CN102419235A - Gas pressure sensor - Google Patents
Gas pressure sensor Download PDFInfo
- Publication number
- CN102419235A CN102419235A CN2010102959039A CN201010295903A CN102419235A CN 102419235 A CN102419235 A CN 102419235A CN 2010102959039 A CN2010102959039 A CN 2010102959039A CN 201010295903 A CN201010295903 A CN 201010295903A CN 102419235 A CN102419235 A CN 102419235A
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- silica gel
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- pressure
- pressure chip
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Abstract
The invention provides a gas pressure sensor, which comprises a protective cover plate, silica gel, a lead wire, a pressure chip, a shell and a base. The gas pressure sensor is characterized in that: the pressure chip is adhered to the base; a wiring terminal on the base is bonded with the pressure chip through the lead wire; the protective silica gel is applied to the pressure chip and the lead wire; and the protective cover plate is arranged on the upper end of the shell, and is provided with an air inlet test hole. The gas pressure sensor has the advantages of simple structure and encapsulation process, low cost, high reliability and long service life, and is suitable for measurement of most non-corrosive gas and dry air medium pressure.
Description
Technical field
The present invention relates to a kind of pressure test element, particularly a kind of gas pressure sensor.
Background technology
Gas pressure sensor is in pneumatic control, pressure switch and controller, and portable pressure gage and pressure gauge, MAP fields such as (manifold absolute pressure sensor) has a wide range of applications.These fields are except very high to sensitivity, stability and the life requirement of sensor, and the special demands packaging technology is simple, with low cost, economic and practical.And the pressure transducer of other packaged type such as the oil-filled encapsulation of isolation diaphragm; Need stuffing pressure transmission medium (like silicone oil) and soldering stainless steel convoluted diaphragm to isolate testing medium and sensor chip; And oil-filled process complicacy is difficult to control; The heat that produces during the soldering stainless steel convoluted diaphragm can exert an influence to the characteristic of chip itself, can make chip failure when serious.Thereby, for the sensor of above-mentioned packaged type, there are certain deficiency and defective.
Summary of the invention
The objective of the invention is provides a kind of gas pressure sensor to the defective that exists in the prior art.The present invention is applicable to the sensor of measuring the non-corrosiveness gaseous tension; Through silica gel isolated pressure chip and testing medium, transmit pressure and protect cell pressure chip and bonding wire; Increase influence and destruction that protecting cover plate protection silica gel does not receive foreign matter in the potting process in the upper end of metal shell or sintering seat; Reduced the repair that applies silica gel when producing, simultaneously also indirect protection pressure chip and bonding wire, thereby the long-term stability that realizes gaseous tension is at low cost measured.The present invention includes: cover sheet, silica gel, lead-in wire, pressure chip, shell, base; It is characterized in that being bonded with pressure chip on the described base; Binding post on the base and pressure chip lead-in wire bonding, pressure chip and lead-in wire are by being filled in silica gel protected in the cavity, and silica gel is kept apart pressure chip, lead-in wire and testing medium; And be that pressure chip, lead-in wire provide protection; Transmit the pressure of gas to be measured simultaneously as medium, the shell upper end is provided with cover sheet, and cover sheet is provided with the air inlet instrument connection.
Advantage of the present invention is:
1. adopt soft silica gel isolating chip and testing medium, both protected chip and bonding wire, transmitted the pressure of gas to be measured almost losslessly.Because the Young modulus of soft silica gel is very little, so in the process of solidifying and using,, thereby can ignore to the output characteristics influence of chip because of the stress that temperature cycles produced is very little.Secondly because coated silica gel layer upper surface leaves big gap with the cover sheet lower surface, so the stress that silica gel is produced in temperature raises expansion process upwards shed, thereby the output of chip is not basically influenced yet.
2. cover sheet protection silica gel, pressure chip and bonding wire are avoided polluting and damaging.On the chip after the silicon-coated adhesive curing; On cover sheet, be provided with the air inlet instrument connection; Influence and destruction that cover sheet protection silica gel does not receive foreign matter in the potting process; Reduced the repair that applies silica gel in producing, also protected pressure chip and bonding wire simultaneously indirectly, the air inlet instrument connection is realized the connection of testing medium and sensor sensing part.
3. this sensor has been avoided the welding technology of necessary oil-extended process of the oil-filled packaged type of isolation diaphragm and convoluted diaphragm; Have structure and packaging technology is simple, with low cost, reliability is high; Advantages such as the life-span is long are useful for the pressure survey of most of non-corrosive gases and dry air medium.
Description of drawings
Fig. 1 split-type structural synoptic diagram of the present invention;
Fig. 2 Contiuum type structural representation of the present invention.
Among the figure: 1 cover sheet, 2 silica gel, 3 lead-in wires, 4 shells, 5 pressure chips, 6TO base.7 metal sintering seats.
Embodiment
Embodiment one
Further specify embodiments of the invention below in conjunction with accompanying drawing:
Referring to Fig. 1; The present invention is applicable to the sensor of measuring the non-corrosiveness gaseous tension; Through silica gel 2 isolated pressure chips 5 with testing medium, transmit pressure and protect cell pressure chip 5 and bonding wire 3; Upper end at shell 4 increases cover sheet 1, and influence and destruction that cover sheet 1 has protected silica gel 2 not receive foreign matter in the potting process have been reduced the repair that applies silica gel when producing; Simultaneously also indirect protection pressure chip 5 and bonding wire 2, thereby the long-term stability that realizes gaseous tension is at low cost measured.Present embodiment is made up of cover sheet 1, silica gel 2, lead-in wire 3, shell 4, pressure chip 5, TO base 6.The form of the encapsulation of present embodiment is split type, and base is a TO base 6.TO base 6 is arranged on the bottom of shell 4; Be bonded with pressure chip 5 on the TO base 6, binding post on the TO base 6 and pressure chip 5 are filled with silica gel 2 through lead-in wire 3 bondings in the cavity of shell 4 and TO base 6 compositions; The lower surface of silica gel 2 upper surfaces and cover sheet 1 leaves the gap; Silica gel 2 is kept apart pressure chip 5, lead-in wire 3 with testing medium, and for pressure chip 5, lead-in wire 3 provide protection, transmits the pressure of gas to be measured simultaneously as medium; Shell 4 upper ends are provided with cover sheet 1, and cover sheet 1 is provided with the air inlet instrument connection.Lead-in wire 3 can be gold thread, aluminum steel and copper cash etc. according to different requirement.
Embodiment two
Embodiment two is identical with embodiment one; Different is that the form that encapsulates is the form of Contiuum type encapsulation, and referring to Fig. 2, base and shell are the metal sintering seats 7 of one; Metal sintering seat 7 inside are filled with silica gel 2; There is cover sheet 1 metal sintering seat 7 upper ends, and sintering seat 7 is bonded with pressure chip 5, the binding post of sintering seat 7 and pressure chip 5 lead-in wire bondings.
Claims (5)
1. gas pressure sensor; Comprise: cover sheet, silica gel, lead-in wire, pressure chip, shell, base; It is characterized in that described pressure chip is bonded on the base, binding post on the base and pressure chip lead-in wire bonding, pressure chip and lead-in wire are coated with protection silica gel; The shell upper end is provided with cover sheet, and cover sheet is provided with the air inlet instrument connection.
2. gas pressure sensor according to claim 1 is characterized in that said sensor is split type encapsulating structure, binding post on the TO base and pressure chip lead-in wire bonding, and the metal shell that links to each other with TO base upper end is provided with cover sheet.
3. gas pressure sensor according to claim 1; It is characterized in that said base is the Contiuum type encapsulating structure, base is the metal sintering seat of one, and there is cover sheet sintering seat upper end; The sintering seat is bonded with pressure chip, the binding post of sintering seat and pressure chip lead-in wire bonding.
4. gas pressure sensor according to claim 1 is characterized in that the lower surface of said coating silica gel upper surface and cover plate is gapped, through silica gel protected pressure chip and bonding wire.
5. gas pressure sensor according to claim 1 is characterized in that: bonding wire is gold thread, aluminum steel and copper cash.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102959039A CN102419235A (en) | 2010-09-28 | 2010-09-28 | Gas pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102959039A CN102419235A (en) | 2010-09-28 | 2010-09-28 | Gas pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102419235A true CN102419235A (en) | 2012-04-18 |
Family
ID=45943752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102959039A Pending CN102419235A (en) | 2010-09-28 | 2010-09-28 | Gas pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102419235A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108275648A (en) * | 2017-12-21 | 2018-07-13 | 中航（重庆）微电子有限公司 | A kind of pressure sensor packaging structure based on silicon piezoresistance type |
| CN112304474A (en) * | 2019-12-04 | 2021-02-02 | 武汉飞恩微电子有限公司 | Pressure sensor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030115967A1 (en) * | 2000-11-01 | 2003-06-26 | Winfried Kuhnt | Pressure sensor module |
| CN1806162A (en) * | 2003-06-12 | 2006-07-19 | 恩德莱斯和豪瑟尔两合公司 | Moisture-protected pressure sensor |
| CN101553719A (en) * | 2006-11-22 | 2009-10-07 | 丹福斯有限公司 | A pressure sensor |
| CN201440101U (en) * | 2009-06-18 | 2010-04-21 | 钦瑞工业股份有限公司 | Pressure gauge structure |
| CN201852665U (en) * | 2010-09-28 | 2011-06-01 | 刘胜 | Gas pressure sensor |
-
2010
- 2010-09-28 CN CN2010102959039A patent/CN102419235A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030115967A1 (en) * | 2000-11-01 | 2003-06-26 | Winfried Kuhnt | Pressure sensor module |
| CN1806162A (en) * | 2003-06-12 | 2006-07-19 | 恩德莱斯和豪瑟尔两合公司 | Moisture-protected pressure sensor |
| CN101553719A (en) * | 2006-11-22 | 2009-10-07 | 丹福斯有限公司 | A pressure sensor |
| CN201440101U (en) * | 2009-06-18 | 2010-04-21 | 钦瑞工业股份有限公司 | Pressure gauge structure |
| CN201852665U (en) * | 2010-09-28 | 2011-06-01 | 刘胜 | Gas pressure sensor |
Non-Patent Citations (1)
| Title |
|---|
| 陈思远: "MEMS气体压力传感器的***级封装（SiP）技术研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108275648A (en) * | 2017-12-21 | 2018-07-13 | 中航（重庆）微电子有限公司 | A kind of pressure sensor packaging structure based on silicon piezoresistance type |
| CN112304474A (en) * | 2019-12-04 | 2021-02-02 | 武汉飞恩微电子有限公司 | Pressure sensor |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120418 |