CN112151231B

CN112151231B - Circuit board including individual magnet parts and magnet mounting method using SMT apparatus

Info

Publication number: CN112151231B
Application number: CN202010347278.1A
Authority: CN
Inventors: 皇甫相武; 昌坤熙; 安斗荣
Original assignee: Novotel Co ltd
Current assignee: Novotel Co ltd
Priority date: 2019-06-27
Filing date: 2020-04-28
Publication date: 2023-04-07
Anticipated expiration: 2040-04-28
Also published as: CN112151231A; KR20210001285A; KR20220002847A; KR102447684B1; KR102386011B1

Abstract

The circuit board of the present invention includes the magnet as a separate component that is used as a separate component rather than as an accessory to the assembly, thus enabling the magnet to be used as an element of the circuit or in place of another appliance design. The magnet can be used in an SMT process or the like by using a shield member, a bracket or the like, and the magnet can be mounted in the SMT process, so that the working efficiency is improved and the manufacturing cost is reduced.

Description

Circuit board including individual magnet parts and magnet mounting method using SMT apparatus

Technical Field

The present invention relates to a circuit board including individual magnet parts and a mounting technique, and more particularly, to a circuit board using magnets as individual parts rather than as accessories of a specific assembly and a mounting method of mounting magnets to a substrate using a Surface Mount Technology (SMT) apparatus.

Background

All magnets used in tablet computers, mobile phones and other ornaments are variously applied to the field of product appliance design, and cannot be applied as an independent component in the field of circuits such as Printed Circuit Boards (PCBs) at present.

Although there are cases where a brushless direct current (BLDC) motor, a hall sensor chip, a camera module, or the like is directly mounted on a circuit board and a magnet is included in an assembly component, in these cases, the magnet cannot be regarded as a separate component, and the mounting on an inner case has little influence on the outside, and the mounting method is not difficult, and thus, it is not necessary to take much trouble.

However, smart devices (mobile communication terminals) such as smart phones and tablet PCs, which can be manufactured in various forms such as a folding type and a slide type, are gradually slimmed, and in addition, a magnet is mounted in a housing in an appliance form, which causes a waste of space, and a trouble of attaching a magnet to an inner wall of the housing is caused in a manufacturing process.

Granted patent No. 10-1794445 (2017.10.31 granted) discloses "a portable terminal in which a body and a cover are combined by a shield magnet module". In the terminal, a magnet is also mounted in the body, and the magnetic field can be prevented from being inclined to the inside of the housing by a shield member or yoke, i.e., a shield member (shield). However, since a separate device is required to be provided for mounting the magnet and the shield member inside the housing, and the magnet needs to be spatially disposed at a corresponding position, another circuit configuration cannot be provided.

Disclosure of Invention

Technical problem

The invention provides a technique for applying a magnet as a separate component to a circuit board and a mounting method thereof.

The present invention provides a circuit board structure and a mounting method thereof, wherein magnets are applied to a circuit board as individual components, and thus the circuit board structure and the mounting method thereof can be used to develop a plurality of substrate structures, circuit effects, and a base of circuit technology.

The present invention provides a circuit board and a mounting method thereof, wherein a magnet is mounted on the circuit board as a separate component, so that the assembly of internal components can be solved only by mounting a substrate without designing an appliance without designing the prior art related to the magnet.

The present invention provides a mounting method of a circuit board using a Surface Mount Technology (SMT) to achieve automatic mounting of magnets as individual components.

Technical scheme

In an exemplary embodiment of the present invention for achieving the above objects of the present invention, the circuit board of the present embodiment includes a magnet as a separate component, which is used as a separate component rather than as an accessory of the assembly, so that the magnet can be used as an element of the circuit or in place of another appliance design. The magnet can be used in an SMT process or the like by using a shield member, a bracket or the like, and the magnet can be mounted in the SMT process, so that the working efficiency is improved and the manufacturing cost is reduced.

All magnets used for tablet computers, mobile phones and other accessories are variously applied to the field of design of product appliances, but since the interrelationship with other components is not clear in the field of circuits such as PCBs, FPCBs and the like, they cannot be applied to circuit boards as individual components.

However, it has been found that the circuit board and the magnet in the terminal are disposed at positions where they interfere with each other, and the circuit board has advantages of the magnet, and that the influence of the magnet due to the electromagnetic wave problem can be minimized by effectively shielding the circuit board with a shielding member or the like.

Therefore, the present invention can directly mount a magnet as a separate component on a circuit board in a smart device such as a smart phone or a tablet PC, which can be manufactured in various forms such as a folding type or a slide type, and can realize manufacture of a smart device having a more various configuration.

Further, a shield member may be included that shields at least one side of the magnet, and the magnet may be attached to the circuit board using the shield member.

The shielding member may include a seating portion protruding from a portion seated on the circuit board to a side, and may be fixed by the seating portion through manual soldering or a solder paste of an SMT process. Also, the outer face of the shield member or the magnet may be formed of a nickel/chrome coating, which may form a weak bonding force when welded or soldered (welding). Therefore, in order to solve such a problem, a partial plating layer of gold, silver, or the like may be formed on the mounting portion, and a solder having a relatively strong bonding force may be formed in a region where the partial plating layer is formed.

A holder that partially receives the magnet so as to be spaced apart from the surface of the circuit board by a predetermined height may be included in addition to the shield member. The holder may be made of the same magnetic material as the shield member, but may be made of other metals, synthetic resins, or the like as the case may be.

The holder can be used for adjusting the mounting angle, posture, arrangement, and the like of the magnet, in addition to spacing the magnet at a predetermined height from the surface of the circuit board.

According to circumstances, the magnet may be partially disposed on the circuit board. To this end, a shielding member may be included to partially receive the magnet, and the magnet may be seated in a mounting hole formed in the circuit board using the shielding member.

The magnet may be attached with a heat demagnetization preventing cap. This is because some of the magnets undergo a magnetic reduction in a reflow (Re flowing) step of the SMT process, and the magnets are protected by caps, which are relatively ferromagnetic bodies, thereby preventing a thermal demagnetization phenomenon. Here, the thermal demagnetization preventing cap may be formed of SPCC or the like, and the cap may be formed by CNC, punching, laser, wire processing, or the like. The cap of the ferromagnetic body can improve the magnetic conductance together with the shield member by forming a closed path of magnetic lines.

Of course, ndFeB magnets or SmCo magnets having good thermal characteristics and high coercive force may be used from the beginning, and a method of magnetizing a product which has not been magnetized or has lost magnetic force in a post-assembly process may be applied. Also, the concept of assembling the magnet may also include a case where the non-magnetized article is assembled and the magnet is magnetically formed to the non-magnetized article after the assembly or before and after the reflow step.

In an exemplary embodiment of the present invention for achieving the above objects of the present invention, a method of mounting at least one magnet as a separate component on a circuit board includes: providing a circuit board; a step of coating solder paste on the circuit board corresponding to the position of the magnet; a step of mounting a magnet on the circuit board in correspondence with the position of the solder paste; and a reflow step of passing the board mounted with the magnet through a reflow apparatus.

In the step of mounting the magnet, the magnet may be mounted on the circuit board using the shield member as a medium, the shield member may include a seating portion protruding from a portion seated on the circuit board to a side, and the magnet may be mounted on the circuit board using solder paste applied to the circuit board corresponding to the seating portion.

A partial plating layer may be formed on the mounting portion with gold, silver, or the like, and the magnet may be mounted on the circuit board using the partially plated portion.

In the step of assembling the magnet, a holder partially receiving the magnet so as to be spaced apart from the surface of the circuit board by a predetermined height may be provided, or the magnet may be assembled to the circuit board using the holder as a medium.

Further, a shield member that partially houses the magnet may be provided, a mounting hole for mounting the shield member may be provided in the circuit board, the shield member may be mounted in the mounting hole, and the magnet may be mounted on the circuit board.

In the step of assembling the magnets, an assembly jig in which magnetic elements are arranged corresponding to the respective magnets is provided to a lower portion of the circuit board, and the magnets are temporarily fixed to the circuit board by an attractive force between the magnetic elements and the magnets. The assembly fixture can comprise a magnetic element for temporarily fixing the magnet to the circuit board, wherein the magnetic element can be a permanent magnet or an electromagnet.

If two or more magnets are arranged on the circuit board, the arrangement of the magnets may be fluctuated by the peripheral magnetic bodies, but the mutual attraction or repulsion between the magnets may also fluctuate the arrangement of the magnets. However, if the magnetic force element of the mounting jig can fix the magnet on the substrate with a relatively large magnetic force, the magnet can be stably fixed during the mounting fixing or reflow process.

The mounting fixture may be separated from the circuit board prior to the reflow step, or may be magnetically separated by weakening the coupling force with the magnet. Of course, the mounting jig can maintain the magnetic coupling even in the reflow apparatus, and the magnetic coupling can be maintained until the reflow process is completed.

In the step of assembling the magnet, a film to which at least one magnet is attached may be provided and laminated on the circuit board, and in the laminating step, soldering may be performed through a reflow process in a state where the film and the circuit board are attached to each other. And the membrane can be separated from the circuit board after the reflow step.

In particular, when a plurality of magnets are arranged, the magnets can be arranged and fixed at once by the film, and the arrangement of the magnets can be stably maintained even in the assembly or reflow process. In the case of using a material in which the adhesive loses its adhesive force when it is heated, the membrane can be easily separated or automatically separated after the reflow process.

An exposure hole for mounting other components than the magnet may be formed on the film, other components may be mounted on the circuit board exposed through the exposure hole, and a heat demagnetization preventing pattern may be formed on an opposite side of the film in correspondence with at least one of the magnets.

Technical effects

According to the circuit board and the mounting method of the present invention, since the magnet is applied to the circuit board as a separate component, it is possible to provide a basis on which various substrate structures, circuit effects, and circuit techniques can be developed.

Further, the magnet is mounted on the circuit board as a separate component, so that the conventional magnet-related art does not need to be designed, and the assembly of the internal components can be achieved by only mounting the substrate without designing the tool.

Also, it is possible to automatically mount a magnet as a separate component by using a Surface Mount Technology (SMT), to automatically assemble by using a shielding member, and to strengthen a bonding force of soldering by using a partial plating layer of gold, silver, or the like in the case of using a nickel/chrome plating layer, or the like.

Drawings

Fig. 1 to 8 are schematic views of a circuit board including a single magnet component for illustrating various embodiments of the present invention;

fig. 9 is a schematic view for explaining a magnet mounting method on a circuit board using an SMT process of the present invention;

fig. 10 is a schematic view of a circuit board for explaining use of a magnet as a separate component according to another embodiment of the present invention;

fig. 11 and 12 are schematic views for explaining a circuit board in which a magnet is used as a separate component and a magnet mounting method thereof according to an embodiment of the present invention;

fig. 13 is a schematic view for explaining a circuit board in which a magnet is used as a separate component and a magnet mounting method thereof according to an embodiment of the present invention;

fig. 14 is a schematic view showing a film for explaining a magnet mounting method according to an embodiment of the present invention.

Description of the reference numerals

100: the circuit board 110: substrate

120:

magnets

130, 140, 150: shielding component

132: the placing part 135: support frame

170: assembling fixtures 190, 191: film

Detailed Description

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings, but the present invention is not limited or restricted to these embodiments. For reference, in the present description, the same reference numerals denote substantially the same elements, and the description may be made by referring to the contents described in other drawings under the above-described rule, and the contents that are considered obvious or duplicated by those skilled in the art may be omitted.

Fig. 1 to 8 are schematic views of circuit boards including individual magnet parts for explaining various embodiments of the present invention, and fig. 9 is a schematic view for explaining a magnet mounting method on a circuit board using an SMT process of the present invention.

Referring to fig. 1 (a), the circuit board 100 of the present embodiment may include a magnet 120 and other circuit parts 111 to 113, and conductive lines connecting the circuit parts 111 to 113 may be formed on a surface or inside of the substrate 110 by printing, etching, or the like. The wire may be designed to pass through the periphery of the magnet 120 or through the lower portion of the magnet 120.

The magnet 120 is mounted on the substrate 110 as a separate component, and may be fixed to the substrate 110 by manual soldering or the SMT process described below. The magnet 120 may be used as a separate component rather than as an accessory to hall sensors, camera modules, motors, and the like.

The magnet 120 on the substrate 110 may be a single-pole magnet or a multi-pole magnet, and may be fixed in various positions according to the arrangement of polarities.

Referring to fig. 2 (a), in order to arrange the magnet 120 in a conventional tablet computer, mobile phone, other accessory, or the like, the placement position 12 for the magnet 120 is designed by a tool inside the housing 10, and a position not overlapping the substrate 110 is selected as the position.

On the other hand, when the magnet 120 is directly mounted on the substrate 110 as in the present embodiment, the substrate 110 can be brought into close contact with the housing 10, and there is no need to form a mounting position for the magnet by designing a tool. In fact, it is known that the distance D between the substrate and the housing in the prior art should be ensured to be larger than the distance D between the substrate and the housing in the present embodiment.

Referring to fig. 1 (b), the magnet 120' may further include a seating portion 122 protruding sideward from a portion seated on the substrate 110. The placing portion 122 can form a wide area in contact with a manual soldering or SMT solder paste.

Referring to fig. 1 (c), in the case of a commercial magnet 120", an outer face may be formed with a nickel/chrome plating 126 in order to prevent corrosion and the like, and the nickel/chrome plating 126 may form a weak bonding force when welding or soldering (soldering). Therefore, in order to solve such a problem, a partial plating layer 126 using gold, silver, or the like may be formed on the seating portion 122, and a relatively strong bonding force may be formed using the partial plating layer 126.

For reference, the substrate 110 is assumed to be a general PCB in this embodiment, but the present invention is not limited thereto, and may be applied to various substrates such as FPCB or sapphire substrate.

Referring to fig. 3 (a), a shield member 130 may be used in order to mount the magnet 120 on the substrate 110. The shielding member 130 may be formed of a magnetic material, is disposed adjacent to the magnet 120, and has effects of shielding electromagnetic waves of a corresponding portion, forming a strong electromagnetic field in a reverse direction, and the like.

Further, since the material selection is easier and the molding is easier than that of the magnet 120, the circuit board 100 can be used for various purposes. The upper surface of the magnet 120 is opened by the shielding member 130 in the present embodiment, but the upper surface may be opened to the side in other embodiments, and the opened side angle may be arbitrarily selected to be 360 degrees or less, or may be partially opened.

Referring to fig. 3 (b), the shielding member 130 'may include a seating portion 132 protruding sideward from a portion seated on the substrate 110, and the shielding member 130' and the magnet 120 may be fixed by the seating portion 132 through manual soldering or a solder paste of an SMT process.

Also, in order to prevent corrosion, the outer surface of the shield member 130 ″ may be also formed with a nickel/chromium plating layer, and a partial plating layer 134 using gold, silver, or the like may be formed at the seating portion 132 as in (c) of fig. 3, and a relatively strong bonding solder may be formed using the partial plating layer 134.

Referring to fig. 4, a holder 135 partially receiving the magnet 120 so as to be spaced apart from the surface of the substrate 110 by a predetermined height may be further included in addition to the shield member. The holder 135 may be made of the same magnetic material as the shield member, but may be made of other metals, synthetic resins, or the like as the case may be.

The holder 135 may be used for adjusting the mounting angle, posture, arrangement, and the like of the magnet, in addition to spacing the magnet at a predetermined height from the surface of the substrate 110.

Referring to fig. 5 (a), the holder 136 may arrange the magnet 120 to be inclined at a predetermined angle with respect to the substrate 110, and the inclination angle may be variously changed according to the designer's intention.

As shown in fig. 5 (b), a plurality of magnets 120 may be arranged vertically on the other holder 138, and the magnets 120 may have a plurality of polarity arrangements. The magnets 120 are arranged in a polarity to act as a repulsive force in the illustrated embodiment, but may be arranged in a configuration to act as an attractive force or to intensify a magnetic field.

The holder may also be formed with a seating portion 132, and the magnet 120 may be fixed by hand soldering or SMT process solder paste through the seating portion 132 which is relatively stable and provides a wide contact surface. Further, although not shown, a partial plating layer of gold, silver, or the like may be formed on the mounting portion 132.

Referring to fig. 6, the shielding member 140 for fixing the magnet 120 to the substrate 110 may be made open at the bottom surface. In this case, it is understood from the illustrated magnetic field lines MF that the magnetic field directed toward the substrate 110, that is, directed downward, is strengthened, and electromagnetic waves and the like directed toward the upper portion of the substrate 110 are shielded. As described above, the shield member 140 may also include the seating part 142, and the seating part 142 may be partially protruded or formed all around the circumference of the shield member 140 like a flange (flange). This may also apply to other embodiments.

Referring to fig. 7 and 8, the magnet 120 and the shielding member 150 may be partially impregnated into the substrate 115. For this purpose, a mounting hole 117 may be formed in the substrate 115.

The seating portion 152 may protrude from an upper portion of a side surface of the shielding member 150, and the seating portion 152 is seated on the solder paste 118 and may be fixed by soldering through a reflow process described below.

As shown in fig. 8, when the magnet 120 is mounted on or impregnated into the substrate 115, the thickness of the entire circuit board can be reduced, and the substrate 115 can be brought into close contact with the housing 10, and such close contact can be applied to a structure coupled by a magnetic force such as a cover outside the housing 10.

Generally, according to the SMT process, a substrate is subjected to a printing process of automatically coating a solder paste, an assembly process of automatically mounting a chip or an IC component on a PCB coated with a solder paste, a reflow process of performing soldering while passing the PCB through a reflow apparatus, and an Inspection process of inspecting a soldering state using Automatic Optical Inspection (AOI), (Visual Inspection ), X-ray (X-ray), and the like.

Fig. 9 can partially explain the assembly fixing and reflow process, and can be used to explain the magnet mounting method of the SMT process. For reference, fig. 9 illustrates a process of mounting one magnet 120, but may be applied to a case of mounting two or more magnets of the same kind or different kinds.

Referring to fig. 9, a substrate 110 may be provided for the SMT process. The substrate 110 may be coated with solder paste 118 at a position corresponding to the position of the magnet 120 to be mounted. The magnet 120 and the shielding member 130 may be provided to an assembling apparatus, and may be assembled together with other components or separately. In the present embodiment, the magnet 120 and the shield member 130 are assembled by the assembling apparatus, but may be assembled in a separate irregular assembling portion or table.

In the case where the magnet 120 and the shielding member 130 are mounted on the substrate 110 corresponding to the position of the solder paste 118, the substrate 110 mounted with the magnet 120 may be subjected to a reflow step in the process of passing through a reflow apparatus.

In the present embodiment, the magnet 120 and the shielding member 130 are assembled, but the shielding member may be omitted and only the magnet may be assembled, and another mounting portion may be formed at the shielding member, and as described above, the shielding member mounted at the bracket or the substrate may be used.

In the step of assembling the magnets 120 of the present embodiment, the assembly jig 170 in which the magnetic elements 172 are arranged corresponding to the respective magnets may be provided to the lower portion of the substrate 110. The magnet 120 can be temporarily fixed to the substrate 110 by the attractive force between the magnetic element 172 and the magnet 120, and the position and the orientation of the magnet 120 can be firmly held by disposing the magnetic element 172. The mounting jig 170 may move together with the base plate 110 by a rail, a chain 162, etc. of the transfer device 160, and a magnetic force element 172 may be provided using a permanent magnet or an electromagnet.

If two or more magnets are arranged on the circuit board, the arrangement of the magnets may be fluctuated by peripheral magnetic bodies, but the arrangement of the magnets may be fluctuated by mutual attraction or repulsion between the magnets. However, if the magnetic force element of the mounting jig can fix the magnet on the substrate with a relatively large magnetic force, the magnet can be stably fixed during the mounting fixing or reflow process.

The mounting fixture 170 can remain in a magnetically coupled relationship with the substrate 110 until the reflow step is complete, but may be physically or magnetically separated from the substrate 110 prior thereto.

Fig. 10 is a schematic diagram of a circuit board for explaining use of a magnet as a separate component according to another embodiment of the present invention.

Referring to fig. 10, a thermal demagnetization preventing cap 126 may be attached to the magnet 120. This is because a part of the magnet may be reduced in magnetism in the reflow step of the smt process, and the magnet may be protected from thermal demagnetization by the cap 126 of the ferromagnetic member. The thermal demagnetization preventing cap 126 may be formed of SPCC or the like, and the cap may be formed by CN C, punching, laser, wire processing, or the like. The cap 126 of the ferromagnetic body may improve magnetic conductance with the shield member by forming a closed path of magnetic flux.

Referring to the drawings, the cap 126 may cover the magnet 120 ((a) of fig. 10), but may cover the magnet 120 together with the shielding member 130' to form a closed magnetic flux path ((b) of fig. 10), and may be provided to cover an upper portion of the bracket 135 ((c) of fig. 10).

Of course, ndFeB magnets or SmCo magnets having good thermal characteristics and high coercive force may be used from the beginning, and a method of magnetizing a product which has not been magnetized or has lost magnetic force in a post-assembly process may be applied.

For reference, the case where the magnet is attached is described in the embodiments described in the present specification, but the present invention may also include attaching a non-attached magnet and forming the magnet by attaching the non-attached magnet after the attaching step or before and after the reflow step.

Fig. 11 and 12 are schematic views for explaining a circuit board in which a magnet is used as a separate component and a magnet mounting method thereof according to an embodiment of the present invention.

Referring to fig. 11 and 12, a plurality of magnets 120-1 to 120-4 can be easily mounted using a film 190. Referring to fig. 11 (a), a plurality of components 111 and a plurality of magnets 120-1 to 120-4 are mounted on one substrate 110, and the magnets 120-1 to 120-4 are adjacent to each other to form an attractive force or a repulsive force, so that a disorder of arrangement or attachment may occur before soldering in an assembling process.

Therefore, as shown in fig. 11 (b), the magnets 120-1 to 120-4 may be provided in a state of being attached to the film 190 in advance, thereby preventing the arrangement of the magnets 120-1 to 120-4 from being disordered after the assembly. Here, the substrate 110 may be maintained in a state where the components 111 are previously mounted.

Referring to fig. 12, a film 190 to which magnets 120-1 to 120-4 have been attached may be provided on a substrate 110 equipped with a component 111 ((a) of fig. 12). Of course, this may be provided by supplying the film to a roll and cutting the film into desired units, and the film may be supplied individually for each magnet.

The film 190 to which the magnets 120-1 to 120-4 are attached may be laminated on the substrate 110 to laminate the substrate 110 and the film 190 with each other (fig. 12 (b)). The substrate 110 may be subjected to a reflow process in a state where the film 190 is attached.

After the reflow process, magnets 120-1 to 120-4 can be fixed to substrate 110 by soldering, and film 190 can be peeled off to transfer magnets 120-1 to 120-4 on film 190 to substrate 110.

In the step of thus assembling the plurality of magnets 120-1 to 120-4, the film 190 to which the magnets 120-1 to 120-4 are attached may be provided and the film 190 may be laminated on the substrate 110 to be stably fixed at one time. And as described below, the film 190 can be easily peeled off by using an adhesive whose adhesive force is reduced by heat.

Further, the magnets 120-1 to 120-4 can be arranged and fixed at one time by the film 190, and the arrangement of the magnets 120-1 to 120-4 can be stably maintained even in the assembling or reflow process.

Fig. 13 is a schematic view for explaining a circuit board in which a magnet according to an embodiment of the present invention is used as a separate component and a magnet mounting method thereof, and fig. 14 is a schematic view showing a film for explaining the magnet mounting method according to the embodiment of the present invention.

Referring to fig. 13, exposure holes 192 and 194 for mounting other components than magnets may be formed in the film 190, and other components 111 may be mounted on the substrate 110 exposed through the exposure holes 192 and 194.

For this purpose, a film 191 to which the magnets 120-1 to 120-4 are attached may be provided on the substrate 110, and exposure holes 192 and 194 may be formed in the film 191 (see fig. 13 (a)). Also, the film 191 may be laminated on the substrate 110 and laminated (see (b) of fig. 13). Here, it may be a state that the substrate 110 has been coated with the solder paste in advance.

And other components 111 can be additionally mounted by an automatic mounting apparatus, and the substrate 110 can be brought into a reflow apparatus in a state where the film 191 is attached.

After the reflow step, the magnets 120-1 to 120-4 can be fixed to the substrate 110 by soldering, and the film 191 with the exposed

holes

192 and 194 formed thereon can be peeled off to transfer the magnets 120-1 to 120-4 on the film 191 to the substrate 110.

Referring to fig. 14, the bottom surface of the film 190 is coated with an adhesive 198. As described above, the adhesive 198 may have a property that the adhesive force is reduced by heat. Also, a thermal demagnetization preventing pattern 196 may be formed on the upper surface of the film 190 corresponding to the position of the magnet 120. The thermal demagnetization preventing pattern 196 may be formed of a ferromagnetic material, and may prevent a magnetic force of the magnet 120 from being reduced during the reflow process.

As described above, although the present invention has been described with reference to the preferred embodiments, it should be understood by those skilled in the art that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention as set forth in the appended claims.

Claims

1. A circuit board on which a circuit component is mounted, comprising:

the circuit component and the magnet as separate components on the upper face on which the circuit component is mounted; and

a shield member that shields at least one surface of the magnet,

the magnet covers only a portion of the upper face of the circuit board,

the shielding member is mounted to the circuit board with solder paste interposed therebetween,

the magnet is attached to the circuit board with the shield member,

the upper surface of the magnet is exposed on the upper surface of the circuit board on which the circuit component is mounted.

2. The circuit board of claim 1, wherein:

the shielding member includes a seating portion protruding sideward from a portion seated on the circuit board.

3. The circuit board of claim 2, wherein:

the mounting portion is formed with a partial plating layer.

4. The circuit board of claim 1, wherein:

the shield member is constituted by a holder which partially receives the magnet so as to be spaced apart from a surface of the circuit board by a predetermined height,

the magnet is attached to the circuit board with the bracket.

5. The circuit board of claim 4, wherein:

the mounting angle of the magnet can be adjusted through the bracket.

6. The circuit board of claim 1, wherein:

a thermal demagnetization preventing cap is attached to the magnet.