mm, and the optimal thickness parameter of the insulating layer is 0.2 mm.
Further, the main component of the thermosetting resin or the photocurable resin contains polyethylene glycol, polyethylene oxide, polypropylene glycol, polyvinyl alcohol, polyacrylamide, polyvinylpyrrolidone, carboxymethylcellulose, and polyether ester
The invention has the beneficial effects that: the surface layer is coated on the wood fiber layer, is cured after being heated or irradiated by a light source, and is extruded and formed with the glue layer and the conducting layer into a plate body; the plate body comprises a conducting layer and an insulating layer arranged on the conducting layer. The insulating layer is composed of a surface layer, a wood fiber layer and a glue layer which are sequentially arranged from top to bottom; the surface layer is made of a material of thermosetting resin or light-cured resin, so that the insulating layer arranged on the conductive layer has strong adhesive property and softer surface, the small drill bit can be instantly adhered and stabilized on the surface of the contact surface layer of the back-drilling small drill bit during drilling, a drill bit on the small drill bit can be vertically drilled, the deflection or slipping or needle breakage of the drill bit is reduced, and the positioning accuracy of the back-drilling small drill bit is improved. Meanwhile, the wood fiber layer disposed under the surface layer is made of paper or kraft paper having wood fiber material as a main component. The cutting powder generated after the cutting of the small back-drilling drill bit is converted into dust which is easily absorbed, a large amount of heat is generated when the back-drilling drill bit is favorable for carrying and drilling, the phenomenon that the drill bit is wound with wires and blocked by the drilled hole when the hole is drilled is reduced, and the surface quality of the processed hole position is favorably improved. In addition, compared with the structure of the traditional back-drilling aluminum sheet plate in the prior art, the invention also has the effect of low processing cost.
The technical solution of the present invention is further described in detail with reference to the accompanying drawings and embodiments.
[ description of the drawings ]
Fig. 1 is a schematic view of a backdrilled aluminum foil cover plate according to the present invention.
[ EXAMPLES ]
Referring to fig. 1, a back-drilled aluminum foil cover plate for use in processing micro-drilled holes in a Flexible Printed Circuit (FPC) is described below with reference to embodiments, which includes a conductive layer 1, a glue layer 2, a wood fiber layer 3, and a surface layer 4.
The surface layer 4 is made of a thermosetting resin or a photo-curing resin, and the wood fiber layer 3 is made of paper or kraft paper containing a wood fiber material as a main component. The conducting layer 1 is made of conducting materials of aluminum foil or alloy aluminum foil or aluminum foil paper or tin foil or alloy tin foil or tin foil paper. The glue layer 2 is made of a water-soluble or thermosetting resin material. The thickness of the conductive layer 1 is between 0.001 mm and 0.2 mm, and the thickness of the insulating layer is between 0.1 mm and 0.6 mm. The optimal thickness parameter of the conductive layer 1 is 0.11 mm, and the optimal thickness parameter of the insulating layer is 0.2 mm. The main components of the thermosetting resin or the light-curing resin comprise polyethylene glycol, polyethylene oxide, polypropylene glycol, polyvinyl alcohol, polyacrylamide, polyvinylpyrrolidone, carboxymethyl cellulose and polyether ester.
The surface layer 4 is coated on the wood fiber layer 3, cured after being heated or irradiated by a light source, and extruded with the glue layer 2 and the conducting layer 1 to form a plate body. The plate body comprises a conductive layer 1 and an insulating layer arranged on the conductive layer 1; the insulating layer is composed of a surface layer 4, a wood fiber layer 2 and a glue layer 2 in sequence from top to bottom.
The surface layer 4 is made of a material of a thermosetting resin or a light-curing resin, and the main components of the thermosetting resin or the light-curing resin contain polyethylene glycol, polyethylene oxide, polypropylene glycol, polyvinyl alcohol, polyacrylamide, polyvinylpyrrolidone, carboxymethyl cellulose and polyether ester. The coating is prepared by mixing a plurality of water-soluble resins, adding an auxiliary agent for blending, and coating and baking. The hardness of the surface layer 4 is proper, which is beneficial to improving the good guiding function of the drill point and improving the precision of the drilled hole position. The surface layer 4 has the characteristic of soft surface, so that a drill bit of a small drill bit is stuck and stabilized at the moment of drilling-down contact, the small drill bit is positioned, the slippage of the drill bit is reduced, the drill bit is drilled in a straight and straight mode, and the purposes of improving the hole site precision and reducing the broken drill bit are achieved.
The wood fiber layer 3 is made of paper or kraft paper containing a wood fiber material as a main component. The cutting powder generated after the cutting of the small back-drilling drill bit is converted into dust which is easily absorbed, a large amount of heat is generated when the back-drilling drill bit is favorable for carrying and drilling, the phenomenon that the drill bit is wound with wires and blocked by the drilled hole when the hole is drilled is reduced, and the surface quality of the processed hole position is favorably improved.
The glue layer 2 is made of a water-soluble or thermosetting resin material. The water-soluble resin has a low melting point of about 60 degrees generally, has good heat dissipation performance, can reduce the breakage phenomenon caused by local overheating of the drill point, and improves the hole site precision. The drill bit has good lubricating and guiding effects on small drill bits, the drill bits are not easy to wear, the hole site accuracy is high, the hole site quality is good, the average hole thickness is about 7m and is far lower than the industry standard (20 m).
The surface layer 4, the wood fiber layer 3 and the glue layer 2 are also called as insulating layers, and the main purpose is to prevent the drill point from accidentally contacting with the conductive layer to generate a wrong signal due to electric conduction, and to improve the precision of back drilling processing, reduce the winding of the drill point, hole plugging of a back drilling hole and the like.
When the drill bit drills down the contact surface layer 4, the drill bit is stabilized by the drill bit contact surface layer 4 instantly, the deflection is reduced, and the dust is sucked away after being cut by the drill bit. In the process of sucking away the cutting converted dust, the heat on the surface of the drill point is also taken away, the temperature of the drill point is reduced, the rigidity of the drill point is improved, the drill point is not easy to bend and deform, and the hole wall precision and the hole site precision of the drilled hole are improved. The insulating layer that surface course 4, wood fiber layer 3 and glue layer 2 constitute, the insulating layer can become gaseous state after preheating and volatilize, volatilizees the chip removal of in-process quickening the cuttings to reduced the resistance of driling in the drilling process, improved the positioning accuracy of little drill point. Meanwhile, the wood fiber layer 3 disposed under the face layer 4 is made of paper or kraft paper having a wood fiber material as a main component. The cutting powder generated after the cutting of the small back-drilling drill bit is converted into dust which is easily absorbed, a large amount of heat is generated when the back-drilling drill bit is favorable for carrying and drilling, the phenomenon that the drill bit is wound with wires and blocked by the drilled hole when the hole is drilled is reduced, and the surface quality of the processed hole position is favorably improved. In addition, compared with the structure of the traditional back-drilling aluminum sheet plate in the prior art, the invention also has the effect of low processing cost.
Modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention.
Claims (6)
1. A back-drilling aluminum foil cover plate is used for the aspect of using cover plate consumables when back-drilling holes, and comprises a conductive layer, a glue layer, a wood fiber layer and a surface layer; the method is characterized in that: the surface layer is coated on the wood fiber layer, is cured after being heated or irradiated by a light source, and is extruded and formed with the glue layer and the conducting layer into a plate body; the board body comprises a conductive layer and an insulating layer arranged on the conductive layer; the insulating layer is composed of a surface layer, a wood fiber layer and a glue layer which are sequentially arranged from top to bottom; the surface layer is made of a thermosetting resin or a light-curing resin, and the wood fiber layer is made of paper or kraft paper mainly containing a wood fiber material.
2. The backdrilling aluminum foil cover plate of claim 1, wherein: the conducting layer is made of conducting materials of aluminum foil or alloy aluminum foil or aluminum foil paper or tin foil or alloy tin foil or tin foil paper.
3. The backdrilling aluminum foil cover plate of claim 1, wherein: the glue layer is made of water-soluble or thermosetting resin material.
4. The backdrilling aluminum foil cover plate of claim 1, wherein: the thickness of the conducting layer is 0.001 mm to 0.2 mm, and the thickness of the insulating layer is 0.1 mm to 0.6 mm.
5. The backdrilling aluminum foil cover plate of claim 1 or 4, wherein: the optimal thickness parameter of the conducting layer is 0.11 mm, and the optimal thickness parameter of the insulating layer is 0.2 mm.
6. The backdrilling aluminum foil cover plate of claim 1, wherein: the main components of the thermosetting resin or the light-curing resin comprise polyethylene glycol, polyethylene oxide, polypropylene glycol, polyvinyl alcohol, polyacrylamide, polyvinylpyrrolidone, carboxymethyl cellulose and polyether ester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910830239.4A CN110626019A (en) | 2019-09-02 | 2019-09-02 | Back-drilling aluminum foil cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910830239.4A CN110626019A (en) | 2019-09-02 | 2019-09-02 | Back-drilling aluminum foil cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110626019A true CN110626019A (en) | 2019-12-31 |
Family
ID=68970114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910830239.4A Pending CN110626019A (en) | 2019-09-02 | 2019-09-02 | Back-drilling aluminum foil cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110626019A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111002679A (en) * | 2019-12-02 | 2020-04-14 | 深圳市宏宇辉科技有限公司 | Back-drilling composite cover plate and machining process thereof |
| CN111251366A (en) * | 2020-01-17 | 2020-06-09 | 珠海纵航科技有限公司 | PCB drilling cover plate |
| CN112267323A (en) * | 2020-10-28 | 2021-01-26 | 深圳市柳鑫实业股份有限公司 | Single-sided aluminum composite paper cover plate and preparation method thereof |
| CN113370602A (en) * | 2020-12-09 | 2021-09-10 | 烟台柳鑫新材料科技有限公司 | Aluminum foil cover plate and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203951682U (en) * | 2014-07-11 | 2014-11-19 | 朱三云 | High-performance coating lubricates cover plate |
| CN206123803U (en) * | 2016-10-11 | 2017-04-26 | 深圳市柳鑫实业股份有限公司 | PCB machine drilling is with apron |
| CN110121241A (en) * | 2019-05-10 | 2019-08-13 | 深圳市宏宇辉科技有限公司 | Soft board cover board and the soft board cover board process flow for flexible circuit board processing |
-
2019
- 2019-09-02 CN CN201910830239.4A patent/CN110626019A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203951682U (en) * | 2014-07-11 | 2014-11-19 | 朱三云 | High-performance coating lubricates cover plate |
| CN206123803U (en) * | 2016-10-11 | 2017-04-26 | 深圳市柳鑫实业股份有限公司 | PCB machine drilling is with apron |
| CN110121241A (en) * | 2019-05-10 | 2019-08-13 | 深圳市宏宇辉科技有限公司 | Soft board cover board and the soft board cover board process flow for flexible circuit board processing |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111002679A (en) * | 2019-12-02 | 2020-04-14 | 深圳市宏宇辉科技有限公司 | Back-drilling composite cover plate and machining process thereof |
| CN111251366A (en) * | 2020-01-17 | 2020-06-09 | 珠海纵航科技有限公司 | PCB drilling cover plate |
| CN112267323A (en) * | 2020-10-28 | 2021-01-26 | 深圳市柳鑫实业股份有限公司 | Single-sided aluminum composite paper cover plate and preparation method thereof |
| CN113370602A (en) * | 2020-12-09 | 2021-09-10 | 烟台柳鑫新材料科技有限公司 | Aluminum foil cover plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110626019A (en) | Back-drilling aluminum foil cover plate | |
| WO2015109908A1 (en) | Drilling method for pcbs with high hole position precision | |
| CN106961798B (en) | A kind of deep method of PCB aperture processing control | |
| CN105101648A (en) | PCB drilling process improvement method | |
| KR101258338B1 (en) | A drill and method for manufacturing a printed wire board | |
| US20140201995A1 (en) | Cutting drill and method for manufacturing printed wiring board | |
| CN201937952U (en) | Back-drilled high-density lamination printed circuit board | |
| CN112533352B (en) | High-shielding-performance flexible circuit board and preparation method thereof | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN109379845A (en) | A kind of multilayer circuit board processing technology containing PTFE | |
| CN203951682U (en) | High-performance coating lubricates cover plate | |
| CN204414730U (en) | A kind of cover plate of PCB back drill | |
| CN108811333A (en) | A method of improving back drill hole quality | |
| CN201529793U (en) | Paper holding composite aluminium plate used in process of drilling print wiring board | |
| CN111002679A (en) | Back-drilling composite cover plate and machining process thereof | |
| CN106735433A (en) | A kind of processing method of PCB printed circuit board (PCB)s backboard drilling | |
| CN105009697B (en) | High-speed printed circuit board with uniform via interior diameter | |
| KR101749606B1 (en) | Miniature drill bit and machining method therefor | |
| CN105945326A (en) | Circuit board drilling cover plate for deep drilling control and control method | |
| JPH11277499A (en) | Backup board for printed wiring board | |
| CN108790356A (en) | Boring paper substrate lubrication cover board of a kind of printed circuit board and preparation method thereof | |
| CN220517736U (en) | Aluminium plate for deep drilling control | |
| CN204076967U (en) | Coating backing plate | |
| JP2004087779A (en) | Through hole forming method | |
| CN202310306U (en) | Positioning and processing structure of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191231 |
|
| RJ01 | Rejection of invention patent application after publication |