CN112366194B - 一种桥接芯片及半导体封装结构 - Google Patents
一种桥接芯片及半导体封装结构 Download PDFInfo
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- CN112366194B CN112366194B CN202011205798.5A CN202011205798A CN112366194B CN 112366194 B CN112366194 B CN 112366194B CN 202011205798 A CN202011205798 A CN 202011205798A CN 112366194 B CN112366194 B CN 112366194B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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CN202011205798.5A CN112366194B (zh) | 2020-11-02 | 2020-11-02 | 一种桥接芯片及半导体封装结构 |
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CN202011205798.5A CN112366194B (zh) | 2020-11-02 | 2020-11-02 | 一种桥接芯片及半导体封装结构 |
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CN112366194A CN112366194A (zh) | 2021-02-12 |
CN112366194B true CN112366194B (zh) | 2022-04-12 |
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Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4318417B2 (ja) * | 2001-10-05 | 2009-08-26 | ソニー株式会社 | 高周波モジュール基板装置 |
US20080093726A1 (en) * | 2006-10-23 | 2008-04-24 | Francesco Preda | Continuously Referencing Signals over Multiple Layers in Laminate Packages |
WO2010057339A1 (en) * | 2008-11-19 | 2010-05-27 | Hong Kong Applied Science and Technology Research Institute Co. Ltd | Semiconductor chip with through-silicon-via and sidewall pad |
US8773866B2 (en) * | 2010-12-10 | 2014-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Radio-frequency packaging with reduced RF loss |
JP6322345B2 (ja) * | 2015-08-20 | 2018-05-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN205320364U (zh) * | 2015-11-13 | 2016-06-15 | 唐水 | 一种pcb板结构 |
CN105428347A (zh) * | 2015-12-28 | 2016-03-23 | 中南大学 | 一种微***三维芯片叠层封装的改进方法 |
CN109087905B (zh) * | 2017-06-14 | 2020-09-29 | 创意电子股份有限公司 | 半导体封装装置及其半导体配线基板 |
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- 2020-11-02 CN CN202011205798.5A patent/CN112366194B/zh active Active
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CB03 | Change of inventor or designer information |
Inventor after: He Yongsong Inventor after: Chen Xiaoqiang Inventor after: Yu Jinjin Inventor after: Qin Zheng Inventor after: Gu Donghua Inventor after: Yin Pengyue Inventor after: Chai Jing Inventor after: Qiu Xuesong Inventor before: He Yongsong Inventor before: Chen Xiaoqiang Inventor before: Yu Jinjin Inventor before: Qin Zheng Inventor before: Gu Donghua Inventor before: Yin Pengyue Inventor before: Chai Jing Inventor before: Qiu Xuesong |
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