CN116528499A - Manufacturing process of ultrathin hard board printing ink for keyboard - Google Patents
Manufacturing process of ultrathin hard board printing ink for keyboard Download PDFInfo
- Publication number
- CN116528499A CN116528499A CN202310670455.3A CN202310670455A CN116528499A CN 116528499 A CN116528499 A CN 116528499A CN 202310670455 A CN202310670455 A CN 202310670455A CN 116528499 A CN116528499 A CN 116528499A
- Authority
- CN
- China
- Prior art keywords
- pet film
- ink
- circuit board
- printing
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 229920002799 BoPET Polymers 0.000 claims abstract description 82
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims description 31
- 238000005520 cutting process Methods 0.000 claims description 24
- 238000005507 spraying Methods 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 15
- 239000007921 spray Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000011161 development Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Abstract
The invention discloses a manufacturing process of keyboard ultrathin hard board printing ink, wherein a PET film is attached to a non-printed surface of a thin circuit board; feeding the PET film to a printing table for printing, pre-baking and exposure; then tearing off the PET film and attaching the PET film to the printed ink surface; and pre-baking, exposing, developing and post-baking the other surface of the printed circuit board, thereby completing the manufacture of the ultrathin hard board printing ink. And (3) attaching the PET film adhesive surface to the circuit board. And (3) attaching the PET film to the circuit board, performing solder resist ink silk screen printing on a printer, covering the surface and holes of the circuit board by the ink, and performing pre-baking and exposure. After exposure, the PET film was repeatedly bonded to the printed ink surface without development, and then the other surface was subjected to solder resist ink printing. The purpose of undeveloped is to avoid developing ink in the holes to cause false copper exposure. Laminating PET lets printing ink fill the hole more firm full, lets the downthehole bubble that does not have, promotes the quality of circuit board.
Description
Technical Field
The invention relates to the technical field related to ultra-thin hard board ink printing, in particular to a manufacturing process of ultra-thin hard board ink for a keyboard.
Background
Along with the increase of functions of electronic products, the higher the circuit integration level is, the more precise the circuit is required, the thinner the thickness requirement is, and the conventional hard circuit board solder mask printing method cannot meet the requirement; the product is applied to integrated circuits in the fields of 5G communication, automobiles, consumer electronics and the like; the prior art of hard circuit board solder resist printing is that more than 6 ejector pins are arranged on a table top of a screen printer, the ejector pins are positioned in the middle of the circuit board to be printed, the circuit board is placed on the ejector pins to perform screen plug hole printing, printing ink is printed in holes to perform pre-baking, printing ink on the surface of the circuit board with good plug holes after pre-baking, printing the other surface, performing pre-baking, exposing, developing and post-baking, and finishing solder resist manufacture; in the existing hard circuit board solder resist manufacture, a circuit board is suspended in the air by a thimble on the table surface of a screen printer, hole plugging is carried out, and printing is carried out after hole plugging, so that the efficiency is low; the ultrathin hard circuit board has the defects of thinness, insufficient rigidity and easy cracking, and if the thin plate is jacked by the ejector pin for printing, the board can crack.
Disclosure of Invention
In order to solve the problems of hard circuit board resistance welding manufacture in the prior art, a circuit board is suspended in the air by a thimble on a table surface of a screen printer, hole plugging is carried out, and printing is carried out after hole plugging, so that the efficiency is low; the invention provides a manufacturing process of ultrathin hard board ink for a keyboard, which has the defects that a board is thin, has insufficient rigidity and is easy to crack, and if a thimble is used for jacking the thin board for printing, the board can crack.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention discloses a manufacturing process of ultrathin hard board printing ink for a keyboard, which comprises the following steps of:
step 1, preparing a thin circuit board to be printed;
step 2, attaching a layer of PET film on the non-printed surface of the thin circuit board;
step 3, feeding the PET film attached with the layer to a printing table for printing, pre-baking and exposing;
step 4, tearing off the PET film and attaching the PET film to the printed ink surface;
and 5, pre-baking, exposing, developing and post-baking the other surface of the printed circuit board, thereby finishing the preparation of the ultrathin hard board printing ink.
In a preferred embodiment of the present invention, the PET film is coated with a layer of adhesive on PET, and the adhesive surface is bonded to a thin circuit board.
As a preferable technical scheme of the invention, the PET film feeding device further comprises a pressing device for feeding the PET film, the pressing device comprises a frame, a positioning plate is arranged on the frame, a positioning groove for positioning the thin circuit board is arranged on the positioning plate, a moving frame which moves transversely is arranged on the frame, a vertical downward telescopic cylinder is arranged on the moving frame, a pressing block is arranged at the telescopic end of the telescopic cylinder, a soft rubber block is arranged on the pressing block, an unreeling mechanism for unreeling the rolled PET film is further arranged on the positioning plate, a spraying mechanism for coating adhesive on the unreeled PET film is arranged on the frame, and a cutting mechanism for cutting the PET film after adhesive spraying is further arranged on the frame.
As a preferable technical scheme of the invention, the rubber block is of an arch structure.
As a preferable technical scheme of the invention, a soft buffer protection layer is arranged at the bottom of the positioning groove.
As a preferable technical scheme of the invention, the spraying mechanism is used for spraying the bottom surface of the PET film in the unreeling process, the spraying mechanism comprises a spray head which is fixed on a positioning seat through a positioning frame and faces upwards, and the frame is also provided with a liquid supply device for supplying adhesive to the spray head.
As a preferable technical scheme of the invention, the positioning seat is provided with an opening roller group for opening the PET film at two sides of the spraying mechanism.
As a preferable technical scheme of the PET film cutting device, the cutting mechanism is arranged on the positioning plate and moves in opposite directions, and a clamping opening for the PET film to pass through is formed between the cutting blades at two sides.
As a preferable technical scheme of the invention, the positioning plate is also provided with a storage box for storing the cutting knife.
The beneficial effects of the invention are as follows:
1. the manufacturing process of the ultrathin hard board ink of the keyboard is to paste a layer of PET film on the unprinted surface of the thin circuit board; feeding the PET film to a printing table for printing, pre-baking and exposure; then tearing off the PET film and attaching the PET film to the printed ink surface; and pre-baking, exposing, developing and post-baking the other surface of the printed circuit board, thereby completing the manufacture of the ultrathin hard board printing ink. The PET film adhesive surface is attached to the circuit board, the hole on the circuit board is blocked mainly, ink leakage from the hole to the table top is avoided, the ink is easy to fill in the hole after printing, and hole plugging printing is not needed. And (3) attaching the PET film to the circuit board, performing solder resist ink silk screen printing on a printer, covering the surface and holes of the circuit board by the ink, and performing pre-baking and exposure. After exposure, the PET film was repeatedly bonded to the printed ink surface without development, and then the other surface was subjected to solder resist ink printing. The purpose of undeveloped is to avoid developing ink in the holes to cause false copper exposure. Laminating PET lets printing ink fill the hole more firm full, lets the downthehole bubble that does not have, promotes the quality of circuit board.
2. The manufacturing process of the ultrathin hard board ink for the keyboard improves the processing capacity of the ultrathin hard circuit board and improves the efficiency; the yield of the solder resist ink is improved; the printing damage of the board is improved; the ink is prevented from polluting equipment tools, and the service life is prolonged.
3. According to the manufacturing process of the ultra-thin hard board printing ink of the keyboard, a specific PET film is arranged for film pasting, the PET film is manually pulled to be laid, then an adhesive is sprayed to the bottom surface of the PET film by using a spraying mechanism, then the PET film is covered on a thin circuit board, then a telescopic cylinder is used for pressing down, a rubber block at the bottom of a pressing block is driven to be contacted with the thin circuit board, then a moving frame which moves transversely is used for driving the rubber block to move, so that the PET film is flattened, the PET film is tightly attached to the thin circuit board, the ink filling hole is firmer and plump, no bubble exists in the hole, the quality of the circuit board is improved, then the PET film is cut off by using a cutting mechanism, and the next film pasting action can be performed.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
In the drawings:
FIG. 1 is a flow chart of a process for manufacturing the ultra-thin hard plate ink of the keyboard;
FIG. 2 is a schematic diagram of a pressing device for a process of manufacturing ink on an ultrathin hard board of a keyboard according to the invention;
fig. 3 is a film-like state diagram of a pressing device of the process for manufacturing the ultra-thin hard plate ink of the keyboard.
In the figure: 1. a frame; 2. a positioning plate; 3. a positioning groove; 4. a moving rack; 5. a telescopic cylinder; 6. pressing the blocks; 7. a rubber block; 8. an unreeling mechanism; 9. a spraying mechanism; 10. a cutting mechanism; 11. a buffer protection layer; 13. a spray head; 15. an opening roller group; 16. a cutting knife; 17. and a storage box.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Examples: as shown in FIG. 1, the process for manufacturing the ultrathin hard board ink for the keyboard comprises the following steps of:
step 1, preparing a thin circuit board to be printed;
step 2, attaching a layer of PET film on the non-printed surface of the thin circuit board;
step 3, feeding the PET film attached with the layer to a printing table for printing, pre-baking and exposing;
step 4, tearing off the PET film and attaching the PET film to the printed ink surface;
and 5, pre-baking, exposing, developing and post-baking the other surface of the printed circuit board, thereby finishing the preparation of the ultrathin hard board printing ink.
The PET film is formed by coating a layer of adhesive on PET, and the adhesive surface is attached to a thin circuit board. A PET film is stuck on the non-printed surface of the thin circuit board; feeding the PET film to a printing table for printing, pre-baking and exposure; then tearing off the PET film and attaching the PET film to the printed ink surface; and pre-baking, exposing, developing and post-baking the other surface of the printed circuit board, thereby completing the manufacture of the ultrathin hard board printing ink. The PET film adhesive surface is attached to the circuit board, the hole on the circuit board is blocked mainly, ink leakage from the hole to the table top is avoided, the ink is easy to fill in the hole after printing, and hole plugging printing is not needed. And (3) attaching the PET film to the circuit board, performing solder resist ink silk screen printing on a printer, covering the surface and holes of the circuit board by the ink, and performing pre-baking and exposure. After exposure, the PET film was repeatedly bonded to the printed ink surface without development, and then the other surface was subjected to solder resist ink printing. The purpose of undeveloped is to avoid developing ink in the holes to cause false copper exposure. Laminating PET lets printing ink fill the hole more firm full, lets the downthehole bubble that does not have, promotes the quality of circuit board.
The manufacturing process of the ultrathin hard board ink for the keyboard improves the processing capacity of the ultrathin hard circuit board and improves the efficiency; the yield of the solder resist ink is improved; the printing damage of the board is improved; the ink is prevented from polluting equipment tools, and the service life is prolonged.
Wherein, as shown in fig. 2 and 3, still include the pressing device that is used for going on the membrane to the PET membrane, just pressing device includes frame 1, just be equipped with locating plate 2 in the frame 1, be equipped with on the locating plate 2 and be used for thin circuit board to carry out the constant head tank 3 that fixes a position, be equipped with lateral shifting's removal frame 4 in the frame 1, just be equipped with vertical decurrent telescopic cylinder 5 on the removal frame 4, just the telescopic end of telescopic cylinder 5 is equipped with presses the piece 6, be equipped with soft rubber piece 7 on the pressing piece 6, just still be equipped with on the locating plate and be used for unreeling the unreeling mechanism 8 of going on the PET membrane of roll-shape, just be equipped with on the frame 1 be used for carrying out adhesive coated spraying mechanism 9 on the PET membrane after unreeling, just frame 1 still is equipped with and is used for carrying out the cutting mechanism 10 that cuts to the PET membrane after spraying the adhesive. The PET film is pasted through setting up specific PET film and going up the membrane, wherein pull the PET film through manual, then utilize spraying mechanism 9 to spray the adhesive to the bottom surface of PET film, then cover on thin circuit board, then utilize telescopic cylinder 5 to push down, drive the rubber piece of pressing block 6 bottom and thin circuit board contact, then utilize lateral shifting's removal frame 4 to drive the rubber piece and remove, the flattening is carried out to the PET film, make PET film and thin circuit board closely laminate, thereby the printing ink filling hole is more firm full, let the downthehole bubble of no, promote the quality of circuit board, then utilize cutting mechanism 10 to cut off the PET film, can carry out the pad pasting action of next.
Wherein the rubber block 7 is of an arch structure. The PET film is pressed and smoothed when being convenient for left and right lateral movement, and the damage to the PET film and the thin circuit board can not be caused.
Wherein, the bottom of the positioning groove 3 is provided with a soft buffer protection layer 11 which plays a role of buffer protection for the thin circuit board.
The spraying mechanism 9 is used for spraying the bottom surface of the PET film in the unreeling process, the spraying mechanism 9 comprises a spray head 13 which is fixed on the positioning seat 1 through a positioning frame and faces upwards, and the frame 1 is further provided with liquid supply equipment for supplying adhesive to the spray head 13, so that the PET film is conveniently sprayed with the adhesive, and the existing spraying mode is adopted, so that good adhesive effect is ensured.
The positioning seat 1 is provided with an opening roller set 15 for opening the PET film at two sides of the spraying mechanism 9, so that the PET film can be conveniently pulled, and one side of the opening roller set 15, which is close to the cutting mechanism 10, is a rubber roller.
The cutting mechanism 10 is provided with cutting blades 16 which are arranged on the positioning plate 1 and move in opposite directions, and a clamping opening for the PET film to pass through is formed between the cutting blades 16 at two sides, so that the PET film can be conveniently cut.
The locating plate 1 is further provided with a storage box 17 for storing the cutting knife 16, and the cutting knife 16 is stored in the storage box when the PET film is not cut, so that workers are prevented from being scratched.
The PET film is pasted through setting up specific PET film and going up the membrane, wherein pull the PET film through manual, then utilize spraying mechanism 9 to spray the adhesive to the bottom surface of PET film, then cover on thin circuit board, then utilize telescopic cylinder 5 to push down, drive the rubber piece of pressing block 6 bottom and thin circuit board contact, then utilize lateral shifting's removal frame 4 to drive the rubber piece and remove, the flattening is carried out to the PET film, make PET film and thin circuit board closely laminate, thereby the printing ink filling hole is more firm full, let the downthehole bubble of no, promote the quality of circuit board, then utilize cutting mechanism 10 to cut off the PET film, can carry out the pad pasting action of next.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The manufacturing process of the ultrathin hard board printing ink for the keyboard is characterized by comprising the following steps of:
step 1, preparing a thin circuit board to be printed;
step 2, attaching a layer of PET film on the non-printed surface of the thin circuit board;
step 3, feeding the PET film attached with the layer to a printing table for printing, pre-baking and exposing;
step 4, tearing off the PET film and attaching the PET film to the printed ink surface;
and 5, pre-baking, exposing, developing and post-baking the other surface of the printed circuit board, thereby finishing the preparation of the ultrathin hard board printing ink.
2. The process for manufacturing the ultrathin hard board ink for the keyboard according to claim 1, wherein the PET film is formed by coating a layer of adhesive on PET, and the adhesive surface is attached to a thin circuit board.
3. The process for manufacturing the ultra-thin hard board ink for the keyboard according to claim 1, further comprising a pressing device for applying the film to the PET film, wherein the pressing device comprises a frame (1), the frame (1) is provided with a positioning plate (2), the positioning plate (2) is provided with a positioning groove (3) for positioning a thin circuit board, the frame (1) is provided with a moving frame (4) which moves transversely, the moving frame (4) is provided with a vertically downward telescopic cylinder (5), the telescopic end of the telescopic cylinder (5) is provided with a pressing block (6), the pressing block (6) is provided with a soft rubber block (7), the positioning plate is further provided with a unreeling mechanism (8) for unreeling the rolled PET film, the frame (1) is provided with a spraying mechanism (9) for coating adhesive on the unreeled PET film, and the frame (1) is further provided with a cutting mechanism (10) for cutting the PET film after adhesive spraying.
4. A process for manufacturing an ultra-thin hard-sheet ink for keyboards according to claim 3, wherein the rubber block (7) has an arch structure.
5. The process for manufacturing the ultrathin hard board ink for the keyboard according to claim 3, wherein a soft buffer protection layer (11) is arranged at the bottom of the positioning groove (3).
6. A process for manufacturing ultra-thin hard-board ink for keyboards according to claim 3, characterized in that the spraying mechanism (9) is used for spraying the bottom surface of the PET film in the unreeling process, the spraying mechanism (9) comprises a spray head (13) which is fixed on the positioning seat (1) through a positioning frame and faces upwards, and the frame (1) is further provided with a liquid supply device for providing adhesive for the spray head (13).
7. The process for manufacturing the ultra-thin hard board ink for the keyboard according to claim 6, wherein the positioning seat (1) is provided with an opening roller set (15) for opening the PET film at two sides of the spraying mechanism (9).
8. A process for manufacturing ultra-thin hard ink for keyboards according to claim 3, wherein the cutting mechanism (10) is arranged on the positioning plate (1) and is provided with cutting blades (16) which move in opposite directions, and a clamping opening for the PET film to pass through is formed between the cutting blades (16) at two sides.
9. The process for manufacturing the ultrathin hard board ink for the keyboard according to claim 3, wherein the positioning board (1) is further provided with a storage box (17) for storing the cutting knife (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310670455.3A CN116528499A (en) | 2023-06-07 | 2023-06-07 | Manufacturing process of ultrathin hard board printing ink for keyboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310670455.3A CN116528499A (en) | 2023-06-07 | 2023-06-07 | Manufacturing process of ultrathin hard board printing ink for keyboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116528499A true CN116528499A (en) | 2023-08-01 |
Family
ID=87408458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310670455.3A Pending CN116528499A (en) | 2023-06-07 | 2023-06-07 | Manufacturing process of ultrathin hard board printing ink for keyboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116528499A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117295260A (en) * | 2023-11-23 | 2023-12-26 | 四川英创力电子科技股份有限公司 | Multilayer soft and hard combined printed circuit board and manufacturing method thereof |
-
2023
- 2023-06-07 CN CN202310670455.3A patent/CN116528499A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117295260A (en) * | 2023-11-23 | 2023-12-26 | 四川英创力电子科技股份有限公司 | Multilayer soft and hard combined printed circuit board and manufacturing method thereof |
| CN117295260B (en) * | 2023-11-23 | 2024-01-30 | 四川英创力电子科技股份有限公司 | Multilayer soft and hard combined printed circuit board and manufacturing method thereof |
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