CN112304474A - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
- Publication number
- CN112304474A CN112304474A CN202011349215.6A CN202011349215A CN112304474A CN 112304474 A CN112304474 A CN 112304474A CN 202011349215 A CN202011349215 A CN 202011349215A CN 112304474 A CN112304474 A CN 112304474A
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- China
- Prior art keywords
- pressure
- cavity
- sensing structure
- pressure sensor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 108010053481 Antifreeze Proteins Proteins 0.000 claims 1
- 230000002528 anti-freeze Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 5
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000003921 oil Substances 0.000 description 30
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 11
- 239000004202 carbamide Substances 0.000 description 11
- 229920002545 silicone oil Polymers 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000007710 freezing Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/02—Measuring force or stress, in general by hydraulic or pneumatic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/18—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements using liquid as the pressure-sensitive medium, e.g. liquid-column gauges
- G01L7/182—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements using liquid as the pressure-sensitive medium, e.g. liquid-column gauges constructional details, e.g. mounting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a pressure sensor which comprises a shell, a metal piece, a pressure chip, a pressure joint and a pressure sensing structure, wherein the shell is provided with an installation cavity, the metal piece is installed in the installation cavity and provided with a first surface and a second surface which are opposite along a first direction, the metal piece is provided with a pressure hole in a penetrating mode along the first direction, the pressure chip is installed on the first surface and is opposite to the pressure hole, the pressure joint is installed on the second surface and is enclosed with the metal piece to form a cavity, and the pressure sensing structure is arranged between the metal piece and the pressure joint to divide the cavity into an upper cavity and a lower cavity which are used for filling a transmission medium.
Description
Technical Field
The embodiment of the invention relates to the technical field of pressure sensors, in particular to a pressure sensor.
Background
The pressure sensor, such as a urea pressure sensor, is a sensor of the SCR urea injection system for engine aftertreatment, and performs urea pressure monitoring to determine the urea injection amount. In the pressure sensor in the prior art (the same situation exists in other liquids or gases except for urea TO be tested, and the urea pressure sensor is taken as an example in the invention), a shell is sealed by a metal base, an oil-filled cavity is formed between the metal base and a pressure sensing structure, a pressure chip is installed on the metal base (namely, a TO base) and is positioned in the oil-filled cavity, so that after the pressure is transmitted TO the pressure sensing structure, the pressure sensing structure transmits the pressure TO a medium (taking silicon oil as an example) in the oil-filled cavity, and the front of the pressure chip senses the pressure of the silicon oil TO measure the urea pressure.
However, the pressure chip, and the bonding of the pressure chip and other components by gold wires and the like increase the height of the oil-filled cavity, so that the volume in the oil-filled cavity is increased, and the oil amount in the oil-filled cavity is increased. When the temperature is higher, the silicone oil in the oil filling cavity expands to apply pressure to the pressure chip, and the more the silicone oil is, the larger the generated thermal expansion volume is, the larger the pressure applied to the pressure chip by the silicone oil in the oil filling cavity is, the output of the pressure chip is influenced, and the temperature drift is generated;
further, the TO base is high in cost, glass is needed for sealing, high-temperature leakage risks exist due TO the influence of a glass sintering process, and high-temperature resistance is poor.
Disclosure of Invention
The invention aims to provide a pressure sensor, and aims to solve the problems that the pressure sensor is easy to generate temperature drift, high in cost and high in leakage risk.
To solve the above technical problem, an embodiment of the present invention provides a pressure sensor including:
a housing having a mounting cavity;
the metal piece is arranged in the mounting cavity and provided with a first surface and a second surface which are opposite along a first direction, and a pressure hole penetrates through the metal piece along the first direction;
the pressure chip is arranged on the first surface and is opposite to the pressure hole;
the pressure joint is arranged on the second surface and forms a cavity together with the metal piece in an enclosing manner; and the number of the first and second groups,
and the pressure sensing structure is arranged between the metal piece and the pressure joint so as to divide the cavity into an upper cavity and a lower cavity which are used for filling a transmission medium.
The invention is provided with a metal piece
Preferably, the pressure sensing structure is mounted on the second face and completely covers the pressure hole;
the inner wall of the pressure port defines the upper chamber.
Preferably, the pressure sensing structure is clamped and mounted between the metal piece and the pressure joint;
the middle part of the second surface is sunken towards the first surface to form an accommodating cavity, and the accommodating cavity and the pressure hole jointly define an upper cavity.
Preferably, the pressure sensing structure is clamped between the metal piece and the pressure fitting and then welded together.
Preferably, the pressure-sensitive structure is a corrugated sheet.
Preferably, the pressure chip has a sensing surface and a mounting surface opposite to the sensing surface, and the mounting surface is disposed opposite to the first surface.
Preferably, the electronic device further comprises a circuit board, wherein the circuit board is mounted on the first face.
Preferably, the circuit board is provided with a mounting groove, and the pressure chip is located in the mounting groove.
Preferably, the pressure joint is provided with a through hole along a first direction, and the through hole and the pressure sensing structure define a lower cavity therebetween.
Preferably, the through hole is filled with an anti-freezing piece.
The invention is provided with a pressure hole along a first direction through the metal piece, a pressure chip is arranged on the first surface and is opposite to the pressure hole, a pressure joint is arranged on the second surface, and forms a cavity together with the metal piece, the pressure sensing structure is arranged between the metal piece and the pressure joint to divide the cavity into an upper cavity and a lower cavity, the upper cavity is filled with a transfer medium, urea (or other liquid or gas) enters the lower cavity, the pressure sensing structure senses pressure and then transmits the pressure to the transmission medium in the upper cavity, the transmission medium transmits the pressure to the pressure chip, because the pressure chip is arranged away from the cavity, the height of the upper cavity is not limited by the pressure chip and the like, and the volume of the upper cavity can be small (the size of the upper cavity can even be only the size of the volume in the pressure hole), so that the oil filling amount is controlled, and the temperature drift is reduced;
furthermore, the pressure chip is arranged on the first surface of the metal piece by adopting a common metal piece, the pressure joint is arranged on the second surface, the pressure sensing structure is arranged between the metal piece and the pressure joint TO divide the cavity into an upper cavity and a lower cavity, and the upper cavity is filled with the transfer medium, so that the pressure chip is prevented from being arranged on the upper cavity, the amount of the transfer medium (generally silicon oil) filled in the upper cavity can be reduced, the product precision is improved, and the temperature sensing device can be suitable for a higher temperature range compared with a TO seat or a sintering seat.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic perspective view of an embodiment of a pressure sensor according to the present invention;
FIG. 2 is a cross-sectional view of one embodiment of FIG. 1;
FIG. 3 is a schematic view of FIG. 2 from another perspective;
fig. 4 is a partial schematic view of the metal part of fig. 2.
The invention is illustrated by the reference numerals:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
4 | |
| 1 | |
41 | Through |
| 2 | |
5 | |
| 21 | |
6 | |
| 22 | |
61 | |
| 23 | |
62 | |
| 24 | Containing cavity | 7 | |
| 3 | |
71 | Mounting groove |
| 31 | |
8 | |
| 32 | Mounting surface | 9 | Dust-proof cap |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1 to 4, the pressure sensor 100 includes a housing 1, a metal member 2, a pressure chip 3, a pressure connector 4, and a pressure sensing structure 5, wherein the housing 1 has a mounting cavity, the metal member 2 is mounted in the mounting cavity and has a first surface 21 and a second surface 22 opposite to each other along a first direction, the metal member 2 is provided with a pressure hole 23 penetrating along a first direction (in this embodiment, the first direction is a vertical direction), the pressure chip 3 is mounted on the first surface 21 and is arranged opposite to the pressure hole 23, the pressure joint 4 is mounted on the second surface 22, and forms a cavity 6 with the metal piece 2, the pressure sensing structure 5 is arranged between the metal piece 2 and the pressure joint 4, to divide the chamber 6 into an upper chamber 61 and a lower chamber 62 for filling with a transmission medium (in this embodiment, the transmission medium is silicone oil).
In the pressure sensor (taking a urea pressure sensor as an example) in the prior art, a shell is sealed by a metal base, an oil filling cavity is formed between the metal base and a pressure sensing structure, a pressure chip is installed on the metal base (namely, a TO base) and is located in the oil filling cavity, after the pressure is transmitted TO the pressure sensing structure 5, the pressure sensing structure transmits the pressure TO a medium (taking silicon oil as an example) in the oil filling cavity, and the front surface of the pressure chip senses the pressure of the silicon oil TO measure the urea pressure. However, the pressure chip, and the bonding of the pressure chip and other components by gold wires and the like increase the height of the oil-filled cavity, so that the volume in the oil-filled cavity is increased, and the oil amount in the oil-filled cavity is increased. When the temperature is higher, the silicone oil in the oil filling cavity expands to apply pressure to the pressure chip, the more the silicone oil is, the larger the thermal expansion volume is, and the more the silicone oil in the oil filling cavity applies pressure to the pressure chip, the more the output of the pressure chip is influenced, and the temperature drift is generated.
Referring to fig. 2 and 3, in the present invention, a pressure hole 23 is formed through the metal member 2 along a first direction, the pressure chip 3 is mounted on the first surface 21 and is disposed opposite to the pressure hole 23, the pressure joint 4 is mounted on the second surface 22 and surrounds the metal member 2 to form a cavity 6, the pressure sensing structure 5 is disposed between the metal member 2 and the pressure joint 4 to divide the cavity 6 into an upper cavity 61 and a lower cavity 62, the upper cavity 61 is filled with a transmission medium, urea enters the lower cavity 62, the pressure sensing structure 5 senses pressure and transmits the pressure to the transmission medium in the upper cavity 61, the transmission medium transmits the pressure to the pressure chip 3, since the pressure chip 3 is disposed away from the cavity 6, the height of the upper cavity 61 is not limited by the pressure chip 3, and the like, the volume of the upper cavity 61 can be small (the size of the upper cavity 61 may even be only the size of the volume in the pressure hole 23), thereby controlling the oil filling amount and reducing the temperature drift.
The pressure sensing structure 5 (in this embodiment, the pressure sensing structure 5 is a corrugated sheet, the corrugated sheet may be made of stainless steel, or may be a noble metal diaphragm, and no specific limitation is made herein), and there may be a plurality of installation forms, where the pressure sensing structure 5 is installed on the second surface 22, and completely covers the pressure hole 23, so that the inner wall of the pressure hole 23 defines the upper cavity 61, and thus, the size of the upper cavity 61 is only the volume size in the pressure hole 23, that is, the oil filling amount is small, the thermal expansion of the silicone oil is smaller, and during specific installation, since the pressure sensing structure 5 is usually a metal corrugated sheet, during installation, the pressure sensing structure 5 is usually welded to the second surface 22; referring to fig. 3, the pressure sensing structure 5 may be clamped and installed between the metal member 2 and the pressure connector 4, a middle portion of the second surface 22 is recessed toward the first surface 21 to form a receiving cavity 24, and the receiving cavity 24 and the pressure hole 23 together define an upper cavity 61. Because the accommodating cavity 24 is not influenced by the heights of the pressure chip 3 and the like, the size of the accommodating cavity 24 can be controlled according to actual needs, and the oil filling amount is reduced. Specifically, the pressure sensing structure 5 is clamped between the metal piece 2 and the pressure joint 4 and then welded together, the pressure sensing structure 5 is easy to weld and low in requirement on welding equipment, the diameter of the pressure sensing structure 5 can be larger in such a way, when the pressure sensing structure 5 is smaller, the heat affected zone of the pressure sensing structure 5 is closer to the sensing zone, the performance of the pressure sensing structure 5 is reduced, the pressure sensed by a chip and transmitted by a pressure sensing element is deviated from the actual pressure, a small-range chip is sensitive, the pressure and the actual pressure difference measured by the chip are larger, the measurement accuracy is reduced, the diameter of the pressure sensing structure 5 can be increased, the temperature drift is reduced, the measurement accuracy is improved, and the overall height of the pressure sensor 100 cannot be increased.
Specifically, the pressure chip 3 has a sensing surface 31 and a mounting surface 32 opposite to the sensing surface 31, and the mounting surface 32 is disposed opposite to the first surface 21. Namely, the pressure chip 3 adopts back pressure sensing, and the pressure chip 3 is arranged outside the oil-filled cavity, so that the situation that the volume of the oil-filled cavity (the upper cavity 61 in the invention) is overlarge due to the requirement of the pressure chip 3 on the same size is avoided compared with the situation that the pressure chip 3 is arranged in the oil-filled cavity due to the front pressure sensing.
In addition, the circuit board 7 is further included, and the circuit board 7 is mounted on the first face 21. In order to reduce the overall height, the circuit board 7 is provided with a mounting groove 71, and the pressure chip 3 is located in the mounting groove 71. The pressure joint 4 is provided with a through hole 41 along a first direction, and the through hole 41 and the pressure sensing structure 5 define a lower cavity 62 therebetween. The through hole 41 is filled with the anti-freezing piece 8, and in the embodiment, the anti-freezing piece 8 is a silica gel foaming tube, so that anti-freezing can be effectively performed. It should be noted that the pressure sensor further includes a dust cap 9, a waterproof and breathable film, etc., which may be conventional technologies and are not described herein again.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A pressure sensor, comprising:
a housing having a mounting cavity;
the metal piece is arranged in the mounting cavity and provided with a first surface and a second surface which are opposite along a first direction, and a pressure hole penetrates through the metal piece along the first direction;
the pressure chip is arranged on the first surface and is opposite to the pressure hole;
the pressure joint is arranged on the second surface and forms a cavity together with the metal piece in an enclosing manner; and the number of the first and second groups,
and the pressure sensing structure is arranged between the metal piece and the pressure joint so as to divide the cavity into an upper cavity and a lower cavity which are used for filling a transmission medium.
2. The pressure sensor of claim 1, wherein the pressure sensing structure is mounted on the second face and completely covers the pressure aperture;
the inner wall of the pressure port defines the upper chamber.
3. The pressure sensor of claim 1, wherein said pressure sensing structure is sandwiched and mounted between said metal member and said pressure fitting;
the middle part of the second surface is sunken towards the first surface to form an accommodating cavity, and the accommodating cavity and the pressure hole jointly define an upper cavity.
4. The pressure sensor of claim 3, wherein the pressure sensing structure is clamped between the metal piece and the pressure fitting and then welded together.
5. The pressure sensor of any of claims 1-4, wherein the pressure sensing structure is a corrugated sheet.
6. The pressure sensor of claim 1, wherein the pressure chip has a sensing surface and a mounting surface opposite the sensing surface, the mounting surface being disposed opposite the first surface.
7. The pressure sensor of claim 1, further comprising a circuit board mounted to the first face.
8. The pressure sensor of claim 7, wherein the circuit board is provided with a mounting slot, the pressure chip being located in the mounting slot.
9. The pressure sensor of claim 1, wherein the pressure fitting has a through-hole extending therethrough in a first direction, the through-hole and the pressure sensing structure defining the lower cavity therebetween.
10. The pressure sensor of claim 9, wherein the through hole is filled with an anti-freeze.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911227446.7A CN110806279A (en) | 2019-12-04 | 2019-12-04 | Low-temperature drift pressure sensor |
| CN2019112274467 | 2019-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112304474A true CN112304474A (en) | 2021-02-02 |
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ID=69492443
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911227446.7A Pending CN110806279A (en) | 2019-12-04 | 2019-12-04 | Low-temperature drift pressure sensor |
| CN202011349215.6A Pending CN112304474A (en) | 2019-12-04 | 2020-11-26 | Pressure sensor |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911227446.7A Pending CN110806279A (en) | 2019-12-04 | 2019-12-04 | Low-temperature drift pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110806279A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113776728A (en) * | 2021-09-17 | 2021-12-10 | 深圳科维新技术有限公司 | Pressure transmission cavity structure for avoiding liquid low-temperature crystallization |
| WO2024124767A1 (en) * | 2022-12-13 | 2024-06-20 | 武汉飞恩微电子有限公司 | Pressure sensor |
| WO2024124765A1 (en) * | 2022-12-13 | 2024-06-20 | 武汉飞恩微电子有限公司 | Pressure sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419235A (en) * | 2010-09-28 | 2012-04-18 | 刘胜 | Gas pressure sensor |
| CN106289634A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of metal shell for pressure sensor package combines |
| CN107907262A (en) * | 2017-12-20 | 2018-04-13 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducers for negative pressure measurement |
| CN208399071U (en) * | 2018-07-27 | 2019-01-18 | 扬州扬杰电子科技股份有限公司 | Silicon piezoresistance type pressure sensor packaging structure |
| CN208833429U (en) * | 2018-09-27 | 2019-05-07 | 江苏德尔森控股有限公司 | A kind of small flame-proof pressure sensor |
| CN209356116U (en) * | 2019-01-29 | 2019-09-06 | 上海海华传感器有限公司 | A kind of urea pressure sensor |
| CN214010595U (en) * | 2020-11-26 | 2021-08-20 | 武汉飞恩微电子有限公司 | Pressure sensor |
-
2019
- 2019-12-04 CN CN201911227446.7A patent/CN110806279A/en active Pending
-
2020
- 2020-11-26 CN CN202011349215.6A patent/CN112304474A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419235A (en) * | 2010-09-28 | 2012-04-18 | 刘胜 | Gas pressure sensor |
| CN106289634A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of metal shell for pressure sensor package combines |
| CN107907262A (en) * | 2017-12-20 | 2018-04-13 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducers for negative pressure measurement |
| CN208399071U (en) * | 2018-07-27 | 2019-01-18 | 扬州扬杰电子科技股份有限公司 | Silicon piezoresistance type pressure sensor packaging structure |
| CN208833429U (en) * | 2018-09-27 | 2019-05-07 | 江苏德尔森控股有限公司 | A kind of small flame-proof pressure sensor |
| CN209356116U (en) * | 2019-01-29 | 2019-09-06 | 上海海华传感器有限公司 | A kind of urea pressure sensor |
| CN214010595U (en) * | 2020-11-26 | 2021-08-20 | 武汉飞恩微电子有限公司 | Pressure sensor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113776728A (en) * | 2021-09-17 | 2021-12-10 | 深圳科维新技术有限公司 | Pressure transmission cavity structure for avoiding liquid low-temperature crystallization |
| CN113776728B (en) * | 2021-09-17 | 2024-06-04 | 深圳科维新技术有限公司 | Pressure transmission cavity structure for avoiding liquid low-temperature crystallization |
| WO2024124767A1 (en) * | 2022-12-13 | 2024-06-20 | 武汉飞恩微电子有限公司 | Pressure sensor |
| WO2024124765A1 (en) * | 2022-12-13 | 2024-06-20 | 武汉飞恩微电子有限公司 | Pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110806279A (en) | 2020-02-18 |
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