CN106304687A - A kind of circuit board carrier - Google Patents
A kind of circuit board carrier Download PDFInfo
- Publication number
- CN106304687A CN106304687A CN201610719086.2A CN201610719086A CN106304687A CN 106304687 A CN106304687 A CN 106304687A CN 201610719086 A CN201610719086 A CN 201610719086A CN 106304687 A CN106304687 A CN 106304687A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- steel disc
- matrix
- laminating
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of circuit board carrier, and for fixing to realize the welding between circuit board, described circuit board carrier includes matrix and pressing steel disc；Wherein, described matrix is provided with the holding area of at least one first circuit board after placing fixing laminating and second circuit board；Described matrix is additionally provided with connector, and described matrix is realized laminating fixing with described pressing steel disc by described connector, thus the first circuit board after described laminating and second circuit board is fixed on each described holding area.First laminating between circuit board and circuit board can be realized by the auxiliary of described circuit board carrier and form entirety, then complete paste solder printing, paster and cross stove welding procedure；Technological process can be greatly reduced, and solve the problem that welding quality is the best.
Description
Technical field
The present invention relates to surface mounting technology (SMT, Surface Mount Technology), particularly relate to surface mount
Circuit board carrier used in technology.
Background technology
When using surface mounting technology to produce in batches, generally place fixing circuit board by circuit board carrier, then lead to
Cross print solder paste, attachment components and parts and cross the technological processes such as stove.
Circuit board can be divided into the big class of PCB and FPCB two；Generally circuit board and circuit board be welded as realize PCB's Yu FPCB
Welding.
Current PC B and the existing two types of FPCB bond pattern:
Both are weldingly connected by Class1: PCB with FPCB by tin soldering machine or hot press:
Shortcoming: 1) welding process easily produces tin sweat(ing) because of its solder of rapid heating-cooling, thus cause functional shunting with
And the protecting film on FPCB surface easily scalds；2) solder joint concordance is poor, and quality is unstable；3) after PCB mount components has been welded
Off-line welds with FPCB again, need to divide two procedures operation, and therefore at the bottom of production efficiency, manufacturing cost is high；4) investment buying is needed to weld
Stannum machine or hot press device.
Type 2: print solder paste on PCB pad, is then mounted on tin cream reflow soldering together by FPCB:
Shortcoming: 1) it is easily destroyed tin cream molding during attachment FPCB, produce tin sweat(ing), thus cause functional shunting；2)
Only FPCB bottom land is eaten stannum thus is easily formed rosin joint and its solder joint of single-sided welding is easily stripped.
To sum up, the overall produced problem of prior art: operation is complex, and welding effect is the best.
Summary of the invention
It is an object of the invention to provide a kind of circuit board carrier, can assist and realize first circuit board and second circuit board
Between first laminating form entirety, then realize first circuit board and second circuit by paste solder printing, paster and the mistake technique such as stove welding
The welding of plate；Technological process can be greatly reduced, and solve the problem that welding quality is the best.
For achieving the above object, the present invention provides a kind of circuit board carrier, for fixing to realize the weldering between circuit board
Connecing, described circuit board carrier includes matrix and pressing steel disc；Wherein, described matrix is provided with at least one after placing laminating
First circuit board and the holding area of second circuit board；Described matrix is additionally provided with connector, and described matrix is real by described connector
Now laminating fixing with described pressing steel disc, thus the first circuit board after described laminating and second circuit board are fixed on each institute
State on holding area.
Compared with prior art, the present invention is used in SMT technique, and first circuit board and second circuit board are placed on base
On body, and first circuit board and second circuit board can be made to post and fix on matrix by placing pressing steel disc, make two
Circuit board fit formation entirety carry out the techniques such as paste solder printing, paster and welding again so that first circuit board and second electricity
Welding and the welding of electronic devices and components between the plate of road can synchronize to carry out, and greatly reduce technological process, cost-effective, carry
The high quality of product.
Preferably, described connector includes several high temperature Magnet being embedded in described matrix, and described pressing steel disc is
Can magnetically attractive steel disc, described pressing steel disc utilizes that magnetic is fixing to be fitted on described matrix.
Preferably, several described high temperature Magnet are distributed in described matrix for the position fitted with described pressing steel disc.
Preferably, the present invention is embedded with high temperature Magnet at matrix, when pressing steel disc is positioned on matrix, and high temperature
Magnet and pressing steel disc are attracting because of magnetic action, and pressing steel disc can realize fixing laminating with matrix, so that first circuit board
It is securely fixed on matrix with second circuit board；Which is simple to operate, and is prone to the taking-up after welding circuit board completes.
Preferably, described matrix is for covering the institute on each described holding area with the position of described pressing steel disc laminating
State the position that the first circuit board after laminating fits with second circuit board.
Further, described pressing steel disc is provided with welding window, and described welding window corresponds to described first circuit board
And/or the pad of described second circuit board and described pressing steel disc joint place is arranged.
Further, described holding area is groove, each described groove the first circuit after placing described laminating
Plate and second circuit board.
Matrix arranges corresponding groove for placing first circuit board and second circuit board, on the one hand, can be corresponding
Location first circuit board and second circuit board position on matrix, make to be welded to each other between first circuit board and second circuit board
Place's accurate contraposition；On the other hand, circuit board can be made to position the correspondence position being placed on matrix, beneficially automatic welding by groove
Stannum printing and the procedures of attachment components and parts.
Further, described matrix is additionally provided with two notches, and two described notches are respectively arranged on all of described accommodating area
Territory is integrally formed outside two opposite side in space.
Matrix arranges two notches, it is simple to circuit board placement on matrix and taking-up.
Further, described first circuit board is PCB, and described second circuit board is FPCB；Or, described first circuit board is
FPCB, described second circuit board is PCB.
Accompanying drawing explanation
Fig. 1 is matrix 1 top view of the preferred embodiment of a kind of circuit board carrier of the present invention；
Fig. 2 is matrix 1 upward view of the preferred embodiment of a kind of circuit board carrier of the present invention；
Fig. 3 is matrix 1 front view of the preferred embodiment of a kind of circuit board carrier of the present invention；
Fig. 4 is matrix 1 pictorial diagram of the preferred embodiment of a kind of circuit board carrier of the present invention；
Fig. 5 is the structure chart of the pressing steel disc 2A of the preferred embodiment of a kind of circuit board carrier of the present invention；
Fig. 6 is the structure chart of the pressing steel disc 2B of the preferred embodiment of a kind of circuit board carrier of the present invention；
Fig. 7 is that the fixing of the preferred embodiment of a kind of circuit board carrier of the present invention is fitted with first circuit board and second circuit
The circuit board carrier pictorial diagram of plate；
Fig. 8 is the circuit board carrier structure chart of the preferred embodiment of a kind of circuit board carrier of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
The embodiment of the present invention provides a kind of circuit board carrier, for fixing to realize the welding between circuit board.This enforcement
The circuit board carrier that example provides includes matrix 1.Fig. 1, Fig. 2 and Fig. 3 are respectively the top view of matrix 1, upward view and front view；Figure
4 is the pictorial diagram of matrix 1.Wherein, matrix 1 is provided with some grooves 11, the first circuit board after placing fixing laminating with
Second circuit board；Specifically, first circuit board and second circuit board after laminating refer to by by first circuit board and second
Circuit board needs the integrated circuit plate that the place of being welded to each other is superimposed together constituted.
Can place and position first circuit board and second circuit board, each groove 11 for realizing groove 11 in the present embodiment
Both sides be equipped with limit 111, location and gap 112, location.
Matrix 1 is embedded with several high temperature Magnet.
Matrix 1 is additionally provided with two notches 12, and two notches 12 are respectively arranged on the space that is made up of all of groove 11
Outside two opposite side.
The circuit board carrier that the present embodiment provides also includes pressing steel disc 2, sees Fig. 5 and Fig. 6, Fig. 5 and Fig. 6 and respectively may be used
It is placed on the pressing steel disc 2A and pressing steel disc 2B of diverse location on same matrix 1；Pressing steel disc 2A and pressing steel disc 2B places
Particular location can be found in Fig. 7 and Fig. 8.Pressing steel disc 2A is consistent with pressing steel disc 2B structure.
The pressing steel disc 2 first circuit board after fitting is integrally attached to matrix 1, pressing with second circuit board
Steel disc 2 is provided with welding window 21, welding window 21 corresponding to the first circuit board after laminating and second circuit board entirety with
The pad locations of pressing steel disc 2 joint place is arranged.
Pressing steel disc 2 be can magnetically attractive steel disc, pressing steel disc 2 utilize with matrix 1 in high temperature Magnet magnetic action laminating
On matrix 1.
In actual production designs, for making pressing steel disc 2 reliably be fitted on matrix 1, the high-temp magnetic that matrix 1 is embedded
Ferrum is specifically distributed in matrix 1 for the position fitted with pressing steel disc 2.
Additionally, in the present embodiment, pressing steel disc 2 is for covering first circuit board and second with the position of matrix 1 laminating
The position, place that fits of circuit board, can be maximum on the basis of ensureing to need the circuit board joint place welded mutually to fit tightly
The material needed for pressing steel disc 2 is saved on degree ground.
The present embodiment, second circuit board for being provided with through hole with the pad of first circuit board laminating, first circuit board and the
During two circuit board laminatings, second circuit board overlays on first circuit board；Realize first circuit board and second circuit board by this
After the auxiliary laminating of circuit board carrier that embodiment is provided, when carrying out paste solder printing and welding, be printed on second circuit board for
Penetrated on the pad of bottom by through hole with the tin cream on the pad of first circuit board laminating, make first circuit board and the second electricity
Road plate is closely attached together by tin cream.Or, first circuit board is used for being provided with through hole with the pad of second circuit board laminating,
When first circuit board and second circuit board are fitted, first circuit board stacks on the second circuit board, this first circuit board and the
The structure of two circuit boards can also realize welding effect by the auxiliary of the circuit board carrier that the present embodiment provides.
Seeing Fig. 7, the present embodiment is with first circuit board as PCB, and as a example by second circuit board is FPCB, the present embodiment provides
Circuit board carrier uses symmetrical structure design, improves circuit board carrier circuit board saturation.This sentences the half of circuit board carrier
Illustrate: every two location groove 11 folded by limit 111 is used for placing PCB, and positions PCB by limit 111, location；Every two location
Groove 11 folded by gap 112 is used for placing PCB and FPCB and fits place；For make PCB and FPCB need place bonded to each other can be real
The most accurately fit, can also be by a base being provided with location steel disc in practice, matrix 1 can be positioned on base,
Location steel disc can form, through corresponding gap 112, location, the mutual patch that deep groove accommodates and positions PCB and FPCB one by one
At conjunction.
Pressing steel disc 2 be positioned over PCB and FPCB fit place position above, matrix 1 utilizes magnetic and pressing steel disc 2 phase
Adhesive, thus realize PCB and FPCB after laminating and be integrally attached on matrix 1.
Matrix 1 is additionally provided with two notches 12, and two notches 12 are respectively arranged on the space that is made up of all of groove 11
Outside two opposite side, after the overall placement of PCB jigsaw and welding are easy to by this notch 12 in the space that all of groove 11 is constituted
PCB and FPCB be monolithically fabricated the taking-up of multiple-printed-panel for circuit board.
Welding process by between PCB and FPCB that this circuit board carrier is realized: by be fixed with the PCB after laminating and
The circuit board carrier of FPCB is placed in bottom steel mesh, and wherein, this onboard lamps structure of steel mesh corresponding circuits is designed as two-sided stairstepping, and
The pad of PCB and FPCB after the perforate correspondence laminating of steel mesh is arranged；By the perforate of steel mesh by paste solder printing after laminating
In the pad locations of PCB and FPCB.Corresponding electronic devices and components in corresponding pad locations attachment again, will be onboard by circuit
Tool realizes PCB and FPCB of laminating and puts into the welding of reflow ovens equipment, and FPCB is for the tin cream of the pad upper surface fusing of the PCB that fits
Penetrated on the pad of bottom PCB by through hole, make to realize welding by tin cream between PCB with FPCB；Meanwhile, on other pad
Tin cream fusing, it is achieved electronic devices and components are weldingly connected with other corresponding pad.Finally, PCB and FPCB entirety is taken out,
PCB and FPCB completes welding.
On the basis of the present invention, be FPCB according to first circuit board, second circuit board be PCB design circuit
The embodiment of the structure of onboard tool is also in protection domain.
When being embodied as, circuit board carrier is provided with the groove of the first circuit board after placing laminating and second circuit board
11, position first circuit board and the second circuit board position on matrix 1 by this groove 11 and make first circuit board and
The two circuit board places of fitting are the most corresponding；And first circuit board and the second circuit board after utilizing pressing steel disc 2 to make laminating fix
On matrix 1；Pressing steel disc 2 is provided with the welding window that the pad of corresponding first circuit board and second circuit board is arranged, in order to
The paste solder printing of pad.
By this circuit board carrier can make two circuit boards fit formation entirety carry out paste solder printing, paster and weldering again
Connect technique, thus the welding realizing electronic devices and components on the welding between two circuit boards and two circuit boards synchronize to carry out,
Greatly reduce technological process, cost-effective；By the welding of two circuit boards that this circuit board carrier realizes, welding effect is more
Good, improve product quality.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, it is also possible to make some improvement and deformation, these improve and deformation is also considered as
Protection scope of the present invention.
Claims (8)
1. a circuit board carrier, for fixing to realize the welding between circuit board, it is characterised in that described circuit board carrier
Including matrix and pressing steel disc；Wherein, described matrix be provided with at least one first circuit board after placing fixing laminating with
The holding area of second circuit board；Described matrix is additionally provided with connector, and described matrix is realized and described pressing by described connector
The fixing laminating of steel disc, thus the first circuit board after described laminating and second circuit board are fixed on each described holding area
On.
2. circuit board carrier as claimed in claim 1, it is characterised in that described connector includes being embedded in described matrix
Several high temperature Magnet, described pressing steel disc be can magnetically attractive steel disc, described pressing steel disc utilizes that magnetic is fixing fits in described base
On body.
3. circuit board carrier as claimed in claim 2, it is characterised in that several described high temperature Magnet are distributed in described matrix
For the position fitted with described pressing steel disc.
4. circuit board carrier as claimed in claim 3, it is characterised in that described matrix is used for and the laminating of described pressing steel disc
The position that the first circuit board after described laminating on each described holding area of position covering fits with second circuit board.
5. circuit board carrier as claimed in claim 1, it is characterised in that described pressing steel disc is provided with welding window, described
Welding window sets corresponding to the pad of described first circuit board and/or described second circuit board with described pressing steel disc joint place
Put.
6. circuit board carrier as claimed in claim 1, it is characterised in that described holding area is groove, each described groove
Described first circuit board and second circuit board after placing laminating.
7. circuit board carrier as claimed in claim 1, it is characterised in that described matrix is additionally provided with two notches, described in two
Notch is respectively arranged on all of described holding area and is integrally formed outside two opposite side in space.
8. the circuit board carrier as described in any one of claim 1～7, it is characterised in that described first circuit board is PCB, institute
Stating second circuit board is FPCB；Or, described first circuit board is FPCB, and described second circuit board is PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719086.2A CN106304687B (en) | 2016-08-24 | 2016-08-24 | A kind of circuit board carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719086.2A CN106304687B (en) | 2016-08-24 | 2016-08-24 | A kind of circuit board carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106304687A true CN106304687A (en) | 2017-01-04 |
| CN106304687B CN106304687B (en) | 2019-01-04 |
Family
ID=57615052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610719086.2A Active CN106304687B (en) | 2016-08-24 | 2016-08-24 | A kind of circuit board carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304687B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793565A (en) * | 2017-01-06 | 2017-05-31 | 昆山圆裕电子科技有限公司 | The easy plates of FPC stick up the welding procedure of electron-like component |
| CN112382713A (en) * | 2020-10-27 | 2021-02-19 | 浙江英特来光电科技有限公司 | SMD full-color LED packaging structure based on flip-chip technology |
| CN113015351A (en) * | 2019-12-19 | 2021-06-22 | 北京小米移动软件有限公司 | Press welding equipment |
| CN114289814A (en) * | 2021-12-31 | 2022-04-08 | 东莞华贝电子科技有限公司 | Circuit board welding method and jig |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| US20080198566A1 (en) * | 2007-02-19 | 2008-08-21 | Yuuji Minota | Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN103630551A (en) * | 2013-12-05 | 2014-03-12 | 无锡市同步电子制造有限公司 | PCB (Printed Circuit Board) bracket for automatic optic inspection device |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
-
2016
- 2016-08-24 CN CN201610719086.2A patent/CN106304687B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| US20080198566A1 (en) * | 2007-02-19 | 2008-08-21 | Yuuji Minota | Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN103630551A (en) * | 2013-12-05 | 2014-03-12 | 无锡市同步电子制造有限公司 | PCB (Printed Circuit Board) bracket for automatic optic inspection device |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793565A (en) * | 2017-01-06 | 2017-05-31 | 昆山圆裕电子科技有限公司 | The easy plates of FPC stick up the welding procedure of electron-like component |
| CN113015351A (en) * | 2019-12-19 | 2021-06-22 | 北京小米移动软件有限公司 | Press welding equipment |
| CN113015351B (en) * | 2019-12-19 | 2022-10-21 | 北京小米移动软件有限公司 | Press welding equipment |
| CN112382713A (en) * | 2020-10-27 | 2021-02-19 | 浙江英特来光电科技有限公司 | SMD full-color LED packaging structure based on flip-chip technology |
| CN114289814A (en) * | 2021-12-31 | 2022-04-08 | 东莞华贝电子科技有限公司 | Circuit board welding method and jig |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106304687B (en) | 2019-01-04 |
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Address after: 510670 Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, South Yun Road 39 (1) Building, the first, second and third floors Applicant after: Guangzhou new energy Co. Ltd. Address before: 510663 No. 39 (1), South Yun three road, science and Technology City, Guangzhou high tech Industrial Development Zone, Guangdong Applicant before: GUANGZHOU LIANGSHI COMMUNICATION APPLIANCE CO., LTD. |
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Address after: 510670 Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, South Yun Road 39 (1) Building, the first, second and third floors Patentee after: Guangzhou Mingmei new energy Co., Ltd Address before: 510670 Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, South Yun Road 39 (1) Building, the first, second and third floors Patentee before: GUANGZHOU TWS NEW ENERGY Co.,Ltd. |